High color gamut quantum dot film package structure

Abstract

The utility model relates to photoelectric display technical field especially, relate to high color gamut quantum dot film packaging structure. The utility model provides such high color gamut quantum dot film packaging structure that possesses efficient heat dissipation capacity and good sealing processing environment, including bottom plate, placement board, fin, guide frame, electric push rod, UV curing equipment and mobile frame etc. The placement board is installed on the bottom plate, a plurality of fins are installed on the placement board, the guide frame is installed on the bottom plate, the electric push rod is installed symmetrically on the guide frame, the mobile frame is jointly connected on the electric push rod, and the UV curing equipment is installed in the mobile frame. The utility model places the base material in the placement board center, and the electric push rod drives the UV curing equipment accurate operation, and the fin strengthens heat dissipation, and the elastic member drives the shielding frame to close and forms the closed cavity, realizes efficient packaging, reaches the effect that radiates heat well and prevents UV leakage.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic display technology, and in particular to a high color gamut quantum dot film encapsulation structure. Background Technology

[0002] With the continuous advancement of display technology, consumers' demands for color performance in display devices are constantly increasing. High color gamut, high brightness, and high contrast have become core indicators for measuring image quality. Quantum dot technology, as an advanced nano-optoelectronic material, is widely used in LCD backlight systems due to its advantages such as tunable emission wavelength, high luminous purity, and excellent conversion efficiency. High color gamut quantum dot films are based on this technology, encapsulating quantum dot materials within a multi-layer optical thin-film structure and placing it between the backlight module and the LCD panel. Through blue light excitation, it achieves precise output of high-purity red and green light, significantly expanding the color gamut range and improving color reproduction and visual experience.

[0003] However, current high color gamut quantum dot film encapsulation structures still face two major challenges: insufficient heat dissipation and poor sealing of the encapsulation environment. Because quantum dot films are typically integrated into space-constrained backlight modules with narrow heat dissipation channels, the heat generated during operation is difficult to dissipate effectively, leading to a continuous rise in the temperature of the quantum dot layer. Prolonged high temperatures not only accelerate material aging, causing luminous efficiency degradation and spectral shift, but may also affect the structural stability of the encapsulation layer, reducing device reliability and lifespan. Furthermore, traditional encapsulation processes are mostly carried out in open or semi-closed environments, making it difficult to effectively block moisture, oxygen, and particulate contamination from the air. This easily leads to oxidation or chemical degradation of the quantum dots, causing performance deterioration and affecting product yield and consistency.

[0004] Therefore, there is an urgent need to design a high color gamut quantum dot film encapsulation structure with efficient heat dissipation capabilities and a good sealing processing environment. Utility Model Content

[0005] In order to overcome the shortcomings of insufficient heat dissipation performance and poor sealing of the packaging environment, this utility model provides a high color gamut quantum dot film packaging structure.

[0006] The technical solution of this utility model is as follows: This utility model provides a high color gamut quantum dot film encapsulation structure, including a base plate, a placement plate, fins, a guide frame, an electric push rod, a UV curing device, a moving frame, a shielding frame, and elastic elements. The placement plate is mounted on the base plate, and multiple fins are mounted on the placement plate. The guide frame is mounted on the base plate, and electric push rods are symmetrically mounted on the guide frame. The moving frame is connected to the electric push rods. The UV curing device is installed inside the moving frame, and several elastic elements are mounted on the UV curing device. The shielding frame is connected to the elastic elements and is tightly fitted outside the moving frame.

[0007] Preferably, it also includes a ventilation pipe and a connecting pipe. Several ventilation pipes are evenly spaced on the placement plate, and a connecting pipe is connected to all the ventilation pipes. The connecting pipe is connected to the temperature control system.

[0008] Preferably, it also includes an observation plate, which is installed on one side of the movable frame.

[0009] Preferably, it also includes a one-way mirror, with a one-way mirror disposed on the inner side of the observation plate.

[0010] Preferably, it also includes infrared sensors, and several infrared sensors are provided inside the placement plate.

[0011] Preferably, it also includes a plastic sheet, with the plastic sheet disposed between the base plate and the placement plate.

[0012] The beneficial effects of this utility model are:

[0013] This invention uses an electric push rod to drive a UV curing device for precise operation, fins to enhance heat dissipation, and elastic elements to drive the shielding frame to close and form a sealed cavity, achieving efficient encapsulation and providing good heat dissipation and preventing UV leakage.

[0014] This invention utilizes cooling gas to dissipate heat through a ventilation pipe, pulls the shielding frame to expose the observation plate for safe observation, and combines an infrared sensor to monitor temperature control and curing progress in real time, achieving effective cooling and preventing light radiation leakage, thus significantly improving packaging accuracy and product yield. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This is a three-dimensional structural diagram of the fins, guide frame, and electric push rod of this utility model.

[0017] Figure 3 This is a three-dimensional structural diagram of the movable frame, the shielding frame, and the elastic element of this utility model.

[0018] Figure 4 This is a three-dimensional structural diagram of the placement plate, ventilation pipe and connecting pipe of this utility model.

[0019] Figure 5 This is a three-dimensional structural diagram of the observation plate and one-way mirror of this utility model.

[0020] Figure 6 This is a three-dimensional structural diagram of the placement plate, infrared sensor, and plastic plate of this utility model.

[0021] The labels in the attached diagram are: 1-base plate, 2-placement plate, 3-fins, 4-guide frame, 5-electric push rod, 6-UV curing equipment, 7-moving frame, 8-shielding frame, 9-elastic element, 10-ventilation pipe, 11-connecting pipe, 12-observation plate, 13-one-way mirror, 14-infrared sensor, 15-plastic plate. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Example 1: High color gamut quantum dot film encapsulation structure, such as Figure 1 , Figure 2 and Figure 3 As shown, the assembly includes a base plate 1, a placement plate 2, fins 3, a guide frame 4, electric push rods 5, a UV curing device 6, a moving frame 7, a shielding frame 8, and an elastic element 9. The placement plate 2, used to support the quantum dot film substrate, is fixedly mounted on the base plate 1. The surface of the placement plate 2 is flat to ensure accurate positioning. Numerous fins 3 are installed on the placement plate 2, significantly increasing the heat dissipation area and improving overall heat dissipation efficiency, effectively preventing material performance degradation due to heat accumulation during the encapsulation process. The guide frame 4 is mounted on the base plate 1, and electric push rods 5 are symmetrically mounted on the guide frame 4. The two electric push rods 5 operate synchronously to ensure smooth movement. A moving frame 7 is connected to each of the electric push rods 5. The movable frame 7 can slide up and down along the guide frame 4. A UV curing device 6 is installed inside the movable frame 7 to uniformly and efficiently irradiate the encapsulating adhesive layer of the quantum dot film with ultraviolet light, so as to achieve rapid curing, improve the sealing performance and structural strength of the encapsulation. Two elastic elements 9 are installed on the UV curing device 6, and a shielding frame 8 is connected to the elastic elements 9. The shielding frame 8 is tightly fitted on the outside of the movable frame 7. During operation, the shielding frame 8 forms a local sealed chamber with the movable frame 7 under the action of the elastic elements 9, which effectively prevents UV light leakage and blocks the entry of external air, moisture and particulate pollutants, ensuring that the encapsulation process is carried out in a clean and safe environment.

[0024] When quantum dot film encapsulation is required, the quantum dot film substrate to be processed is accurately placed in the center of the placement plate 2, ready for dot film encapsulation. Then, the electric push rod 5 is activated to drive the UV curing equipment 6 to move up and down along the guide frame 4, thereby controlling the UV curing equipment 6 to accurately approach the encapsulation area and cure the coated quantum dot material with ultraviolet light, achieving an efficient and uniform encapsulation process. At the same time, the fins 3 on the placement plate 2 significantly increase the heat dissipation contact area, improve the overall heat dissipation capacity, and effectively prevent the performance degradation of the quantum dot material due to local overheating. During operation, the UV curing equipment 6, under the buffering effect of the elastic element 9, makes the shielding frame 8 tightly fit and completely close the moving frame 7, forming a sealed working cavity to ensure that UV light does not leak out, ensuring operational safety and environmental cleanliness.

[0025] Example 2: Based on Example 1, such as Figure 4 , Figure 5 and Figure 6 As shown, it also includes ventilation pipes 10, connecting pipes 11, observation plate 12, one-way mirror 13, infrared sensor 14, and plastic plate 15. Fourteen ventilation pipes 10 are evenly spaced on the placement plate 2, and the ventilation pipes 10 are symmetrically distributed in two rows, with seven in each row. The layout is reasonable and ensures that the airflow covers the entire encapsulation area. The ventilation pipes 10 are all connected to the connecting pipes 11, which are connected to the temperature control system. Cooling gas can be introduced to achieve active heat dissipation and environmental temperature and humidity control of the quantum dot film working area, effectively preventing heat accumulation and improving process stability. An observation plate 12 is installed on the front of the moving frame 7. If it is necessary to observe the working status of the UV curing equipment 6, the observation plate 12 can be used. Pulling the shielding frame 8 exposes the observation plate 12, allowing direct observation. A one-way mirror 13 is installed on the inner side of the observation plate 12, which allows external personnel to clearly observe the internal operation while effectively blocking the leakage of ultraviolet and infrared radiation generated during the UV curing process, ensuring operational safety. Multiple infrared sensors 14 are evenly spaced inside the placement plate 2 to monitor the temperature distribution and curing reaction process on the surface of the quantum dot film in real time, realize data feedback and closed-loop control, and improve the packaging accuracy and consistency. A plastic plate 15 is installed between the base plate 1 and the placement plate 2 to prevent excessive heat conduction to the base and improve the electrical safety and vibration resistance of the overall structure.

[0026] When cooling control of the encapsulation area is required, cooling gas is introduced into the connecting pipe 11 through an external temperature control system. The cold gas is blown onto the surface of the quantum dot film through the evenly distributed ventilation pipe 10, realizing active heat dissipation of the chip area and preventing heat accumulation from affecting the stability of the material. If it is necessary to observe the working status of the UV curing equipment 6, the shielding frame 8 is pulled to expose the observation plate 12 so that it can be directly observed. A one-way mirror 13 is attached inside the observation plate 12, allowing external personnel to clearly observe the internal process, while effectively blocking the leakage of ultraviolet and infrared rays generated inside, ensuring the safety and reliability of the observation process. In addition, the infrared sensor 14 can monitor the temperature change and curing reaction progress of the encapsulation area in real time, realizing dynamic feedback and precise control of process parameters, significantly improving the consistency, accuracy and yield of dot film encapsulation.

[0027] The above-described embodiments are merely preferred embodiments of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications, improvements, and substitutions without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

Claims

1. A high color gamut quantum dot film encapsulation structure, comprising a base plate (1), a placement plate (2), a guide frame (4), an electric push rod (5), a UV curing device (6), and a movable frame (7), wherein the placement plate (2) is mounted on the base plate (1), the guide frame (4) is mounted on the base plate (1), the electric push rod (5) is symmetrically mounted on the guide frame (4), the movable frame (7) is connected to the electric push rod (5), and the UV curing device (6) is installed inside the movable frame (7), characterized in that, It also includes fins (3), shielding frame (8) and elastic element (9). Multiple fins (3) are installed on the placement plate (2), and several elastic elements (9) are installed on the UV curing equipment (6). The shielding frame (8) is connected to the elastic element (9) together, and the shielding frame (8) is tightly fitted on the outside of the moving frame (7).

2. The high color gamut quantum dot film encapsulation structure according to claim 1, characterized in that, It also includes ventilation pipes (10) and connecting pipes (11). Several ventilation pipes (10) are evenly spaced on the placement plate (2). Connecting pipes (11) are connected to the ventilation pipes (10). The connecting pipes (11) are connected to the temperature control system.

3. The high color gamut quantum dot film encapsulation structure according to claim 2, characterized in that, It also includes an observation plate (12), which is installed on one side of the movable frame (7).

4. The high color gamut quantum dot film encapsulation structure according to claim 3, characterized in that, It also includes a one-way mirror (13), and a one-way mirror (13) is installed inside the observation plate (12).

5. The high color gamut quantum dot film encapsulation structure according to claim 4, characterized in that, It also includes an infrared sensor (14), and several infrared sensors (14) are installed inside the placement plate (2).

6. The high color gamut quantum dot film encapsulation structure according to claim 5, characterized in that, It also includes a plastic sheet (15), and the plastic sheet (15) is provided between the base plate (1) and the placement plate (2).

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