A semiconductor package structure with frame metal bending molding

Abstract

The utility model discloses a kind of semiconductor packaging structures of frame metal bending forming, including metal frame, packaging base, condenser lens, transmitting chip and receiving chip;Metal frame includes the first metal support of bending parallel arrangement, second metal support, third metal support, second metal support top is equipped with bowl-shaped cavity, transmitting chip and receiving chip are located in bowl-shaped cavity, transmitting chip is connected with the first metal support by first connecting wire, and receiving chip is connected with the third metal support by second connecting wire;Metal frame upper portion is located in packaging base, and condenser lens is located at the top of packaging base.The utility model can improve the structural stability of metal frame in packaging process by bending parallel arrangement and connecting support retainer of the first metal support, second metal support and third metal support;Condenser lens is located at the top of packaging base, and is integrally formed using epoxy resin, which can effectively improve the optical performance and packaging efficiency of semiconductor device.

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