A three-stage ladder type three-in-one RGB high-voltage lamp bead device

CN224924138UActive Publication Date: 2026-10-30SHENZHEN CROSS-STRAIT SEMICON TECH CO LTD
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Patent Information

Application Number
CN202521347484.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-30
Publication Date
2026-10-30
Estimated Expiration
2035-06-30

AI Technical Summary

Technical Problem

上述的LED灯珠高压方案采用18V串联设计,无法满足大功率场景需求,传统均厚支架导致局部热积聚,影响36V高电流下的稳定性,且常规平面布局导致光线叠加产生光斑暗区,混光不均匀

Benefits of technology

与现有技术相比,本实用新型提供了一种三级阶梯式三合一RGB高压灯珠器件,具备以下有益效果:

✦ Generated by Eureka AI based on patent content.

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    Figure CN224924138U_ABST
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Abstract

The utility model belongs to the technical field of lamp pearl, specifically is a kind of three-stage three-in-one RGB high-pressure lamp pearl device, it includes: PCT support, the substrate of PCT support is silver-plated size surface, PCT support is used to set up light emitting chip;Stiffener, the stiffener fixedly connected in PCT support inside;Light emitting chip, light emitting chip is combined to emit light as required, and is fixedly connected with PCT support;Gold wire, gold wire is used to realize the connection between chip;Pad, the pad is covered in PCT support surface.The utility model passes through the on-off different positive and negative terminal, utilizes gold wire transmission current, realizes light emitting chip light emitting, adopts gradient annular chip layout, and different color light emitting chip is connected in different height platform, realizes high pressure balance, solves the problem of lamp pearl voltage adaptation limitation.
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Description

Technical Field

[0001] This utility model belongs to the field of LED technology, specifically a three-stage stepped three-in-one RGB high-voltage LED device. Background Technology

[0002] In recent years, LED lighting has made rapid progress, and the types and styles of LED products have basically been finalized. The luminous efficacy of LED products is an important parameter affecting their performance and quality. Light-emitting diodes, or LEDs for short, can emit visible light when electrons and holes recombine. Therefore, they can be used to make light-emitting diodes, which are used as indicator lights in circuits and instruments, or to form text or number displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. Due to their chemical properties, they are also divided into organic light-emitting diodes (OLEDs) and inorganic light-emitting diodes (LEDs). LEDs are a type of semiconductor diode that can convert electrical energy into light energy.

[0003] In the existing technology, there is an RGBWW five-in-one high-voltage LED lamp bead with the publication number CN218160369U. This application achieves blue-green light display by connecting three 18V blue and green light chips in series, and achieves high-voltage red light display by adding red phosphor to three 18V blue light chips. It also utilizes SMC's high temperature resistance, good reliability, and power output of 3-5W. During encapsulation, it can seamlessly fuse with the encapsulating glue, resulting in better anti-sulfurization performance. It exhibits no brightness loss or delamination after 1500 rounds of thermal shock and has high anti-yellowing capability, thus realizing an RGBWW five-in-one high-voltage LED lamp bead. However, the following problems still exist: The aforementioned high-voltage LED lamp bead solution uses an 18V series design, which cannot meet the needs of high-power scenarios. The traditional uniform thickness bracket causes local heat accumulation, affecting the stability under 36V high current. In addition, the conventional planar layout causes light to overlap, resulting in light spots and dark areas, and uneven light mixing.

[0004] Therefore, a three-stage stepped three-in-one RGB high-voltage lamp bead device is proposed to address the above problems. Utility Model Content

[0005] (a) Technical problems to be solved To address the shortcomings of existing technologies and solve the problems of limited voltage adaptation, inadequate thermal management, and severe luminous efficiency loss in LED chips, a three-stage stepped three-in-one RGB high-voltage chip device is proposed.

[0006] (II) Technical Solution To achieve the above objectives, this utility model provides the following technical solution: A three-stage stepped RGB high-voltage LED chip device includes: PCT bracket, wherein the substrate of the PCT bracket is 6061 with silver plating on the surface; Reinforcing ribs, several of which are fixedly connected inside the PCT bracket; Light-emitting chips, a plurality of such light-emitting chips are distributed and soldered onto a PCT bracket; Gold wires, used to connect the light-emitting chips; The pads cover the surface of the PCT bracket.

[0007] Preferably, the PCT bracket stamping process is a three-stage bracket; The first-stage support has a thickness of 0.8mm, a width of 2.0mm, and a stamping accuracy of ±0.02mm; The second-level support has a thickness of 1.2mm, a width of 2.5mm, and an edge chamfer radius of R0.1mm. The third-level support has a thickness of 1.5mm and a width of 3.0mm; Preferably, the PCT bracket adopts a rounded corner stepped transition structure, and the stepped connection adopts a radius of 0.3mm.

[0008] Preferably, the reinforcing ribs are provided in three sections.

[0009] Preferably, the light-emitting chip is divided into a blue light chip, a green light chip, and a red light chip, and the light-emitting chip is arranged in a gradient ring.

[0010] Preferably, the overlap angle between the light ring emitted by the red light chip and the light ring emitted by the green light chip is such that the light ring emitted by the blue light chip is centered, and the light emission effect from the inside out is blue light to green light to red light.

[0011] Preferably, the blue light chip is arranged in 12 strings, and each string of blue light chips is connected in series by gold wire; The green light chip is arranged in 12 strings, and each string of green light chips is connected in series by gold wire; The red light chip is arranged in 18 strings, and each string of red light chips is connected in series by gold wire.

[0012] Preferably, the light-emitting chip is fixedly connected to the PCT bracket by insulating adhesive, and the light-emitting chip and the PCT bracket are bonded together by gold wire to conduct the circuit.

[0013] Preferably, the PCT support is filled with high-transmittance silicone.

[0014] Preferably, the PCT support has positive and negative terminals at both ends.

[0015] (III) Beneficial Effects Compared with the prior art, this utility model provides a three-stage stepped three-in-one RGB high-voltage lamp bead device, which has the following beneficial effects: 1. This utility model achieves light emission from the light-emitting chip by connecting different positive and negative terminals and using gold wire to transmit current. By adopting a gradient ring chip layout, light-emitting chips of different colors are connected in series on platforms at different heights, achieving high voltage balance and solving the problem of limited voltage adaptation of lamp beads.

[0016] 2. This utility model PCT bracket, by setting three platforms or layers of different heights, realizes the layered and staggered arrangement of light-emitting chips of different colors. The stepped structure helps to more effectively conduct the heat generated by the light-emitting chips in different positions to the PCT bracket, thereby optimizing the overall heat dissipation and solving the problem of insufficient thermal management.

[0017] 3. This utility model achieves a more uniform color mixing effect by placing three colors of light-emitting chips at different heights and adding SiO diffusion powder to high-transmittance silicone, reducing the phenomenon of "color separation" or "spots", and realizing a smaller color mixing distance. This allows the LED beads to mix uniform white light or target color light at a closer distance, solving the problem of serious light efficiency loss. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the structure of the solder pad of this utility model; Figure 3 This is a side view of the PCT bracket of this utility model.

[0019] In the diagram: 1. PCT bracket; 2. Reinforcing rib; 3. Light-emitting chip; 4. Gold wire; 5. Solder pad. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] Specific implementation examples are given below.

[0022] Please see Figures 1-3This utility model provides a three-stage stepped three-in-one RGB high-voltage lamp bead device, including: a PCT bracket 1, the substrate of the PCT bracket 1 is 6061 with silver plating, the PCT bracket 1 is used to set the light-emitting chip 3; a reinforcing rib 2, the reinforcing rib 2 is fixedly connected inside the PCT bracket 1; light-emitting chips 3, the light-emitting chips 3 are combined to emit light as needed, and are fixedly connected to the PCT bracket 1; gold wires 4, the gold wires 4 are used to realize the connection between the light-emitting chips 3; and solder pads 5, the solder pads 5 cover the surface of the PCT bracket 1.

[0023] like Figure 1 and Figure 3 As shown, the PCT bracket 1 is a three-stage stamping process; the first stage bracket has a thickness of 0.8mm, a width of 2.0mm, and a stamping accuracy of ±0.02mm; the second stage bracket has a thickness of 1.2mm, a width of 2.5mm, and an edge chamfer of R0.1mm; the third stage bracket has a thickness of 1.5mm and a width of 3.0mm. The PCT bracket 1 adopts a rounded stepped transition structure, with R0.3mm rounded corners at the step connections, reducing the stress concentration factor by 40%. Three reinforcing ribs 2 are provided to increase the bending stiffness of the PCT bracket 1 by 25%.

[0024] The above solution involves setting up three platforms or levels of different heights in the PCT bracket 1 to arrange the light-emitting chips 3 in layers and staggered manner. The stepped structure helps to more effectively conduct the heat generated by the light-emitting chips 3 at different positions to the PCT bracket 1, thus optimizing the overall heat dissipation.

[0025] like Figure 1 and Figure 3 As shown, the light-emitting chip 3 is divided into blue light chip, green light chip and red light chip. The light-emitting chip 3 is arranged in a gradient ring. The light ring emitted by the red light chip overlaps with the light ring emitted by the green light chip. The light ring emitted by the blue light chip is in the center. The light emission effect is blue light to green light to red light from the inside out. There are 12 strings of blue light chips, and each string of blue light chips is connected in series by gold wire 4. There are 12 strings of green light chips, and each string of green light chips is connected in series by gold wire 4. There are 18 strings of red light chips, and each string of red light chips is connected in series by gold wire 4. The light-emitting chip 3 is fixedly connected to the PCT bracket 1 with insulating glue. The light-emitting chip 3 and the PCT bracket 1 are bonded to conduct the circuit through the gold wire 4. The PCT bracket 1 has positive and negative terminals at both ends.

[0026] Through the above solution: 12 blue LEDs in series, total voltage = 12 * 3.0 = 36V, total current = 20mA; Total power: 36 * 20 = 0.72W; Total voltage = 12 * 3.0 = 36V, total current = 20mA; Total power: 36 * 20 = 0.72W; Total voltage = 18 * 2.0 = 36V; Total current = 20mA; Total power: 36*20=0.72W, achieving high voltage balance.

[0027] like Figure 1 and Figure 3 As shown, the PCT bracket 1 is filled with high-transmittance silicone, and SiO2 diffusing powder is added to the high-transmittance silicone to make the emitted light more uniform.

[0028] The above scheme involves placing the three colors of light-emitting chips 3 at different heights, and adding SiO2 diffusion powder to the high-transmittance silicone to achieve a more uniform color mixing effect, reduce the phenomenon of "color separation" or "spots", and achieve a smaller color mixing distance, so that the LED beads can mix uniform white light or target color light at a closer distance.

[0029] Working principle: In practical use, firstly, different positive and negative terminals are connected, and current is transmitted through gold wire 4 to make the light-emitting chip 3 emit light. A gradient ring chip layout is adopted, and light-emitting chips of different colors are connected in series on platforms at different heights to complete high voltage balance.

[0030] Secondly, the PCT bracket 1 arranges the light-emitting chips 3 in layers and staggered manner by setting three platforms or layers of different heights. The stepped structure helps to more effectively conduct the heat generated by the light-emitting chips 3 in different positions to the PCT bracket 1, thus optimizing the overall heat dissipation.

[0031] Finally, the three colors of light-emitting chips 3 are placed at different heights, and SiO2 diffusion powder is added to the high light transmittance silicone to obtain a more uniform color mixing effect, reduce the phenomenon of "color separation" or "spots", and achieve a smaller color mixing distance, so that the lamp beads can mix uniform white light or target color light at a closer distance.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A three-stage stepped three-in-one RGB high-voltage lamp bead device, characterized in that, include: PCT bracket (1), wherein the substrate of the PCT bracket (1) is 6061 with silver plating on the surface; Reinforcing ribs (2), several of the reinforcing ribs (2) are fixedly connected inside the PCT bracket (1); Light-emitting chips (3), a plurality of said light-emitting chips (3) are distributed and welded on PCT bracket (1); Gold wire (4), the gold wire (4) is used to realize the connection between light-emitting chips (3); Pads (5) are applied to the surface of the PCT support (1); PCT bracket (1) is set as a three-level bracket using a stamping process; The first-level support has a thickness of 0.8mm, a width of 2.0mm, and a stamping accuracy of ±0.02mm. The second-level support has a thickness of 1.2mm, a width of 2.5mm, and an edge chamfer radius of R0.1mm. The third-level support has a thickness of 1.5mm and a width of 3.0mm. The PCT support (1) adopts a rounded corner stepped transition structure, and the stepped connection adopts a radius of 0.3mm. The light-emitting chip (3) is divided into a blue light chip, a green light chip and a red light chip, and the light-emitting chip (3) is arranged in a gradient ring.

2. The three-stage stepped three-in-one RGB high-voltage lamp bead device according to claim 1, characterized in that: The reinforcing rib (2) has three ribs.

3. The three-stage stepped three-in-one RGB high-voltage lamp bead device according to claim 1, characterized in that: The red light chip emits a halo that overlaps with the green light chip at an angle, and the blue light chip emits a halo that is centered. The light emission effect, from the inside out, is blue light to green light to red light.

4. The three-stage stepped three-in-one RGB high-voltage lamp bead device according to claim 3, characterized in that: The blue light chip is arranged in 12 strings, and each string of blue light chips is connected in series by gold wire (4); The green light chip is arranged in 12 strings, and each string of green light chips is connected in series by gold wire (4); The red light chip is arranged in 18 strings, and each string of red light chips is connected in series by gold wire (4).

5. The three-stage stepped three-in-one RGB high-voltage lamp bead device according to claim 1, characterized in that: The light-emitting chip (3) is fixedly connected to the PCT bracket (1) by insulating glue, and the light-emitting chip (3) and the PCT bracket (1) are bonded and connected by gold wire (4).

6. The three-stage stepped three-in-one RGB high-voltage lamp bead device according to claim 1, characterized in that: The PCT support (1) is filled with high-transmittance silicone.

7. The three-stage stepped three-in-one RGB high-voltage lamp bead device according to claim 1, characterized in that: The PCT support (1) has positive and negative terminals at both ends.

Citation Information

Patent Citations

  • RGBWW five-in-one high-voltage LED lamp bead

    CN218160369U