Display panel

Abstract

The application relates to a display panel comprising a light emitting device. The light emitting device comprises a substrate, a plurality of light emitting chips, a first reflective layer and a second reflective layer. The plurality of light emitting chips are arranged on a surface of the substrate; the first reflective layer is provided with a plurality of first holes corresponding to the plurality of light emitting chips, and the first reflective layer comprises a first bottom surface attached to the substrate, a first top surface away from the substrate, and a first inner side surface connected between the first bottom surface and the first top surface, the first inner side surface forms an inner wall of the first hole, and the bottom surface area of the first hole is smaller than the top surface area of the first hole. The second reflective layer is provided with a plurality of second holes corresponding to the plurality of light emitting chips, and the second reflective layer comprises a second bottom surface attached to the first top surface, a second top surface away from the first reflective layer, and a second inner side surface connected between the second bottom surface and the second top surface, the second inner side surface forms an inner wall of the second hole, the bottom surface of the second hole coincides with the top surface of the first hole, and the bottom surface area of the second hole is greater than the top surface area of the second hole.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to display panels. Background Technology

[0002] MicroLEDs (micro-light-emitting diodes) are typically between 1 and 10 micrometers in size, only one-tenth the diameter of a human hair. This level of miniaturization gives MicroLEDs significant advantages in display performance, such as extremely high photoelectric conversion efficiency and nanosecond-level response times. Furthermore, MicroLED technology does not rely on a backlight, further improving its energy efficiency and display quality.

[0003] Currently, the light emitted by light-emitting chips (such as MicroLEDs) follows a Lambertian distribution, making it difficult to effectively utilize lateral light and resulting in waste. Existing reflector bowl structures and microlens structures cannot fully utilize all the light. Utility Model Content

[0004] Therefore, it is necessary to provide a display panel that improves light utilization efficiency to address the aforementioned technical problems.

[0005] In a first aspect, this application provides a display panel, comprising:

[0006] Light-emitting devices, including:

[0007] Substrate;

[0008] Multiple light-emitting chips are spaced apart on the surface of the substrate;

[0009] A first reflective layer is disposed on the surface of the substrate. The first reflective layer has a plurality of first holes corresponding to the plurality of light-emitting chips. The first reflective layer includes a first bottom surface that is in contact with the substrate, a first top surface that is away from the substrate, and a first inner surface that connects the first bottom surface and the first top surface. The first inner surface forms the inner wall of the first hole, and the bottom surface area of ​​the first hole is smaller than the top surface area of ​​the first hole.

[0010] The second reflective layer is disposed on the surface of the first reflective layer away from the substrate. The second reflective layer has a plurality of second holes corresponding to the plurality of light-emitting chips. The second reflective layer includes a second bottom surface that is in contact with the first top surface, a second top surface that is away from the first reflective layer, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole. The bottom surface of the second hole coincides with the top surface of the first hole. The bottom surface area of ​​the second hole is larger than the top surface area of ​​the second hole.

[0011] Beneficial effects: The first reflective layer has multiple first holes corresponding to multiple light-emitting chips, and the second reflective layer has multiple second holes corresponding to multiple light-emitting chips. The bottom area of ​​the first hole is smaller than the top area of ​​the first hole, and the bottom area of ​​the second hole is larger than the top area of ​​the second hole. Therefore, a portion of the first light beam emitted from the light-emitting chip can be reflected by the inner wall of the first hole before being emitted; a portion of the second light beam emitted from the light-emitting chip can be reflected by the inner wall of the second hole to the inner wall of the first hole, and then reflected by the inner wall of the first hole before being emitted. Furthermore, the angle between the second light beam and the viewing angle is within a smaller range than the angle between the first light beam and the viewing angle. Thus, the display panel in this embodiment can converge large-angle light and light with angles smaller than large-angle light, reducing the waste of lateral light and thereby improving light utilization.

[0012] In one embodiment, the light-emitting device includes:

[0013] A refractive layer is disposed on the surface of the second reflective layer away from the substrate. The refractive layer has multiple third holes corresponding to the multiple light-emitting chips. The refractive layer includes a third bottom surface that is in contact with the second top surface, a third top surface that is away from the second reflective layer, and a third inner surface that connects the third bottom surface and the third top surface. The third inner surface forms the inner wall of the third hole. The bottom surface of the third hole coincides with the top surface of the second hole. The bottom surface area of ​​the third hole is larger than the top surface area of ​​the third hole.

[0014] Beneficial effects: By setting a refractive layer on the surface of the second reflective layer away from the substrate, the refractive layer can refract the light beam reflected by the first refractive layer onto the second reflective layer or the first reflective layer, thereby adjusting the exit angle of the final emitted light beam to be closer to the normal direction, thus reducing the risk of beam crosstalk.

[0015] In one embodiment, the light-emitting device includes:

[0016] A spacer layer is disposed on the second reflective layer and the surface facing away from the substrate;

[0017] A lens layer is disposed on the surface of the spacer layer opposite to the substrate. The lens layer has multiple protrusion structures, and the multiple protrusion structures are correspondingly disposed with multiple light-emitting chips. The orthogonal projection of the protrusion structures on the substrate covers the orthogonal projection of the top surface of the third hole on the substrate.

[0018] Beneficial effects: The spacer layer can precisely control the optical distance between each light-emitting chip and its corresponding lens layer, thereby ensuring good uniformity and consistency among multiple light-emitting chips. The lens layer has multiple protrusion structures, which can shape and focus at least a portion of the light beam emitted by the corresponding light-emitting chip. This not only improves light utilization and display quality but also helps reduce crosstalk between adjacent light-emitting chips, thereby improving display clarity and accuracy.

[0019] In one embodiment, at least a portion of the first hole, the second hole, and the third hole is filled with an optical material, the refractive index of which is greater than 1 and less than the refractive index of the refractive layer, the refractive index of which is less than the refractive index of the spacer layer, and the difference between the refractive index of the spacer layer and the refractive index of the lens layer satisfies a preset error condition.

[0020] Beneficial effects: At least a portion of the first, second, and third holes are filled with optical material, wherein the refractive index of the optical material is greater than 1 and less than the refractive index of the refractive layer, and the refractive index of the refractive layer is less than the refractive index of the spacer layer. This allows the light beam to be deflected by the refractive layer and the spacer layer, ultimately moving closer to the normal direction, thereby reducing optical crosstalk between adjacent light-emitting chips. Furthermore, the difference between the refractive index of the spacer layer and the refractive index of the lens layer satisfies a preset error condition, enabling the light beam to propagate nearly in a straight line and improving the collimation of the emitted beam.

[0021] In one embodiment, each of the light-emitting chips is used to emit light within the same wavelength range; at least a portion of the first hole, the second hole, and the third hole is filled with an optical material, the type of which includes quantum dot materials.

[0022] At least some of the light-emitting chips are filled with different quantum dot materials in their respective holes, which is used to convert the light emitted from the corresponding light-emitting chip into light with a wavelength range corresponding to the quantum dot material.

[0023] Beneficial effects: The wavelength range of the light beam emitted by each light-emitting chip is the same, by filling at least a portion of the first, second, and third holes with optical materials, such as quantum dot materials. When optical materials are filled in portions of the first, second, and third holes, the optical materials can be spaced apart from the light-emitting chips. The spacers can be filled with air or a transparent dielectric layer. The refractive index of the transparent dielectric layer is between that of gallium nitride and that of light-emitting chips. This reduces the adverse effects of heat generation from the light-emitting chips on the optical materials, improves the lifespan of the optical materials, and protects the light-emitting chips. Furthermore, the quantum dot materials filled in each hole of at least some of the light-emitting chips are different. Besides adjusting the wavelength range of the emitted light beam, this also improves the color purity of the emitted light beam, enhancing the display effect of the display panel.

[0024] In one embodiment, the top and bottom surfaces of the first hole, the second hole, and the third hole are all regular hexagons, the bottom area of ​​the first hole is equal to the top area of ​​the third hole, and the diagonal length of the top surface of the first hole is equal to the sum of the thickness of the first reflective layer, the thickness of the second reflective layer, and the thickness of the refractive layer.

[0025] The thickness of the first reflective layer is equal to the sum of the thickness of the second reflective layer and the thickness of the refractive layer.

[0026] Beneficial effects: The regular hexagon has high symmetry. The top and bottom surfaces of the first, second, and third holes are all regular hexagons. The bottom area of ​​the first hole is equal to the top area of ​​the third hole, allowing the light field emitted from the light-emitting chip to be more uniformly distributed within the first, second, and third holes, improving light uniformity. The diagonal length of the top surface of the first hole is equal to the sum of the thicknesses of the first reflective layer, the second reflective layer, and the refractive layer. The thickness of the first reflective layer is equal to the sum of the thicknesses of the second reflective layer and the refractive layer. This creates a more matched constraint condition for the light beam in the direction perpendicular to the top / bottom surfaces of each hole and along the hexagonal plane, making the light beam reflection path more regular and improving light utilization.

[0027] In one embodiment,

[0028] The angle between the third inner surface and the third bottom surface is greater than π / 2 and less than or equal to 5π / 6.

[0029] Beneficial effects: The angle θ between the third inner surface and the third bottom surface is greater than π / 2 and less than or equal to 5π / 6, which can ensure that the second incident angle θ3 of the light beam refracted by the refractive layer at the interface between the refractive layer and the spacer layer meets the deflection requirements, thereby enabling the refractive layer to accurately refract the light beam and effectively reduce optical crosstalk between adjacent light-emitting chips.

[0030] In one embodiment, at least a portion of the light-emitting chip is used to emit light in different wavelength ranges.

[0031] Beneficial effects: At least some of the light-emitting chips are used to emit light of different wavelength ranges, which can form a wider color gamut coverage, making the display panel display more realistic and vivid colors, significantly improving the color performance of the display panel, and meeting the user's demand for a high-quality visual experience.

[0032] In one embodiment, in a cross-sectional direction perpendicular to the surface of the substrate, the first width W1 of each light-emitting chip satisfies: 0.5μm≤W1≤50μm, and the second width W2 of the first hole satisfies 1.2*W1≤W2≤4*W1;

[0033] The first height H1 of each of the light-emitting chips satisfies: 3μm≤H1≤20μm; the thickness H2 of the first reflective layer satisfies 1.2*H1≤H2≤4*H1.

[0034] Beneficial effects: The light-emitting chip is a micron-sized chip, resulting in a relatively large beam divergence angle when emitting light directly. By setting the second width W2 of the first aperture to be 1.2 to 4 times the first width W1 of the light-emitting chip, and the thickness H2 of the first reflective layer (i.e., the height of the first aperture) to be 1.2 to 4 times the first height H1 of the light-emitting chip, when the beam propagates within the first aperture, the edge rays are confined by the aperture wall, reducing the overall beam divergence angle and improving directionality, thus concentrating the beam and reducing light waste. Simultaneously, it makes the intensity distribution of the emitted beam more uniform, avoiding localized bright spots or dark areas.

[0035] In one embodiment, the plurality of light-emitting chips are arranged in an array; or...

[0036] The light-emitting chips are arranged in multiple columns, and the centers of the light-emitting chips in adjacent columns are staggered in a direction perpendicular to the column direction.

[0037] Beneficial effects: Arraying light-emitting chips significantly improves luminous efficiency and uniformity. Multiple chips working together result in more uniform brightness across the entire luminous area, reducing bright spots and dark areas. Furthermore, compared to a single chip, an array can concentrate more luminous flux, thereby increasing luminous intensity and meeting the high brightness and uniformity requirements of various display fields, effectively improving the display quality of the image on the display panel. Multiple chips arranged in multiple columns, with the centers of adjacent columns staggered in a direction perpendicular to the column direction, allow for a close arrangement of chips, maximizing space utilization and increasing the number of chips per unit area, thus improving the resolution and display effect of the display panel. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic block diagram of the display panel structure in one embodiment of this application;

[0040] Figure 2 This is one of the structural schematic diagrams of a light-emitting device in one embodiment of this application;

[0041] Figure 3This is an optical path diagram of the first beam in one embodiment of this application;

[0042] Figure 4 This is an optical path diagram of the second beam in one embodiment of this application;

[0043] Figure 5 This is a second schematic diagram of the structure of the light-emitting device in one embodiment of this application;

[0044] Figure 6 This is an optical path diagram of the third beam in one embodiment of this application;

[0045] Figure 7 This is an optical path diagram of the fourth beam in one embodiment of this application;

[0046] Figure 8 This is the third schematic diagram of the structure of the light-emitting device in one embodiment of this application;

[0047] Figure 9 This is an optical path diagram of the fifth beam in one embodiment of this application;

[0048] Figure 10 The emission angle of the light beam emitted by the light-emitting chip in one embodiment of this application is defined by the refractive layer, the spacer layer, and the lens layer.

[0049] Figure 11 This is one of the structural schematic diagrams of an embodiment of the present application showing that optical material fills at least a portion of the first hole, the second hole, and the third hole;

[0050] Figure 12 This is a second schematic diagram of the structure in which optical material fills at least a portion of the first hole, the second hole, and the third hole in one embodiment of this application;

[0051] Figure 13 This is a third schematic diagram of the structure in which optical material fills at least a portion of the first hole, the second hole, and the third hole in one embodiment of this application;

[0052] Figure 14 This is one of the top views of the arrangement of the light-emitting chip array in one embodiment of this application;

[0053] Figure 15 This is a second top view of the arrangement of the light-emitting chip array in one embodiment of this application;

[0054] Figure 16 This is the third top view of the arrangement of the light-emitting chip array in one embodiment of this application;

[0055] Figure 17 This is the fourth top view of the arrangement of the light-emitting chip array in one embodiment of this application;

[0056] Figure 18This is a top view of a plurality of light-emitting chips arranged in multiple columns in one embodiment of the present application, wherein the centers of the light-emitting chips in two adjacent columns are offset in a direction perpendicular to the column direction.

[0057] Figure 19 This is one of the schematic diagrams illustrating the fabrication process of the light-emitting device in one embodiment of this application;

[0058] Figure 20 This is a second schematic diagram of the fabrication process of the light-emitting device in one embodiment of this application;

[0059] Figure 21 This is the third schematic diagram of the fabrication process of the light-emitting device in one embodiment of this application;

[0060] Figure 22 This is the fourth schematic diagram of the fabrication process of the light-emitting device in one embodiment of this application.

[0061] Explanation of icon numbers:

[0062] 10: Display panel; 100: Light-emitting device; 110: Substrate; 111: Temporary substrate; 120: Light-emitting chip; 130: First reflective layer; 131: First aperture; 140: Second reflective layer; 141: Second aperture; 150: Refractive layer; 151: Third aperture; 160: Spacer layer; 170: Lens layer; 180: Logic switch layer; 1100: Sacrificial layer; 200: Driving circuit. Detailed Implementation

[0063] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0064] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0065] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0067] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0068] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0069] See Figure 1 , Figure 1 A schematic diagram of the structure of a display panel 10 according to an embodiment of this application is shown. The display panel 10 provided in an embodiment of this application may include a light-emitting device 100.

[0070] See appendix Figure 2 , attached Figure 2This illustration shows one of the structural schematic diagrams of a light-emitting device 100 according to an embodiment of this application. The light-emitting device 100 in this embodiment may include a substrate 110. In the light-emitting device 100, the substrate 110 serves as the basic material that carries the light-emitting layer and provides mechanical support, electrical connection, and heat dissipation pathways for the light-emitting device 100.

[0071] In some embodiments, the crystal structure of the substrate 110 may be close to the lattice constant of the light-emitting layer material (i.e., "lattice matching") to reduce defects (such as dislocations) during material growth and improve luminous efficiency. Exemplarily, the material of the substrate 110 may be aluminum oxide, silicon, silicon carbide, gallium arsenide, gallium phosphide, zinc oxide, etc., and is not limited thereto.

[0072] The light-emitting device 100 in this embodiment may include a plurality of light-emitting chips 120, which are spaced apart on the surface of the substrate 110. For example, see attached... Figure 2 Only three light-emitting chips 120 are shown in the figure. In other embodiments, the number of light-emitting chips 120 is not limited to that shown in the figure.

[0073] The light-emitting device 100 in this embodiment may include a first reflective layer 130. The first reflective layer 130 is disposed on the surface of the substrate 110. The first reflective layer 130 is provided with a plurality of first holes 131 corresponding to the light-emitting chip 120. The first reflective layer 130 includes a first bottom surface that is attached to the substrate 110, a first top surface that is away from the substrate 110, and a first inner surface that connects the first bottom surface and the first top surface. The first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131.

[0074] The light-emitting device 100 in this embodiment may include a second reflective layer 140. The second reflective layer 140 is disposed on the surface of the first reflective layer 130 away from the substrate 110. The second reflective layer 140 is provided with a plurality of second holes 141 corresponding to a plurality of light-emitting chips 120. The second reflective layer 140 includes a second bottom surface that is in contact with the first top surface, a second top surface that is away from the first reflective layer 130, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole 141. The bottom surface of the second hole 141 coincides with the top surface of the first hole 131. The bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141.

[0075] In this embodiment, both the first reflective layer 130 and the second reflective layer 140 may include a polymer material layer and a surface reflective layer. The polymer material layer may be SU8 (EPON™ Resin SU-8, a polymer based on epoxy resin, named for the approximately 8 active epoxy groups in each monomer molecule), and the material of the surface reflective layer may be gold, silver, DBR (Distributed Bragg Reflector), etc., and is not limited to these.

[0076] By way of example, the light-emitting device 100 in the embodiments of this application is shown in the appendix. Figure 3 and attached Figure 4 , attached Figure 3 The optical path diagram of a portion of the first beam in an embodiment of this application is shown, with appendix. Figure 4 The optical path diagram of a portion of the second beam in an embodiment of this application is shown. A portion of the first beam emitted from the light-emitting chip 120 is emitted after being reflected by the first inner side surface, and the first beam is a beam whose angle with the positive viewing angle is within a first angular range; the second beam emitted from the light-emitting chip 120 is emitted after being reflected sequentially by the second inner side surface and the first inner side surface, and the second beam is a beam whose angle with the positive viewing angle is within a second angular range; the second angular range is smaller than the first angular range.

[0077] The viewing angle is the angle from which the display panel 10 is viewed when viewed directly in front of it. The viewing angle of the display panel 10 can be measured in terms of horizontal and vertical viewing angles. The horizontal viewing angle is based on the vertical normal of the display panel 10 (the imaginary vertical line in the center of the display panel 10), while the vertical viewing angle is based on the horizontal normal. The range of angles in which the content displayed on the display panel 10 can be clearly seen in both the horizontal and vertical viewing angles can be understood as the range related to the viewing angle. For example, if the horizontal viewing angle of a display panel 10 is 178°, it means that the content of the display panel 10 can be viewed well from within a range of 89° to the left and right of the front of the display panel 10. 89° is half of the horizontal viewing angle range.

[0078] In this embodiment, the first reflective layer 130 is provided with multiple first holes 131 corresponding to multiple light-emitting chips 120, and the second reflective layer 140 is provided with multiple second holes 141 corresponding to multiple light-emitting chips 120. The bottom area of ​​the first hole 131 is smaller than the top area of ​​the first hole 131, and the bottom area of ​​the second hole 141 is larger than the top area of ​​the second hole 141. Therefore, a portion of the first light beam emitted from the light-emitting chip 120 can be reflected by the inner wall of the first hole 131 before being emitted; a portion of the second light beam emitted from the light-emitting chip 120 can be reflected by the inner wall of the second hole 141 to the inner wall of the first hole 131, and then reflected by the inner wall of the first hole 131 before being emitted. Furthermore, the angle between the second light beam and the viewing angle is within a smaller range than the angle between the first light beam and the viewing angle. Thus, the display panel 10 in this embodiment can converge large-angle light and light with angles smaller than large-angle light, reducing the waste of lateral light and thereby improving light utilization.

[0079] In some embodiments, the display panel 10 provided in this application may further include a driving circuit 200, which is electrically connected to the light-emitting device 100 and is used to provide a driving signal to the light-emitting device 100 to control the light-emitting state of the light-emitting layer of the light-emitting device 100, such as brightness and color, so as to achieve efficient and stable light-emitting display function.

[0080] For example, in some embodiments, the light-emitting device 100 may include a logic switch layer 180, which is disposed between the substrate 110 and the light-emitting chip 120, and the number of logic switch layers 180 corresponds to the number of light-emitting chips 120. It is used to electrically connect the driving circuit 200 and the light-emitting chip 120 and to transmit the driving signal output by the driving circuit 200 to the light-emitting chip 120.

[0081] Combination Figure 5 As shown, Figure 5 The second schematic diagram of the structure of the light-emitting device 100 in one embodiment of this application is shown. In some embodiments, the light-emitting device 100 in this application includes a refractive layer 150. The refractive layer 150 is disposed on the surface of the second reflective layer 140 away from the substrate 110. The refractive layer 150 is provided with a plurality of third holes 151 corresponding to a plurality of light-emitting chips 120. The refractive layer 150 includes a third bottom surface that is in contact with the second top surface, a third top surface that is away from the second reflective layer 140, and a third inner surface that connects the third bottom surface and the third top surface. The third inner surface forms the inner wall of the third hole 151. The bottom surface of the third hole 151 coincides with the top surface of the second hole 141, and the bottom surface area of ​​the third hole 151 is larger than the top surface area of ​​the third hole 151.

[0082] In the embodiments of this application, see the appendix. Figure 6 and attached Figure 7 , attached Figure 6 An optical path diagram of a portion of the third beam in one embodiment of this application is shown. (Attached) Figure 7 The diagram illustrates the optical path of a portion of the fourth beam in one embodiment of this application. A portion of the third beam emitted from the light-emitting chip 120 is refracted by the third inner side surface (the inner wall of the third hole 151) before exiting. The third beam is a beam whose angle with the positive viewing angle is within a third angular range, which is smaller than the second angular range. A portion of the fourth beam emitted from the light-emitting chip 120 is reflected sequentially by the first inner side surface (the inner wall of the first hole 131) and refracted by the third inner side surface (the inner wall of the third hole 151) before exiting. The fourth beam is a beam whose angle with the positive viewing angle is within a fourth angular range, which is larger than the first angular range.

[0083] In this embodiment, please refer to the appendix. Figure 6 The light beam is shown by the dashed line at the midpoint. Without the refractive layer 150, if the light beam emitted from the light-emitting chip 120 is within a certain angle range from the normal viewing angle, the second reflective layer 140 may reflect the light beam emitted from the light-emitting chip 120 to adjacent light-emitting chips 120, thus causing light crosstalk. In this embodiment, by providing the refractive layer 150 on the surface of the second reflective layer 140 facing away from the substrate 110, the refractive layer 150 can refract the light beam reflected by the first refractive layer 150 from the second reflective layer 140 or the first reflective layer 130, thereby adjusting the emission angle of the final emitted light beam to be closer to the normal direction, thus reducing the risk of light crosstalk.

[0084] Combination Figure 8 As shown, Figure 8 The third schematic diagram shows the structure of a light-emitting device 100 according to one embodiment of this application. In some embodiments, the light-emitting device 100 in this application includes a spacer layer 160. The spacer layer 160 is disposed on the surface of the second reflective layer 140 on the side opposite to the substrate 110.

[0085] The light-emitting device 100 in this embodiment includes a lens layer 170. The lens layer 170 is disposed on the surface of the spacer layer 160 facing away from the substrate 110. The lens layer 170 has a plurality of protrusion structures, which are correspondingly disposed with a plurality of light-emitting chips 120. The orthogonal projection of the protrusion structures onto the substrate 110 covers the orthogonal projection of the top surface of the third hole 151 onto the substrate 110.

[0086] The third or fourth beam emitted through the refractive layer 150 is also used to be emitted after being deflected by the spacer layer 160 and the lens layer 170.

[0087] In the embodiments of this application, see the appendix. Figure 9 , attached Figure 9The optical path diagram of the fifth beam in one embodiment of this application is shown. The fifth beam emitted from the light-emitting chip 120 is emitted through the spacer layer 160 to the lens layer 170, and is collimated by the lens layer 170 before being emitted. The fifth beam is a beam within the fifth angle range of the positive viewing angle, and the fifth angle range is smaller than the third angle range.

[0088] In this embodiment, the spacer layer 160 can precisely control the optical spacing between each light-emitting chip 120 and the corresponding lens layer 170, thereby ensuring good uniformity and consistency among the multiple light-emitting chips 120. The lens layer 170 has multiple protrusion structures, which can shape and focus at least a portion of the light beam emitted by the corresponding light-emitting chip 120. This not only improves light utilization and enhances display quality but also helps reduce crosstalk between adjacent light-emitting chips 120, thereby improving display clarity and accuracy.

[0089] In MicroLED applications, the substrate 110 is stripped away. Since the material of the light-emitting chip 120 can be gallium nitride (GaN) or aluminum gallium indium phosphide (AlGaInphosphide), and GaN has a higher refractive index (n=~2.4) and AlGaInphosphide has an even higher refractive index (n=~3.3), significantly different from the refractive index of air (n=1), the total internal reflection angle is very small. Therefore, a large amount of light cannot escape from the light-emitting chip 120, resulting in energy loss. Based on this, in some embodiments of this application, at least a portion of the first hole 131, the second hole 141, and the third hole 151 are filled with optical material. The refractive index of the optical material is greater than 1 and less than the refractive index of the refractive layer 150. The refractive index of the refractive layer 150 is less than the refractive index of the spacer layer 160, and the difference between the refractive index of the spacer layer 160 and the refractive index of the lens layer 170 satisfies a preset error condition.

[0090] For example, see Appendix Figure 10 , attached Figure 10 The diagram illustrates the exit angles of a portion of the light beam emitted from the light-emitting chip 120 at the refractive layer 150, spacer layer 160, and lens layer 170. The first incident angle θ1 of the light beam emitted from the light-emitting chip 120 at the interface between the refractive layer 150 and the third aperture 151 is greater than the first refraction angle θ2 at the same interface. The second incident angle θ3 of the light beam refracted by the refractive layer 150 at the interface between the refractive layer 150 and the spacer layer 160 is greater than the second refraction angle θ4 at the same interface. The third incident angle θ5 of the light beam emitted from the lens layer 170 at the interface between the lens layer 170 and the outside is less than the third refraction angle θ6 at the same interface, causing the light beam to deflect towards the normal of the lens layer 170, thus improving the utilization rate of the final emitted light.

[0091] In this embodiment, at least a portion of the first hole 131, the second hole 141, and the third hole 151 are filled with optical material. The refractive index of the optical material is greater than 1 and less than the refractive index of the refractive layer 150. The refractive index of the refractive layer 150 is less than the refractive index of the spacer layer 160. This allows the light beam to be deflected by the refractive layer 150 and the spacer layer 160, ultimately moving closer to the normal direction, thereby reducing optical crosstalk between adjacent light-emitting chips 120. Furthermore, the difference between the refractive index of the spacer layer 160 and the refractive index of the lens layer 170 satisfies a preset error condition, enabling the light beam to propagate almost in a straight line and improving the collimation of the emitted light beam.

[0092] In some embodiments, please refer to the appendix. Figure 10 The angle θ7 between the third inner surface and the third bottom surface is greater than π / 2 and less than or equal to 5π / 6.

[0093] In this embodiment, the second incident angle θ3 of the light beam refracted by the refractive layer 150 at the interface between the refractive layer 150 and the spacer layer 160, the first refraction angle θ2 of the light beam emitted from the light-emitting chip 120 at the interface between the refractive layer 150 and the third hole 151, and the angle θ7 between the third inner surface and the third bottom surface satisfy a specific relationship: θ3 = π - θ7 - θ2. Therefore, in this embodiment, the angle θ7 between the third inner surface and the third bottom surface is greater than π / 2 and less than or equal to 5π / 6, which ensures that the second incident angle θ3 of the light beam refracted by the refractive layer 150 at the interface between the refractive layer 150 and the spacer layer 160 meets the deflection requirement, thereby enabling the refractive layer 150 to accurately deflect the light beam and effectively reduce optical crosstalk between adjacent light-emitting chips 120.

[0094] In some embodiments, each light-emitting chip 120 in this application embodiment is used to emit light within the same wavelength range. At least a portion of the first hole 131, the second hole 141, and the third hole 151 is filled with optical material, including quantum dot materials.

[0095] For example, see Appendix Figure 11 , attached Figure 11 This illustration shows one of the structural schematic diagrams of an embodiment of the present application in which optical material is filled in at least a portion of the first hole 131, the second hole 141, and the third hole 151. The optical material can fill the first hole 131 and the second hole 141, or, if a refractive layer 150 is also provided, the optical material can fill the first hole 131, the second hole 141, and the third hole 151. In this example, the optical material can contact the corresponding light-emitting chip 120, ensuring the light conversion effect of the optical material (e.g., quantum dot material) on the light beam emitted from the light-emitting chip 120, emitting a highly monochromatic light beam, improving the purity of the light emitted from the light-emitting device 100, and thus improving the display effect of the display panel.

[0096] Another example is shown in Appendix Figure 12 and attached Figure 13 , attached Figure 12 This is a second schematic diagram showing at least a portion of the optical material filling the first hole 131, the second hole 141, and the third hole 151 according to an embodiment of this application. Figure 13 This is shown as a third schematic diagram of an embodiment of the present application, illustrating the structure in which optical material is filled in at least a portion of the first hole 131, the second hole 141, and the third hole 151. The optical material may fill only the second hole 141, or it may fill both the second hole 141 and a portion of the first hole 131. Alternatively, if a refractive layer 150 is also provided, the optical material may fill the third hole 151, or it may fill both the third hole 151 and the second hole 141, or it may fill the third hole 151, the second hole 141, and a portion of the first hole 131. In this example, the optical material may be spaced apart from the corresponding light-emitting chip 120, wherein the spacer region may be filled with a space or a transparent dielectric layer. The refractive index of the transparent dielectric layer is between 1 and the refractive index of gallium nitride, which can reduce the adverse effects of heat generation from the light-emitting chip 120 on the optical material, improve the lifespan of the optical material, and protect the light-emitting chip 120.

[0097] In some embodiments, each light-emitting chip 120 is used to emit light within the same wavelength range; the optical material includes quantum dot material. At least some of the light-emitting chips 120 have different quantum dot materials for their corresponding optical materials, which are used to convert the light emitted by the corresponding light-emitting chip 120 into light within the wavelength range corresponding to the quantum dot material.

[0098] The wavelength conversion of light emitted from a light-emitting chip by quantum dots is influenced not only by the particle size of the quantum dot material, but also by various factors such as material composition, surface modification, environmental factors (e.g., temperature, matrix), and excitation light characteristics. These factors indirectly affect the emission wavelength and conversion performance by altering the electronic energy level structure, luminous efficiency, or stability of the quantum dots. The material and shell structure of the quantum dots determine their band gap (affecting the emission wavelength), and the inherent characteristics of different material systems lead to differences in emission wavelengths for the same particle size: different materials, such as cadmium selenide (CdSe) (visible light band), indium phosphide (InP) (green to red light), lead sulfide (PbS) (near-infrared), and zinc sulfide (ZnS) (ultraviolet to blue light), etc. For example, because InP has a smaller band gap, InP quantum dots of the same particle size emit longer wavelengths than CdSe quantum dots. Encasing the core with a shell (such as ZnS or CdS) can reduce surface defects, while the overall energy level can be adjusted by controlling the band gap of the shell material. For example, ZnS has a wider bandgap, restricting electron-hole pair diffusion; therefore, CdSe / ZnS core-shell quantum dots emit a slightly shorter wavelength than pure CdSe quantum dots. The wavelength conversion performance of quantum dots is the result of the combined effects of particle size, material composition, surface state, environmental conditions, and excitation parameters. Among these, particle size and material composition are the core factors determining the emission wavelength, while surface modification, temperature, and aggregation state mainly affect defects or energy level structures, leading to wavelength fine-tuning or stability changes. In practical applications, stable and accurate wavelength conversion can be achieved by optimizing material preparation processes (such as precisely controlling the core-shell structure) and the operating environment (such as temperature control design) to reduce interference from non-particle size factors.

[0099] For example, the light-emitting chip 120 emits light within the same wavelength range. After light conversion through material layers of different quantum dot materials, the quantum dots efficiently convert the light into monochromatic light of a specific wavelength based on their own material properties. For instance, the blue-emitting chip 120 can convert blue light into pure green light of 520nm-550nm using green quantum dots (such as 2nm-3nm CdSe / zinc sulfide ZnS or InP / ZnS), and into pure red light of 620nm-650nm using red quantum dots (such as 5nm-8nm homologous materials). If yellow quantum dots are used, it can be converted into yellow light of 580nm-600nm, and so on. Therefore, by using the same wavelength-emitting chip 120 with different quantum dot materials, light beams of different wavelength ranges (light beams of different colors) can be produced, achieving a high color gamut display. By using the same batch of blue light chips paired with green and red quantum dot material layers, green and red light can be directly produced, which, together with the unconverted blue light, form RGB (red, green, and blue) three primary colors, achieving high color gamut display.

[0100] Furthermore, if multiple different types of quantum dots are mixed in proportion to form a material layer, the light beam emitted by the light-emitting chip 120 will be converted to output a composite light of multiple monochromatic lights, such as white light.

[0101] In this embodiment, the optical material includes quantum dot material. At least some of the light-emitting chips 120 correspond to different quantum dot materials. In addition to adjusting the wavelength range of the light beam emitted by the light-emitting device 100, it can also improve the color purity of the emitted light beam and improve the display effect of the display panel.

[0102] In some embodiments, the type of optical material in this application may include a transparent dielectric material layer. In this embodiment, the refractive index of the transparent dielectric material layer is between 1 and the refractive index of gallium nitride, thereby increasing the total internal reflection angle of the emitted beam from the light-emitting chip 120, increasing the emitted beam, and reducing power consumption.

[0103] In some embodiments, at least a portion of the first hole 131, the second hole 141, and the third hole 151 in this application embodiment may include an air layer. In this embodiment, compared to the refractive index of the core material of the light-emitting chip 120 (e.g., GaN refractive index about 2.4, sapphire about 1.77), the refractive index of air is lower (about 1.0). When light is incident from the light-emitting chip 120 made of a high-refractive-index material to the low-refractive-index air, if the angle of incidence is greater than the critical angle, total internal reflection will occur and the light will be absorbed by the interior of the light-emitting chip 120. However, the low refractive index of air makes the critical angle smaller (e.g., the critical angle of GaN to air is about 24.6°), allowing more light incident at small angles to "escape" into the air instead of being absorbed by the light-emitting chip 120 itself or the encapsulation material of the light-emitting device 100, reducing total internal reflection loss and optimizing the extraction efficiency of the light beam emitted from the light-emitting chip 120.

[0104] In some embodiments, at least a portion of the light-emitting chip 120 is used to emit light in different wavelength ranges.

[0105] For example, some of the light-emitting chips 120 emit blue light with a wavelength range of 400nm to 480nm. This blue light chip provides a basic blue light source for the display device, used to present the blue tones in the image, making the blue appear purer and more vibrant, thus enhancing the visual effect. Another portion of the light-emitting chips 120 emits green light with a wavelength range of 520nm to 580nm. The light emitted by the green light chip can work in conjunction with the blue light, and through different proportions of mixing, it can produce rich green tones, improving the color saturation and layering of the green areas in the image. A third portion of the light-emitting chips 120 emits red light with a wavelength range of 620nm to 750nm. The red light emitted by the red light chip works together with the blue and green light to form a wider color gamut coverage, making the display panel display more realistic and vivid colors, significantly improving the color performance capability of the display panel, and meeting the user's demand for a high-quality visual experience.

[0106] In some embodiments, the top and bottom surfaces of the first hole, the second hole, and the third hole are all regular hexagons. The area of ​​the bottom surface of the first hole is equal to the area of ​​the top surface of the third hole, and the length of the diagonal of the top surface of the first hole is equal to the sum of the thickness of the first reflective layer, the thickness of the second reflective layer, and the thickness of the refractive layer. The thickness of the first reflective layer is equal to the sum of the thickness of the second reflective layer and the thickness of the refractive layer.

[0107] In this embodiment, the top and bottom surfaces of the first, second, and third holes are all regular hexagons. The side lengths of the regular hexagons on the top and bottom surfaces of the first hole correspond to a first preset ratio, the side lengths of the regular hexagons on the top and bottom surfaces of the second hole correspond to a second preset ratio, and the side lengths of the regular hexagons on the top and bottom surfaces of the third hole correspond to a third preset ratio. The regular hexagons have high symmetry; the area of ​​the bottom surface of the first hole is equal to the area of ​​the top surface of the third hole. This allows the light beam emitted from the light-emitting chip to be more evenly distributed within the first, second, and third holes, improving light uniformity. The diagonal length of the top surface of the first aperture is equal to the sum of the thickness of the first reflective layer, the thickness of the second reflective layer, and the thickness of the refractive layer. The thickness of the first reflective layer is equal to the sum of the thickness of the second reflective layer and the thickness of the refractive layer. This creates a more matching constraint condition for the light beam in the direction perpendicular to the top / bottom surface of each aperture and along the direction of the hexagonal plane, making the reflection path of the light beam more regular and improving the utilization rate of light.

[0108] In some embodiments, in a cross-sectional direction perpendicular to the surface of the substrate 110, the first width W1 of each light-emitting chip 120 satisfies: 0.5μm≤W1≤50μm, and the second width W2 of the first hole 131 satisfies 1.2*W1≤W2≤4*W1.

[0109] For example, the first width W1 of the light-emitting chip 120 can be 0.5μm, 1μm, 2μm, 5μm, 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, etc., and is not limited thereto.

[0110] The first height H1 of each light-emitting chip 120 satisfies: 3μm≤H1≤20μm; the thickness H2 of the first reflective layer 130 satisfies 1.2*H1≤H2≤4*H1.

[0111] For example, the first height H1 of the light-emitting chip 120 can be 3μm, 5μm, 8μm, 10μm, 12μm, 15μm, 18μm, 20μm, etc., and is not limited thereto.

[0112] In this embodiment, the light-emitting chip 120 is a micrometer-scale chip, which has a large beam divergence angle when emitting light directly. The second width W2 of the first aperture 131 is set to be 1.2 to 4 times the first width W1 of the light-emitting chip 120, and the thickness H2 of the first reflective layer 130 (i.e., the height of the first aperture 131) is 1.2 to 4 times the first height H1 of the light-emitting chip 120. When the light beam propagates within the first aperture 131, the edge light rays are restricted by the aperture wall, reducing the overall beam divergence angle and improving the directionality, making the beam more concentrated and reducing light waste. At the same time, it makes the intensity distribution of the emitted beam more uniform, avoiding the appearance of local bright spots or dark areas.

[0113] In some embodiments, a plurality of light-emitting chips 120 are arranged in an array.

[0114] The array arrangement of light-emitting chips 120 refers to arranging multiple light-emitting chips 120 into an array according to certain rules. By adjusting parameters such as the array spacing, number of rows and columns of the light-emitting chips 120, the shape and size of the light-emitting area can be flexibly changed to adapt to different application scenarios.

[0115] For example, see Appendix Figure 14 ~Appendix Figure 17 , attached Figure 14 ~Appendix Figure 17 A top view is shown of four different array arrangements of 120 light-emitting chips.

[0116] In this embodiment, the appendix Figure 14 Appendix Figure 15 and attached Figure 17 The array arrangement structure shown is attached. Figure 14 and attached Figure 15 In the top view, the first reflective layer 130, the second reflective layer 140, and the first aperture 131, the second aperture 141, and the third aperture 151 are polygonal, which can more effectively guide light, causing the light to converge towards the center and reducing light loss, compared to the attached... Figure 17 The top-down view of the first reflective layer 130, the second reflective layer 140, and the first aperture 131, the second aperture 141, and the third aperture 151 shown is circular. This polygonal, multi-sided (multi-reflective surface) arrangement provides superior light-gathering performance. Furthermore, the circular layout allows the reflective surfaces to have a uniform curvature, enabling the light beam to be distributed and focused more evenly within the circumference. (See attached image.) Figure 16 The top view of the first reflective layer 130, the second reflective layer 140, the first hole 131, the second hole 141, and the third hole 151 shown is square, which can reduce the difficulty of preparation during the preparation process.

[0117] In this embodiment, the array arrangement of the light-emitting chips 120 significantly improves luminous efficiency and uniformity. The coordinated emission of multiple chips results in more uniform brightness across the entire luminous area, reducing the appearance of light spots and dark areas. Furthermore, compared to a single light-emitting chip 120, the array arrangement can concentrate more luminous flux, thereby increasing luminous intensity and meeting the requirements of various display fields for high brightness and uniformity, effectively improving the display quality of the display panel image.

[0118] In some embodiments, a plurality of light-emitting chips 120 are arranged in multiple columns, and the centers of adjacent columns of light-emitting chips 120 are offset in a direction perpendicular to the column direction.

[0119] For example, see Appendix Figure 18 , attached Figure 18 The illustration shows a top view of an embodiment of the present application in which multiple light-emitting chips 120 are arranged in multiple columns, with the centers of adjacent columns of light-emitting chips 120 offset in a direction perpendicular to the column direction.

[0120] In this embodiment, multiple light-emitting chips 120 are arranged in multiple columns, and the centers of adjacent columns of light-emitting chips 120 are staggered in a direction perpendicular to the column direction, so that multiple light-emitting chips 120 can be arranged in a close arrangement to achieve the highest space utilization rate, thereby increasing the number of light-emitting chips 120 in the same area, thereby improving the resolution and display effect of the display panel.

[0121] In some embodiments, the light-emitting device 100 of this application includes a substrate 110, a plurality of light-emitting chips 120 disposed on the surface of the substrate 110, a logic switch layer 180 disposed between the substrate 110 and the light-emitting chips 120, a first reflective layer 130 disposed on the portion of the surface of the substrate 110 where no light-emitting chips 120 are disposed, a second reflective layer 140 disposed on the surface of the first reflective layer 130 facing away from the substrate 110, a spacer layer 160 disposed on the surface of the second reflective layer 140 facing away from the substrate 110, and a lens layer 170 disposed on the surface of the spacer layer 160 facing away from the substrate 110. The first reflective layer 130 is provided with a plurality of first holes 131 corresponding to the light-emitting chips 120. The first reflective layer 130 includes a first bottom surface that is in contact with the substrate 110, a first top surface that is away from the substrate 110, and a first inner surface that connects the first bottom surface and the first top surface. The first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131. The second reflective layer 140 is provided with a plurality of second holes 141 corresponding to a plurality of light-emitting chips 120. The second reflective layer 140 includes a second bottom surface that is in contact with the first top surface, a second top surface that is away from the first reflective layer 130, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole 141. The bottom surface of the second hole 141 coincides with the top surface of the first hole 131. The bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141.

[0122] The logic switch layer 180 can be connected to the driving circuit 200 to transmit the driving signal output by the driving circuit 200 to the corresponding light-emitting chip 120, and the light-emitting chip 120 emits light under the drive of the driving signal.

[0123] For example, see Appendix Figure 19 , attached Figure 19This illustration shows one of the fabrication process diagrams of the light-emitting device 100 in this application embodiment. The fabrication process of the light-emitting device 100 in this application embodiment may include: 1. Integrating light-emitting chips 120 onto a substrate 110 on which a logic switch layer 180 is disposed; 2. Fabricating a first reflective layer 130 at a location on the surface of the substrate 110 where no light-emitting chips 120 are disposed; 3. Distributing a plurality of first holes 131 at the locations of the first reflective layer 130 corresponding to the positions of the light-emitting chips 120, such that the first reflective layer 130 includes a first bottom surface that is in contact with the substrate 110, a first top surface that is away from the substrate 110, and a first inner surface connecting the first bottom surface and the first top surface, wherein the first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131; 4. On the side of the first reflective layer 130 away from the substrate 110 A second reflective layer 140 is prepared on the surface of the first reflective layer 130, wherein the second reflective layer 140 is provided with a plurality of second holes 141 corresponding to a plurality of light-emitting chips 120. The second reflective layer 140 includes a second bottom surface that is in contact with the first top surface, a second top surface that is away from the first reflective layer 130, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole 141. The bottom surface of the second hole 141 coincides with the top surface of the first hole 131, and the bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141. Fifth, a spacer layer 160 is prepared on the surface of the second reflective layer 140 away from the substrate 110, and the thickness of the spacer layer 160 is adjusted to control the spacing. Sixth, a lens layer 170 is prepared on the surface of the spacer layer 160 away from the substrate 110.

[0124] Another example is shown in Appendix Figure 20 , attached Figure 20The second schematic diagram shows the fabrication process of the light-emitting device 100 in the embodiments of this application. The process of fabricating the light-emitting device 100 described in the embodiments of this application may include: 1. providing a temporary substrate 111; 2. fabricating a first reflective layer 130 on the surface of the substrate 110, wherein the first reflective layer 130 is provided with a plurality of first holes 131 corresponding to the light-emitting chip 120, the first reflective layer 130 includes a first bottom surface attached to the substrate 110, a first top surface away from the substrate 110, and a first inner surface connecting the first bottom surface and the first top surface, wherein the first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131; 3. fabricating a sacrificial layer 1100 at a position on the surface of the substrate 110 where the first reflective layer 130 is not provided; 4. fabricating a second reflective layer 140 on the surface of the second reflective layer 140 away from the substrate 110, wherein the second reflective layer 140 is provided with a plurality of second holes 141 corresponding to the plurality of light-emitting chips 120, and the second reflective layer 140 includes a second bottom surface attached to the first top surface, a first top surface away from the first reflective layer 110, a first bottom surface attached to the substrate 110, a first top surface away from the substrate ... The first reflective layer 130 has a second top surface and a second inner surface connecting the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole 141. The bottom surface of the second hole 141 coincides with the top surface of the first hole 131, and the bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141. Fifth, a spacer layer 160 is prepared on the surface of the second reflective layer 140 facing away from the substrate 110, and the spacing is adjusted. Sixth, a lens layer 170 is prepared on the surface of the spacer layer 160 facing away from the second reflective layer 140. Seventh, the temporary substrate 111 is removed. Eighth, the sacrificial layer 1100 is removed, and the first hole 131 of the first reflective layer 130 and the second hole 141 of the second reflective layer 140 are filled with a medium or quantum dot material with adjustable refractive index. Ninth, the structure prepared in step eight is flipped in the thickness direction of the light-emitting device 100. Tenth, the structure prepared in step nine is integrated with the substrate 110 on which the logic switch layer 180 is provided.

[0125] In some embodiments, the light-emitting device 100 in this application includes a substrate 110, a plurality of light-emitting chips 120 disposed on the surface of the substrate 110, a logic switch layer 180 disposed between the substrate 110 and the light-emitting chips 120, a first reflective layer 130 disposed on the surface of the substrate 110, a second reflective layer 140 disposed on the surface of the first reflective layer 130 away from the substrate 110, a refractive layer 150 disposed on the surface of the second reflective layer 140 away from the substrate 110, a spacer layer 160 disposed on the surface of the refractive layer 150 away from the substrate 110, and a lens layer 170 disposed on the surface of the spacer layer 160 away from the substrate 110. The first reflective layer 130 has multiple first holes 131 corresponding to the light-emitting chip 120. The first reflective layer 130 includes a first bottom surface that is attached to the substrate 110, a first top surface that is away from the substrate 110, and a first inner surface that connects the first bottom surface and the first top surface. The first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131. The second reflective layer 140 has multiple second holes 141 corresponding to the multiple light-emitting chips 120. The second reflective layer 140 includes a second bottom surface that is attached to the first top surface, a second top surface that is away from the first reflective layer 130, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole 141, the bottom surface of the second hole 141 coincides with the top surface of the first hole 131, and the bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141. The refractive layer 150 is provided with multiple third holes 151 corresponding to multiple light-emitting chips 120. The refractive layer 150 includes a third bottom surface that is in contact with the second top surface, a third top surface that is away from the second reflective layer 140, and a third inner surface that connects the third bottom surface and the third top surface. The third inner surface forms the inner wall of the third hole 151. The bottom surface of the third hole 151 coincides with the top surface of the second hole 141. The bottom surface area of ​​the third hole 151 is larger than the top surface area of ​​the third hole 151. The logic switch layer 180 can be connected to the driving circuit 200 to transmit the driving signal output by the driving circuit 200 to the corresponding light-emitting chip 120. The light-emitting chip 120 emits light under the drive of the driving signal.

[0126] For example, see Appendix Figure 21 , attached Figure 21This is shown as the third schematic diagram of the fabrication process of the light-emitting device 100 in this embodiment of the application. The fabrication process of the light-emitting device 100 in this embodiment of the application may include: 1. Integrating light-emitting chips 120 onto a substrate 110 on which a logic switch layer 180 is disposed; 2. Fabricating a first reflective layer 130 at a position on the surface of the substrate 110 where no light-emitting chip 120 is disposed; 3. Distributing a plurality of first holes 131 at the positions of the first reflective layer 130 corresponding to the positions of the light-emitting chips 120, such that the first reflective layer 130 includes a first bottom surface that is attached to the substrate 110, a first top surface that is away from the substrate 110, and a first bottom surface that is connected to the first bottom surface. A first inner surface between the bottom surface and the first top surface, wherein the first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131; Fourth, a second reflective layer 140 is prepared on the surface of the first reflective layer 130 facing away from the substrate 110, wherein the second reflective layer 140 is provided with a plurality of second holes 141 corresponding to a plurality of light-emitting chips 120, and the second reflective layer 140 includes a second bottom surface that is attached to the first top surface, a second top surface that is away from the first reflective layer 130, and a surface connected to the second bottom surface. A second inner surface between the second top surface and the second bottom surface, wherein the second inner surface forms the inner wall of the second hole 141, the bottom surface of the second hole 141 coincides with the top surface of the first hole 131, and the bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141; Fifth, a refractive layer 150 is prepared on the surface of the second reflective layer 140 away from the first reflective layer 130, wherein the refractive layer 150 is provided with a plurality of third holes 151 corresponding to a plurality of light-emitting chips 120, and the refractive layer 150 includes a third bottom surface that is attached to the second top surface and a third bottom surface that is away from the second reflective layer 130. The third top surface of layer 140 and the third inner surface connecting the third bottom surface and the third top surface, wherein the third inner surface forms the inner wall of the third hole 151, the bottom surface of the third hole 151 coincides with the top surface of the second hole 141, and the bottom surface area of ​​the third hole 151 is larger than the top surface area of ​​the third hole 151; sixth, a spacer layer 160 is prepared on the surface of the refractive layer 150 away from the substrate 110, and the thickness of the spacer layer 160 is adjusted to control the spacing; seventh, a lens layer 170 is prepared on the surface of the spacer layer 160 away from the substrate 110.

[0127] Another example is shown in Appendix Figure 22 , attached Figure 22This is shown as the fourth schematic diagram of the fabrication process of the light-emitting device 100 in the embodiments of this application. The fabrication process of the light-emitting device 100 in the embodiments of this application may include: 1. providing a temporary substrate 111; 2. fabricating a first reflective layer 130 on the surface of the substrate 110, wherein the first reflective layer 130 is provided with a plurality of first holes 131 corresponding to the light-emitting chip 120, the first reflective layer 130 includes a first bottom surface that is attached to the substrate 110, a first top surface that is away from the substrate 110, and a first inner surface that connects the first bottom surface and the first top surface, wherein the first inner surface forms the inner wall of the first hole 131, and the bottom surface area of ​​the first hole 131 is smaller than the top surface area of ​​the first hole 131; 3. not providing a first reflective layer on the surface of the substrate 110. A sacrificial layer 1100 is prepared at position 130; Fourth, a second reflective layer 140 is prepared on the surface of the second reflective layer 140 facing away from the substrate 110. The second reflective layer 140 is provided with multiple second holes 141 corresponding to multiple light-emitting chips 120. The second reflective layer 140 includes a second bottom surface that is attached to the first top surface, a second top surface that is away from the first reflective layer 130, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole 141. The bottom surface of the second hole 141 coincides with the top surface of the first hole 131, and the bottom surface area of ​​the second hole 141 is larger than the top surface area of ​​the second hole 141; Fifth, in A refractive layer 150 is formed on the surface of the second reflective layer 140 facing away from the first reflective layer 130. The refractive layer 150 has multiple third holes 151 corresponding to the multiple light-emitting chips 120. The refractive layer 150 includes a third bottom surface that is in contact with the second top surface, a third top surface away from the second reflective layer 140, and a third inner surface connecting the third bottom surface and the third top surface. The third inner surface forms the inner wall of the third hole 151. The bottom surface of the third hole 151 coincides with the top surface of the second hole 141, and the bottom surface area of ​​the third hole 151 is larger than the top surface area. Sixth, on the surface of the refractive layer 150 facing away from the substrate 110, the refractive layer 150 faces away from the substrate. 110. Prepare a spacer layer 160 on one side of the surface and adjust the spacing; 2. Prepare a lens layer 170 on the side of the spacer layer 160 facing away from the second reflective layer 140; 3. Remove the temporary substrate 111; 4. Remove the sacrificial layer 1100 and fill the first hole 131 of the first reflective layer 130, the second hole 141 of the second reflective layer 140 and the third hole 151 in the refractive layer 150 with a medium or quantum dot material that adjusts the refractive index; 5. Flip the structure prepared in step 8 in the thickness direction of the light-emitting device 100; 6. Integrate the structure prepared in step 9 with the substrate 110 on which the logic switch layer 180 is provided.

[0128] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0129] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Light-emitting devices, including: Substrate; Multiple light-emitting chips are spaced apart on the surface of the substrate; A first reflective layer is disposed on the surface of the substrate. The first reflective layer has a plurality of first holes corresponding to the plurality of light-emitting chips. The first reflective layer includes a first bottom surface that is in contact with the substrate, a first top surface that is away from the substrate, and a first inner surface that connects the first bottom surface and the first top surface. The first inner surface forms the inner wall of the first hole, and the bottom surface area of ​​the first hole is smaller than the top surface area of ​​the first hole. The second reflective layer is disposed on the surface of the first reflective layer away from the substrate. The second reflective layer has a plurality of second holes corresponding to the plurality of light-emitting chips. The second reflective layer includes a second bottom surface that is in contact with the first top surface, a second top surface that is away from the first reflective layer, and a second inner surface that connects the second bottom surface and the second top surface. The second inner surface forms the inner wall of the second hole. The bottom surface of the second hole coincides with the top surface of the first hole. The bottom surface area of ​​the second hole is larger than the top surface area of ​​the second hole.

2. The display panel according to claim 1, characterized in that, The light-emitting device includes: A refractive layer is disposed on the surface of the second reflective layer away from the substrate. The refractive layer has multiple third holes corresponding to the multiple light-emitting chips. The refractive layer includes a third bottom surface that is in contact with the second top surface, a third top surface that is away from the second reflective layer, and a third inner surface that connects the third bottom surface and the third top surface. The third inner surface forms the inner wall of the third hole. The bottom surface of the third hole coincides with the top surface of the second hole. The bottom surface area of ​​the third hole is larger than the top surface area of ​​the third hole.

3. The display panel according to claim 2, characterized in that, The light-emitting device includes: A spacer layer is disposed on the second reflective layer and the surface facing away from the substrate; A lens layer is disposed on the surface of the spacer layer opposite to the substrate. The lens layer has multiple protrusion structures, and the multiple protrusion structures are correspondingly disposed with multiple light-emitting chips. The orthogonal projection of the protrusion structures on the substrate covers the orthogonal projection of the top surface of the third hole on the substrate.

4. The display panel according to claim 3, characterized in that, At least a portion of the first hole, the second hole, and the third hole is filled with an optical material, the refractive index of which is greater than 1 and less than the refractive index of the refractive layer, the refractive index of which is less than the refractive index of the spacer layer, and the difference between the refractive index of the spacer layer and the refractive index of the lens layer satisfies a preset error condition.

5. The display panel according to claim 3, characterized in that, Each of the light-emitting chips is used to emit light within the same wavelength range; at least a portion of the first hole, the second hole, and the third hole is filled with optical material, the type of which includes quantum dot material; At least some of the light-emitting chips are filled with different quantum dot materials in their respective holes, which is used to convert the light emitted from the corresponding light-emitting chip into light with a wavelength range corresponding to the quantum dot material.

6. The display panel according to claim 2, characterized in that, The top and bottom surfaces of the first hole, the second hole, and the third hole are all regular hexagons. The bottom surface area of ​​the first hole is equal to the top surface area of ​​the third hole. The diagonal length of the top surface of the first hole is equal to the sum of the thickness of the first reflective layer, the thickness of the second reflective layer, and the thickness of the refractive layer. The thickness of the first reflective layer is equal to the sum of the thickness of the second reflective layer and the thickness of the refractive layer.

7. The display panel according to claim 2, characterized in that, The angle between the third inner surface and the third bottom surface is greater than π / 2 and less than or equal to 5π / 6.

8. The display panel according to claim 1, characterized in that, At least a portion of the light-emitting chip is used to emit light in different wavelength ranges.

9. The display panel according to claim 1, characterized in that, In a cross-sectional view perpendicular to the surface of the substrate, the first width W1 of each light-emitting chip satisfies: 0.5μm≤W1≤50μm, and the second width W2 of the first hole satisfies 1.2*W1≤W2≤4*W1; The first height H1 of each of the light-emitting chips satisfies: 3μm≤H1≤20μm; the thickness H2 of the first reflective layer satisfies 1.2*H1≤H2≤4*H1.

10. The display panel according to claim 1, characterized in that, Multiple light-emitting chips are arranged in an array; or, The light-emitting chips are arranged in multiple columns, and the centers of the light-emitting chips in adjacent columns are staggered in a direction perpendicular to the column direction.

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