A high power density light source structure

Abstract

The utility model discloses a kind of high power density light source structures, including at least one first light-emitting column;First light-emitting column includes multiple first chips and multiple second chips arranged along first direction, in the same column first light-emitting column, two first chips are adjacent or first chip and second chip are adjacent;First chip is provided with first anode and first cathode, first anode is arranged at the front of first chip, first cathode is arranged at the back of first chip;Second chip is provided with second anode and second cathode, second anode and second cathode are all arranged at the front of second chip;All first chips in the same column first light-emitting column are connected in series, all second chips in the same column first light-emitting column are connected in series.The power density of the utility model has been improved compared with traditional light source structure, and volume, weight and the light-emitting surface of light source are all reduced compared with the volume, weight and the light-emitting surface of light source of traditional light source structure.

Description

Technical Field

[0001] This utility model belongs to the field of lighting source technology, specifically relating to a high power density light source structure. Background Technology

[0002] With the increasing popularity and application of LED lighting, special lighting fields, such as photographic fill light, stage lighting, and outdoor mobile lighting, require LED luminaires to be small, portable, and have high requirements for controlling the size and weight of the luminaires. The size of the light-emitting surface of the LED light source will directly affect the aperture of the optical lens design of the luminaire, thus determining the size and weight of the luminaire.

[0003] Currently, the light-emitting surfaces of commonly used four-color or higher LED photography lights are generally large, and their power density (power density refers to the ratio of the light source's electrical power to the area of ​​the light-emitting surface) is generally below 0.8w / mm2. As a result, the light-emitting surface is large, which in turn leads to the larger size and weight of the lamps. Utility Model Content

[0004] To overcome at least one of the defects described in the prior art, this utility model provides a high power density light source structure, including at least one first light-emitting column. The first light-emitting column includes a plurality of first chips and a plurality of second chips arranged along a first direction. The first positive electrode and the first negative electrode of the first chip are respectively disposed on its front and back sides, and the second positive electrode and the second negative electrode of the second chip are both disposed on its front side. This facilitates the wiring and routing of the first chip and the second chip, thereby improving the power density of this utility model compared to traditional light source structures. Furthermore, the volume, weight, and light-emitting surface of the light source are all reduced compared to traditional light source structures.

[0005] The technical solution adopted by this utility model to solve its problem is: A high power density light source structure includes at least one first light-emitting column; The first light-emitting column includes a plurality of first chips and a plurality of second chips arranged along a first direction. In the same column of the first light-emitting column, two first chips are arranged adjacent to each other or a first chip and a second chip are arranged adjacent to each other. The first chip has a first positive electrode and a first negative electrode. The first positive electrode is located on the front side of the first chip, and the first negative electrode is located on the back side of the first chip. The second chip has a second positive electrode and a second negative electrode, both of which are located on the front side of the second chip. All first chips in the first light-emitting column of the same column are connected in series, and all second chips in the first light-emitting column of the same column are connected in series.

[0006] As an optional implementation, in the same first light-emitting column, two adjacent first chips are electrically connected through a first pad, and two adjacent second chips are electrically connected through a second pad.

[0007] As an optional implementation, the high power density light source structure also includes at least one second light-emitting column; The second light-emitting column is formed by arranging multiple third chips along the first direction, and all the third chips are connected in series; The third chip has a third positive electrode and a third negative electrode, both of which are located on the front side of the third chip.

[0008] As an optional implementation, the high power density light source structure also includes at least one third light-emitting column; The third light-emitting column is formed by arranging multiple fourth chips along the first direction, and all the fourth chips are connected in series; The fourth chip has a fourth positive electrode and a fourth negative electrode, both of which are located on the front side of the fourth chip.

[0009] As an alternative implementation, the first chip emits light of a first color, the second chip emits light of a second color, the third chip emits light of a third color, and the fourth chip emits light of a fourth color.

[0010] As an alternative implementation, the first color is red, the second color is blue, the third color is green, and the fourth color is white.

[0011] As an optional implementation, the high power density light source structure includes n first light-emitting columns, n second light-emitting columns, and 2n third light-emitting columns, where n is a positive integer greater than or equal to 1; The high power density light source structure has a first light-emitting column, a second light-emitting column, and a third light-emitting column on both sides of the central axis; The colors of the light emitted by the first light-emitting columns located on both sides of the central axis of the high power density light source structure are symmetrical about their central axis; the colors of the light emitted by the second light-emitting columns located on both sides of the central axis of the high power density light source structure are symmetrical about their central axis; and the colors of the light emitted by the third light-emitting columns located on both sides of the central axis of the high power density light source structure are symmetrical about their central axis. The direction of the central axis of the high power density light source structure is parallel to the first direction.

[0012] As an optional implementation, the high power density light source structure includes 4 first light-emitting columns, 4 second light-emitting columns, and 8 third light-emitting columns.

[0013] As an optional implementation, the high power density light source structure also includes a substrate structure, which includes a first substrate and a second substrate. The first chip and the second chip are both disposed on the first substrate, and the first substrate is disposed on the second substrate.

[0014] As an optional implementation, the first substrate is a high thermal conductivity ceramic substrate, and the second substrate is a thermoelectrically separated copper substrate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention includes at least one first light-emitting column, which includes multiple first chips and multiple second chips arranged along a first direction. The first positive electrode and the first negative electrode of the first chip are respectively disposed on its front and back sides, and the second positive electrode and the second negative electrode of the second chip are both disposed on its front side. This facilitates the wiring and routing of the first chip and the second chip, thereby improving the power density of this invention compared to traditional light source structures. Furthermore, the volume, weight, and light-emitting surface of the light source are all reduced compared to traditional light source structures. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a first-view structural schematic diagram of an embodiment of the present invention.

[0018] Figure 2 This is an embodiment of the present utility model. Figure 1 A partial structural diagram.

[0019] Figure 3 This is an embodiment of the present utility model. Figure 2 A partial structural diagram.

[0020] Figure 4 This is a schematic diagram of the internal structure from a second perspective of an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the structure of the first chip in an embodiment of this utility model.

[0022] Figure 6 This is a schematic diagram of the structure of the second chip in an embodiment of this utility model.

[0023] Figure 7 This is a schematic diagram of the structure of the third chip in an embodiment of this utility model.

[0024] Figure 8 This is a schematic diagram of the structure of the fourth chip in this embodiment of the present invention.

[0025] Explanation of key figure labels: 10. First light-emitting column; 101. First chip; 111. First positive electrode; 112. First negative electrode; 102. Second chip; 121. Second positive electrode; 122. Second negative electrode; 103. First pad; 104. Second pad; 20. Second light-emitting column; 1201. Third chip; 211. Third positive electrode; 212. Third negative electrode; 30. Third light-emitting column; 301. Fourth chip; 311. Fourth positive electrode; 312. Fourth negative electrode; 40. Substrate structure; 401. First substrate; 402. Second substrate. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0028] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0029] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0030] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0031] The technical solution of this utility model will be further described below with reference to the embodiments and accompanying drawings.

[0032] See Figures 1 to 8 This utility model discloses a high power density light source structure, including at least one first light-emitting column 10. The first light-emitting column 10 includes a plurality of first chips 101 and a plurality of second chips 102 arranged along a first direction. In the same column of the first light-emitting column 10, two first chips 101 are arranged adjacent to each other or a first chip 101 and a second chip 102 are arranged adjacent to each other. A first positive electrode 111 and a first negative electrode 112 are provided on the first chip 101. The first positive electrode 111 is located on the front side of the first chip 101, and the first negative electrode 112 is located on the back side of the first chip 101. A second positive electrode 121 and a second negative electrode 122 are provided on the second chip 102. Both the second positive electrode 121 and the second negative electrode 122 are located on the front side of the second chip 102. All the first chips 101 in the same column of the first light-emitting column 10 are connected in series, and all the second chips 102 in the same column of the first light-emitting column 10 are connected in series.

[0033] It should be noted that the high power density light source structure includes one first light-emitting column 10 or at least two first light-emitting columns 10. When at least two first light-emitting columns 10 are provided, the at least two first light-emitting columns 10 are arranged along a second direction, which is a direction perpendicular to the first direction. The first direction is the Y-axis direction in the coordinate system, and the second direction is the X-axis direction in the coordinate system.

[0034] See Figures 1 to 3 In order to facilitate the series connection of all the second chips 102 in the same column of the first light-emitting column 10 and to facilitate wiring, in the same column of the first light-emitting column 10, the second positive electrode 121 of one of the second chips 102 and the second negative electrode 122 of the adjacent second chip 102 are arranged close to each other and connected in series by wires, and the second negative electrode 122 of one of the second chips 102 and the second positive electrode 121 of the adjacent second chip 102 are arranged close to each other and connected in series by wires.

[0035] This utility model includes at least one first light-emitting column 10, which includes a plurality of first chips 101 and a plurality of second chips 102 arranged along a first direction. The first positive electrode 111 and the first negative electrode 112 of the first chip 101 are respectively disposed on its front and back sides, and the second positive electrode 121 and the second negative electrode 122 of the second chip 102 are both disposed on its front side, which facilitates the wiring of the first chip 101 and the second chip 102, so that the power density of this utility model is improved compared with the traditional light source structure, and the volume, weight and light-emitting surface of the light source are reduced compared with the traditional light source structure.

[0036] In this embodiment of the present invention, in the same column of first light-emitting columns 10, two adjacent first chips 101 are electrically connected through a first pad 103, and two adjacent second chips 102 are electrically connected through a second pad 104.

[0037] In this embodiment of the present invention, the high power density light source structure further includes at least one second light-emitting column 20; the second light-emitting column 20 is formed by arranging a plurality of third chips 201 along a first direction, and all the third chips 201 are connected in series; a third positive electrode 211 and a third negative electrode 212 are provided on the third chip 201, and the third positive electrode 211 and the third negative electrode 212 are both provided on the front side of the third chip 201.

[0038] It should be noted that the high power density light source structure includes one second light-emitting column 20 or at least two second light-emitting columns 20. When at least two second light-emitting columns 20 are provided, the at least two second light-emitting columns 20 are arranged along the second direction.

[0039] See Figures 1 to 3 In order to facilitate the series connection of all the third chips 201 in the same column of the second light-emitting column 20 and to facilitate wiring, in the same column of the second light-emitting column 20, the third positive electrode 211 of one of the third chips 201 and the third negative electrode 212 of the adjacent third chip 201 are arranged close to each other and connected in series by wires, and the third negative electrode 212 of one of the third chips 201 and the third positive electrode 211 of the adjacent third chip 201 are arranged close to each other and connected in series by wires.

[0040] In this embodiment of the present invention, the high power density light source structure further includes at least one third light-emitting column 30; the third light-emitting column 30 is formed by arranging a plurality of fourth chips 301 along a first direction, and all the fourth chips 301 are connected in series; the fourth chip 301 is provided with a fourth positive electrode 311 and a fourth negative electrode 312, and the fourth positive electrode 311 and the fourth negative electrode 312 are both disposed on the front side of the fourth chip 301.

[0041] It should be noted that the high power density light source structure includes one column of third light-emitting columns 30 or at least two columns of third light-emitting columns 30. When at least two columns of third light-emitting columns 30 are provided, the at least two columns of third light-emitting columns 30 are arranged along the second direction.

[0042] See Figures 1 to 3 In order to facilitate the series connection of all fourth chips 301 in the same column of the third light-emitting column 30 and to facilitate wiring, in the same column of the third light-emitting column 30, the fourth positive electrode 311 of one fourth chip 301 and the fourth negative electrode 312 of the adjacent fourth chip 301 are arranged close to each other and connected in series by wires, and the fourth negative electrode 312 of one fourth chip 301 and the fourth positive electrode 311 of the adjacent fourth chip 301 are arranged close to each other and connected in series by wires.

[0043] In this embodiment of the invention, the first chip 101 emits light of a first color, the second chip 102 emits light of a second color, the third chip 201 emits light of a third color, and the fourth chip 301 emits light of a fourth color.

[0044] In this embodiment of the invention, the first color is red, the second color is blue, the third color is green, and the fourth color is white.

[0045] In this embodiment of the invention, the high-power-density light source structure includes n first light-emitting columns 10, n second light-emitting columns 20, and 2n third light-emitting columns 30, where n is a positive integer greater than or equal to 1. The high-power-density light source structure has first light-emitting columns 10, second light-emitting columns 20, and third light-emitting columns 30 arranged on both sides of its central axis. The colors of the light emitted by the first light-emitting columns 10 located on both sides of the central axis are symmetrically arranged about their central axis; the colors of the light emitted by the second light-emitting columns 20 located on both sides of the central axis are symmetrically arranged about their central axis; and the colors of the light emitted by the third light-emitting columns 30 located on both sides of the central axis are symmetrically arranged about their central axis. The direction of the central axis of the high-power-density light source structure is parallel to a first direction.

[0046] In this embodiment of the invention, the high power density light source structure includes four first light-emitting columns 10, four second light-emitting columns 20, and eight third light-emitting columns 30.

[0047] For example, see Figure 2 Along the second direction, columns 1, 4, 5, 8, 9, 12, 13 and 16 are all third light-emitting columns 30, columns 2, 6, 11 and 15 are all second light-emitting columns 20, and columns 3, 7, 10 and 14 are all first light-emitting columns 10.

[0048] The third light-emitting column 30 in the first column includes 4 fourth chips 301, the third light-emitting column 30 in the fourth column includes 11 fourth chips 301, the third light-emitting column 30 in the fifth column includes 11 fourth chips 301, the third light-emitting column 30 in the eighth column includes 14 fourth chips 301, the third light-emitting column 30 in the ninth column includes 14 fourth chips 301, the third light-emitting column 30 in the twelfth column includes 11 fourth chips 301, the third light-emitting column 30 in the thirteenth column includes 11 fourth chips 301, and the third light-emitting column 30 in the sixteenth column includes 4 fourth chips 301.

[0049] The second light-emitting column 20 located in the 2nd column includes 8 third chips 201, the second light-emitting column 20 located in the 6th column includes 13 third chips 201, the second light-emitting column 20 located in the 11th column includes 13 third chips 201, and the second light-emitting column 20 located in the 15th column includes 8 third chips 201.

[0050] The first light-emitting column 10 located in the 3rd column includes 5 first chips 101 and 4 second chips 102, the first light-emitting column 10 located in the 7th column includes 8 first chips 101 and 6 second chips 102, the first light-emitting column 10 located in the 10th column includes 8 first chips 101 and 6 second chips 102, and the first light-emitting column 10 located in the 11th column includes 5 first chips 101 and 4 second chips 102.

[0051] Specifically, five first chips 101 and four second chips 102 are alternately arranged in the first light-emitting column 10 located in the 3rd and 11th columns, and two first chips 101 located in the first light-emitting column 10 located in the 7th and 10th columns are arranged adjacent to each other.

[0052] In this embodiment of the present invention, the high power density light source structure further includes a substrate structure 40, which includes a first substrate 401 and a second substrate 402. The first chip 101 and the second chip 102 are both disposed on the first substrate 401, and the first substrate 401 is disposed on the second substrate 402.

[0053] In this embodiment of the invention, the first substrate 401 is a high thermal conductivity ceramic substrate, and the second substrate 402 is a thermoelectrically separated copper substrate.

[0054] The main material of the thermoelectric separation copper substrate is copper Cu (thermal conductivity: 380-400 w / m*k), and the main material of the high thermal conductivity ceramic substrate is aluminum nitride AlN (thermal conductivity: 180-300 w / m*k).

[0055] The main manufacturing process of this utility model is as follows: 1. Fabricate a first substrate 401, a second substrate 402, a first pad 103, and a second pad 104; 2. The first chip 101 is welded to the predetermined position of the processed first substrate 401 by eutectic bonding process, and the second chip 102, the third chip 201 and the fourth chip 301 are welded to the predetermined position of the processed first substrate 401 by nano silver paste by die bonding process to obtain a ceramic substrate semi-finished product. 3. The obtained ceramic substrate semi-finished product is electrically connected using wires (such as gold wires or alloy wires); 4. The third chip 201 and the fourth chip 301 need to be coated with phosphor; 5. Solder the first substrate 401 and the second substrate 402 together; 6. Check whether the first chip 101, the second chip 102, the third chip 201 and the fourth chip 301 can all be lit normally. If they are all lit normally and the light parameters are within the range, the fabrication of the high power density light source structure is complete.

[0056] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A high power density light source structure, characterized in that, Including at least one first luminous column (10); The first light-emitting column (10) includes a plurality of first chips (101) and a plurality of second chips (102) arranged along a first direction. In the same column of the first light-emitting column (10), two first chips (101) are arranged adjacent to each other or the first chip (101) and the second chip (102) are arranged adjacent to each other. The first chip (101) is provided with a first positive electrode (111) and a first negative electrode (112). The first positive electrode (111) is provided on the front side of the first chip (101), and the first negative electrode (112) is provided on the back side of the first chip (101). The second chip (102) is provided with a second positive electrode (121) and a second negative electrode (122), and the second positive electrode (121) and the second negative electrode (122) are both provided on the front side of the second chip (102); All the first chips (101) in the first light-emitting column (10) in the same column are connected in series, and all the second chips (102) in the first light-emitting column (10) in the same column are connected in series.

2. The high power density light source structure according to claim 1, characterized in that: In the first light-emitting column (10) in the same column, two adjacent first chips (101) are electrically connected through a first pad (103), and two adjacent second chips (102) are electrically connected through a second pad (104).

3. The high power density light source structure according to claim 1, characterized in that: The high power density light source structure also includes at least one second light-emitting column (20); The second light-emitting column (20) is formed by arranging a plurality of third chips (201) along a first direction, and all the third chips (201) are connected in series; The third chip (201) is provided with a third positive electrode (211) and a third negative electrode (212), both of which are located on the front side of the third chip (201).

4. The high power density light source structure according to claim 3, characterized in that: The high power density light source structure also includes at least one third light-emitting column (30); The third light-emitting column (30) is formed by arranging a plurality of fourth chips (301) along a first direction, and all the fourth chips (301) are connected in series; The fourth chip (301) is provided with a fourth positive electrode (311) and a fourth negative electrode (312), both of which are located on the front side of the fourth chip (301).

5. The high power density light source structure according to claim 4, characterized in that: The first chip (101) emits light of a first color, the second chip (102) emits light of a second color, the third chip (201) emits light of a third color, and the fourth chip (301) emits light of a fourth color.

6. The high power density light source structure according to claim 5, characterized in that: The first color is red, the second color is blue, the third color is green, and the fourth color is white.

7. The high power density light source structure according to claim 5, characterized in that: The high power density light source structure includes n first light-emitting columns (10), n second light-emitting columns (20), and 2n third light-emitting columns (30), where n is a positive integer greater than or equal to 1; The high power density light source structure has a first light-emitting column (10), a second light-emitting column (20) and a third light-emitting column (30) on both sides of the central axis. The colors of the light emitted by the first light-emitting column (10) located on both sides of the central axis of the high power density light source structure are symmetrical about their central axis; the colors of the light emitted by the second light-emitting column (20) located on both sides of the central axis of the high power density light source structure are symmetrical about their central axis; and the colors of the light emitted by the third light-emitting column (30) located on both sides of the central axis of the high power density light source structure are symmetrical about their central axis. The direction of the central axis of the high power density light source structure is parallel to the first direction.

8. The high power density light source structure according to claim 7, characterized in that: The high power density light source structure includes 4 columns of the first light-emitting column (10), 4 columns of the second light-emitting column (20), and 8 columns of the third light-emitting column (30).

9. The high power density light source structure according to any one of claims 1-8, characterized in that: The high power density light source structure further includes a substrate structure (40), which includes a first substrate (401) and a second substrate (402). The first chip (101) and the second chip (102) are both disposed on the first substrate (401), and the first substrate (401) is disposed on the second substrate (402).

10. The high power density light source structure according to claim 9, characterized in that: The first substrate (401) is a high thermal conductivity ceramic substrate, and the second substrate (402) is a thermoelectrically separated copper substrate.

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