Wafer surface cleaning apparatus

Abstract

The utility model provides a kind of wafer surface cleaning equipment, including workbench, feeding mechanism, manipulator, slag removal mechanism, wiping mechanism, discharging mechanism, feeding mechanism, discharging mechanism are oppositely arranged in the both sides of workbench, feeding mechanism is used for feeding, discharging mechanism is used for discharging, manipulator is used to transport wafer, slag removal mechanism is arranged on workbench, including rotary table and two scrapers oppositely arranged in the both sides of rotary table, rotary table is used to place wafer, and can drive wafer rotation, two scrapers can be centrally moved towards with rotary table, and two scrapers are flexibly pressed in wafer back when slag removal;Wiping mechanism includes wiping plate, wiping plate is arranged outside rotary table, wiping cloth is wound on wiping plate, and wiping cloth is attached to wafer back when slag removal.The utility model is simple in structure, small in occupied space, can automatically clean wafer, and adopt scraper and wiping cloth to work together to realize double cleaning, high in cleaning efficiency, good in cleaning quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer surface cleaning device. Background Technology

[0002] During wafer manufacturing, foreign matter such as crystals or particles can easily accumulate on the back side of the wafer (especially within about 10mm of the wafer edge), such as silicon dross particles. These foreign matter adheres to the back side of the wafer, affecting its flatness and subsequent photolithography, etching, and other processes, thereby reducing wafer yield. Therefore, it is necessary to remove foreign matter from the wafer surface.

[0003] Currently, removal is generally achieved through manual scraping or chemical processes. Manual scraping is inefficient, and it's difficult to control the scraping force, resulting in inconsistent scraping quality and potential damage to the wafer. Chemical removal requires using chemical agents to remove foreign matter, followed by cleaning equipment to remove chemical reagents and foreign matter residues from the wafer surface, and then drying. This process is cumbersome, complex, requires large equipment space, and increases production costs. Utility Model Content

[0004] The present invention aims to provide a wafer surface cleaning device to overcome the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer surface cleaning device, including a worktable, a loading mechanism, a robot arm, a slag removal mechanism, a wiping mechanism, and a unloading mechanism. The loading mechanism and the unloading mechanism are arranged opposite each other on both sides of the worktable. The loading mechanism is used to load and store wafers to be slag removed, and the unloading mechanism is used to unload and store wafers that have been slag removed. The robot arm is arranged between the loading mechanism and the unloading mechanism for transporting wafers. The slag removal mechanism is arranged on the worktable, located on one side of the robot arm, and includes a rotating table and two scrapers arranged opposite each other on both sides of the rotating table. The rotating table is used to place the wafer and can drive the wafer to rotate. The two scrapers can move towards each other with the rotating table as the center, and during slag removal, the two scrapers are flexibly pressed against the back of the wafer. The wiping mechanism is arranged on the side of the slag removal mechanism away from the robot arm, and includes a wiping plate. The wiping plate is arranged outside the rotating table, and a wiping cloth is wrapped around the wiping plate. During slag removal, the wiping cloth is in contact with the back of the wafer.

[0006] Furthermore, in the aforementioned wafer surface cleaning equipment, the feeding mechanism includes a material box and a material box mounting base. The material box is suspended outside the worktable via the material box mounting base. The material box has multiple stacked insertion slots inside, which are adapted to the shape of the wafer for placing the wafer. The material box mounting base is provided with a positioning component for positioning the material box. The positioning component includes a front positioning block and a rear positioning block. The front positioning block abuts against the front end face of the material box. The rear positioning block has multiple positioning parts arranged in a stepped manner. Each positioning part is adapted to a rear end opening of the material box of a certain size, and the positioning part is inserted into the rear end opening of the material box to limit the position of the material box.

[0007] Furthermore, in the aforementioned wafer surface cleaning equipment, the material box mounting base is also equipped with a sensing component for detecting wafer size. The sensing component detects the wafer size inside the material box by sensing the position of the material box, and the sensing component is also electrically connected to the slag removal mechanism.

[0008] Furthermore, in the aforementioned wafer surface cleaning equipment, the slag removal mechanism further includes a second positioning component. The second positioning component includes a vacuum stage and a positioning seat. The vacuum stage is positioned above a rotary table, and its top has vacuum grooves for adsorbing wafers. These vacuum grooves are evenly distributed within the wafer's adsorption range. The positioning seat is fitted around the outside of the vacuum stage. Above the positioning seat are multiple sets of support blocks arranged around the vacuum stage. Each set of support blocks includes two opposing fixed support blocks and a movable support block. The fixed support blocks are fixed to the positioning seat via the fixed seat. The movable support blocks are connected to the output end of a movable cylinder mounted on the positioning seat and can move radially along the vacuum stage via the movable cylinder. Preferably, both the fixed and movable support blocks have multiple support portions. These multiple support portions are arranged in a multi-step manner along the radial direction of the vacuum stage. Each support portion includes a horizontal support portion and a vertical limiting portion. The horizontal support portion supports the wafer, and the vertical limiting portion is perpendicular to the horizontal support portion and cooperates with the outer surface of the wafer to limit its position.

[0009] Furthermore, in the aforementioned wafer surface cleaning equipment, the slag removal mechanism further includes a lifting assembly, which includes a lifting motor and guide rods. The lifting motor is fixed on a rotating base, and its output end is connected to a positioning seat via a connector. Multiple guide rods are provided below the positioning seat, and the lower ends of the guide rods are inserted into the rotating base and slidably connected to the rotating base.

[0010] Furthermore, in the aforementioned wafer surface cleaning equipment, the two scrapers move towards each other via a moving assembly. The moving assembly includes a base plate, a lead screw, a support base, and a moving base. The lead screw is a double-ended lead screw located above the base plate, with support bases rotatably connected to both ends of the lead screw. One end of the lead screw is also connected to the output end of a drive motor via a coupling. Two moving bases are provided, symmetrically located at both ends of the lead screw and fixedly connected to the lead screw nut on the lead screw. The lower end of each moving base is also slidably connected to a guide rail fixed on the base plate. The two scrapers are each mounted on one moving base.

[0011] Furthermore, in the aforementioned wafer surface cleaning equipment, the scraper is flexibly held against the back of the wafer by a self-adjusting component. The self-adjusting component, mounted on a movable base, includes a scraper holder, a connecting base, a guide wheel, a counterweight, and a steel wire rope. The scraper is mounted on the scraper holder with its blade angled upwards. The scraper holder is mounted on the connecting base. The connecting base and the counterweight are positioned opposite each other on opposite sides of the movable base and are slidably connected to slide rails on corresponding sides of the movable base. The top of the movable base has a guide wheel rotatably connected to it. Both the connecting base and the counterweight have steel wire rope connectors at their tops. One end of the steel wire rope is connected to the connecting base, and the other end is wound upwards around the guide wheel and then extends downwards to connect to the counterweight. Preferably, an adjuster is provided between the scraper holder and the connecting base to adjust the scraper's tilt angle.

[0012] Furthermore, in the aforementioned wafer surface cleaning equipment, the slag removal mechanism further includes a dust collection component. The dust collection component includes a dust collection pipe and a slag collection box. The slag collection box is arranged along the outer side of the vacuum stage and is located below the scraper. It is fixedly connected to the rotary table via a support plate. The dust collection pipe is fixedly connected to the worktable via a support column. One end of the dust collection pipe is connected to the slag outlet at the bottom of the slag collection box, and the other end is connected to an external air suction device. The side of the slag collection box away from the vacuum stage is provided with an opening slot that matches the shape of the blade holder. The blade holder is inserted into the opening slot, and at least part of the blade holder is located inside the slag collection box.

[0013] Furthermore, in the aforementioned wafer surface cleaning equipment, the wiping mechanism further includes a wiping box, a wiping support, an unwinding reel, and a rewinding reel. One end of the wiping support is connected to the worktable, and the other end extends into the wiping box and is connected to it. The unwinding reel and the rewinding reel are both located inside the wiping box and are rotatably connected to the wiping mounting plate. The wiping mounting plate is fixedly connected to the wiping box. The unwinding reel is used to unwind the wiping cloth, and the rewinding reel is used to rewind the used wiping cloth. The wiping cloth is led out through the unwinding reel, wound around the wiping plate, and then wound upwards onto the rewinding reel. The upper and lower sides of the wiping plate are provided with grooves that are adapted to the wiping cloth to guide the path of the wiping cloth. The wiping plate is also connected to a lifting cylinder located below it, and the lifting cylinder is fixed to the outside of the wiping box.

[0014] Furthermore, in the aforementioned wafer surface cleaning equipment, the unwinding tray is located at the front end of the tray shaft one. The tray shaft one is rotatably connected to the wiping mounting plate via a bearing mounted on the wiping mounting plate. A spring one is sleeved on the rear end of the tray shaft one through the wiping mounting plate. One end of the spring one abuts against the wiping mounting plate, and the other end is provided with a nut that is threadedly connected to the tray shaft one. The take-up reel is mounted on the second reel shaft. The rear end of the second reel shaft passes through the wiping mounting plate and connects to a drive assembly mounted on the wiping mounting plate. The drive assembly drives the second reel shaft to rotate. The front end of the second reel shaft, from back to front, is provided with a seated bearing, a take-up reel, a pressure plate, and a second spring. The end of the second spring away from the pressure plate is provided with a nut threadedly connected to the second reel shaft. Preferably, the drive assembly includes a main synchronous pulley, a driven synchronous pulley, and a tension pulley located on the rear side of the wiping mounting plate. The main synchronous pulley is connected to a motor located on the front side of the wiping mounting plate. The driven synchronous pulley is connected to the second reel shaft and is belt-driven to the main synchronous pulley via an annular belt. The tension pulley is located outside the annular belt and is used to tension the annular belt.

[0015] Furthermore, in the aforementioned wafer surface cleaning equipment, the wiping mechanism further includes a guide assembly for guiding the movement of the wiping cloth. This guide assembly includes guide roller one and guide roller two. Multiple guide roller one are provided between the unwinding reel and the wiping plate, and multiple guide roller two are provided between the rewinding reel and the wiping plate. Preferably, at least one limiting block is provided between the guide roller one, and the limiting block has a limiting groove for the wiping cloth to pass through.

[0016] Furthermore, in the aforementioned wafer surface cleaning equipment, the guiding assembly further includes a guide wheel three and a guide shaft. The guide shaft is rotatably connected to the wiping mounting plate via a bearing with a seat, and the front end of the guide shaft is connected to the guide wheel three. The rear end of the guide shaft passes through the wiping mounting plate and is connected to a guide drive wheel located behind the wiping mounting plate. The guide drive wheel is connected to a drive assembly that drives the take-up reel to rotate, and can rotate synchronously with the take-up reel through the drive assembly. The guide wheel three cooperates with a guide wheel two to guide the wiping cloth.

[0017] Preferably, the wiping mechanism further includes an adjustment component, which adjusts the wiping range by adjusting the distance the wiping plate extends into the wafer. The adjustment component includes a second slide rail, which is located above the wiping support. The lower end of the wiping box is provided with a mounting plate, and a slider that is slidably connected to the second slide rail is provided below the mounting plate. A guide rail clamp for locking the second slide rail is also provided below the mounting plate.

[0018] Compared with the prior art, the advantages of this utility model are: the utility model has a simple structure, occupies little space, can adapt to the cleaning of wafers of different sizes, has good flexibility, and has a wide range of applications.

[0019] This invention also achieves fully automatic wafer cleaning with a high degree of automation and a simple cleaning process. During cleaning, the wafer rotates, and two scrapers remove foreign objects from the back of the wafer. At the same time, a wiping cloth wipes away foreign objects and dust adhering to the wafer surface. The wafer is cleaned while rotating, and the scrapers and wiping cloth work together to achieve dual cleaning, resulting in high cleaning efficiency and good cleaning quality. Furthermore, the scrapers are flexibly pressed against the wafer surface during descaling, ensuring stable descaling force. This not only guarantees cleaning quality but also avoids damaging the wafer during descaling. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the external structure of the wafer surface cleaning equipment of this utility model; Figure 2 This is a schematic diagram of the internal structure of the wafer surface cleaning equipment of this utility model; Figure 3 This is a schematic diagram of the feeding mechanism of the wafer surface cleaning equipment of this utility model; Figure 4 This is a partial schematic diagram of the feeding mechanism of the wafer surface cleaning equipment of this utility model; Figure 5 This is a schematic diagram of the slag removal mechanism of the wafer surface cleaning equipment of this utility model; Figure 6 This is a partial schematic diagram of the slag removal mechanism of the wafer surface cleaning equipment of this utility model; Figure 7 This is a schematic diagram of the self-adjusting component of the wafer surface cleaning equipment of this utility model. Figure 1 ; Figure 8 This is a schematic diagram of the self-adjusting component of the wafer surface cleaning equipment of this utility model. Figure 2 ; Figure 9 This is a partial structural schematic diagram of the wafer surface cleaning equipment of this utility model; Figure 10 This is a schematic diagram of the wiping mechanism of the wafer surface cleaning equipment of this utility model; Figure 11 This is a cross-sectional schematic diagram of the wiping mechanism of the wafer surface cleaning equipment of this utility model; Figure 12 This is a partial schematic diagram of the wiping mechanism of the wafer surface cleaning equipment of this utility model. Figure 1 ; Figure 13 This is a partial schematic diagram of the wiping mechanism of the wafer surface cleaning equipment of this utility model. Figure 2 ; In the diagram: 1. Workbench; 11. External frame; 12. Fan and filter unit; 2. Feeding mechanism; 21. Material box; 211. Insertion slot; 22. Material box mounting base; 23. Positioning component one; 231. Front positioning block; 232. Rear positioning block; 2321. Positioning part; 24. Sensing component; 25. Outer compartment box; 3. Robotic arm; 4. Slag removal mechanism; 41. Rotary table; 42. Scraper; 43. Positioning component two; 431. Vacuum stage; 4311. Vacuum tank; 432. Positioning seat; 433. Fixed support block; 4331. Support part; 434. Moving support block; 435. Fixed seat; 436. Moving cylinder; 44. Lifting assembly; 441. Lifting motor; 442. Guide rod; 443. Rotating base; 45. Moving assembly Components; 451, base plate; 452, lead screw; 453, support base; 454, movable base; 455, guide rail; 46, self-adjusting assembly; 461, tool holder; 462, connecting base; 463, guide wheel; 464, counterweight; 465, slide rail one; 466, adjuster; 47, dust collection assembly; 471, dust collection pipe; 472, slag collection box; 4721, opening slot; 473, support plate; 474, support column; 5. Wiping Mechanism; 511. Wiping Plate; 512. Wiping Cloth; 513. Lifting Cylinder; 521. Wiping Box; 522. Wiping Support; 523. Wiping Mounting Plate; 53. Unwinding Reel; 531. Reel Shaft 1; 532. Spring 1; 54. Rewinding Reel; 541. Reel Shaft 2; 542. Pressure Plate; 543. Spring 2; 55. Guide Assembly; 551. Guide Wheel 1; 552. Guide Wheel 2; 553. Limiting Block; 554. Guide Wheel 3; 555. Guide Shaft; 556. Guide Drive Wheel; 56. Drive Assembly; 561. Main Synchronous Wheel; 562. Slave Synchronous Wheel; 563. Tensioning Wheel; 564. Circular Belt; 57. Adjustment Assembly; 571. Slide Rail 2; 572. Mounting Plate; 573. Guide Rail Clamping Device; 6. Feeding mechanism. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1 like Figure 1-13 As shown, a wafer surface cleaning device includes a worktable 1, a loading mechanism 2, a robotic arm 3, a slag removal mechanism 4, a wiping mechanism 5, and a unloading mechanism 6. The loading mechanism 2 and the unloading mechanism 6 are arranged opposite each other on both sides of the worktable 1. The loading mechanism 2 is used to load and store wafers to be slag-removed, and the unloading mechanism 6 is used to unload and store wafers that have been slag-removed. The robotic arm 3 is located between the loading mechanism 2 and the unloading mechanism 6 for transporting wafers. The slag removal mechanism 4 is located on the worktable 1, on one side of the robotic arm 3, and includes a rotating mechanism. The rotating platform 41 and two scrapers 42 are disposed on opposite sides of the rotating platform 41. The rotating platform 41 is used to place the wafer and can drive the wafer to rotate. The two scrapers 42 can move towards each other with the rotating platform 41 as the center, and the two scrapers 42 are flexibly pressed against the back of the wafer when removing slag. The wiping mechanism 5 is disposed on the side of the slag removal mechanism 4 away from the robot arm 3, including a wiping plate 511. The wiping plate 511 is disposed on the outside of the rotating platform 41, and a wiping cloth 512 is wrapped around the wiping plate 511. When removing slag, the wiping cloth 512 is in contact with the back of the wafer.

[0024] Among them, such as Figure 1 As shown, the bottom of the workbench 1 is equipped with a control box, and the outside of the workbench 1 is equipped with an outer frame 11 that covers the equipment. The top of the outer frame 11 is equipped with a fan filter unit (FFU) 12, which can purify the air inside the outer frame 11 and meet the requirements of the ultra-clean production environment.

[0025] In addition, an ion air bar fixed on the outer frame 11 is provided above the slag removal mechanism 4, which can eliminate static electricity and prevent dust from adhering to the scraper 42 and affecting the scraping effect.

[0026] In this embodiment, the wiping cloth is a dust-free cloth. During operation, the robotic arm picks up the wafer from the loading mechanism and places it on the rotary table. After the wafer is positioned, two scrapers move to the descaling range, and the wiping area of ​​the wiping plate is also within the wiping range. The rotary table rotates, and the wafer rotates with it. The two scrapers scrape off foreign objects on the back of the wafer, while the wiping cloth wipes off foreign objects and dust adhering to the wafer surface. The wafer is cleaned while rotating, and the scrapers and wiping cloth work together to achieve dual cleaning, which is highly efficient and of good quality. Moreover, the scrapers are flexibly pressed against the wafer surface, which not only ensures the cleaning quality but also avoids damage to the wafer during descaling.

[0027] In the above structure, such as Figure 5-8As shown, the slag removal mechanism 4 also includes a second positioning component 43. The second positioning component 43 includes a vacuum stage 431 and a positioning seat 432. The vacuum stage 431 is located above the rotary table 41, and its top is provided with a vacuum groove 4311 for adsorbing wafers. The vacuum groove 4311 is arranged in an annular grid and is evenly distributed within the adsorption range of the wafers. The positioning seat 432 is sleeved on the outside of the vacuum stage 431. Above the positioning seat 431, there are multiple sets of support blocks arranged around the vacuum stage 431. Each set of support blocks includes two oppositely arranged fixed support blocks 433 and movable support blocks 434. The fixed support blocks 433 are fixed to the positioning seat 432 by a fixed seat 435. The movable support blocks 434 are connected to the output end of a movable cylinder 436 installed on the positioning seat 432 and can move radially along the vacuum stage 431 by the movable cylinder 436.

[0028] Specifically, such as Figure 5-6 As shown, both the fixed support block 433 and the movable support block 434 are provided with multiple support parts 4331. These support parts 4331 are arranged in a multi-step manner along the radial direction of the vacuum stage 431. Each support part 4331 includes a horizontal support part and a vertical limiting part. The horizontal support part supports the wafer, and the vertical limiting part is perpendicular to the horizontal support part, cooperating with the outer surface of the wafer to limit its position. Each support part 4331 corresponds to a wafer of a specific size. In this embodiment, it mainly corresponds to the descaling of 5-inch, 6-inch, and 8-inch wafers; therefore, there are three support parts arranged in a multi-step manner according to the wafer size.

[0029] During slag removal, after the wafer is placed on the vacuum stage 431, the positioning seat 432 rises, and the bottom surface of the support part 4331 corresponding to the wafer size abuts against the wafer. Then, the moving cylinder 436 drives the moving support block 434 to move, positioning the wafer. The wafer is then adsorbed and fixed by the vacuum stage 431, completing the positioning and fixing of the wafer. By setting multiple sets of support blocks to position the wafer center, it is possible to ensure that the wafer rotates coaxially with the rotary table, ensuring positioning accuracy and thus ensuring accurate slag removal range.

[0030] The aforementioned positioning component 43 also includes a lifting component 44, which includes a lifting motor 441 and guide rods 442. The lifting motor 441 is fixed on the rotating base 443, and its output end is connected to the positioning seat 432 through a connector. Multiple guide rods 442 are provided below the positioning seat 432, and the lower ends of the guide rods 442 are inserted into the rotating base 443 and slidably connected to the rotating base 443. The lifting component 44 can be used to drive the fixed support block 433 and the movable support block 434 on the positioning seat 432 to move up and down, so that the support part 4331 corresponding to the wafer size rises and aligns with the wafer on the vacuum stage 431 to position its center. In addition, it can also lift the wafer on the vacuum stage 431 after the vacuum adsorption is released during unloading, so that the wafer is detached from the vacuum stage 431, making it easier for the robot arm 3 to unload and pick up the wafer.

[0031] It should be noted that the device of this invention directly operates under vacuum, without the need for a vacuum generator to convert the vacuum. The device operates under both positive and negative pressure. Under normal circumstances, positive pressure is supplied, while the negative pressure is directly used for vacuum adsorption devices such as the vacuum stage. Specifically, a vacuum pipe is installed on the outside of the device and connects to the inside. A vacuum solenoid valve is installed on the vacuum pipe, which controls the opening and closing of the vacuum pipe, thereby controlling the vacuum adsorption devices to apply or remove the vacuum.

[0032] like Figure 5 As shown, two scrapers 42 move towards each other via a moving assembly 45. The moving assembly 45 includes a base plate 451, a lead screw 452, a support base 453, and a moving base 454. The lead screw 452 is a double-ended lead screw, located above the base plate 451. Support bases 453 are rotatably connected to both ends of the lead screw 452. One end of the lead screw 452 is also connected to the output end of a drive motor via a coupling. Two moving bases 454 are provided, symmetrically located at both ends of the lead screw 452, and fixedly connected to the lead screw nut on the lead screw 452. The lower end of the moving base 454 is also slidably connected to a guide rail 455 fixed on the base plate 451. The two scrapers 42 are each mounted on one moving base 454. A rotating base 433 is mounted above the base plate 451 and spans the middle of the lead screw 452. A rotating table 41 is fixed on the rotating base 433. The distance between the two scrapers 42 can be adjusted by the moving assembly to adapt to the slag removal of wafers of different sizes. In this embodiment, the rotary table 41 is a motor, which has a simple and compact structure.

[0033] like Figure 5 and 8 As shown in Figure 9, the scraper 42 is flexibly held on the back side of the wafer by a self-adjusting component 46. The self-adjusting component 46 is located on the moving base 454 and includes a blade holder 461, a connecting base 462, a guide wheel 463, a counterweight 464, and a steel wire rope. The scraper 42 is located on the blade holder 461 with its blade tip angled upward. The blade holder 461 is located on the connecting base 462. The connecting base 462 and the counterweight 464 are located opposite each other on both sides of the moving base 454 and are slidably connected to the slide rails 465 located on the corresponding sides of the moving base 454. The top of the moving base 454 is provided with a guide wheel 463 that is rotatably connected to it. The top of the connecting base 462 and the counterweight 464 are both provided with steel wire rope joints. One end of the steel wire rope (not shown in the figure) is connected to the connecting base 462, and the other end is wound upward around the guide wheel 463 and then extends downward to connect with the counterweight 464. In addition, an adjuster 466 is provided between the blade holder 461 and the connecting seat 462, which is used to adjust the tilt angle of the scraper 42.

[0034] The weight of the counterweight 464 was determined through multiple trials to achieve the optimal weight, and the scraping force can also be adjusted by replacing the counterweight. Furthermore, the moving base 454 has a limiting component on its side that cooperates with the connecting base 462. This limiting component can restrict the upper limit position of the scraper when there is no wafer on the vacuum stage, allowing the scraper to have upward floating space. In this embodiment, the upward floating distance is small and can be adjusted according to the wafer situation. When the wafer is adsorbed, it overcomes the resistance brought by the upward movement of the scraper and is adsorbed and fixed on the vacuum stage. During scraping, the scraper 42 is kept in contact with the back of the wafer by the gravity of the counterweight 464, flexibly pressing against the back of the wafer, resulting in stable scraping force. Compared with devices such as torque motors that control scraping force, the self-adjusting component of this invention can self-adjust the force, has a simple structure, low cost, and is not easily affected by interference.

[0035] like Figure 5-6 As shown, the slag removal mechanism 4 also includes a dust collection assembly 47, which includes a dust collection pipe 471 and a slag receiving box 472. The slag receiving box 472 is arranged along the outer side of the vacuum stage 431 and is located below the scraper 42. It is fixedly connected to the rotating table 41 via a support plate 473. The dust collection pipe 471 is fixedly connected to the worktable 1 via a support column 474. One end of the dust collection pipe 471 is connected to the slag outlet at the bottom of the slag receiving box 472, and the other end is connected to an external air suction device. The dust collection pipe 471 is also equipped with a telescopic mechanism. The slag receiving box 472 has a flexible opening slot 4721 on the side away from the vacuum stage 431, which is adapted to the shape of the blade holder 461. The blade holder 461 is inserted into the opening slot 4721, and at least part of the blade holder 461 is located in the slag receiving box 472. The opening slot serves to support the scraper and improve operational safety. When the scraper is working, the dust suction pipe 471 is activated, which, together with the slag receiving box 472, can collect the waste residue scraped by the scraper 42, preventing the waste residue from adhering to the scraper and the wafer, and further improving the cleaning effect.

[0036] Example 2 Based on the structure of Example 1, such as Figure 3-4As shown, the feeding mechanism 2 includes a material box 21 and a material box mounting base 22. The material box 21 is suspended on the outside of the workbench 1 through the material box mounting base 22. The material box 21 has multiple stacked insertion slots 211 inside. The insertion slots 211 are adapted to the shape of the wafer and are used to place the wafer. The front and rear ends of the material box 21 are provided with openings. The front opening is used to pick up and put in the material. The material box mounting base 22 is provided with a positioning component 23 for positioning the material box 21. The positioning component 23 includes a front positioning block 231 and a rear positioning block 232. The front positioning block 231 abuts against the front end face of the material box 21. The rear positioning block 232 is provided with multiple positioning parts 2321 arranged in a stepped manner. Each positioning part 2321 is adapted to a rear opening of the material box 21 of a certain size, and the positioning part 2321 is inserted into the rear opening of the material box 21 to limit the position of the material box 21. Different sizes of wafers require different sizes of material boxes 21. Each positioning part 2321 corresponds to a material box of a certain size. In this embodiment, it mainly corresponds to the slag removal of 5-inch, 6-inch and 8-inch wafers. Therefore, there are 3 positioning parts, which are arranged in a stepped manner according to the size of the wafers.

[0037] The material box mounting base 22 is also equipped with a sensing component 24 for detecting wafer size. The sensing component 24 detects the wafer size inside the material box 21 by sensing the position of the material box 21. The sensing component 24 is also electrically connected to the slag removal mechanism 4. In this embodiment, the control system is set with a cleaning program corresponding to each wafer size. The sensing component 24 includes multiple sets of sensing sensors. Each set of sensing sensors detects a wafer of a certain size. When a set of sensing sensors is triggered, the control system controls the slag removal mechanism 4 to perform the corresponding action according to the trigger signal. It can control the two scrapers 42 to move towards each other by a set distance to ensure that the scrapers 42 are within the slag removal range on the wafer. This allows the equipment to automatically adapt to the slag removal of wafers of different sizes, providing good flexibility and a wide range of applications.

[0038] In addition, such as Figure 1 , 3 As shown, an outer compartment box 25 is provided outside the material box 21. The outer compartment box 25 is fixed on the outer frame 11 and has an openable compartment cover for loading and unloading the material box 21. The outer compartment box 25 also isolates the material box 21 from the outside to ensure a clean production environment. In this embodiment, the unloading mechanism 6 is the same as the loading mechanism 2, and will not be described in detail here.

[0039] Among them, the robotic arm 3 is equipped with two robotic arms, which can pick up and put down materials at the same time, improving its loading and unloading efficiency on the vacuum platform.

[0040] like Figure 9-13As shown, the wiping mechanism 5 also includes a wiping box 521, a wiping support 522, an unwinding tray 53, and a rewinding tray 54. One end of the wiping support 522 is connected to the workbench 1, and the other end extends into and connects to the wiping box 521. The unwinding tray 53 and the rewinding tray 54 are both located inside the wiping box 521 and are rotatably connected to the wiping mounting plate 523. The wiping mounting plate 523 is fixedly connected to the wiping box 521. The unwinding tray 53 is used to unwind the wiping cloth, and the rewinding tray 54 is used to rewind the used wiping cloth. The wiping cloth 512 is led out through the unwinding tray 53, wound around the wiping plate 511, and then wound upwards onto the take-up tray 54. The upper and lower sides of the wiping plate 511 are provided with grooves that are compatible with the wiping cloth 512 to guide the path of the wiping cloth 512. The wiping plate 511 is also connected to the lifting cylinder 513 located below it. The lifting cylinder 513 is fixed to the outside of the wiping box 521. The lifting cylinder 513 can drive the wiping cloth to adhere to the wafer during deslagging, or drive the wiping plate 511 to descend and separate from the wafer when deslagging is completed.

[0041] In addition, such as Figure 1 As shown, the wiping box 521 is equipped with an openable cover with a viewing window. Opening the cover allows for easy replacement of the unwinding tray 53 and the rewinding tray 54.

[0042] like Figure 12-13 As shown, the unwinding tray 53 is located at the front end of the tray shaft 531. The tray shaft 531 is rotatably connected to the wiping mounting plate 523 via a bearing mounted on the wiping mounting plate 523. The rear end of the tray shaft 531 passes through the wiping mounting plate 523 and is fitted with a spring 532. One end of the spring 532 abuts against the wiping mounting plate 523, and the other end is provided with a nut that is threadedly connected to the tray shaft 531.

[0043] The take-up reel 54 is mounted on the second reel shaft 541. The rear end of the second reel shaft 541 passes through the wiping mounting plate 523 and is connected to the drive assembly 56 mounted on the wiping mounting plate 523. The drive assembly 56 is used to drive the second reel shaft 541 to rotate. The front end of the second reel shaft 541 is provided with a seated bearing, the take-up reel 54, the pressure plate 542, and the second spring 543 in sequence from back to front. The end of the second spring 543 away from the pressure plate 542 is provided with a nut that is threaded to the second reel shaft 541. Through the setting of the first spring 532 and the second spring 543, the unwinding reel 53 and the take-up reel 54 can move a certain amount in the axial direction of the reel, adapting to the offset of the wiping cloth and ensuring the stable delivery of the wiping cloth.

[0044] The rewinding tray 54 of this utility model rotates intermittently, thereby allowing the wiping cloth to move in sections. The feeding amount of the wiping cloth is set according to the number of rotations or time of the rotary table. The wiping cloth after automatic feeding and wiping can accurately control the feeding amount of the cleanroom cloth each time and control the wiping time of each section of wiping cloth 512.

[0045] like Figure 11-13 As shown, the drive assembly 56 is a belt drive assembly, including a main synchronous pulley 561, a driven synchronous pulley 562, and a tension pulley 563 located on the rear side of the wiping mounting plate 523. The wiping mounting plate 523 and the rear side plate of the wiping box 521 are spaced apart. The main body of the drive assembly 56 is located in the spaced space. The main synchronous pulley 561 is connected to a motor located on the front side of the wiping mounting plate 523. The driven synchronous pulley 562 is connected to the material tray shaft 541 and is belt driven by the main synchronous pulley 561 through an annular belt 564. The tension pulley 563 is located on the outside of the annular belt 564 and is used to tension the annular belt 564.

[0046] like Figure 11-13 As shown, the wiping mechanism 5 also includes a guide assembly 55 for guiding the movement of the wiping cloth 512. The guide assembly 55 includes a first guide wheel 551 and a second guide wheel 552. Multiple first guide wheels 551 are provided between the unwinding reel 53 and the wiping plate 511. At least one limiting block 553 is provided between the first guide wheels 551. The limiting block 553 is provided with a limiting groove for the wiping cloth 512 to pass through. Multiple second guide wheels 552 are provided between the winding reel 54 and the wiping plate 511.

[0047] The guide assembly 55 also includes a guide wheel 554 and a guide shaft 555. The guide shaft 555 is rotatably connected to the wiping mounting plate 523 via a bearing with a seat. The front end of the guide shaft 555 is connected to the guide wheel 554. The rear end of the guide shaft 555 passes through the wiping mounting plate 523 and is connected to the guide drive wheel 556 located on the rear side of the wiping mounting plate 523. The guide drive wheel 556 is connected to the drive assembly 56 and can rotate synchronously with the take-up reel 54 through the drive assembly 56. The guide wheel 554 cooperates with a guide wheel 552 to guide the wiping cloth 512. Specifically, the guide drive wheel 556 is connected to the annular belt 564 via belt drive. In this embodiment, the guide wheel 554 has a soft layer on the outside, such as a sponge. The guide wheel 554 is located obliquely above the guide wheel 552 that it cooperates with, and is tangent to the guide wheel 552. The wiping cloth 512 passes through the tangent point. The guide drive wheel 556 and the synchronous wheel 562 are the same size and rotate synchronously with the take-up reel 54. The guide wheel 554 cooperates with the guide wheel 552 to guide the wiping cloth to take up, which can reduce the downstream take-up load. Moreover, the wiping cloth 512 passing through the tangent point can make the used wiping cloth more neat, which is convenient for subsequent take-up.

[0048] like Figure 10-11As shown, it also includes an adjustment component 57. The adjustment component 57 adjusts the wiping range by adjusting the distance the wiping plate 511 extends into the wafer. It includes a second slide rail 571, which is located above the wiping support 522. The lower end of the wiping box 521 is provided with a mounting plate 572. The bottom surface of the cover of the wiping box 521 is flush with the mounting plate 572, which makes the appearance more aesthetically pleasing and easier to adjust. Below the mounting plate 572, there is a slider that is slidably connected to the second slide rail 571. Below the mounting plate 572, there is also a guide rail clamp 573 for locking the second slide rail 571. The mounting plate 572 is provided with an adjustment slot for adjusting the guide rail clamp 573. After releasing the guide rail clamp 573, the position of the wiping box 521 relative to the wiping support 522 can be adjusted, thereby adjusting the distance the wiping plate 511 extends into the wafer.

[0049] The working principle of this utility model is as follows: The wafer to be descaled is placed into the feeding mechanism 2 through the material box 21. The sensing component 24 of the feeding mechanism 2 detects the size of the wafer in the material box. The control system controls the equipment to start the descaling program for the wafer size according to the triggered sensing signal. The two scrapers 42 move to the descaling range corresponding to the wafer size according to the set program. The robot arm 3 picks up the wafer from the feeding mechanism 2 and places it on the rotating table 41. After the wafer is positioned by the positioning component 43, the wiping plate 511 rises, and the wiping cloth 512 on it comes into contact with the wafer. The rotating table 41 rotates, and the wafer rotates with it. The two scrapers 42 flexibly press against the surface of the wafer to scrape away foreign objects on the back of the wafer, while the wiping cloth 412 wipes the wafer. Foreign matter and dust adhering to the surface are cleaned while the wafer rotates. The scraper 42 and the wiping cloth 412 work together to achieve dual cleaning, resulting in high cleaning efficiency and good cleaning quality. After cleaning is completed, the rotating table 41 stops rotating, the positioning component 2 43 releases the positioning of the wafer, and the lifting component 44 drives the wafer to detach from the vacuum stage 431. The robot arm 3 unloads the cleaned wafer into the hopper of the unloading mechanism 6. At the same time, it picks up a wafer from the loading mechanism 2 and places it on the rotating table 41 to start cleaning the next wafer until the wafers in the hopper 21 of the loading mechanism 2 are cleaned. Then, another hopper to be cleaned is loaded and placed into the loading mechanism 2, and the wafers in the next hopper are cleaned in the same way.

[0050] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0051] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer surface cleaning device, characterized in that: The system includes a worktable, a loading mechanism, a robotic arm, a slag removal mechanism, a wiping mechanism, and a unloading mechanism. The loading and unloading mechanisms are located opposite each other on the worktable. The loading mechanism is used to load and store wafers to be slag removed, and the unloading mechanism is used to unload and store wafers that have been slag removed. The robotic arm is located between the loading and unloading mechanisms and is used to transport wafers. The slag removal mechanism is located on the worktable, on one side of the robotic arm, and includes a rotary table and two scrapers located opposite each other on both sides of the rotary table. The rotary table is used to place the wafers and can drive the wafers to rotate. The two scrapers can move towards each other around the rotary table, and during slag removal, the two scrapers flexibly press against the back of the wafer. The wiping mechanism is located on the side of the slag removal mechanism away from the robotic arm and includes a wiping plate. The wiping plate is located outside the rotary table, and a wiping cloth is wrapped around the wiping plate. During slag removal, the wiping cloth is in contact with the back of the wafer.

2. The wafer surface cleaning equipment according to claim 1, characterized in that: The feeding mechanism includes a material box and a material box mounting base. The material box is suspended on the outside of the workbench via the material box mounting base. The material box has multiple stacked insertion slots inside, which are used to place wafers. The material box mounting base is provided with a positioning component for positioning the material box. The positioning component includes a front positioning block and a rear positioning block. The front positioning block abuts against the front end face of the material box. The rear positioning block has multiple positioning parts arranged in a stepped manner. Each positioning part is adapted to a rear end opening of the material box of a certain size, and the positioning part is inserted into the rear end opening of the material box to limit the position of the material box.

3. The wafer surface cleaning equipment according to claim 2, characterized in that: The material box mounting base is also equipped with a sensing component for detecting wafer size. The sensing component detects the wafer size inside the material box by sensing the position of the material box. The sensing component is also electrically connected to the slag removal mechanism.

4. The wafer surface cleaning equipment according to claim 1, characterized in that: The slag removal mechanism also includes a second positioning component, which includes a vacuum stage and a positioning seat. The vacuum stage is located above the rotary table and has a vacuum groove for adsorbing wafers on its top. The vacuum grooves are evenly distributed within the wafer adsorption range. The positioning seat is sleeved on the outside of the vacuum stage. Above the positioning seat are multiple sets of support blocks arranged around the vacuum stage. Each set of support blocks includes two oppositely arranged fixed support blocks and a movable support block. The fixed support blocks are fixed to the positioning seat by the fixed seat. The movable support blocks are connected to the output end of a movable cylinder installed on the positioning seat and can move radially along the vacuum stage by the movable cylinder.

5. The wafer surface cleaning equipment according to claim 4, characterized in that: It also includes a lifting assembly, which includes a lifting motor and guide rods. The lifting motor is fixed on the rotating base, and its output end is connected to the positioning seat through a connector. Multiple guide rods are provided below the positioning seat, and the lower ends of the guide rods are inserted into the rotating base and slidably connected to the rotating base.

6. The wafer surface cleaning equipment according to claim 1, characterized in that: The two scrapers move toward each other via a moving assembly, which includes a base plate, a lead screw, a support base, and a moving base. The lead screw is a double-ended lead screw located above the base plate, with support bases rotatably connected to both ends of the lead screw. One end of the lead screw is also connected to the output end of a drive motor via a coupling. Two moving bases are provided, symmetrically located at both ends of the lead screw and fixedly connected to the lead screw nut on the lead screw. The lower end of each moving base is also slidably connected to a guide rail fixed on the base plate. The two scrapers are each mounted on one moving base.

7. The wafer surface cleaning equipment according to claim 1 or 6, characterized in that: The scraper is flexibly held on the back of the wafer by a self-adjusting component. The self-adjusting component is located on a movable base and includes a scraper holder, a connecting seat, a guide wheel, a counterweight, and a steel wire rope. The scraper is located on the scraper holder with its blade angled upward. The scraper holder is located on the connecting seat. The connecting seat and the counterweight are located opposite each other on both sides of the movable base and are slidably connected to slide rails located on the corresponding sides of the movable base. The top of the movable base is provided with a guide wheel that is rotatably connected to it. One end of the steel wire rope is connected to the connecting seat, and the other end is wound upward around the guide wheel and then extends downward to connect with the counterweight.

8. The wafer surface cleaning equipment according to claim 1, characterized in that: The slag removal mechanism also includes a dust collection component, which includes a dust collection pipe and a slag receiving box. The slag receiving box is arranged along the outer side of the vacuum stage and is located below the scraper. It is fixedly connected to the rotary table via a support plate. The dust collection pipe is fixedly connected to the worktable via a support column. One end of the dust collection pipe is connected to the slag outlet at the bottom of the slag receiving box, and the other end is connected to an external air suction device. The side of the slag receiving box away from the vacuum stage has an opening slot that matches the shape of the blade holder. The blade holder is inserted into the opening slot.

9. The wafer surface cleaning equipment according to claim 1, characterized in that: The wiping mechanism also includes a wiping box, a wiping support, an unwinding reel, and a winding reel. One end of the wiping support is connected to the workbench, and the other end extends into the wiping box and is connected to the wiping box. The unwinding reel and the winding reel are both located inside the wiping box and are rotatably connected to the wiping mounting plate. The wiping mounting plate is fixedly connected to the wiping box. The unwinding reel is used to unwind the wiping cloth, and the winding reel is used to wind up the used wiping cloth. The wiping cloth is led out through the unwinding reel, wound around the wiping plate, and then wound upwards onto the winding reel. The wiping plate is also connected to a lifting cylinder located below it, and the lifting cylinder is fixed to the outside of the wiping box.

10. The wafer surface cleaning equipment according to claim 9, characterized in that: The unwinding tray is located at the front end of the tray shaft one. The tray shaft one is rotatably connected to the wiping mounting plate via a bearing with a seat on the wiping mounting plate. The rear end of the tray shaft one passes through the wiping mounting plate and is fitted with a spring one. One end of the spring one abuts against the wiping mounting plate, and the other end is provided with a nut that is threadedly connected to the tray shaft one. The take-up reel is mounted on the reel shaft two. The rear end of the reel shaft two passes through the wiping mounting plate and is connected to the drive assembly mounted on the wiping mounting plate. The drive assembly is used to drive the reel shaft two to rotate. The front end of the reel shaft two is provided with a seated bearing, a take-up reel, a pressure plate, and a spring two in sequence from back to front. The end of the spring two away from the pressure plate is provided with a nut that is threadedly connected to the reel shaft two.

11. The wafer surface cleaning equipment according to claim 9 or 10, characterized in that: The wiping mechanism also includes a guide component for guiding the movement of the wiping cloth. The guide component includes a guide wheel one and a guide wheel two. Multiple guide wheels one are provided between the unwinding tray and the wiping plate, and multiple guide wheels two are provided between the winding tray and the wiping plate. The guiding assembly also includes a guide wheel three and a guide shaft. The guide shaft is rotatably connected to the wiping mounting plate via a bearing with a seat, and the front end of the guide shaft is connected to the guide wheel three. The rear end of the guide shaft passes through the wiping mounting plate and is connected to a guide drive wheel located on the rear side of the wiping mounting plate. The guide drive wheel is connected to a drive assembly that drives the take-up reel to rotate, and can rotate synchronously with the take-up reel through the drive assembly. The guide wheel three cooperates with a guide wheel two to guide the wiping cloth.

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