A circuit chip packaging device

Abstract

The utility model provides a kind of circuit chip packaging device, including mould box, sliding plate, separation mechanism and floating assembly, the side surface welding of mould box has fixed plate, the bottom surface welding of fixed plate has support leg, the top surface welding of mould box has first boss, the bottom surface of sliding plate is equipped with recess, the inside of recess is embedded in first boss, the top surface of sliding plate is equipped with injection hole, the device is separated by the separation mechanism of installation, when epoxy resin inside mould box is cooled and is shaped, pull down square thick plate and drive sheet metal from shaping plastic simultaneously, first scraper removes square sheet metal sidewall residual plastic, the top surface of sheet metal is separated from shaping plastic in the process of sliding sliding plate, simultaneously, second scraper removes the residue on the bottom surface of sliding plate and guides scrap from gap discharge, realizes stripping and cleaning integrated operation, prevents the surface defect of finished product caused by residue adhesion, effectively avoids the damage risk of plastic part when stripping, improves packaging efficiency and quality consistency.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically to a circuit chip packaging device. Background Technology

[0002] Circuit chip molding is a technology that uses resin material to encapsulate chips. Its function is to provide physical protection, heat dissipation and electrical insulation for the chips, ensuring their stable operation in various electronic devices. According to the existing technology, such as the packaging substrate and integrated circuit package disclosed in Chinese patent document CN205564729U, the plastic material is injected along the injection channel on the packaging substrate and flows into the molding area of ​​each packaging substrate unit through the injection part, thereby forming a molding shell that shields the chip and the corresponding surface of the packaging substrate within the molding area.

[0003] According to its publicly available technical solutions, in the existing technology, after the plastic sealing is completed, the finished product is detached by gravity by flipping the substrate. Since the colloid is very easy to stick to the mold surface, the finished product may not be able to be detached by flipping, and further manual peeling is required. Moreover, after peeling, the inner wall of the mold is prone to residual plastic, and the inner wall of the mold box needs to be cleaned again. This process is time-consuming and reduces production efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a circuit chip packaging device to solve the problems mentioned in the background. This invention utilizes a separation mechanism where, after the epoxy resin inside the mold box cools and solidifies, a square thick plate pulls down, causing a thin plate to separate from the molded plastic. Simultaneously, a first scraper removes residual plastic from the sidewalls of the square thin plate. During the sliding process, the top surface of the molded plastic detaches, while a second scraper removes residual material from the bottom surface of the sliding plate and guides debris out through the gaps. This integrated demolding and cleaning operation prevents surface defects caused by residual material adhesion, effectively avoids the risk of damage to plastic parts during demolding, and improves packaging efficiency and quality consistency.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a circuit chip packaging device, including a packaging device body, the packaging device body including a mold box, a slide plate, a separation mechanism and a floating component, a fixing plate welded to the side of the mold box, a supporting leg welded to the bottom surface of the fixing plate, a first protrusion welded to the top surface of the mold box, a groove formed on the bottom surface of the slide plate, the first protrusion being embedded in the groove, and an injection hole formed on the top surface of the slide plate.

[0006] Furthermore, the separation mechanism includes a square thin plate, a square plate, and a second scraper. A square thick plate is welded to the bottom surface of the square thin plate, and the end of the square thin plate passes through the bottom surface of the mold box.

[0007] Furthermore, the top surface of the square plate is welded to the bottom surface of the mold box, and a spring rod is inserted into the side of the square plate.

[0008] Furthermore, the other end of the spring rod is welded to the side of the first scraper, and the second scraper is inserted into the top surface of the mold box.

[0009] Furthermore, a telescopic spring is welded to the end of the second scraper, and the other end of the telescopic spring is welded to the inner wall of the mold box.

[0010] Furthermore, the floating assembly includes a circular cover and a circular plate, the circular cover being inserted inside the injection port, with the surface of the circular cover contacting the inner wall of the injection port.

[0011] Furthermore, the surface of the circular cover is provided with a groove, and the inner wall of the injection hole is welded with a second protrusion, which is embedded in the groove.

[0012] Furthermore, an L-shaped rod is welded to the top surface of the circular plate, and the other end of the L-shaped rod is welded to the inner wall of the circular cover.

[0013] The beneficial effects of this utility model are: 1. This circuit chip packaging device, through the installed separation mechanism, pulls down the square thick plate after the epoxy resin inside the mold box cools and solidifies, causing the thin plate to separate from the molded plastic. At the same time, the first scraper scrapes off the residual plastic on the side wall of the square thin plate. During the sliding slide, the top surface of the molded plastic is detached. Meanwhile, the second scraper scrapes off the residual material on the bottom surface of the slide and guides the debris to be discharged from the gap. This realizes the integrated operation of demolding and cleaning, prevents surface defects of the finished product caused by residual material adhesion, effectively avoids the risk of damage to plastic parts during demolding, and improves packaging efficiency and quality consistency.

[0014] 2. The circuit chip packaging device uses a floating mechanism to allow the circular plate to rise synchronously with the liquid level when liquid is injected. Through the linkage of the L-shaped rod and the circular cover, the circular plate rises into the injection hole when the mold box is full. During this process, the liquid attached to the injection hole area is cut off and the bottom of the injection hole is sealed, preventing quality problems such as protrusions, burrs or defects on the surface of the package caused by the tailing and stringing of the colloid. At the same time, it avoids residual liquid dripping and contaminating the surface of the mold box. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the external structure of a circuit chip packaging device according to the present invention; Figure 2 This is a side sectional view of the mold box of a circuit chip packaging device according to the present invention; Figure 3 This is a cross-sectional view of a slide plate of a circuit chip packaging device according to the present invention; Figure 4 This is a schematic diagram of the separation mechanism of a circuit chip packaging device according to the present invention; In the diagram: 1. Mold box; 2. Slide plate; 3. Separation mechanism; 4. Floating component; 5. Fixed plate; 6. Support leg; 7. Injection hole; 8. Spring rod; 9. First scraper; 10. Square plate; 11. Square thin plate; 12. First protrusion; 13. Square thick plate; 14. Second scraper; 15. Telescopic spring; 16. Groove; 17. Second protrusion; 18. Circular cover; 19. Circular plate; 20. L-shaped rod; 21. Slide groove. Detailed Implementation

[0016] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0017] Please see Figures 1 to 4 This utility model provides the following technical solution: a circuit chip packaging device, including a packaging device body, the packaging device body including a mold box 1, a slide plate 2, a separation mechanism 3 and a floating component 4, a fixing plate 5 welded to the side of the mold box 1, a support leg 6 welded to the bottom surface of the fixing plate 5, a first protrusion 12 welded to the top surface of the mold box 1, a groove 16 opened on the bottom surface of the slide plate 2, the first protrusion 12 being embedded in the inside of the groove 16, an injection hole 7 opened on the top surface of the slide plate 2, epoxy resin is injected into the mold box 1, when it is full, a circular plate 19 seals the bottom of the injection hole 7, and after cooling, the square thick plate 13 and the slide plate 2 are pulled to demold the finished product.

[0018] In this embodiment, the separation mechanism 3 includes a square thin plate 11, a square plate 10, and a second scraper 14. A square thick plate 13 is welded to the bottom surface of the square thin plate 11. The end of the square thin plate 11 passes through the bottom surface of the mold box 1. The top surface of the square plate 10 is welded to the bottom surface of the mold box 1. A spring rod 8 is inserted into the side of the square plate 10. The other end of the spring rod 8 is welded to the side of the first scraper 9. The second scraper 14 is inserted into the top surface of the mold box 1. A telescopic spring 15 is welded to the end of the second scraper 14. The other end of the telescopic spring 15 is welded to the inner wall of the mold box 1. The thick square plate 13 is pulled to move, thereby causing the square thin plate 11 to move synchronously. During the movement of the square thin plate 11, it separates from the molded plastic. Then, the sliding plate 2 is slid to separate it from the top surface of the molded plastic, thereby completing the demolding of the finished product.

[0019] In this embodiment, the floating component 4 includes a circular cover 18 and a circular plate 19. The circular cover 18 is inserted into the injection hole 7, and the surface of the circular cover 18 contacts the inner wall of the injection hole 7. A groove 21 is formed on the surface of the circular cover 18. A second protrusion 17 is welded to the inner wall of the injection hole 7 and is embedded in the groove 21. An L-shaped rod 20 is welded to the top surface of the circular plate 19, and the other end of the L-shaped rod 20 is welded to the inner wall of the circular cover 18. When the liquid level rises, the circular plate 19 rises synchronously. When the circular plate 19 moves into the injection hole 7, it cuts off the liquid connected to the injection hole 7 and seals the injection hole 7.

[0020] Working principle: The chip is placed inside the mold box 1, with the chip end contacting the inner wall of the square thin plate 11. The sliding slide 2 moves the first protrusion 12 on the bottom surface of the slide 2 along the groove 16, so that the end of the slide 2 coincides with the end of the mold box 1. In the initial state, the first scraper 9 is continuously pressured on the square thick plate 13 by the elastic force of the spring rod 8. The square thick plate 13 does not move downward due to friction. The molten epoxy resin is injected into the injection hole 7. The epoxy resin inside the injection hole 7 flows to the top surface of the circular plate 19. The epoxy resin on the top surface of the circular plate 19 eventually flows into the interior of the mold box 1. When the liquid level rises to contact the bottom surface of the circular plate 19, the liquid level continues to rise, pushing the circular plate 19 to rise synchronously. The upward movement of the circular plate 19 drives the L-shaped rod 20 to contact the circular plate 19. The cover 18 moves upward synchronously. During the displacement of the circular cover 18, the second protrusion 17 slides along the slide groove 21. The second protrusion 17 stops moving when it contacts the inner wall of the bottom of the slide groove 21. At this time, the liquid inside the mold box 1 is filled. The circular plate 19 moves into the injection hole 7 and seals the bottom of the injection hole 7. The bottom surface of the circular plate 19 is on the same plane as the bottom surface of the slide plate 2. During the process of the circular plate 19 entering the injection hole 7, it cuts off the adhering liquid to prevent adhesion. After the epoxy resin inside the mold box 1 has cooled down, the square thick plate 13 is pulled down. The square thick plate 13 moves down and drives the square thin plate 11 to move down synchronously. During the process of the square thin plate 11 moving down, it separates from the molded plastic. During the process of the square thick plate 13 moving down, the first scraper 9 moves along the side of the square thick plate 13. The surface is scraped. As the square thick plate 13 continues to move downward and detaches from the first scraper 9, the first scraper 9 is displaced to the surface of the square thin plate 11 by the pushing force of the spring rod 8. During the downward movement of the square thick plate 13, the first scraper 9 scrapes along the side of the square thin plate 11, scraping away most of the plastic remaining on the side of the square thin plate 11. When the square thin plate 11 is completely detached from the inner wall of the mold box 1, the side of the molded plastic is detached. The sliding plate 2 is then slid along one side of the second scraper 14. The displacement of the sliding plate 2 causes the circular plate 19 and the circular cover 18 to move synchronously. The second scraper 14 is continuously pressured on the bottom surface of the sliding plate 2 by the elastic force of the telescopic spring 15. During the sliding process of the sliding plate 2, the bottom surface of the sliding plate 2 is completely detached from the top surface of the molded plastic, and the second scraper... 14. Scrape off the remaining plastic on the bottom surface of the slide plate 2. The scraped debris falls into the gap formed by the removal of the square thin plate 11 and eventually falls to the outside of the mold box 1. When the end of the slide plate 2 is completely separated from the molded plastic, the side and top surfaces of the molded plastic have been separated. After removing it, reinsert the square thin plate 11 so that the top surface of the square thick plate 13 is on the same plane as the bottom surface of the mold box 1. Place the next chip to be packaged in, and slide the slide plate 2 in the opposite direction. During the displacement of the slide plate 2, when the circular plate 19 is removed from the top surface of the mold box 1, the circular plate 19 moves downward under the action of gravity. The displacement of the circular plate 19 drives the circular cover 18 to move synchronously. When the circular cover 18 moves to the point where the second protrusion 17 contacts the top inner wall of the slide groove 21,Stop the displacement when the end of the slide plate 2 coincides with the end of the mold box 1. Repeat the above process.

[0021] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model.

[0022] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A circuit chip packaging device, comprising a packaging device body, characterized in that: The main body of the packaging device includes a mold box (1), a slide plate (2), a separation mechanism (3) and a floating component (4). A fixing plate (5) is welded to the side of the mold box (1), and a support leg (6) is welded to the bottom surface of the fixing plate (5). A first protrusion (12) is welded to the top surface of the mold box (1). A groove (16) is opened on the bottom surface of the slide plate (2), and the first protrusion (12) is embedded in the groove (16). An injection hole (7) is opened on the top surface of the slide plate (2). The separation mechanism (3) includes a square thin plate (11), a square plate (10) and a second scraper (14). A square thick plate (13) is welded to the bottom surface of the square thin plate (11). The end of the square thin plate (11) passes through the bottom surface of the mold box (1). The top surface of the square plate (10) is welded to the bottom surface of the mold box (1). A spring rod (8) is inserted into the side of the square plate (10).

2. The circuit chip packaging device according to claim 1, characterized in that: The other end of the spring rod (8) is welded to the side of the first scraper (9), and the second scraper (14) is inserted into the top surface of the mold box (1).

3. The circuit chip packaging device according to claim 2, characterized in that: The end of the second scraper (14) is welded with a telescopic spring (15), and the other end of the telescopic spring (15) is welded to the inner wall of the mold box (1).

4. The circuit chip packaging device according to claim 1, characterized in that: The floating component (4) includes a circular cover (18) and a circular plate (19), the circular cover (18) being inserted inside the injection hole (7), and the surface of the circular cover (18) contacting the inner wall of the injection hole (7).

5. A circuit chip packaging device according to claim 4, characterized in that: The surface of the circular cover (18) is provided with a groove (21), and the inner wall of the injection hole (7) is welded with a second protrusion (17), which is embedded in the groove (21).

6. A circuit chip packaging device according to claim 5, characterized in that: An L-shaped rod (20) is welded to the top surface of the circular plate (19), and the other end of the L-shaped rod (20) is welded to the inner wall of the circular cover (18).

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