GPP manual cleaning line

Abstract

The utility model relates to the technical field of semiconductor wafer, disclose a kind of GPP manual cleaning line, including equipment ontology, exhaust system and electric control system.The utility model can be uniformly clamped and cleaned to wafer rack of multiple wafer sizes, basket notch can correspond different model wafer rack, servo lifting, temperature control system, ultrasonic cleaning unit all adopt standard module configuration, under the premise of guaranteeing cleaning quality, manual feeding and discharging mode retains the flexibility of manual intervention, operation interface is simple and intuitive, applicable to multiple batches, small batch, frequently switched cleaning task, especially suitable for R&D line, trial production line or flexible manufacturing environment use, improve the economy and practicality of cleaning process, realize the efficient cleaning of wafer, accurate lifting, rapid flushing and safe exhaust, applicable to the pretreatment or intermediate cleaning link in semiconductor device manufacturing, with the characteristics of process stability, operation friendly, strong adaptability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer technology, specifically a GPP manual cleaning line. Background Technology

[0002] Wafer cleaning is a critical step in the semiconductor manufacturing process, typically used to remove particles, metallic impurities, organic residues, or photoresist residues from the wafer surface to ensure the smooth operation of subsequent processes. Common cleaning methods include wet cleaning and ultrasonic cleaning. Wet cleaning is widely used in small-batch production and R&D pilot production due to its wide applicability and relatively simple equipment structure.

[0003] Existing wafer cleaning equipment is mostly automated dedicated cleaning lines, adapted to a certain type of wafer size and specific process flow. While highly automated, they lack flexibility and are not suitable for frequent product model switching or processing multiple wafer specifications. Although some manual cleaning devices are simple in structure and low in investment cost, they have significant shortcomings in cleaning efficiency, temperature control accuracy, and safe ventilation, and cannot meet the comprehensive requirements of high cleanliness, high consistency, and high versatility.

[0004] Therefore, there is an urgent need for a GPP manual cleaning line that can be adapted to uniform cleaning of various wafer racks while retaining the flexibility of manual intervention, so as to meet the application needs of trial production, development, and small-batch processing of multiple types of wafers, thereby improving cleaning efficiency and the economics of equipment use. Utility Model Content

[0005] The purpose of this invention is to provide a GPP manual cleaning line to solve the problem of high automation but poor flexibility mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a GPP manual cleaning line, comprising a device body, an exhaust system, and an electrical control system. The device body is divided into a cleaning zone and a rinsing zone. One or two sets of cleaning tanks are provided in the cleaning zone, and an overflow tank is provided in the rinsing zone. Each cleaning tank is equipped with a partition, and an ultrasonic cleaner is installed at the bottom of each cleaning tank. A servo lift is installed on the rear of the inner wall of the device body corresponding to the cleaning tank. A bracket is fixedly connected to the output shaft of the servo lift, and a basket is attached to the outside of the bracket. The overflow tank is located in front of the cleaning tank, and a flow equalization plate is fixedly installed at its bottom for rapid water overflow. The exhaust system includes an exhaust device fixed to the upper part of the inner wall of the device body for exhausting waste gas. The electrical control system includes a thermostat installed in the cleaning tank and the overflow tank for controlling the water temperature.

[0007] As a further technical solution of this utility model, a wafer rack is placed inside the basket, and the inner wall of the basket is machined with slots corresponding to the shape and number of wafer racks to facilitate docking with the wafer racks.

[0008] As a further technical solution of this utility model, the outer shell of the cleaning tank is covered with a protective cover, and the protective cover is provided with an opening for the hanging rack to pass through without obstructing its rotation.

[0009] As a further technical solution of this utility model, a wind pressure gauge is installed at the inlet of each exhaust device, and a wind duct is installed at the outlet of each exhaust device. The wind duct is fixed to the top of the equipment body, and a manually adjustable wind baffle is installed inside each wind duct. The wind duct is connected to an external exhaust duct.

[0010] As a further technical solution of this utility model, the electronic control system also includes a touch screen display, operation indicator light and function buttons installed on the upper front wall of the equipment body.

[0011] As a further technical solution of this utility model, the equipment body is a porcelain white PPS flame-retardant board, and resin casters and adjustable feet are installed at the bottom of the equipment body for moving and fixing the position of the equipment body.

[0012] Compared with existing technologies, the advantages of this utility model are: the cleaning tank can uniformly clamp and clean wafer racks of various wafer sizes; the basket slots can correspond to different models of wafer racks; the servo lifting, temperature control system, and ultrasonic cleaning unit all adopt standard modular configurations; while ensuring cleaning quality, the manual loading and unloading method retains the flexibility of human intervention; the operation interface is simple and intuitive; it is suitable for cleaning tasks with multiple batches, small quantities, and frequent switching; it is especially suitable for use in R&D lines, pilot production lines, or flexible manufacturing environments; it improves the economy and practicality of the cleaning process; it achieves efficient cleaning, precise lifting, rapid rinsing, and safe ventilation of wafers; it is suitable for pre-processing or intermediate cleaning stages in semiconductor device manufacturing; and it features stable process, user-friendly operation, and strong adaptability. Attached Figure Description

[0013] Figure 1 This is a three-dimensional left-side view schematic diagram of the present invention; Figure 2 This is a three-dimensional bottom view of the structure of this utility model; Figure 3 This is a three-dimensional right-side view of the present invention. Figure 4 This is a front view structural diagram of the present utility model; Figure 5 This is a bottom view of the structure of this utility model; Figure 6 This is a schematic diagram of the rear view structure of this utility model.

[0014] In the diagram: 1. Equipment body; 2. Exhaust system; 3. Electrical control system; 4. Cleaning tank; 5. Overflow tank; 101. Resin casters; 102. Adjustable feet; 201. Exhaust device; 202. Pressure gauge; 203. Air duct; 204. Manually adjustable baffle; 301. Temperature controller; 302. Touch screen display; 303. Operation indicator light; 304. Function buttons; 401. Partition; 402. Ultrasonic cleaner; 403. Servo lift; 404. Hanging rack; 405. Basket; 406. Wafer rack; 407. Protective cover; 501. Flow equalization plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figure 1-6 The present invention provides an embodiment of a GPP manual cleaning line, comprising a device body 1, an exhaust system 2 and an electrical control system 3. The device body 1 is divided into a cleaning area and a rinsing area. One or two sets of cleaning tanks 4 are provided in the cleaning area, and an overflow tank 5 is provided in the rinsing area. The device body 1 is made of porcelain white PPS flame retardant board. Resin casters 101 and adjustable feet 102 are installed at the bottom of the device body 1 for moving and fixing the position of the device body 1. Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the entire equipment body 1 is made of porcelain white PPS flame-retardant board, which has excellent corrosion resistance and flame retardant properties. It can be used for a long time in the corrosive environment containing acids and alkalis in semiconductor cleaning processes. The resin casters 101 installed at the bottom support the flexible movement of the equipment in the clean room, which is convenient for changing the position or maintenance. The adjustable feet 102 fix the horizontal position of the equipment to ensure the stability and structural reliability during operation. The interior of the equipment body 1 is divided into a cleaning area and a rinsing area, forming independent functional areas to prevent cross-interference of the cleaning process and facilitate operation.

[0017] The exhaust system 2 includes an exhaust device 201 fixed to the upper part of the inner wall of the equipment body 1 for exhausting exhaust gas; a wind pressure gauge 202 is installed at the inlet of the exhaust device 201, and a wind duct 203 is installed at the outlet of the exhaust device 201. The wind duct 203 is fixed to the top of the equipment body 1, and a manually adjustable wind baffle 204 is installed inside the wind duct 203. The wind duct 203 is connected to the external exhaust duct. Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 As shown, the exhaust system 2 uses the exhaust device 201 to extract acidic vapors or volatile gases generated during the cleaning process in real time, effectively reducing the risk of harmful gases accumulating inside the equipment and ensuring operator safety. A pressure gauge 202 is installed at the inlet to visually monitor the negative pressure of the pipeline and promptly detect blockages or abnormal exhaust. The air duct 203 serves as a transition channel connecting to the external exhaust duct, ensuring efficient transmission of exhaust gas and preventing external pollution. The manually adjustable baffle 204 is used to flexibly adjust the exhaust flow rate so that the exhaust efficiency matches the working conditions.

[0018] The electrical control system 3 includes a thermostat 301 installed in the cleaning tank 4 and the overflow tank 5 for controlling the water temperature. The electrical control system 3 also includes a touch screen 302, an operation indicator 303 and a function button 304 installed on the upper front wall of the equipment body 1. Specifically, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the electrical control system 3 is responsible for the temperature control and operation interaction of the entire line. The temperature controller 301 controls the liquid temperature of the cleaning tank 4 and the overflow tank 5 respectively. The operator can quickly set the temperature, view the status and adjust the process parameters on the touch screen 302. The operation indicator 303 provides real-time operation status feedback, which makes it easy to quickly judge the equipment operation status in the long distance or poor light environment. The function button 304 supports common operations such as power on / off, emergency stop, manual mode, etc., enhancing the human-machine safety interaction experience of the equipment.

[0019] Cleaning tank 4, with partitions 401 between each cleaning tank 4, and ultrasonic cleaners 402 installed at the bottom of each cleaning tank 4. A servo lift 403 is installed on the rear inner wall of the equipment body 1 corresponding to the cleaning tank 4. A bracket 404 is fixedly connected to the output shaft of the servo lift 403. A basket 405 is hung on the outside of the bracket 404. A wafer rack 406 is placed inside the basket 405. The inner wall of the basket 405 is machined with slots corresponding to the shape and number of wafer racks 406 to facilitate docking with the wafer racks 406. A protective cover 407 is provided on the outer shell of the cleaning tank 4. A notch is provided at the protective cover 407 for the bracket 404 to pass through without obstructing its rotation. Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the cleaning tank 4 serves as the core processing structure, responsible for completing the main cleaning process of the wafers. A partition 401 is set between each group of cleaning tanks 4. The ultrasonic cleaner 402 installed at the bottom of the tank creates a cavitation effect in the liquid through high-frequency vibration, which can powerfully remove particles, residual adhesive and metal impurities from the wafer surface, improving cleaning efficiency. A servo lift 403 is equipped on the rear wall, which can realize precise lifting and lowering movements during the cleaning process, ensuring the time control of soaking and oscillation. The servo lift 403 drives the hanger 404 to move the basket 405. The hanger 404 has a stable structure and moves smoothly. The basket 405 is used to hold the wafer rack 406, which facilitates unified entry and exit of the tank and improves the operation rhythm of batch cleaning.

[0020] The hanger 404 is used in conjunction with the servo lift 403 to realize the automatic lifting and lowering of the wafers during the cleaning process. The basket 405 serves as the wafer loading carrier, and its interior is machined with several slots that match the shape of the wafer rack 406 to ensure the wafer rack 406 is stably fixed and to prevent displacement, tilting or other conditions that affect the cleaning quality during ultrasonic cleaning or lifting. The basket 405 is suitable for various specifications of wafer racks 406, has good versatility and adaptability, and is easy to replace and clean.

[0021] The cleaning tank 4 can be covered with a protective cover 407 to form an effective protective barrier, preventing the cleaning liquid from splashing or evaporating into the operating area and protecting the safety of the operators. The protective cover 407 has a special opening for the hanger 404 to pass through and maintain smooth movement during lifting and lowering, ensuring that the entire line completes the cleaning operation under closed conditions, meeting the process requirements of high-cleanliness workshops and improving the overall protection level.

[0022] Overflow trough 5 is located in front of cleaning trough 4, and a flow equalization plate 501 is fixedly installed at its bottom for rapid water overflow; Specifically, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the wafer is quickly rinsed in the overflow tank 5, and the residual liquid is quickly removed by the high flow rate of rinsing water. A flow equalization plate 501 is provided at the bottom to evenly spread the incoming water flow, prevent the water flow from impacting the wafer, reduce the risk of mechanical damage, and reduce manual intervention.

[0023] Working principle: The operator inserts the wafer holder 406, already loaded with wafers, into the corresponding slot on the inner wall of the basket 405, ensuring the wafer holder 406 is stably fixed. Then, the basket 405 is hung on the hanger 404, which is driven by a servo lift 403 to move up and down, smoothly delivering the wafers into the corresponding cleaning tank 4. After the ultrasonic cleaner 402 at the bottom of the cleaning tank 4 is started, it generates a cavitation effect in the liquid through high-frequency vibration, forming continuous bursts of microbubbles that efficiently peel and rinse the wafer surface, removing particles. Metal impurities and chemical residues are separated from the multiple cleaning tanks by partitions 401 to avoid cross-contamination of liquids, allowing the cleaning process to be carried out independently in sections. A protective cover 407 can be installed on the outside of the cleaning tank 4 to isolate acid mist and block splashing liquids. Its notch design facilitates the lifting and movement of the hanging rack 404, improving operational safety. After ultrasonic cleaning, the servo lift 403 drives the hanging rack 404 to lift the basket 405, and the operator moves it above the overflow tank 5 in the rinsing area for subsequent rinsing. The overflow tank 5 forms a stable... A constant water level and a bottom flow equalization plate 501 evenly distribute the incoming water, allowing the wafers to be quickly rinsed in a high-flow-rate water body, removing residual chemical liquids from the surface and ensuring cleaning effectiveness. This also reduces the risk of wafer damage caused by localized water flow impacts. During the cleaning and rinsing process, the exhaust system 2's exhaust device 201 continuously operates, extracting acidic vapors or volatile gases from the cleaning and rinsing areas to the outside, ensuring a clean environment. A pressure gauge 202 monitors the negative pressure state to ensure stable exhaust efficiency. The air duct 203 serves as a transitional connection to the external exhaust pipe, and its internal... The unit is equipped with a manually adjustable baffle 204, which facilitates manual adjustment of the air volume to meet the exhaust needs of different stages. The entire cleaning line is intelligently managed through the electronic control system 3. The temperature controller 301 monitors and adjusts the water temperature of each tank in real time to keep the liquid within the set temperature range. The touch screen display 302 provides a human-machine interface, supporting the setting of cleaning parameters, status viewing, and reading of historical records. The operation indicator light 303 provides timely feedback on the equipment status, and the function buttons 304 facilitate the execution of power on / off, emergency stop, and manual control operations, thus improving the overall convenience and safety of operation.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A GPP manual cleaning line, comprising a main body (1), an exhaust system (2), and an electrical control system (3), characterized in that: The equipment body (1) is divided into a cleaning area and a rinsing area. One or two sets of cleaning tanks (4) are set in the cleaning area, and an overflow tank (5) is set in the rinsing area. A cleaning tank (4) is provided with a partition (401) between the cleaning tanks (4). An ultrasonic cleaner (402) is installed at the bottom of each cleaning tank (4). A servo lift (403) is installed on the inner wall of the equipment body (1) corresponding to the cleaning tank (4). The output shaft of the servo lift (403) is fixedly connected to a bracket (404). A basket (405) is hung on the outside of the bracket (404). An overflow trough (5) is located in front of the cleaning trough (4), and a flow equalization plate (501) is fixedly installed at its bottom for rapid water overflow. The exhaust system (2) includes an exhaust device (201) fixed to the upper part of the inner wall of the equipment body (1) for exhausting waste gas; The electrical control system (3) includes a thermostat (301) installed in the cleaning tank (4) and the overflow tank (5) for controlling the water temperature.

2. The GPP manual cleaning line according to claim 1, characterized in that: The basket (405) contains a wafer rack (406), and the inner wall of the basket (405) is machined with slots corresponding to the shape and number of the wafer rack (406) to facilitate docking with the wafer rack (406).

3. The GPP manual cleaning line according to claim 1, characterized in that: The cleaning tank (4) is covered with a protective cover (407), and the protective cover (407) has an opening for the hanging bracket (404) to pass through without obstructing its rotation.

4. A GPP manual cleaning line according to claim 1, characterized in that: Each of the exhaust devices (201) is equipped with a wind pressure gauge (202) at the inlet and a wind duct (203) at the outlet of each exhaust device (201). The wind duct (203) is fixed to the top of the equipment body (1). Each wind duct (203) is equipped with a manually adjustable wind baffle (204). The wind duct (203) is connected to the external exhaust pipe.

5. A GPP manual cleaning line according to claim 1, characterized in that: The electronic control system (3) also includes a touch screen (302), a running indicator (303), and function buttons (304) installed on the upper front wall of the equipment body (1).

6. A GPP manual cleaning line according to claim 1, characterized in that: The device body (1) is made of porcelain white PPS flame retardant board. Resin casters (101) and adjustable feet (102) are installed at the bottom of the device body (1) for moving and fixing the position of the device body (1).

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