Anti-wafer adsorption tackifying hot plate and coating machine

Abstract

The utility model provides a kind of anti wafer adsorption's tackifying hot plate and gluing machine, by being equipped with limit ring on hot plate body upper surface, limit ring inner side is inclined surface, and limit ring is equipped with fracture in preset position, when wafer is placed on hot plate body upper surface, limit ring can support and limit wafer, fracture can make the area between wafer and hot plate body and outside communication, to avoid wafer and hot plate body between generating airtight area, to avoid wafer and hot plate body separation when fragment caused by wafer adsorption on hot plate body upper surface, improve yield.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor technology and relates to an adhesive-enhancing hot plate and a coating machine for preventing wafer adsorption. Background Technology

[0002] In the semiconductor field, before applying adhesive to wafers, an adhesive bonding process is often completed in an adhesive bonding heat exchanger (AD) unit before the wafers are sent to the adhesive coating chamber for adhesive coating.

[0003] After undergoing thin film or bonding processes, wafers often warp, especially when they warp into a bowl shape. During the bonding process, the wafer edge adheres to the hot plate, forming a sealed area. This area experiences negative pressure due to bottom venting, while the upper surface of the wafer experiences positive pressure due to nitrogen purge and atmospheric pressure after the top cover is opened. Under the pressure difference between the upper and lower surfaces of the wafer, the wafer adheres to the hot plate due to downward pressure. After the bonding process is completed, the wafer is prone to fragmentation when separating from the hot plate.

[0004] Therefore, how to provide a heat-adhesive plate and a coating machine that prevents wafers from adhering to the heat plate and avoids fragmentation when the wafers are separated from the heat plate has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an anti-wafer adsorption hot plate and a glue coating machine, which solves the problem that wafers are easily broken when separated from the hot plate in the prior art.

[0006] To achieve the above and other related objectives, this utility model provides an anti-adhesion heat plate for preventing wafer adhesion, comprising:

[0007] Hot plate body;

[0008] A limiting ring is located on the upper surface of the hot plate body. The inner side of the limiting ring is a slope, and a break is provided at a preset position of the limiting ring.

[0009] When the wafer is placed on the upper surface of the hot plate body, the limiting ring limits the wafer, wherein the break allows the area between the wafer and the hot plate body to communicate with the outside.

[0010] Optionally, the angle between the inner side of the limiting ring and the upper surface of the hot plate body is 8°~10°.

[0011] Optionally, the number of the fracture points can be multiple.

[0012] Optionally, the limiting ring is a circular ring, the minimum inner diameter of the limiting ring is A, and the diameter of the wafer without warping is B, wherein A is less than B.

[0013] Optionally, it also includes multiple buffer points located on the upper surface of the hot plate body and within the area enclosed by the limiting ring, with the top of the buffer point lower than the top of the limiting ring.

[0014] Optionally, the height of the buffer point protruding from the upper surface of the hot plate body is 0.2mm to 0.3mm.

[0015] Optionally, it also includes a ejector pin, wherein the hot plate body is provided with an ejector pin channel, and the ejector pin is capable of vertical movement in the ejector pin channel.

[0016] Optionally, it also includes a top cover located above the hot plate body.

[0017] Optionally, the limiting ring is a polyetheretherketone limiting ring or a polyimide limiting ring.

[0018] This utility model also provides a glue coating machine, which includes the anti-wafer adsorption heat plate described in any of the above claims.

[0019] As described above, in the anti-wafer adsorption hot plate and coating machine of this utility model, a limiting ring is provided on the upper surface of the hot plate body. The inner side of the limiting ring is inclined, and the limiting ring has a break at a preset position. When the wafer is placed on the upper surface of the hot plate body, the limiting ring can support and limit the wafer. The break can connect the area between the wafer and the hot plate body with the outside world, so as to avoid the formation of a closed area between the wafer and the hot plate body during the adhesion process. This prevents the wafer from adsorbing on the upper surface of the hot plate body, which would cause fragmentation when the wafer separates from the hot plate body, thus improving the yield. Attached Figure Description

[0020] Figure 1 The image shows a top view of the wafer placed on the hot plate body.

[0021] Figure 2 The view shown is a cross-sectional view of the wafer placed on the hot plate body.

[0022] Figure 3 The image shown is a top view of the anti-wafer adhesion heating plate in an embodiment of this utility model.

[0023] Figure 4 The image shown is a cross-sectional view of a warp-free wafer placed on the upper surface of a hot plate body in an embodiment of this utility model.

[0024] Figure 5 The image shown is a cross-sectional view of a slightly warped wafer placed on the upper surface of a hot plate body in an embodiment of this utility model.

[0025] Figure 6 The image shown is a cross-sectional view of a warped wafer placed on the upper surface of a hot plate body in an embodiment of this invention.

[0026] Component labeling: 1-Hot plate body, 11-Limiting ring, 111-Break, 12-Buffer point, 13-Ejector pin, 14-Limiting pin, 2-Wafer, 3-Top cover. Detailed Implementation

[0027] Please see Figures 1-2 In the prior art, the upper surface of the hot plate body 1 is provided with a plurality of limiting pins 14 for limiting the wafer 2. When the wafer 2 is warped and the edge of the wafer 2 is attached to the hot plate body 1, a sealed area is formed between the wafer 2 and the hot plate body 1. When there is a pressure difference between the sealed area and the outside, the wafer 2 will be adsorbed on the upper surface of the hot plate body 1. The purpose of this application is to prevent the wafer from adsorbing on the hot plate body and avoid fragmentation when the wafer is separated from the hot plate body.

[0028] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0029] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0030] In the detailed description of the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0031] In the context of this application, the structure described above the first feature may include embodiments in which the first feature and the second feature are in direct contact, or embodiments in which an additional feature is disposed between the first feature and the second feature, such that the first feature and the second feature may not be in direct contact.

[0032] Please see Figures 3-6It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0033] This embodiment provides a heat-insulating plate to prevent wafer adhesion. Please refer to [link / reference]. Figures 3 to 4 The anti-wafer adhesion heat plate includes a heat plate body 1 and a limiting ring 11. The limiting ring 11 is located on the upper surface of the heat plate body 1. The inner side of the limiting ring 11 is a slope. The limiting ring 11 has a break 111 at a preset position. When the wafer 2 is placed on the upper surface of the heat plate body 1, the limiting ring 11 limits the wafer 2. The break 111 allows the area between the wafer 2 and the heat plate body 1 to communicate with the outside.

[0034] As an example, the hot plate body 1 is used to support and heat the wafer 2.

[0035] As an example, the limiting ring 11 is circular in shape and is used to limit the wafer 2 placed on the hot plate body 1.

[0036] As an example, the minimum inner diameter of the limiting ring 11 is A (the minimum inner diameter is the diameter at the lowest point of the inner surface), and the diameter of the wafer 2 without warping is B, wherein A is less than B. Figure 4 As shown, when the wafer 2 requiring adhesion enhancement is warp-free, the edge of the wafer 2 contacts the inner surface of the limiting ring 11. Because the limiting ring 11 has a pre-set break 111, the area between the wafer 2 and the hot plate body 1 is connected to the outside, preventing the area between the wafer 2 and the hot plate body 1 from forming a sealed area, thus avoiding the wafer 2 from adsorbing onto the hot plate body 1.

[0037] As an example, the angle between the inner side of the limiting ring 11 and the upper surface of the hot plate body 1 is 8°~10°, for example, it can be 8°, 9°, 10°, etc., selected according to requirements. The inner side of the limiting ring 11 is a smooth inclined surface. When there is a placement deviation of the wafer 2, and one end of the edge of the wafer 2 is higher than the other end, the wafer 2 can slide on the inner side to balance the two ends of the wafer 2.

[0038] As an example, in this embodiment, the width of the limiting ring 11 is approximately 5 mm, the minimum inner diameter of the limiting ring 11 is 298 mm, and the diameter of the wafer 2 without warping is 300 mm. When the wafer 2 is placed on the hot plate body 1, the edge of the wafer 2 falls on the inner side of the limiting ring 11, and the vertical distance between it and the upper surface of the hot plate body 1 is 0.35 mm, which does not affect the normal heating efficiency of the hot plate body 1 on the wafer 2.

[0039] As an example, the number of breaks 111 is multiple to improve the communication between the area between the wafer 2 and the hot plate body 1 and the outside world. Specifically, in this embodiment, the number of breaks 111 is set to 4, and the 4 breaks 111 are evenly distributed in the limiting ring 11. In other examples, the number of breaks 111 may be more than 4 or less than 4, depending on the requirements.

[0040] As an example, the limiting ring 11 is a polyetheretherketone limiting ring or a polyimide limiting ring, which can be selected according to the requirements.

[0041] As an example, such as Figure 5 As shown, when the wafer 2, which requires adhesive bonding treatment, experiences a slight warping, the edge of the wafer 2 falls onto the inner side of the limiting ring 11, which provides support and positioning for the wafer 2.

[0042] As an example, the anti-wafer adhesion hot plate also includes a plurality of buffer points 12, which are located on the upper surface of the hot plate body 1 and within the area enclosed by the limiting ring 11, with the top of each buffer point 12 lower than the top of the limiting ring 11. Figure 6 As shown, when the wafer 2, which requires adhesive bonding treatment, experiences large warping, the wafer 2 will smoothly fall onto the buffer point 12, and the limiting ring 11 will limit the wafer 2.

[0043] As an example, the height of the buffer point 12 protruding from the upper surface of the hot plate body 1 is 0.2mm to 0.3mm, for example, it can be 0.2mm, 0.25mm, 0.3mm, etc., and can be selected according to the requirements; specifically, in this embodiment, the height of the buffer point 12 protruding from the upper surface of the hot plate body 1 is 0.2mm.

[0044] As an example, the anti-wafer adhesion hot plate also includes a pin 13, wherein the hot plate body 1 is provided with a pin channel, and the pin 13 can move vertically in the pin channel. When a transfer device such as a robot places the wafer 2 into the pin 13, the pin 13 moves downward to place the wafer 2 on the upper surface of the hot plate body 1; when the wafer 2 completes the adhesion process, the pin 13 moves upward to separate the wafer 2 from the upper surface of the hot plate body 1.

[0045] As an example, the anti-wafer adhesion hot plate also includes an upper cover 3, which is located above the hot plate body 1. When the wafer 2 is being adhesion-enhanced, the wafer 2 is located in a sealed space formed by the upper cover 3 and the hot plate body 1.

[0046] This embodiment also provides a glue coating machine, which includes the aforementioned anti-wafer adhesion heat plate.

[0047] In summary, the anti-wafer adhesion hot plate and coating machine of this invention feature a limiting ring on the upper surface of the hot plate body. The inner side of the limiting ring is beveled, and the limiting ring has a break at a preset position. When the wafer is placed on the upper surface of the hot plate body, the limiting ring can support and limit the wafer. The break allows the area between the wafer and the hot plate body to be connected to the outside, preventing the formation of a sealed area between the wafer and the hot plate body during the adhesion process. This avoids the wafer adhering to the upper surface of the hot plate body, preventing fragmentation when the wafer separates from the hot plate body, thus improving yield. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0048] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A heat-insulating plate for preventing wafer adhesion, characterized in that, include: Hot plate body; A limiting ring is located on the upper surface of the hot plate body. The inner side of the limiting ring is a slope, and a break is provided at a preset position of the limiting ring. When the wafer is placed on the upper surface of the hot plate body, the limiting ring limits the wafer, wherein the break allows the area between the wafer and the hot plate body to communicate with the outside.

2. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that: The angle between the inner side of the limiting ring and the upper surface of the hot plate body is 8°~10°.

3. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that: The number of fractures is multiple.

4. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that: The limiting ring is a circular ring, the minimum inner diameter of the limiting ring is A, and the diameter of the wafer without warping is B, wherein A is less than B.

5. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that, It also includes multiple buffer points, which are located on the upper surface of the hot plate body and within the area enclosed by the limiting ring, with the top of the buffer point lower than the top of the limiting ring.

6. The anti-adhesion heating plate for preventing wafer adhesion according to claim 5, characterized in that: The height of the buffer point protruding from the upper surface of the hot plate body is 0.2mm~0.3mm.

7. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that, It also includes thimbles, among which, The hot plate body is provided with a ejector pin channel, and the ejector pin can move vertically in the ejector pin channel.

8. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that, It also includes a top cover, which is located above the hot plate body.

9. The anti-adhesion heating plate for preventing wafer adhesion according to claim 1, characterized in that: The limiting ring is a polyetheretherketone limiting ring or a polyimide limiting ring.

10. A glue applicator, characterized in that, The coating machine includes a heat-increasing plate for preventing wafer adsorption as described in any one of claims 1-9.

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