Chip package anti-warping carrier

Abstract

The utility model discloses a kind of warping-preventing carriers for chip packaging, belong to chip packaging field, and it includes hard seal frame, the top of the hard seal frame is fixedly connected with insert block, the inside of the insert block is fixedly connected with inner spring, one end of the inner spring is fixedly connected with the clamping arc block, the bottom of the clamping arc block is movably connected with transparent cover frame, the inside of the transparent cover frame is fixedly connected with inner interface column, the bottom of the inner interface column is fixedly connected with soft rubber pressure plate;Hard seal frame, insert block, inner spring, clamping arc block, transparent cover frame, inner interface column and soft rubber pressure plate set up, can make the carrier used for chip packaging more convenient, can provide the effect of warping-preventing for chip, to reduce the probability of chip damage after packaging, reduce the probability of goods damage in subsequent work, reduce the overall work cost, facilitate the mass use of chip packaging carrier.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, specifically an anti-warping carrier for chip packaging. Background Technology

[0002] A chip (also known as an integrated circuit) is a miniature electronic device that integrates a large number of electronic components such as transistors, resistors, and capacitors, along with their interconnections, onto a semiconductor wafer (mostly a silicon wafer) using micro-nano manufacturing technology. It performs specific electrical functions and its core function is to calculate, store, process, and transmit electrical signals. It is the "brain" and "heart" of all electronic devices and is widely used in almost all fields that rely on electronic technology, such as mobile phones, computers, automobiles, home appliances, communication equipment, industrial control, and aerospace. In order to package the manufactured chips, chip packaging carriers are needed.

[0003] An investigation revealed that patent CN114242667B discloses a fan-out chip packaging method and structure. The method involves forming a first adhesive film protrusion on the surface of a carrier, followed by molding to form a molded enclosure covering the first adhesive film protrusion. The carrier and the first adhesive film protrusion are then removed, leaving the molded enclosure with a first groove. A first chip is then mounted within the first groove, and a passivation layer is formed on the surface of the molded enclosure. Finally, a wiring assembly layer is formed, and ball bearings are installed. Compared to existing technologies, this invention avoids etching grooves on a silicon substrate to place the chip, thus avoiding a series of problems associated with etching. Furthermore, the use of adhesive film protrusion molding reduces the process difficulty and allows for more precise control over the dimensions of the first groove, which is beneficial for chip mounting. In addition, since the molding process is completed on the carrier, the support of the carrier effectively prevents warping of the molded enclosure.

[0004] When users use the aforementioned patents, most chip packaging carriers currently on the market are not very convenient to use, do not provide anti-warping effects for chips, thereby increasing the probability of chip damage after packaging, increasing the probability of product loss in subsequent work, increasing the overall work cost, and hindering the large-scale use of chip packaging carriers.

[0005] Therefore, this utility model provides an anti-warping carrier for chip packaging to solve the above problems. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] This invention provides an anti-warping carrier for chip packaging, aiming to solve the problems mentioned in the background art.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, the present invention provides the following technical solution: an anti-warping carrier for chip packaging, comprising a rigid sealing frame, an insertion block fixedly connected to the top of the rigid sealing frame, an inner spring fixedly connected inside the insertion block, a locking arc block fixedly connected to one end of the inner spring, and a transparent cover frame movably connected to the bottom of the locking arc block.

[0010] The transparent cover frame is fixedly connected to an inner post, and the bottom of the inner post is fixedly connected to a soft rubber pressure plate. This makes the chip packaging carrier more convenient to use, provides anti-warping effect for the chip, reduces the probability of chip damage after packaging, reduces the probability of product damage in subsequent work, reduces the overall work cost, and is conducive to the mass use of chip packaging carriers.

[0011] As a preferred technical solution of this application, a T-shaped limiting strip is fixedly connected to one side of the transparent cover frame, and the length of the T-shaped limiting strip is equal to the length of the transparent cover frame.

[0012] As a preferred technical solution of this application, a side spring is fixedly connected inside the T-shaped limiting strip, and a limiting piston is fixedly connected to the top of the side spring.

[0013] As a preferred technical solution of this application, a limiting side frame is fixedly connected to one side of the transparent cover frame, and a circular hole is provided at the top of the limiting side frame, and the diameter of the circular hole at the top of the limiting side frame is equal to the diameter of the limiting piston.

[0014] As a preferred technical solution of this application, the bottom of the rigid enclosure is fixedly connected with a drop-proof rubber pad, and the length and width of the drop-proof rubber pad are both greater than the length and width of the rigid enclosure.

[0015] As a preferred technical solution of this application, one side of the locking arc block is movably connected to the interior of the insertion block via an inner spring, and the number of insertion blocks is two.

[0016] As a preferred technical solution of this application, the top of the hard sealing frame is provided with a rectangular opening, the length and width of the rectangular opening at the top of the hard sealing frame are both greater than the length and width of the soft rubber pressing plate.

[0017] (III) Beneficial Effects

[0018] This utility model provides an anti-warping carrier for chip packaging. By setting a hard sealing frame, interlocking block, inner spring, locking arc block, transparent cover frame, inner connecting post and soft rubber pressure plate, the carrier for chip packaging can be made more convenient to use, can provide anti-warping effect for the chip, thereby reducing the probability of chip damage after packaging, reducing the probability of product damage in subsequent work, reducing the overall work cost, and facilitating the mass use of chip packaging carriers.

[0019] This utility model provides an anti-warping carrier for chip packaging. By setting a T-shaped limiting strip, side spring, limiting piston, limiting side frame and anti-drop rubber pad, multiple carriers can be connected and locked, which facilitates the subsequent transportation of batch carriers and is beneficial for the carriers to be moved to different locations. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a bottom view of the structure of this utility model;

[0023] Figure 3 This is a cross-sectional view of the structure of this utility model;

[0024] Figure 4 This is a side sectional view of the structure of this utility model;

[0025] Figure 5 This is the utility model Figure 4 Enlarged view of the structure at point A in the middle.

[0026] In the picture:

[0027] 1. Hard sealing frame; 2. Insertion block; 3. Inner spring; 4. Engaging arc block; 5. Transparent cover frame; 6. Inner connecting column; 7. Soft rubber pressure plate; 8. T-shaped limit strip; 9. Side spring; 10. Limiting movable column; 11. Limiting side frame; 12. Anti-fall rubber pad. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-5 The present invention provides a technical solution: an anti-warping carrier for chip packaging, including a rigid frame 1, a mating block 2 fixedly connected to the top of the rigid frame 1, and an inner spring 3 fixedly connected inside the mating block 2.

[0030] In this embodiment, a T-shaped limiting strip 8 is fixedly connected to one side of the transparent cover frame 5, and the length of the T-shaped limiting strip 8 is equal to the length of the transparent cover frame 5. A side spring 9 is fixedly connected inside the T-shaped limiting strip 8, and a limiting piston 10 is fixedly connected to the top of the side spring 9.

[0031] like Figure 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: one end of the inner spring 3 is fixedly connected to a locking arc block 4, and the bottom of the locking arc block 4 is movably connected to a transparent cover frame 5.

[0032] In this embodiment, a limiting side frame 11 is fixedly connected to one side of the transparent cover frame 5. A circular hole is provided at the top of the limiting side frame 11, and the diameter of the circular hole at the top of the limiting side frame 11 is equal to the diameter of the limiting piston 10. An anti-fall rubber pad 12 is fixedly connected to the bottom of the hard sealing frame 1, and the length and width of the anti-fall rubber pad 12 are both greater than the length and width of the hard sealing frame 1.

[0033] like Figure 1-5 As shown, based on Embodiment 1, this utility model provides a technical solution: an inner post 6 is fixedly connected inside the transparent cover frame 5, and a soft rubber pressing plate 7 is fixedly connected to the bottom of the inner post 6. This makes the chip packaging carrier more convenient to use, provides anti-warping effect for the chip, thereby reducing the probability of chip damage after packaging, reducing the probability of product damage in subsequent work, reducing the overall work cost, and facilitating the mass use of chip packaging carriers.

[0034] In this embodiment, one side of the locking arc block 4 is movably connected to the interior of the insertion block 2 via an inner spring 3, and there are two insertion blocks 2. The top of the hard sealing frame 1 is provided with a rectangular opening, and the length and width of the rectangular opening at the top of the hard sealing frame 1 are both greater than the length and width of the soft rubber pressure plate 7.

[0035] like Figure 1-5As shown, when a user needs to use an anti-warping carrier for chip packaging, pressing the locking arc block 4 causes the inner spring 3 to contract. The contraction of the inner spring 3 causes the locking arc block 4 to retract into the insertion block 2. Now, the transparent cover frame 5 can be removed by lifting it upwards. The chip to be packaged is placed at the opening at the top of the hard cover frame 1. Then, the opening at the top of the transparent cover frame 5 is aligned with the insertion block 2 and pressed down, causing the locking arc block 4 to pop out from the top of the transparent cover frame 5. At the same time, the soft rubber pressure plate 7 can... The chip is pressed and positioned to prevent it from shaking inside. If multiple vehicles need to be spliced ​​together, the T-shaped limiting strip 8 of the first vehicle slides into the side of the limiting side frame 11. When the limiting piston 10 contacts the limiting side frame 11, the limiting piston 10 is pressed to compress the side spring 9, thereby causing the limiting piston 10 to retract into the interior of the T-shaped limiting strip 8 until the limiting piston 10 pops out at the top opening of the limiting side frame 11, thus completing the splicing of the two vehicles.

[0036] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A warp-resistant carrier for chip packaging, comprising a rigid encapsulation frame (1), characterized in that: The top of the hard sealing frame (1) is fixedly connected to a plug block (2), the inside of the plug block (2) is fixedly connected to an inner spring (3), one end of the inner spring (3) is fixedly connected to a locking arc block (4), and the bottom of the locking arc block (4) is movably connected to a transparent cover frame (5). An inner post (6) is fixedly connected inside the transparent cover frame (5), and a soft rubber pressure plate (7) is fixedly connected to the bottom of the inner post (6).

2. The anti-warping carrier for chip packaging according to claim 1, characterized in that: A T-shaped limiting strip (8) is fixedly connected to one side of the transparent cover frame (5), and the length of the T-shaped limiting strip (8) is equal to the length of the transparent cover frame (5).

3. The anti-warping carrier for chip packaging according to claim 2, characterized in that: The T-shaped limiting strip (8) is internally fixedly connected to a side spring (9), and the top end of the side spring (9) is fixedly connected to a limiting piston (10).

4. The anti-warping carrier for chip packaging according to claim 1, characterized in that: A limiting side frame (11) is fixedly connected to one side of the transparent cover frame (5). A circular hole is provided at the top of the limiting side frame (11), and the diameter of the circular hole at the top of the limiting side frame (11) is equal to the diameter of the limiting piston (10).

5. The anti-warping carrier for chip packaging according to claim 1, characterized in that: The bottom of the hard enclosure (1) is fixedly connected to an anti-fall rubber pad (12), and the length and width of the anti-fall rubber pad (12) are both greater than the length and width of the hard enclosure (1).

6. The anti-warping carrier for chip packaging according to claim 1, characterized in that: One side of the locking arc block (4) is movably connected to the interior of the insertion block (2) via an inner spring (3), and there are two insertion blocks (2).

7. The anti-warping carrier for chip packaging according to claim 1, characterized in that: The top of the hard sealing frame (1) is provided with a rectangular opening, the length and width of which are greater than the length and width of the soft rubber pressing plate (7).

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