Chip heat sink transfer jig

Abstract

The application relates to a material transfer jig for a chip heat sink, which comprises a jig main body, the center of one side surface of the jig main body is a step position recessed inward, the step position is used for accommodating a placing box, and the inner side edge of the step position provides limiting for the edge of the placing box, and the placing box and the jig main body are switched between a buckling state and a separation state. In the embodiments provided by the application, the jig main body matched with a plastic wafer box and a metal wafer box as the placing box is used for material transfer, the jig main body is buckled on the plastic wafer box and is turned over, then the metal wafer box is buckled on the jig main body and is turned over again, so that the chips in the plastic wafer box are transferred to the metal wafer box, the chips are sent to the heat sink treatment through the metal wafer box, and the efficiency of chip material transfer operation before heat sink processing is effectively improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip manufacturing and processing technology, and in particular to a transfer fixture for chip heat sinks. Background Technology

[0002] A chip heat sink is a process used to dissipate heat from a chip. Its main function is to absorb and dissipate heat from the chip, keeping it within a suitable range for operation, processing, and testing, and preventing problems such as performance degradation, shortened lifespan, or even damage caused by overheating.

[0003] During chip heat sinking, plastic waffle boxes are typically used for temporary storage and transport of chips at the incoming end. However, since plastic waffle boxes are prone to contamination in plasma cleaning machines, the chips need to be transferred from plastic waffle boxes to metal waffle boxes before being sent to the heat sink process.

[0004] In existing technologies, chip transfer is often done by transfer machines, such as robotic arms, to pick up and place chips one by one. This method is inefficient and not conducive to mass production. Utility Model Content

[0005] This application provides a chip heat sink transfer fixture to solve the problem of low efficiency in chip transfer operations in the prior art.

[0006] This application provides a transfer fixture for a chip heat sink, comprising: a fixture body, wherein the center of one side of the fixture body is an inwardly recessed step, the step being used to accommodate a placement box, and the inner edge of the step providing a limit for the edge of the placement box, and the placement box and the fixture body switching between a snap-fit ​​state and a detached state.

[0007] Furthermore, the step position includes a first-level step and a second-level step arranged from high to low, and the placement box includes: a base plate and a placement platform disposed at the center of the base plate. In the snap-fit ​​state, the outer side of the base plate is in contact with the inner side of the first-level step, and the outer side of the protrusion is in contact with the inner side of the second-level step.

[0008] Furthermore, the inner corner of the step is provided with an inner rounded corner, and in the snap-fit ​​state, the outer corner of the placement box is embedded in the inner round hole.

[0009] Furthermore, an anti-foolproof groove is provided at one inner corner of the step, the anti-foolproof groove being used to accommodate an anti-foolproof chamfer at one outer corner of the box.

[0010] Furthermore, an identification chamfer is provided at the outer corner of the fixture body corresponding to the error-proof slot.

[0011] Furthermore, the jig body has symmetrically arranged stripping grooves along its edges. These stripping grooves are through grooves that pass through the upper and lower surfaces of the jig body and extend to the edge of the step.

[0012] Furthermore, the jig body has symmetrical gripping grooves on its edges, and the gripping grooves are blind grooves that do not penetrate the upper and lower surfaces of the jig body.

[0013] Furthermore, the fixture body is provided with a plurality of transfer slots, which correspond to the placement slots of the placement box and are mirror images of each other.

[0014] The technical solutions provided in this application have the following advantages compared with the prior art:

[0015] In the embodiments provided in this application, a fixture body matching the plastic waffle box and the metal waffle box used as placement boxes is used for material transfer. The fixture body is placed upside down on the plastic waffle box and flipped over, and then the metal waffle box is placed upside down on the fixture body and flipped over a second time. This achieves the transfer of chips from the plastic waffle box to the metal waffle box, so that the chips can be sent to the heat sink for heat sink processing through the metal waffle box, effectively improving the efficiency of chip transfer operation before heat sink processing. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0019] Figure 1 This is a schematic diagram of the assembly structure of a chip heat sink transfer fixture provided in an embodiment of this application.

[0020] Figure 2 This is a schematic diagram showing the plastic waffle box separated from the main fixture body.

[0021] Figure 3 This is a schematic diagram of the fixture body separated from the metal waffle box.

[0022] Figure 4 This is a schematic diagram of the main body of the fixture.

[0023] Figure 5 This is a structural diagram of the box.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Fixture body; 11. Step position; 111. First-level step; 112. Second-level step; 12. Inner rounded corner; 13. Anti-foolproof groove; 14. Identification chamfer; 15. Detachment groove; 16. Grip groove; 17. Transfer groove; 2. Placement box; 21. Base plate; 22. Placement platform; 23. Anti-foolproof chamfer; 24. Placement groove; 3. Chip. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0028] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0029] To address the low efficiency of chip transfer operations in existing technologies, this application provides a chip heat sink transfer fixture. This fixture uses a main body that matches a plastic waffle box and a metal waffle box used as placement boxes for transfer. The fixture main body is inverted onto the plastic waffle box and flipped, then the metal waffle box is inverted onto the fixture main body and flipped a second time. This transfers the chip from the plastic waffle box to the metal waffle box, facilitating the delivery of the chip to the heat sink for processing, effectively improving the efficiency of chip transfer operations before heat sink processing.

[0030] Please see Figures 1 to 5 This application provides a transfer fixture for a heat sink of a chip 3, including: a fixture body 1, wherein the center of one side of the fixture body 1 is an inwardly recessed step 11, the step 11 is used to accommodate a placement box 2, and the inner edge of the step 11 provides a limit for the edge of the placement box 2, and the placement box 2 and the fixture body 1 can switch between a snap-fit ​​state and a disengaged state.

[0031] In the embodiments provided in this application, the placement box 2 is divided into a plastic waffle box and a metal waffle box according to its material. When the chip 3 arrives, it is generally loaded and fed through the plastic waffle box. However, since the plastic waffle box cannot be sent into the plasma cleaning equipment, it is necessary to transfer the chip 3 placed in the plastic waffle box to the metal waffle box, so that the chip 3 can be carried into the plasma cleaning equipment for the corresponding heat sink process through the metal waffle box.

[0032] Before the heat sink process, the fixture body 1 is inverted onto the plastic waffle box, so that the edge of the plastic waffle box is in contact with the inner edge of the step 11 on the fixture body 1. Then, the plastic waffle box and fixture body 1 are flipped upside down, so that the fixture body 1 is below and the plastic waffle box is above. The plastic waffle box is removed. At this time, the chip 3 in the plastic waffle box separates from the plastic waffle box under the action of gravity and falls onto the fixture body 1. The metal waffle box is then snapped onto the fixture body 1, so that the edge of the metal waffle box is in contact with the inner edge of the step 11 on the fixture body 1. Then, the metal waffle box and fixture body 1 are flipped upside down, so that the fixture body 1 is above and the metal waffle box is below. The fixture body 1 is removed. At this time, the chip 3 in the fixture body 1 separates from the fixture body 1 under the action of gravity and falls into the metal waffle box. In this state, since the chip 3 has been flipped twice, its orientation is the same as that of the chip 3 when it is transported in the plastic waffle box. Furthermore, since the two flipping processes provide a limiting effect through the inner edge of the step position 11 of the fixture body 1, the position of the chip 3 is stable, ensuring the consistency of the chip 3 before and after the transfer.

[0033] In the embodiments provided in this application, a fixture body 1 matching the plastic waffle box and the metal waffle box used as the placement box 2 is used for material transfer. The fixture body 1 is placed upside down on the plastic waffle box and flipped over. Then, the metal waffle box is placed upside down on the fixture body 1 and flipped over a second time. In this way, the chip 3 in the plastic waffle box is transferred to the metal waffle box, so that the chip 3 can be sent to the heat sink through the metal waffle box for heat sink processing, which effectively improves the efficiency of the chip 3 material transfer operation before heat sink processing.

[0034] In some embodiments, the step position 11 includes a first-level step 111 and a second-level step 112 arranged from high to low. Each placement box 2 includes a base plate 21 and a placement platform 22 disposed at the center of the base plate 21. In the snap-fit ​​state, the outer side of the base plate 21 is in contact with the inner side of the first-level step 111, and the outer side of the protrusion is in contact with the inner side of the second-level step 112. By setting the step position 11 as a hierarchical first-level step 111 and second-level step 112, the base plate 21 and the outer side of the placement platform 22 of the plastic waffle box and / or metal waffle box are simultaneously limited and fixed, improving the connection stability between the fixture body 1 and the plastic waffle box or metal waffle box in the snap-fit ​​state, ensuring that the position of the chip 3 does not change before and after flipping, so as to meet the requirement of transferring the chip 3 by flipping, and making it easy to keep the relative position of the chip 3 unchanged during two flipping processes, so as to improve the transfer accuracy during the second flipping.

[0035] In some embodiments, the inner corner of the step 11 is provided with an inner rounded corner 12, and in the snap-fit ​​state, the outer corner of the placement box 2 is embedded in the inner round hole. In the prior art, during the processing of the fixture body 1, the step 11 of the fixture body 1 is not processed properly, resulting in processing allowance at the inner corner, which in turn interferes with the outer corner of the plastic waffle box or metal waffle box, affecting the overall snap-fit ​​effect. In this case, since the plastic waffle box or metal waffle box cannot fit tightly with the fixture body 1, there is a gap between the plastic waffle box or metal waffle box and the fixture body 1, which can easily cause displacement during the transfer of the chip 3, affecting the subsequent transfer effect. In the embodiments provided in this application, since an inner rounded corner 12 is provided at the inner corner of the step 11, it is ensured that the plastic waffle box and the fixture body 1, or the metal waffle box and the fixture body 1, can fit tightly in the snap-fit ​​state, avoiding the chip 3 from shifting from the gap during the flipping process and affecting the transfer effect.

[0036] In some embodiments, the fixture body 1 is provided with a plurality of transfer slots 17, which correspond to the placement slots 24 of the plastic waffle box and the metal waffle box, and are mirror images of each other. Upon arrival, the chips 3 are sequentially placed in the placement slots 24 of the plastic waffle box. By snapping the plastic waffle box onto the fixture body 1 and flipping it over, the chips 3 fall from the placement slots 24 of the plastic waffle box into the transfer slots 17 of the fixture body 1, thus completing the first transfer of the chips 3. After removing the plastic waffle box and attaching the metal waffle box to the fixture body 1, the fixture body 1 and the metal waffle box are flipped over. This allows the chip 3 to fall from the transfer slot 17 of the fixture body 1 into the placement slot 24 of the metal waffle box, thus transferring the chip 3 into the metal waffle box. At the same time, the position of the chip 3 and the distance between them remain unchanged, making it convenient to send the chip 3 in batches into the plasma cleaning equipment for the corresponding heat sink process through the metal waffle box.

[0037] In some embodiments, an anti-mistake groove 13 is provided at one inner corner of the step 11, and the anti-mistake groove 13 is used to accommodate an anti-mistake chamfer 23 at one outer corner of the placement box 2. By setting mutually matching anti-mistake grooves 13 and anti-mistake chamfers 23, when performing a fastening operation between the plastic waffle box and the fixture body 1, or between the metal waffle box and the fixture body 1, if the anti-mistake groove 13 and the anti-mistake chamfer 23 are in the matching position, the fastening action can be successfully achieved, and there will be no gap between the plastic waffle box and the fixture body 1, or between the metal waffle box and the fixture body 1, which can effectively transfer the chip 3 and send the chip 3 into the corresponding transfer slot 17 or placement slot 24. If the anti-misalignment groove 13 and the anti-misalignment chamfer 23 do not match during the snap-fitting process, the outer corner of the anti-misalignment chamfer 23 will interfere with the anti-misalignment groove 13, causing the plastic waffle box and the fixture body 1, or the metal waffle box and the fixture body 1, to not be fully fitted. This will alert the operator that there is an abnormal snap-fitting direction, so that the operator can correct it in time. This will prevent the chip 3 from failing to fall into the preset transfer slot 17 or placement slot 24 after the chip 3 is transferred due to the incorrect fitting direction, which would cause the chip 3 to be in a disordered position during subsequent transportation or processing, affecting the overall efficiency of automated processing.

[0038] In some embodiments, an identification chamfer 14 is provided at the outer corner of the fixture body 1 corresponding to the anti-misalignment slot 13. Because the transfer slot 17 and the placement slot 24 are obstructed when the plastic waffle box or the metal waffle box is fastened to the fixture body 1, the operator cannot visually determine whether the relative positional relationship between the plastic waffle box and the fixture body 1, or between the metal waffle box and the fixture body 1, is correct. Therefore, by providing an identification chamfer 14 at the outer corner of the fixture body 1 near the anti-misalignment slot 13, the operator can quickly identify the fastening direction, effectively improving the overall material transfer efficiency.

[0039] In some embodiments, the jig body 1 is symmetrically provided with release grooves 15 along its edge. The release grooves 15 are through grooves that pass through the upper and lower surfaces of the jig body 1 and extend to the edge of the step 11. When the plastic waffle box is flipped over from the jig body 1 and it is necessary to remove the plastic waffle box from the top, a hand can be inserted through the release grooves 15 to the edge of the bottom plate 21 where the plastic waffle box and the jig body 1 are attached, so as to lift and detach the plastic waffle box from the jig body 1, so as to facilitate the subsequent fastening of the metal waffle box.

[0040] In some embodiments, the jig body 1 is symmetrically provided with gripping grooves 16 along its edges. The gripping grooves 16 are blind grooves that do not penetrate the upper and lower surfaces of the jig body 1. When the jig body 1 and the metal waffle box are flipped over and it is necessary to remove the jig body 1 located on top, one can reach into the gripping grooves 16 to grasp and lift the jig body 1, thereby separating the jig body 1 from the metal waffle box and transferring the chip 3 into the metal waffle box.

[0041] In the embodiments provided in this application, a jig body 1 matching the plastic waffle box and the metal waffle box is used for material transfer. The jig body 1 is placed upside down on the plastic waffle box and flipped over. Then, the metal waffle box is placed upside down on the jig body 1 and flipped over a second time. In this way, the chip 3 in the plastic waffle box is transferred to the metal waffle box, so that the chip 3 can be sent to the heat sink through the metal waffle box for heat sink processing, which effectively improves the efficiency of the chip 3 material transfer operation before heat sink processing.

[0042] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0043] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0048] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0049] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A transfer fixture for chip heat sinks, characterized in that, include: The fixture body has an inwardly recessed step at the center of one side. The step is used to accommodate the placement box and provides a limit for the edge of the placement box through the inner edge of the step. The placement box and the fixture body can switch between a snap-fit ​​state and a detached state.

2. The chip heat sink transfer fixture according to claim 1, characterized in that, The steps include a first-level step and a second-level step arranged from high to low. The placement box includes a base plate and a placement platform disposed at the center of the base plate. In the snap-fit ​​state, the outer side of the base plate is attached to the inner side of the first-level step, and the outer side of the protrusion is attached to the inner side of the second-level step.

3. The chip heat sink transfer fixture according to claim 1 or 2, characterized in that, The inner corner of the step is rounded, and in the snap-fit ​​state, the outer corner of the placement box is embedded in the inner round hole.

4. The chip heat sink transfer fixture according to claim 1 or 2, characterized in that, An anti-foolproof groove is provided at one inner corner of the step, and the anti-foolproof groove is used to accommodate the anti-foolproof chamfer at one outer corner of the box.

5. The chip heat sink transfer fixture according to claim 4, characterized in that, The fixture body has an identification chamfer at the outer corner corresponding to the anti-mistake slot.

6. The chip heat sink transfer fixture according to claim 1, characterized in that, The jig body has symmetrically arranged stripping grooves along its edges. The stripping grooves are through grooves that pass through the upper and lower surfaces of the jig body and extend to the edge of the step.

7. The chip heat sink transfer fixture according to claim 1, characterized in that, The jig body has symmetrical gripping grooves along its edges. These gripping grooves are blind grooves that do not penetrate the upper or lower surfaces of the jig body.

8. The chip heat sink transfer fixture according to claim 1, characterized in that, The fixture body is provided with a number of transfer slots, which correspond to the placement slots of the placement box and are mirror images of each other.

Images