A film loading and unloading device

Abstract

The utility model relates to a semiconductor technical field discloses a kind of piece mounting and taking device, jig, getter assembly and air intake assembly;Jig is equipped with the accommodation groove for accommodating substrate;Getter assembly includes the suction disc main body being equipped in the upper portion of jig;Air intake assembly includes air guide plate, air guide plate is equipped between suction disc main body and jig, and air guide plate is equipped with suction hole;Air guide plate inside is provided with air inlet channel, and air inlet channel includes air inlet end and air outlet end, and air inlet end is used to pass in sweep gas;Air outlet end is set to the side of air guide plate close to jig, and air outlet end is equipped with air inlet gap, and the side wall of air inlet gap far from jig center is obliquely arranged;The utility model realizes the guidance to high-pressure gas by the oblique side wall of air inlet gap, so that high-pressure gas can be more stably and reliably guided to the below of substrate, cooperates suction disc main body, creates more stable and reliable pressure difference, and substrate can be more quickly and stably sucked and fixed, improves the transfer efficiency and production detection efficiency of substrate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer loading and unloading device. Background Technology

[0002] Indium phosphide (IP) substrates have applications in the manufacture of high-frequency, high-power devices, fiber optic communications, wireless transmission, radio astronomy, and other radio frequency (RF) devices. RF devices manufactured using IPT substrates have demonstrated excellent performance in applications such as satellites and radar.

[0003] In the manufacturing process of indium phosphide substrates, the indium phosphide substrates need to be transferred between multiple devices in different processes to ensure the normal operation of each production and testing process. However, most of the devices currently used to pick up and transfer indium phosphide substrates between different process devices are ordinary suction cup structures, which are difficult to stably and reliably pick up and fix indium phosphide substrates. This makes the transfer efficiency of indium phosphide substrates between different processes slow, which seriously affects the production efficiency of indium phosphide substrates. Utility Model Content

[0004] The technical problem to be solved by this utility model is: how to improve the absorption stability of indium phosphide substrate and thus improve the transfer efficiency of indium phosphide. In order to solve the above technical problem, this utility model provides a wafer loading and unloading device, including a jig, a gas suction component and a gas inlet component. The fixture is provided with a receiving groove for receiving an indium phosphide substrate to be grasped; The suction assembly includes a suction cup body, which is disposed above the fixture. A vacuum cavity is formed between the suction cup body and the fixture to create a vacuum negative pressure environment on the upper part of the upper surface of the indium phosphide substrate. The air intake assembly includes an air guide plate disposed between the suction cup body and the fixture. The air guide plate has a suction hole extending through it in a direction perpendicular to its surface. An air intake channel is provided inside the air guide plate, which includes an air intake end and multiple air outlet ends. The air intake end is used to introduce purge gas. The air outlet ends are located on the side of the air guide plate near the fixture and within the receiving groove. The air guide plate has an air intake notch at the air outlet end. The air intake notch has an opening on the side facing the center of the fixture, and the side wall of the air intake notch away from the center of the fixture is inclined.

[0005] Preferably, the air guide plate has a first groove and a second groove on both sides, the suction cup body is disposed in the first groove, the side wall of the second groove is disposed in the receiving groove, the side wall of the first groove is disposed outside the receiving groove, the air inlet is disposed outside the side wall of the first groove, and the air outlet is disposed inside the side wall of the second groove; the side wall of the first groove is provided with an air inlet pipe, and the air inlet pipe is connected to the air inlet.

[0006] Preferably, the air intake channel includes a first air intake channel, a second air intake channel, and a third air intake channel connected in sequence; The first air intake channel extends radially along the air guide plate, and one end of the first air intake channel penetrates the side wall of the first groove of the air guide plate and communicates with the air intake pipe. The second air intake channel is arranged in a ring around the central axis of the air guide plate at the top of the side wall of the first groove; The third air intake channel extends in a direction perpendicular to the surface of the air guide plate, and the end of the third air intake channel away from the second air intake channel is connected to the air intake notch; The air outlet has multiple outlets evenly distributed around the central axis of the air guide plate, and the air inlet notch and the third air inlet channel are provided in multiple ways corresponding to the air outlet.

[0007] Preferably, the edge of the bottom surface of the receiving groove is provided with a guide surface corresponding to the air inlet, and the guide surface is inclined from the side away from the center of the fixture to the side away from the air guide plate.

[0008] Preferably, the guide surface is arranged in a ring around the central axis of the fixture, and the inclination angle of the guide surface relative to the bottom surface of the receiving groove is 45 degrees.

[0009] Preferably, the air intake hole includes a first air intake hole and a second air intake hole, the first air intake hole being disposed in the middle of the air guide plate, and the second air intake hole being disposed on one side of the air guide plate near the edge.

[0010] Preferably, there are multiple first air intake holes and multiple second air intake holes, with the multiple first air intake holes arranged circumferentially around the central axis of the air guide plate, and the multiple second air intake holes arranged circumferentially around the central axis of the air guide plate.

[0011] Preferably, the end of the air guide plate away from the fixture is provided with a sealing plate and a top cover arranged in sequence, the sealing plate being disposed between the top cover and the air guide plate, and the sealing plate being used to seal the second air intake channel.

[0012] Preferably, a vacuum suction tube connector is provided at the end of the suction cup body away from the fixture, and the vacuum suction tube connector is used to connect an external vacuuming device.

[0013] Preferably, the suction cup body is provided with a handle, the handle is provided with a threaded interface, and the threaded interface is used to connect an external displacement device.

[0014] Compared with the prior art, the wafer loading and unloading device provided in this embodiment of the present invention has the following advantages: In this invention, both a suction component and an inlet component are employed. The suction component creates a vacuum negative pressure environment on the upper surface of the substrate to suck up the substrate. Simultaneously, gas is injected through the inlet channel into the inlet gap located inside the receiving groove. The inclined sidewall of the inlet gap guides the gas injected into the receiving groove, allowing the gas to be injected into the underside of the substrate more quickly and stably. This more comprehensively disrupts the state between the bottom surface of the substrate and the bottom surface of the receiving groove, blowing the substrate out of the receiving groove more quickly. This accelerates the suction efficiency of the suction cup body on the substrate and improves the stability of the substrate suction state, thereby improving the efficiency of substrate gripping and transfer, and ultimately improving the production and testing efficiency of indium phosphide substrates. Attached Figure Description

[0015] Figure 1 This is a side view of the present invention; Figure 2 This is a perspective view of the present invention; Figure 3 This is a cross-sectional view of the present invention; Figure 4 This is an exploded view of the present invention; Figure 5 This is a partial structural schematic diagram of the cross-section of the tooling and the gas guide plate of this utility model.

[0016] In the diagram: 1. Substrate; 2. Fixture; 21. Receiving groove; 22. Guide surface; 3. Suction cup body; 31. Vacuum suction tube connector; 32. Handle; 33. Threaded interface; 4. Air guide plate; 41. First air intake hole; 42. Second air intake hole; 43. Air intake notch; 44. First groove; 45. Second groove; 5. Air intake pipe; 6. Intake channel; 61. Intake end; 62. Exit end; 63. First intake channel; 64. Second intake channel; 65. Third intake channel; 7. Sealing plate; 8. Top cover. Detailed Implementation

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0018] like Figures 1 to 5 As shown, a preferred embodiment of the present invention provides a wafer loading and unloading device, which includes a jig 2, a suction assembly, and an air intake assembly; The fixture 2 is provided with a receiving groove 21, which is used to receive the indium phosphide substrate 1 to be grasped; The suction assembly includes a suction cup body 3, which is disposed above the fixture 2. A vacuum cavity is formed between the suction cup body 3 and the fixture 2 to form a vacuum negative pressure environment on the upper part of the upper surface of the indium phosphide substrate 1. The air intake assembly includes an air guide plate 4, which is disposed between the suction cup body 3 and the fixture 2. The air guide plate 4 has a suction hole through it in a direction perpendicular to its surface. An air intake channel 6 is provided inside the air guide plate 4. The air intake channel 6 includes an air intake end 61 and multiple air outlet ends 62. The air intake end 61 is used to introduce purge gas. The air outlet ends 62 are disposed on the side of the air guide plate 4 near the fixture 2 and are located in the receiving groove 21. The air guide plate 4 has an air intake notch 43 at the air outlet end 62. The air intake notch 43 has an opening on the side facing the center of the fixture 2. The side wall of the air intake notch 43 away from the center of the fixture 2 is inclined.

[0019] Specifically, in this embodiment, the substrate 1 is gripped using an upward suction and downward blowing method, thereby improving the substrate 1 gripping efficiency and consequently the substrate 1 transfer efficiency. During actual operation, the suction cup body 3 is connected to an external vacuum device. Through the continuous operation of the external device, a vacuum negative pressure environment is formed above the substrate 1, thus stably gripping the substrate 1. Before and during the gripping process, high-pressure gas is introduced into the bottom of the receiving groove 21 through the air inlet channel 6. This high-pressure gas is guided through the inclined sidewall of the air inlet notch 43 at the air outlet 62. The guide plate 4 allows the gas to enter the space below the substrate 1 more stably and quickly, that is, into the gap between the substrate 1 and the fixture 2, thereby blowing the substrate 1 away from the state of contact with the fixture 2. Since the upper end of the substrate 1 is in a negative pressure environment created by the suction cup body 3, while the lower end is in a high pressure environment, the pressure difference between the two ends of the substrate 1 makes it easier for the substrate 1 to be blown up and presses it tightly onto the guide plate 4 by the pressure difference, thereby improving the suction efficiency and stability of the substrate 1, facilitating the subsequent transfer of the substrate 1, and greatly improving the efficiency and stability of the substrate 1 transfer.

[0020] In some embodiments, the air guide plate 4 is provided with a first groove 44 and a second groove 45 on both sides, the suction cup body 3 is disposed in the first groove 44, the side wall of the second groove 45 is disposed in the receiving groove 21, the side wall of the first groove 44 is disposed outside the receiving groove 21, the air inlet end 61 is disposed outside the side wall of the first groove 44, and the air outlet end 62 is disposed inside the side wall of the second groove 45; the side wall of the first groove 44 is provided with an air inlet pipe 5, and the air inlet pipe 5 is connected to the air inlet end 61.

[0021] Specifically, in actual use, the openings of the first groove 44 and the second groove 45 are set in opposite directions. The bottom plate of the first groove 44 is the top plate of the second groove 45. During the vacuuming process, the air in the accommodating groove 21 of the fixture 2 is drawn from the first groove 44 to the second groove 45 through the suction hole, and is finally drawn into the vacuum equipment. This creates a negative pressure vacuum environment in both the first groove 44 and the second groove 45. The air inlet section can be connected to the external high-pressure gas equipment through the air inlet pipe 5, so as to better introduce high-pressure gas into the second groove 45. The air outlet 62 is located on the inner side of the side wall of the second groove 45, which allows the high-pressure gas to enter the side wall of the first groove 44 through the air inlet channel 6, and then enter the bottom of the substrate 1, thereby forming a pressure difference between the upper and lower end faces of the substrate 1, so that the substrate 1 can be adsorbed and grasped more quickly and stably.

[0022] It should also be noted that, under normal conditions, the high-pressure gas entering the second groove 45 through the inlet 61 is easily affected by the negative pressure environment on the upper surface of the substrate 1, thus affecting the generation of the negative pressure vacuum environment on the upper surface of the substrate 1. This leads to instability in the adsorption state of the substrate 1 and low adsorption efficiency. In this application, the inclined sidewall at the inlet notch 43 guides the flow path of the high-pressure gas, allowing more high-pressure gas to be guided to the bottom of the substrate 1. This creates a pressure difference between the two end faces of the substrate 1 more quickly and stably, enabling the substrate 1 to be more quickly and stably adsorbed and fixed on the gas guide plate 4, thereby improving the flow efficiency of the substrate 1.

[0023] In some embodiments, the air intake passage 6 includes a first air intake passage 63, a second air intake passage 64 and a third air intake passage 65 connected in sequence; The first air intake channel 63 extends radially along the air guide plate 4. One end of the first air intake channel 63 penetrates the side wall of the first groove 44 of the air guide plate 4 and is connected to the air intake pipe 5. The second air intake channel 64 is arranged in a ring around the central axis of the air guide plate 4 at the top of the side wall of the first groove 44; The third air intake channel 65 extends in a direction perpendicular to the surface of the air guide plate 4, and the end of the third air intake channel 65 away from the second air intake channel 64 is connected to the air intake notch 43. Among them, multiple air outlets 62 are evenly distributed around the central axis of the air guide plate 4, and multiple air inlet notches 43 and third air inlet channels 65 are provided corresponding to the air outlets 62.

[0024] Specifically, in this embodiment, the high-pressure gas in the inlet pipe 5 enters the second inlet channel 64 through the first inlet channel 63, and then is dispersed to various parts of the second inlet channel 64 along the annular structure. Finally, it is transported to different outlet ends 62 through the third inlet channel 65 connected to various parts of the second inlet channel 64. There are also multiple outlet ends 62 arranged in an annular shape, so that the substrate 1 can be blown up more comprehensively and stably, avoiding problems such as tilting of the substrate 1 during the blowing process.

[0025] In some embodiments, the edge of the bottom surface of the receiving groove 21 is provided with a guide surface 22 corresponding to the air inlet 43, and the guide surface 22 is inclined on the side away from the center of the fixture 2 towards the side away from the air guide plate 4.

[0026] Furthermore, the guide surface 22 is arranged in a ring around the central axis of the fixture 2, and the inclination angle of the guide surface 22 relative to the bottom surface of the receiving groove 21 is 45 degrees.

[0027] The guide surface 22 is an inclined surface, which can further guide and buffer the high-pressure gas output from the gas outlet 62 to the gas outlet notch, allowing more high-pressure gas to enter the bottom of the substrate 1, thereby blowing the substrate 1 up. The annular guide surface 22 can further buffer and contain the high-pressure gas, and disperse the high-pressure gas to various parts of the edge of the receiving groove 21. This allows the high-pressure gas to be guided more comprehensively from all directions and positions to the bottom surface of the substrate 1 and the fixture 2, making the blowing state of the substrate 1 more stable, and the pressure state of the lower end surface of the substrate 1 more balanced and stable. In other words, the state of the substrate 1 when being absorbed is more stable and reliable, thereby improving the absorption efficiency of the substrate 1.

[0028] In some embodiments, the air intake hole includes a first air intake hole 41 and a second air intake hole 42. The first air intake hole 41 is disposed in the middle of the air guide plate 4, and the second air intake hole 42 is disposed on one side of the air guide plate 4 near the edge.

[0029] Furthermore, multiple first air intake holes 41 and multiple second air intake holes 42 are provided. Multiple first air intake holes 41 are arranged circumferentially around the central axis of the air guide plate 4, and multiple second air intake holes 42 are arranged circumferentially around the central axis of the air guide plate 4.

[0030] Specifically, the circumferential arrangement and position of the first suction hole 41 and the second suction hole 42 ensure that the pressure on the upper surface of the substrate 1 is more even and stable during the vacuuming process of the suction cup body 3. No pressure difference exists between different positions on the upper surface of the substrate 1, making the substrate 1 more stable and reliable during the suction process, thus improving the suction efficiency of the substrate 1. In some alternative embodiments, the first suction hole 41 and the second suction hole 42 can be arc-shaped slots instead of circular holes.

[0031] In some embodiments, a sealing plate 7 and an upper cover 8 are sequentially arranged at the end of the air guide plate 4 away from the fixture 2. The sealing plate 7 is disposed between the upper cover 8 and the air guide plate 4 and is used to seal the second air intake channel 64. The upper cover 8 is fixedly connected to the side wall of the first groove 44 by bolts, thereby pressing the sealing plate 7 above the second air intake channel 64 to achieve sealing of the second air intake channel 64, prevent leakage of high-pressure gas, ensure that the substrate 1 can be blown up, and stabilize the pressure difference between the two end faces of the substrate 1.

[0032] In some embodiments, a vacuum suction tube connector 31 is provided at the end of the suction cup body 3 away from the fixture 2. The vacuum suction tube connector 31 is used to connect to an external vacuum pumping device. The vacuum suction tube connector 31 can be connected to the vacuum pumping device through a hose structure, thereby creating a stable negative pressure vacuum environment between the suction cup body 3 and the substrate 1.

[0033] In some embodiments, the suction cup body 3 is provided with a handle 32, and the handle 32 is provided with a threaded interface 33 for connecting an external displacement device. The displacement device includes a three-dimensional displacement device. After the suction cup body 3 stably picks up the substrate 1, the displacement device can move the suction cup body 3 and the adsorbed substrate 1 to different equipment in different processes through the handle 32 and its threaded interface 33, thereby realizing the transfer of the substrate 1.

[0034] In summary, this utility model embodiment provides a wafer loading and unloading device, which guides and restricts the flow path of high-pressure gas through the inclined sidewall of the air inlet 43 of the air guide plate 4 and the inclined guide surface 22 at the bottom of the accommodating groove 21 of the fixture 2. This allows the high-pressure gas to be guided more stably and reliably to the bottom of the substrate 1. In conjunction with the suction cup body 3, a more stable and reliable pressure difference is created between the upper and lower surfaces of the substrate 1. The substrate 1 can be picked up and fixed by the suction cup body 3 more quickly and stably, ultimately achieving rapid gripping of the substrate 1 and improving the transfer efficiency and production testing efficiency of the substrate 1.

[0035] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of this utility model, and these improvements and substitutions should also be considered within the protection scope of this utility model.

Claims

1. A wafer loading and unloading device for gripping substrates, characterized in that, include: A jig, wherein the jig is provided with a receiving groove for receiving a substrate to be gripped; A suction assembly includes a suction cup body disposed above the fixture, and a vacuum cavity is formed between the suction cup body and the fixture to create a vacuum negative pressure environment on the upper part of the upper surface of the substrate. An air intake assembly includes an air guide plate disposed between the suction cup body and the fixture. The air guide plate has a suction hole extending through it in a direction perpendicular to its surface. An air intake channel is provided inside the air guide plate, including an air inlet end and multiple air outlet ends. The air inlet end is used to introduce purge gas. The air outlet ends are located on the side of the air guide plate near the fixture and within the receiving groove. The air guide plate has an air inlet notch at the air outlet end. The air inlet notch has an opening on the side facing the center of the fixture, and the side wall of the air inlet notch away from the center of the fixture is inclined.

2. The wafer loading and unloading device according to claim 1, characterized in that, The air guide plate has a first groove and a second groove on its two sides respectively. The suction cup body is disposed in the first groove, the side wall of the second groove is disposed in the receiving groove, the side wall of the first groove is disposed outside the receiving groove, the air inlet is disposed outside the side wall of the first groove, and the air outlet is disposed inside the side wall of the second groove. The side wall of the first groove is provided with an air inlet pipe, which is connected to the air inlet.

3. The wafer loading and unloading device according to claim 2, characterized in that, The air intake channel includes a first air intake channel, a second air intake channel, and a third air intake channel connected in sequence; The first air intake channel extends radially along the air guide plate, and one end of the first air intake channel penetrates the side wall of the first groove of the air guide plate and communicates with the air intake pipe. The second air intake channel is arranged in a ring around the central axis of the air guide plate at the top of the side wall of the first groove; The third air intake channel extends in a direction perpendicular to the surface of the air guide plate, and the end of the third air intake channel away from the second air intake channel is connected to the air intake notch; The air outlet has multiple outlets evenly distributed around the central axis of the air guide plate, and the air inlet notch and the third air inlet channel are provided in multiple ways corresponding to the air outlet.

4. The wafer loading and unloading device according to claim 1, characterized in that, The bottom edge of the receiving groove is provided with a guide surface corresponding to the air inlet, and the guide surface is inclined from the side away from the center of the fixture to the side away from the air guide plate.

5. The wafer loading and unloading device according to claim 4, characterized in that, The guide surface is arranged in a ring around the central axis of the fixture, and the guide surface is inclined at an angle of 45 degrees relative to the bottom surface of the receiving groove.

6. The wafer loading and unloading device according to claim 1, characterized in that, The air intake includes a first air intake and a second air intake. The first air intake is located in the middle of the air guide plate, and the second air intake is located on one side of the air guide plate near the edge.

7. The wafer loading and unloading device according to claim 6, characterized in that, Multiple first and second air intake holes are provided, with multiple first air intake holes arranged circumferentially around the central axis of the air guide plate, and multiple second air intake holes arranged circumferentially around the central axis of the air guide plate.

8. The wafer loading and unloading device according to claim 3, characterized in that, The end of the air guide plate away from the fixture is provided with a sealing plate and an upper cover arranged in sequence. The sealing plate is located between the upper cover and the air guide plate and is used to seal the second air intake channel.

9. The wafer loading and unloading device according to claim 1, characterized in that, The suction cup body is provided with a vacuum suction tube connector at the end away from the fixture, and the vacuum suction tube connector is used to connect to an external vacuum pumping device.

10. The wafer loading and unloading device according to claim 1, characterized in that, The suction cup body is provided with a handle, and the handle is provided with a threaded interface for connecting an external displacement device.

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