A robot for large warping wafer transmission working condition

Abstract

The utility model relates to wafer transmission related technical field discloses a big warping wafer transmission working condition robot, including fork arm front end and every adsorption arm's front end all install the suction nozzle, the bottom side of fork arm is equipped with the first air groove that recesses inward, just the second air groove that is equipped with with first air groove intercommunication on fork arm, just the mounting hole that is equipped with for installing suction nozzle all on fork arm, adsorption arm, the mounting hole is intercommunication with first air groove, second air groove, just the outside of first air groove and second air groove is equipped with sealing plate, just the air flue that forms between sealing plate and first air groove, second air groove, the free end of mechanical hand is connected with fork arm through the connecting fixed block, the utility model discloses the volume is smaller, can be transferred in the narrow space to fork arm and adsorption arm and be equipped with first air groove and second air groove, need not carry out the pipe arrangement in this way, avoid pipeline entanglement.

Description

Technical Field

[0001] This utility model relates to the field of wafer transport technology, specifically a robot for transporting wafers with large warpage. Background Technology

[0002] With the continuous development of industrial automation and intelligent thinning processes, the demand for large warp wafer transport is increasing both domestically and internationally. Wafers that have been thinned or processed all have warp of different sizes. Therefore, a special robotic arm is needed to transport these warped wafers. Thus, designing a robot for transporting large warped wafers has become an urgent problem for the industry. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a robot for transporting wafers with large warpage.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0005] This utility model discloses a robot for transporting wafers with large warpage, comprising a base on which two freely movable manipulators are mounted. Each manipulator is fixed with a flat fork arm. Adsorption arms are located on both sides of the front end of each fork arm, and a suction nozzle for adsorbing the wafer is installed at the front end of each fork arm and the front end of each adsorption arm. A first air groove is recessed inward on the bottom side of each fork arm, and a second air groove communicating with the first air groove is provided on each adsorption arm. Mounting holes for mounting the suction nozzles are provided on both the fork arm and the adsorption arm, communicating with the first and second air grooves. A sealing plate is provided outside the first and second air grooves, forming an air channel between the sealing plate and the first and second air grooves. The fork arm is connected to the free end of the manipulator via a connecting and fixing block. An air suction hole communicating with the first air groove is provided at the end of each fork arm. A cavity communicating with the adsorption hole is provided on the fixing block, and a vacuum tube for evacuating the cavity is provided on the fixing block.

[0006] As a preferred embodiment of this invention, the suction nozzle is a flexible suction nozzle.

[0007] As a preferred technical solution of this utility model, the front end of the connecting fixing block is provided with a support plate that extends to the middle of the fork arm and supports the fork arm.

[0008] As a preferred technical solution of this utility model, the bottom of the base is provided with a base, the interior of the base is provided with a vertically arranged mounting plate, and the mounting plate is provided with a vertical lead screw. The mounting plate is provided with a limiting groove arranged parallel to the lead screw. The lead screw is provided with a movable seat that moves along the lead screw. The movable seat is provided with a limiting slider that moves along the limiting groove. The movable seat is provided with a rotating seat. The rotating end of the rotating seat is provided with a vertically upward lifting frame. The base is fixed to the top of the lifting frame. The rotating seat is provided with a rotating mechanism that rotates the lifting frame.

[0009] As a preferred embodiment of this utility model, both the first and second air ducts have T-shaped cross-sections.

[0010] The beneficial effects of this utility model are:

[0011] 1. This robot for transporting large warped wafers utilizes two freely moving robotic arms to transfer the wafers, resulting in high work efficiency. Each robotic arm is equipped with a flat fork arm, with suction arms on both sides of the fork arm's front end. A suction nozzle is installed at the front end of the fork arm and each suction arm, making the overall size small and enabling transfer in confined spaces. Furthermore, the fork arm and suction arm are equipped with a first air duct and a second air duct, eliminating the need for tubing and preventing tangling.

[0012] 2. In this type of robot used for large warp wafer transfer, the front end of the connecting and fixing block is provided with a support plate that extends to the middle of the fork arm and supports the fork arm. This provides a supporting force to the fork arm and avoids deformation of the fork arm due to stress.

[0013] 3. The robot used in this type of large warp wafer transfer process is equipped with a lifting seat at the bottom, which can drive the whole body to lift and lower, thereby realizing the transfer of wafers in conjunction with the rotational motion. Attached Figure Description

[0014] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0015] Figure 1 This is a schematic diagram of the structure of a robot for transporting large warped wafers according to this utility model;

[0016] Figure 2 This is a schematic diagram of the sealing plate of a robot used in the transmission of large warped wafers according to this utility model.

[0017] Figure 3This is a schematic diagram of the structure of the second air duct of a robot for transporting large warped wafers according to this utility model;

[0018] Figure 4 This is a schematic diagram of the vacuum tube structure of a robot used in the transmission of large warped wafers according to this utility model;

[0019] Figure 5 This is a schematic diagram of the fork arm of a robot used in the transmission of large warped wafers according to this utility model.

[0020] Figure 6 This is a schematic diagram of the base of a robot for transporting large warped wafers according to this utility model.

[0021] Figure 7 This is a schematic diagram of the moving base of a robot used in the large warp wafer transmission process according to this utility model;

[0022] Figure 8 This is a schematic diagram of the manipulator of a robot used in the transmission of large warped wafers according to this utility model.

[0023] In the diagram: 1. Base; 2. Robotic arm; 3. Fork arm; 4. Adsorption arm; 5. Suction nozzle; 6. First air duct; 7. Second air duct; 8. Mounting hole; 9. Sealing plate; 10. Connecting fixing block; 11. Suction hole; 13. Vacuum tube; 14. Clearance area; 15. Support plate; 16. Base; 17. Lead screw; 18. Mounting plate; 19. Moving seat; 20. Limiting groove; 21. Lifting frame; 22. Limiting slider; 23. Rotating seat. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0025] Example: Figures 1-8As shown, this utility model discloses a robot for transporting large warped wafers, including a base 1. The base 1 is equipped with two freely movable robotic arms 2. The robot is characterized in that each robotic arm 2 is fixed with a flat fork arm 3. The front ends of the fork arm 3 are provided with suction arms 4. The front ends of the fork arm 3 and each suction arm 4 are equipped with a suction nozzle 5 for adsorbing the wafer. The suction nozzle 5 is a flexible suction nozzle so as not to damage the wafer. The fork arm 3 has an inwardly recessed first air groove 6 on its bottom side, and the suction arm 4 has a second air groove 7 that communicates with the first air groove 6. Both the fork arm 3 and the suction arm 4 have mounting holes 8 for mounting the suction nozzle 5. The mounting holes 8 communicate with the first air groove 6 and the second air groove 7. The first air groove 6 and the second air groove 7 are provided with a sealing plate 9 on their exterior, and the sealing plate forms an air duct with the first air groove 6 and the second air groove 7. The fork arm 3 is connected to the free end of the robot arm 2 via a connecting fixing block 10. The end of the fork arm 3 has a suction hole 11 that communicates with the first air groove 6. The fixing block 10 has a cavity that communicates with the suction hole 11, and the fixing block 10 has a vacuum tube 13 for evacuating the cavity. By setting up two freely moving robotic arms 2, the wafers can be transferred using the two robotic arms 2, thus achieving better work efficiency. Each robotic arm 2 is fixed with a flat fork arm 3, and suction arms 4 are provided on both sides of the front end of the fork arm 3. A suction nozzle 5 is installed at the front end of the fork arm 3 and the front end of each suction arm 4, which makes the overall volume small and can be transferred in a narrow space. Furthermore, the fork arm 3 and the suction arm 4 are provided with a first air groove 6 and a second air groove 7, so there is no need to lay pipes and avoids pipe tangling.

[0026] The robotic arm is an existing mechanical mechanism. The joints between the robotic arms are synchronized, allowing the robotic arm in the robotic arm to work and has the ability to transfer horizontally. It is combined with a base with rotation and lifting functions to realize the transfer of wafers.

[0027] One of the robotic arms 2 is provided with a avoidance area 14 for avoiding collisions with another robotic arm 2. The avoidance area is formed by an inwardly recessed avoidance groove on the robotic arm 2. This prevents the joints of the robotic arm 2 from colliding with the other robotic arm 2 during movement.

[0028] The connecting fixing block 10 has a support plate 15 extending to the middle of the fork arm 3 and supporting the fork arm 3, so that the fork arm 3 has a supporting force and avoids the fork arm 3 from being deformed by force.

[0029] The base 1 has a base 16 at its bottom, and a vertically mounted mounting plate 18 inside the base 16. A vertical lead screw 17 is mounted on the mounting plate 18, and a limiting groove 20 parallel to the lead screw 17 is provided on the mounting plate 18. A movable seat 19 that moves along the lead screw 17 is provided on the movable seat 19, and a limiting slider 22 that moves along the limiting groove 20 is mounted on the movable seat 19. A servo motor that drives the lead screw to rotate is provided on the base. A rotating seat 23 is provided on the movable seat 19, and a vertically upward lifting frame 21 is provided on the rotating end of the rotating seat 23. The base 1 is fixed to the top of the lifting frame 21. A rotating mechanism that drives the lifting frame 21 to rotate is provided on the rotating seat 23. The rotating mechanism is driven by a motor to rotate the lifting frame 21 using a synchronous belt drive mechanism. This allows the entire assembly to be lifted and rotated, thereby better realizing the transfer of the wafer through coordinated rotational motion.

[0030] The first air duct 6 and the second air duct 7 both have T-shaped cross-sections, which is used to install the sealing plate.

[0031] During operation, this robot for transporting large warped wafers uses two freely moving manipulators 2 to transfer the wafers, resulting in good work efficiency. Each manipulator 2 is equipped with a flat fork arm 3, and suction arms 4 are provided on both sides of the front end of the fork arm 3. A suction nozzle 5 is installed at the front end of the fork arm 3 and the front end of each suction arm 4, making the overall size small and enabling transfer in confined spaces. Furthermore, the fork arm 3 and the suction arm 4 are provided with a first air groove 6 and a second air groove 7, eliminating the need for pipework and avoiding tangling of pipelines.

[0032] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A robot for transporting large warp wafers, comprising a base (1) on which two freely movable robotic arms (2) are mounted. Its features are, Each of the robotic arms (2) is fixed with a flat fork arm (3). Adsorption arms (4) are provided on both sides of the front end of the fork arm (3). A suction nozzle (5) for adsorbing wafers is installed on the front end of both the fork arm (3) and the front end of each adsorption arm (4). A first air groove (6) is provided on the bottom side of the fork arm (3), and a second air groove (7) is provided on the adsorption arm (4) communicating with the first air groove (6). Both the fork arm (3) and the adsorption arm (4) are provided with mounting holes (8) for installing the suction nozzles (5). The mounting holes (8) are connected to the first air groove (6). The air duct (6) and the second air duct (7) are connected, and the first air duct (6) and the second air duct (7) are provided with a sealing plate (9) on the outside, and the sealing plate (9) forms an air duct with the first air duct (6) and the second air duct (7). The fork arm (3) is connected to the free end of the robot (2) via a connecting fixing block (10). The end of the fork arm (3) is provided with a suction hole (11) that communicates with the first air duct (6). The fixing block (10) is provided with a cavity that communicates with the suction hole (11), and the fixing block (10) is provided with a vacuum tube (13) for evacuating the cavity.

2. The robot for transporting large warp wafers according to claim 1, characterized in that, The suction nozzle (5) is a flexible suction nozzle.

3. The robot for transporting large warp wafers according to claim 1, characterized in that, The front end of the connecting fixing block (10) is provided with a support plate (15) that extends to the middle of the fork arm (3) and supports the fork arm (3).

4. The robot for transporting large warp wafers according to claim 1, characterized in that, The base (1) has a base (16) at its bottom. The base (16) has a vertically mounted mounting plate (18) inside. A vertical lead screw (17) is mounted on the mounting plate (18). A limiting groove (20) is provided on the mounting plate (18) and is parallel to the lead screw (17). A movable seat (19) is provided on the lead screw (17) and moves along the lead screw (17). A limiting slider (22) is installed on the movable seat (19) and moves along the limiting groove (20). A rotating seat (23) is provided on the movable seat (19). A vertically upward lifting frame (21) is provided on the rotating end of the rotating seat (23). The base (1) is fixed on the top of the lifting frame (21). A rotating mechanism that rotates the lifting frame (21) is provided on the rotating seat (23).

5. The robot for transporting large warp wafers according to claim 1, characterized in that, The cross-sections of the first air duct (6) and the second air duct (7) are both T-shaped.

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