Semiconductor die bonding pressure jaw

Abstract

The utility model relates to the field of semiconductor manufacturing discloses a semiconductor fixed -crystal pressure claw, including base plate, the outer wall sliding connection of base plate has sliding mechanism, the outer wall fixed connection of sliding mechanism has dismantling mechanism, the inner wall mounting of sliding mechanism has pressure claw shell, the sliding mechanism includes sliding block, the outer wall sliding connection of sliding block in the outer wall of base plate, the outer wall fixed connection of sliding block has connecting arm, the inner wall sliding connection of connecting arm has sliding post. In the utility model, through pressing the cover and driving the sliding post work, press the cover and make the sliding post extrude spring one and separate the card plate restriction, drive the sliding block and pressure claw shell movement through connecting arm again, the sliding block still drives the limiting plate to slide in the limiting groove, realize the function that the pressure claw position is accurate adjustment, compared with prior art, played the effect that the unlocking adjustment is convenient and prevents the deviation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a semiconductor die bonder. Background Technology

[0002] Semiconductor chips are becoming increasingly precise, and the bonding process between the chip and the substrate has particularly high requirements. This requires precise control of the pressing force, and semiconductor die bonding claws are the key components for this task. Therefore, the demand for them is increasing. The pressing force is crucial; uneven force and inaccurate positioning will directly affect the yield. In the early days, the claws were made of a metal of a certain hardness, and the force could not be adjusted. It all depended on the worker's experience to control it. This could not guarantee uniform force and could only be used in scenarios with low requirements. The number of qualified chips produced was also small. Later, it was improved by using elastic composite materials and adding parts that can sense the force, which met the requirements of high-end chip manufacturing. The core design of semiconductor die bonding grippers is their ability to precisely control the pressure applied and adapt to different working scenarios. This ensures that the chip is bonded to the substrate stably and accurately. The grippers are equipped with pressure-sensing components, allowing them to precisely adjust the pressure regardless of whether the chip is large or small, or what special requirements exist during bonding. This prevents the chip from being crushed due to uneven pressure, avoiding issues that could affect the number of qualified chips and subsequent processing steps due to unusable grippers. With these grippers, the semiconductor chip bonding process becomes more reliable, and it also helps improve the quality and efficiency of chip manufacturing. Current semiconductor die-bonding jaws have significant shortcomings in terms of operational flexibility and ease of maintenance. The jaws cannot be adjusted in position and are only fixed to fit a single chip size. When faced with die-bonding requirements for chips of different sizes, they cannot precisely adjust the alignment angle, easily leading to chip misalignment and reduced die-bonding yield. Furthermore, the jaws are inconvenient to disassemble, as they are mostly fixedly connected to the die-bonding equipment. When the jaws wear out or malfunction, the entire equipment must be disassembled for replacement, which is not only time-consuming and labor-intensive but also prone to damaging equipment components and extending downtime. These problems not only increase equipment maintenance costs but also increase chip wear due to misalignment and affect production efficiency due to downtime. Therefore, a semiconductor die-bonding jaw is proposed to solve these problems through structural optimization. Utility Model Content

[0003] To overcome the above shortcomings, this utility model provides a semiconductor die bonding gripper, which aims to improve the problem in the prior art that grippers cannot align the angles of chips of different sizes.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor die bonder includes a substrate, a sliding mechanism slidably connected to the outer wall of the substrate, a disassembly mechanism fixedly connected to the outer wall of the sliding mechanism, and a die bonder housing installed on the inner wall of the sliding mechanism. The sliding mechanism includes a sliding block, the outer wall of which is slidably connected to the outer wall of the base plate, a connecting arm fixedly connected to the outer wall of the sliding block, a sliding column slidably connected to the inner wall of the connecting arm, a push-button cover fixedly connected to one end of the sliding column, a spring sleeved on the outer wall of the sliding column, a locking plate slidably connected to the outer wall of the sliding column, a limit plate fixedly connected to the outer wall of the sliding block, a limit groove formed on the inner wall of the base plate, and a positioning component fixedly connected to the outer wall of the sliding block. As a further description of the above technical solution: The disassembly mechanism includes a fixed block, the outer wall of which is fixedly connected to the outer wall of the sliding mechanism, a movable column slidably connected to the inner wall of the fixed block, a fixed column fixedly connected to one end of the movable column, a spring II sleeved on the outer wall of the movable column, a positioning column fixedly connected to the outer wall of the movable column, and a rotating block rotatably connected to the outer wall of the positioning column. As a further description of the above technical solution: The positioning component includes a positioning plate, the outer wall of which is fixedly connected to the outer wall of the sliding block, and the inner wall of the base plate is provided with a positioning groove. As a further description of the above technical solution: The outer wall of the limiting plate is slidably connected to the inner wall of the limiting groove, and the outer wall of the positioning plate is slidably connected to the inner wall of the positioning groove. As a further description of the above technical solution: The outer wall of the card plate is fixed to the outer wall of the base plate, and the outer wall of the connecting arm is slidably connected to the outer wall of the base plate; As a further description of the above technical solution: One end of the spring is fixedly connected to the outer wall of the push cover, and the other end of the spring is fixedly connected to the outer wall of the connecting arm. As a further description of the above technical solution: The outer wall of the rotating block is slidably connected to the outer wall of the fixed block, and the fixed column is slidably connected to the inner wall of the pressure claw housing; As a further description of the above technical solution: The outer wall of the second spring is slidably connected to the inner wall of the fixed block, and one end of the second spring is fixedly connected to the outer wall of the fixed column.

[0005] This utility model has the following beneficial effects: 1. In this utility model, pressing the cover drives the sliding column to work. Pressing the cover down causes the sliding column to squeeze the spring and disengage from the clamping plate. Then, the connecting arm drives the sliding block and the pressure claw housing to move. The sliding block also drives the limiting plate to slide in the limiting groove, realizing the function of precise adjustment of the pressure claw position. Compared with the prior art, it has the effect of convenient unlocking and adjustment and anti-displacement, meeting the semiconductor die bonding position requirements.

[0006] 2. In this utility model, the rotating block drives the moving column and the fixed column to work. After the rotating block rotates upward, the positioning column causes the moving column to slide upward and drives the fixed column to move. The fixed column is released from the pressure claw shell and the restriction is lifted, realizing the function of pressure claw disassembly. Compared with the prior art, it has the effect of simple disassembly operation and quick release of fixation, which facilitates pressure claw replacement or maintenance and improves operation efficiency. Attached Figure Description

[0007] Figure 1 This is a three-dimensional schematic diagram of a semiconductor die-bonding gripper proposed in this utility model; Figure 2 This is a schematic diagram of the sliding block of a semiconductor die-bonding gripper proposed in this utility model; Figure 3 This is a schematic diagram of the fixing block of a semiconductor die-bonding claw proposed in this utility model; Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0008] Legend: 1. Base plate; 2. Sliding mechanism; 21. Sliding block; 22. Connecting arm; 23. Sliding column; 24. Press cover; 25. Spring 1; 26. Clamping plate; 27. Limiting plate; 28. Limiting groove; 29. Positioning component; 291. Positioning plate; 292. Positioning groove; 3. Disassembly mechanism; 31. Fixing block; 32. Moving column; 33. Fixing column; 34. Spring II; 35. Rotating block; 36. Positioning column; 4. Press claw housing. Detailed Implementation

[0009] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0010] Example: A semiconductor die bonder, as shown in the reference Figure 1 and Figure 2 The device includes a base plate 1, which provides a mounting and support foundation to ensure the stability of the entire die bonding claw structure. A sliding mechanism 2 is slidably connected to the outer wall of the base plate 1. The sliding mechanism 2 can drive the device to adjust its position to ensure that the claw can accurately align with the semiconductor die bonding position. A disassembly mechanism 3 is fixedly connected to the outer wall of the sliding mechanism 2. The disassembly mechanism 3 can quickly release the device from the fixation, facilitating the disassembly, replacement, or maintenance of the claw. A claw housing 4 is installed on the inner wall of the sliding mechanism 2. The claw housing 4 is the core execution component of the semiconductor die bonding operation. The position is adjusted by the sliding mechanism 2 and the disassembly mechanism 3 realizes disassembly and assembly. Specifically, the semiconductor die bonding claw uses the substrate 1 as a stable support base. The sliding mechanism 2, which is slidably connected to its outer wall, can be adjusted along the substrate 1 to drive the assembled components to move precisely, ensuring that the claw can accurately align with the semiconductor die bonding position. The disassembly mechanism 3, which is fixed to the outer wall of the sliding mechanism 2, can be quickly released through action, facilitating the disassembly, replacement, or maintenance of the claw housing 4 installed on the inner wall of the sliding mechanism 2. All structures work together to achieve precision in die bonding operations and ease of maintenance.

[0011] The sliding mechanism 2 includes a sliding block 21, which is the core moving component of the sliding mechanism 2. It can drive the device to slide synchronously and realize position adjustment. The outer wall of the sliding block 21 is slidably connected to the outer wall of the base plate 1, so that the sliding block 21 can slide smoothly along the outer wall of the base plate 1 and ensure the accuracy of position adjustment. The outer wall of the sliding block 21 is fixedly connected to a connecting arm 22, which transmits the power of the pressing operation and drives the sliding block 21 to slide. The inner wall of the connecting arm 22 is slidably connected to a sliding column 23, which can slide within the connecting arm 22. Through cooperation, the sliding mechanism 2 can be locked and unlocked. One end of the sliding column 23 is fixedly connected to a pressing cover 24, which provides the operator with a force point for pressing operation and facilitates the movement of the sliding column 23 by external force. The outer wall of the sliding column 23 is fitted with a spring 25, which stores or releases elastic force through elastic deformation to provide power for the reset of the sliding column 23 and ensure that the sliding mechanism 2 can be relocked after unlocking. Specifically, the sliding mechanism 2 uses the sliding block 21 as the core moving component. Its outer wall slides smoothly along the outer wall of the base plate 1, which can drive the device to adjust its position synchronously and ensure positioning accuracy. The connecting arm 22, which is fixed to the outer wall of the sliding block 21, can transmit the pressing operation power to drive the sliding block 21 to slide. Its inner wall is also adapted to slide with the sliding column 23. The pressing cover 24 at one end of the sliding column 23 provides the operator with a pressing force point. When pressed, it can drive the sliding column 23 to slide along the connecting arm 22, thereby unlocking the sliding mechanism 2. The spring 25, which is sleeved on the outer wall of the sliding column 23, will generate elastic deformation and store elastic force as the sliding column 23 slides. After the pressing cover 24 is released, the spring 25 releases the elastic force to push the sliding column 23 to reset, so that the sliding mechanism 2 is locked again.

[0012] A locking plate 26 is slidably connected to the outer wall of the sliding column 23. The locking plate 26 restricts the movement of the sliding mechanism 2 by cooperating with the sliding column 23, thereby locking the position of the sliding mechanism 2. A limiting plate 27 is fixedly connected to the outer wall of the sliding block 21 to limit the sliding trajectory of the sliding block 21 and prevent the sliding block 21 from deviating and causing the pressure claw position to deviate. A limiting groove 28 is opened on the inner wall of the base plate 1. The limiting groove 28 provides sliding space and guidance for the limiting plate 27, ensuring that the sliding block 21 drives the pressure claw to adjust its position along a preset trajectory. A positioning component 29 is fixedly connected to the outer wall of the sliding block 21. The positioning component 29 assists the sliding mechanism 2 in precise positioning and further improves the accuracy of the pressure claw position adjustment. Specifically, the card plate 26, which is slidably connected to the outer wall of the sliding column 23, restricts the movement of the sliding mechanism 2 by cooperating with the sliding column 23, thereby achieving position locking. The limiting plate 27 on the outer wall of the sliding block 21 is embedded in the limiting groove 28 on the inner wall of the base plate 1. The limiting groove 28 provides sliding space and guidance for the limiting plate 27, preventing the sliding block 21 from shifting and causing the pressure claw to misalign. At the same time, the positioning component 29 on the outer wall of the sliding block 21 assists in precise positioning, ensuring that the sliding block 21 drives the pressure claw to adjust stably along the preset trajectory, thereby improving position accuracy.

[0013] Positioning component 29 includes positioning plate 291, which provides an additional positioning reference for the sliding mechanism 2 to prevent positional deviation after adjustment. The outer wall of positioning plate 291 is fixedly connected to the outer wall of sliding block 21, so that positioning plate 291 and sliding block 21 move synchronously, ensuring that positioning and sliding actions are synchronized. The inner wall of base plate 1 is provided with positioning groove 292, which provides embedding space for positioning plate 291. Precise positioning is achieved by the fit between positioning plate 291 and positioning groove 292. The outer wall of clamping plate 26 is fixed to the outer wall of base plate 1, so that clamping plate 26 and base plate 1 are aligned. A secure connection ensures a stable locking effect on the sliding post 23. The outer wall of the connecting arm 22 is slidably connected to the outer wall of the base plate 1. The base plate 1 provides auxiliary guidance for the sliding of the connecting arm 22, ensuring that the connecting arm 22 drives the sliding block 21 to move smoothly. One end of the spring 25 is fixedly connected to the outer wall of the pressing cover 24, so that the elastic force of the spring 25 can directly act on the pressing cover 24, pushing the pressing cover 24 and the sliding post 23 to reset. The other end of the spring 25 is fixedly connected to the outer wall of the connecting arm 22, and the connecting arm 22 provides fixed support for the spring 25, ensuring that the spring can stably store elastic force. Specifically, in the positioning component 29, the positioning plate 291 is fixed to the outer wall of the sliding block 21 and moves synchronously with the sliding block 21. It is embedded in the positioning groove 292 on the inner wall of the base plate 1. The two fit together to provide an additional positioning reference for the sliding mechanism 2 and avoid offset after adjustment. The locking plate 26 is fixed to the outer wall of the base plate 1 and cooperates stably with the sliding column 23 to achieve locking. The connecting arm 22 slides along the outer wall of the base plate 1. The base plate 1 provides auxiliary guidance for it and ensures that the connecting arm 22 drives the sliding block 21 to move smoothly. The two ends of the spring 25 are fixed to the push cover 24 and the connecting arm 22 respectively. The connecting arm 22 provides fixed support for the spring so that it can stably store the elastic force. When the push cover 24 is released, the elastic force directly pushes the push cover 24 and the sliding column 23 to reset.

[0014] Reference Figure 1 , Figure 3 and Figure 4The disassembly mechanism 3 includes a fixed block 31, which provides installation space and support and is the core load-bearing component of the disassembly mechanism 3. The outer wall of the fixed block 31 is fixedly connected to the outer wall of the sliding mechanism 2, so that the fixed block 31 and the sliding mechanism 2 move synchronously, ensuring that the disassembly mechanism 3 can always effectively act on the pressure claw housing 4. The inner wall of the fixed block 31 is slidably connected to a moving column 32, which can slide within the fixed block 31 to fix and release the pressure claw housing 4. One end of the moving column 32 is fixedly connected to a fixed column 33. When the fixed column 33 is embedded in the inner wall of the pressure claw housing 4, it is fixed, and when it is detached, it is released. It is the core execution component of the disassembly mechanism 3. The outer wall of the moving column 32 is fitted with a spring 34. The spring 34 assists the moving column 32 and the fixed column 33 to reset through elastic deformation, ensuring that the fixed column 33 can be stably embedded in the pressure claw housing 4 to achieve fixation. The outer wall of the moving column 32 is fixedly connected to a positioning column 36, and the rotation of the positioning column 36 is converted into the sliding power of the moving column 32. Specifically, the disassembly mechanism 3 uses the fixed block 31 as the core bearing component, and its outer wall is fixedly connected to the sliding mechanism 2. The sliding mechanism 2 moves synchronously with the sliding mechanism 2 to ensure that the action on the pressure claw housing 4 is always effective. The moving column 32, which is slidably connected to the inner wall of the fixed block 31, can slide along the fixed block 31. The fixed column 33 at one end is the core execution component. When the fixed column 33 is embedded in the inner wall of the pressure claw housing 4, it is fixed. When it is detached, it is released. The spring 34 sleeved on the outer wall of the moving column 32 can assist the moving column 32 and the fixed column 33 to reset through elastic deformation, ensuring that the fixed column 33 is stably embedded and fixed. The positioning column 36 on the outer wall of the moving column 32 can convert its own rotation into the sliding power of the moving column 32 to drive the fixing or unlocking action.

[0015] A rotating block 35 is rotatably connected to the outer wall of the positioning column 36. The rotating block 35 provides the force point for the operator to rotate the column. The rotation drives the positioning column 36 and the moving column 32 to move. The outer wall of the rotating block 35 is slidably connected to the outer wall of the fixed block 31. The fixed block 31 provides guidance and support for the rotation of the rotating block 35, ensuring that the rotating block 35 can stably drive the moving column 32 to move. The fixed column 33 is slidably connected to the inner wall of the pressure claw housing 4. The sliding cooperation between the fixed column 33 and the inner wall of the pressure claw housing 4 realizes the detachable fixation of the pressure claw housing 4. The outer wall of the second spring 34 is slidably connected to the inner wall of the fixed block 31. The fixed block 31 provides guidance for the deformation of the second spring 34, avoiding the spring offset from affecting the reset effect. One end of the second spring 34 is fixedly connected to the outer wall of the fixed column 33, so that the elastic force of the second spring 34 can directly act on the fixed column 33, pushing the fixed column 33 into the pressure claw housing 4 to achieve fixation. Specifically, the rotating block 35, which is rotatably connected to the outer wall of the positioning post 36, provides a force point for operation. It slides and rotates along the outer wall of the fixed block 31, driving the positioning post 36 and the moving post 32 to move together. The fixed block 31 provides guiding support for the rotating block 35 to ensure stable operation. The fixed post 33 at one end of the moving post 32 slides with the inner wall of the pressure claw housing 4 to achieve detachable fixation. The outer wall of the spring 34 slides along the inner wall of the fixed block 31, and one end of it is fixed to the fixed post 33. The elastic force directly pushes the fixed post 33 into the pressure claw housing 4 to ensure reliable fixation. Rotating the rotating block 35 in the opposite direction can release the fixation.

[0016] The implementation principle of this application embodiment is as follows: When it is necessary to adjust the position of the pressure claw, the pressing cover 24 is pressed down. Pressing down the pressing cover 24 is the starting operation to trigger the unlocking of the sliding mechanism 2, which provides power for the movement of the sliding column 23. At this time, the sliding column 23 will follow the pressing cover 24 and squeeze the spring 25 together to move downward until it is free from the restriction of the clamping plate 26. The sliding column 23 slides down synchronously with the pressing cover 24 and compresses the spring 25. After it is free from the clamping plate 26, the sliding mechanism 2 is unlocked and can be freely adjusted. At this time, the left and right sliding connecting arm 22 drives the sliding block 21 to move synchronously with the pressure claw housing 4 to realize the adjustment of the pressure claw position. The connecting arm 22 will drive the sliding block 21 and the limiting plate 27 to slide together in the limiting groove 28. The sliding block 21 drives the limiting plate 27 to slide along the limiting groove 28 to ensure that the pressure claw is adjusted along the preset trajectory and avoid position deviation, thereby achieving the purpose of adjusting the position of the pressure claw. Through the process of unlocking, sliding, and positioning, the precise adjustment of the pressure claw position is achieved to meet the position requirements of semiconductor die bonding. When it is necessary to disassemble the pressure claw, rotate the rotating block 35 upward. Rotating the rotating block 35 upward is the starting operation that triggers the disassembly mechanism 3, providing power for the movement of the moving column 32 and the fixed column 33. The rotating block 35 will drive the moving column 32 and the fixed column 33 to move upward together. The rotation of the rotating block 35 is converted into the upward sliding of the moving column 32 through the positioning column 36, which drives the fixed column 33 to simultaneously detach from the pressure claw housing 4, so that the fixed column 33 is released from the restriction on the pressure claw housing 4. After the fixed column 33 is separated from the inner wall of the pressure claw housing 4, the pressure claw housing 4 is no longer fixed by the disassembly mechanism 3 and can be removed freely, thereby achieving the purpose of disassembling the pressure claw, quickly releasing the fixation of the pressure claw, facilitating the replacement or maintenance of the pressure claw, and improving operating efficiency.

[0017] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor die bonder, comprising a substrate (1), characterized in that: The outer wall of the base plate (1) is slidably connected to a sliding mechanism (2), the outer wall of the sliding mechanism (2) is fixedly connected to a disassembly mechanism (3), and the inner wall of the sliding mechanism (2) is fitted with a pressure claw housing (4). The sliding mechanism (2) includes a sliding block (21), the outer wall of the sliding block (21) is slidably connected to the outer wall of the base plate (1), the outer wall of the sliding block (21) is fixedly connected to a connecting arm (22), the inner wall of the connecting arm (22) is slidably connected to a sliding column (23), one end of the sliding column (23) is fixedly connected to a push cover (24), the outer wall of the sliding column (23) is sleeved with a spring (25), the outer wall of the sliding column (23) is slidably connected to a locking plate (26), the outer wall of the sliding block (21) is fixedly connected to a limiting plate (27), the inner wall of the base plate (1) is provided with a limiting groove (28), and the outer wall of the sliding block (21) is fixedly connected to a positioning component (29).

2. The semiconductor die bonder according to claim 1, characterized in that: The disassembly mechanism (3) includes a fixed block (31), the outer wall of which is fixedly connected to the outer wall of the sliding mechanism (2), the inner wall of which is slidably connected to a moving column (32), one end of which is fixedly connected to a fixed column (33), the outer wall of which is sleeved with a spring (34), the outer wall of which is fixedly connected to a positioning column (36), and the outer wall of which is rotatably connected to a rotating block (35).

3. The semiconductor die bonder according to claim 1, characterized in that: The positioning component (29) includes a positioning plate (291), the outer wall of which is fixedly connected to the outer wall of the sliding block (21), and the inner wall of the base plate (1) is provided with a positioning groove (292).

4. A semiconductor die bonder according to claim 3, characterized in that: The outer wall of the limiting plate (27) is slidably connected to the inner wall of the limiting groove (28), and the outer wall of the positioning plate (291) is slidably connected to the inner wall of the positioning groove (292).

5. A semiconductor die bonder according to claim 1, characterized in that: The outer wall of the card plate (26) is fixed to the outer wall of the base plate (1), and the outer wall of the connecting arm (22) is slidably connected to the outer wall of the base plate (1).

6. A semiconductor die bonder according to claim 1, characterized in that: One end of the spring (25) is fixedly connected to the outer wall of the push cover (24), and the other end of the spring (25) is fixedly connected to the outer wall of the connecting arm (22).

7. A semiconductor die bonder according to claim 2, characterized in that: The outer wall of the rotating block (35) is slidably connected to the outer wall of the fixed block (31), and the fixed column (33) is slidably connected to the inner wall of the pressure claw housing (4).

8. A semiconductor die bonder according to claim 2, characterized in that: The outer wall of the second spring (34) is slidably connected to the inner wall of the fixed block (31), and one end of the second spring (34) is fixedly connected to the outer wall of the fixed column (33).

Images