Semiconductor stage fast calibration positioning device
Patent Information
- Application Number
- CN202522338716.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-04
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-11-04
AI Technical Summary
[0004]本实用新型的目的在于提供一种半导体载台快速校准定位装置,以解决现有技术中不便于调节半导体载台的水平使用角度,同时不便于对上载台进行水平角度的校准问题
[0012]1、本实用新型利用立轴和轴承座之间通过齿轮组传动连接有电动机,齿轮组采用减速齿轮,且电动机固定安装在底座上,使得通过电动机和齿轮组驱动轴承座上部的上载台水平旋转调节,从而便于调节半导体载台的水平使用角度。
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Figure CN224924178U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor stage technology, specifically a semiconductor stage rapid calibration and positioning device. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. The conductivity of semiconductor materials can be altered through doping; the concentration and polarity of the impurities incorporated into the intrinsic semiconductor significantly affect its conductivity. Semiconductors doped with donor impurities primarily exhibit electron-type conductivity in the conduction band, while those doped with acceptor impurities exhibit hole-type conductivity. Semiconductor stages are core equipment used in semiconductor manufacturing and testing to support wafers or chips, primarily used in processes such as wafer inspection and laser annealing.
[0003] A semiconductor stage, as described in prior art application number 202221099070.3, is used to support a fixture for placing layered products. This semiconductor stage includes an image capturing unit and a processing unit. The image capturing unit captures an image of the layered product, and the processing unit determines the product's condition based on the captured image. Because the image capturing unit uses planar detection, the captured image records the state of the entire "plane," improving detection capability compared to point detection. It can effectively detect various abnormal conditions such as warping, oblique insertion, or stacking, thus avoiding misjudgments. However, it is inconvenient to adjust the horizontal operating angle of the semiconductor stage and also inconvenient to calibrate the horizontal angle of the upper stage. Utility Model Content
[0004] The purpose of this invention is to provide a rapid calibration and positioning device for a semiconductor stage, so as to solve the problems in the prior art where it is inconvenient to adjust the horizontal operating angle of the semiconductor stage and also inconvenient to calibrate the horizontal angle of the upper stage.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor stage rapid calibration and positioning device, comprising a base, an upper stage rotatably mounted on the upper side of the base via a vertical shaft and a bearing seat, two first sliders being threaded in opposite directions on the upper side of the upper stage via a first lead screw, and a first positioning clamping plate being provided on the upper side of the two first sliders, the first positioning clamping plate being provided with a right-angle clamping groove, a motor being connected to the vertical shaft and the bearing seat via a gear set, and a sensor for angle rotation calibration being provided between the upper stage and the base, the sensor including a signal receiver disposed on the lower side of the upper stage, and the sensor also including multiple signal transmitters disposed on the upper side of the base at multiple angles.
[0006] Furthermore, two second sliders are provided on one side of the first positioning clamp via a second lead screw thread, and a second positioning clamp is provided on one side of each of the two second sliders.
[0007] Furthermore, the gear set is a reduction gear, and the motor is fixedly mounted on the base.
[0008] Furthermore, the multiple signal transmitters are arranged at an angle, and the signal receiver is located directly above the signal transmitters.
[0009] Furthermore, both the first positioning clamp and the second positioning clamp are rectangular clamps, and both the first positioning clamp and the second positioning clamp are provided with protective pads on one side.
[0010] Furthermore, the two first sliders are slidably disposed in the limiting groove on the upper side of the upper platform, and the limiting groove is also provided with a guide rod.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] 1. This utility model utilizes a gear set to drive an electric motor between the vertical shaft and the bearing seat. The gear set is a reduction gear, and the electric motor is fixedly mounted on the base. This allows the upper platform on the bearing seat to be rotated horizontally by the electric motor and the gear set, thereby facilitating the adjustment of the horizontal operating angle of the semiconductor platform.
[0013] 2. This utility model utilizes a sensor including a signal receiver disposed on the lower side of the upper platform, and the sensor also includes multiple signal transmitters with bases disposed on the upper side at multiple angles. By controlling the signal transmitters at different angles to emit signals, and observing whether the signal receiver receives the corresponding signals, the horizontal angle of the upper platform can be calibrated.
[0014] 3. This utility model utilizes two first sliders connected by a first lead screw threaded in opposite directions on the upper side of the upper platform, and a first positioning clamp is provided on the upper side of the two first sliders. This allows the two first positioning clamps to be moved in opposite directions by the first lead screw for adjustment, thereby clamping and fixing the left and right sides of the semiconductor. Then, two second sliders are connected by a second lead screw threaded in opposite directions on one side of the first positioning clamp, and a second positioning clamp is provided on one side of each of the two second sliders. This allows the two second positioning clamps to be moved in opposite directions by the second lead screw for adjustment, thereby clamping and fixing the front and rear sides of the semiconductor, which facilitates the improvement of the stability of the semiconductor clamped and fixed on the upper platform. Attached Figure Description
[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0016] Figure 1 This is a schematic diagram of the overall first-view structure of this utility model;
[0017] Figure 2 This is a schematic diagram of the overall second-view structure of this utility model;
[0018] Figure 3 This is a schematic diagram of the first positioning clamping plate structure of this utility model.
[0019] In the diagram: 1. Base; 2. Vertical shaft; 3. Bearing seat; 4. Gear set; 5. Motor; 6. Upper platform; 7. First lead screw; 8. First slider; 9. First positioning clamp; 10. Second slider; 11. Second positioning clamp; 12. Second lead screw; 13. Limiting groove; 14. Guide rod; 15. Signal transmitter; 16. Signal receiver; 17. Right angle clamp. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figure 1 , Figure 2 , Figure 3 In this embodiment of the present invention, a semiconductor stage rapid calibration and positioning device includes a base 1 and a PLC control cabinet for overall operation. An upper stage 6 is rotatably mounted on the upper side of the base 1 via a vertical shaft 2 and a bearing seat 3. The gear set 4 is a reduction gear, and the motor 5 is fixedly mounted on the base 1, so that the upper stage 6 on the upper part of the bearing seat 3 is driven to rotate horizontally by the motor 5 and the gear set 4, thereby facilitating the adjustment of the horizontal operating angle of the semiconductor stage.
[0022] like Figure 1 and Figure 3 As shown, in order to improve the stability of the semiconductor clamping and fixing on the upper platform, two first sliders 8 are provided on the upper side of the upper platform 6 via a first lead screw 7 with opposing threads, and a first positioning clamp 9 is provided on the upper side of the two first sliders 8. The two first sliders 8 are slidably disposed in the limiting groove 13 on the upper side of the upper platform 6, and a guide rod 14 is also provided in the limiting groove 13. The first positioning clamp 9 is provided with a right angle clamping groove 17, so that the two first positioning clamps 9 can be moved and adjusted in opposite directions by the first lead screw 7, which can clamp and fix the left and right sides of the semiconductor. Two second sliders 10 are provided on one side of the first positioning clamp 9 via a second lead screw 12 with opposing threads, and a second positioning clamp 11 is provided on one side of each of the two second sliders 10, so that the two second positioning clamps 11 can be moved and adjusted in opposite directions by the second lead screw 12, which can clamp and fix the front and rear sides of the semiconductor, which can improve the stability of the semiconductor clamping and fixing on the upper platform 6.
[0023] like Figure 1 and Figure 2 As shown, a motor 5 is also connected between the vertical shaft 2 and the bearing seat 3 via a gear set 4. A sensor for angle rotation calibration is provided between the upper platform 6 and the base 1. The sensor includes a signal receiver 16 located on the lower side of the upper platform 6 and multiple signal transmitters 15 located on the upper side of the base 1 at multiple angles. The multiple signal transmitters 15 are arranged at equal angles. The signal receiver 16 is located directly above the signal transmitters 15. The multiple signal transmitters 15 and the signal receiver 16 are electrically connected to an external controller, so that by controlling the signal transmitters 15 at different angles to emit signals and observing whether the signal receiver 16 receives the corresponding signals, the horizontal angle of the upper platform 6 can be calibrated.
[0024] like Figure 1 and Figure 2 As shown, both the first positioning clamp 9 and the second positioning clamp 11 are rectangular clamps, and both the first positioning clamp 9 and the second positioning clamp 11 are provided with protective pads on one side, which increases the anti-slip properties of one side of the positioning clamp and helps to improve the stability of semiconductor clamping and fixing. At the same time, in conjunction with a pressure sensor, it prevents excessive squeezing and damage to the semiconductor.
[0025] The working principle and usage process of this utility model are as follows: In use, an upper platform 6 is rotatably mounted on the upper side of the base 1 via a vertical shaft 2 and a bearing seat 3. A motor 5 is connected to the vertical shaft 2 and the bearing seat 3 through a gear set 4, so that the upper platform 6 on the upper part of the bearing seat 3 is driven to rotate horizontally by the motor 5 and the gear set 4, thereby facilitating the adjustment of the horizontal operating angle of the semiconductor stage. Moreover, a sensor for angle rotation calibration is provided between the upper platform 6 and the base 1. The sensor includes a signal receiver 16 located on the lower side of the upper platform 6, and multiple signal transmitters 15 located at multiple angles on the upper side of the base 1. The multiple signal transmitters 15 and the signal receivers 16 are electrically connected to an external controller, so that by controlling the signal transmitters 15 at different angles to emit signals, and by observing whether the signal receivers 16 receive the corresponding signals, the horizontal angle of the upper platform 6 can be calibrated.
[0026] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A semiconductor stage rapid calibration and positioning device, comprising a base (1), characterized in that: The upper side of the base (1) is provided with an upper platform (6) through a vertical shaft (2) and a bearing seat (3). The upper side of the upper platform (6) is provided with two first sliders (8) through a first lead screw (7) with opposing threads. The upper side of the two first sliders (8) is provided with a first positioning clamp (9). The vertical shaft (2) and the bearing seat (3) are connected by a motor (5) through a gear set (4). The upper platform (6) and the base (1) are provided with a sensor for angle rotation calibration. The sensor includes a signal receiver (16) set on the lower side of the upper platform (6). The sensor also includes multiple signal transmitters (15) set on the upper side of the base (1) at multiple angles.
2. The semiconductor stage rapid calibration and positioning device according to claim 1, characterized in that: Two second sliders (10) are provided on one side of the first positioning clamp (9) through the second lead screw (12) and two second positioning clamps (11) are provided on one side of each second slider (10).
3. The semiconductor stage rapid calibration and positioning device according to claim 1, characterized in that: The gear set (4) is a reduction gear, and the motor (5) is fixedly mounted on the base (1).
4. The semiconductor stage rapid calibration and positioning device according to claim 1, characterized in that: The multiple signal transmitters (15) are arranged at an angle, and the signal receiver (16) is located directly above the signal transmitters (15).
5. The semiconductor stage rapid calibration and positioning device according to claim 2, characterized in that: The first positioning clamp (9) and the second positioning clamp (11) are both rectangular clamps, and a protective pad is provided on one side of both the first positioning clamp (9) and the second positioning clamp (11).
6. The semiconductor stage rapid calibration and positioning device according to claim 1, characterized in that: The two first sliders (8) are slidably disposed in the limiting groove (13) on the upper side of the upper platform (6), and the limiting groove (13) is also provided with a guide rod (14).
Citation Information
Patent Citations
Semiconductor stage
CN217507271U