Wafer centering and searching device

Abstract

The utility model relates to wafer manufacturing equipment technical field discloses a kind of wafer centering parameter searching device. Wafer centering parameter searching device includes base module, laser parameter searching module and bearing positioning module, laser parameter searching module is connected with base module, bearing positioning module includes support mechanism, table mechanism, centering mechanism and rotary drive mechanism, table mechanism is engaged with support mechanism, can be carried fixed wafer;Centering mechanism is installed on support mechanism, for correcting the position of wafer;Support mechanism and base module sliding fit, so that bearing positioning module has second position away from laser parameter searching module and makes wafer can be placed in table mechanism along vertical, and close to laser parameter searching module;Rotary drive mechanism can drive table mechanism rotation, to make the positioning feature of wafer edge be identified by laser parameter searching module. The wafer centering parameter searching device, wafer can be vertically fed and discharged, wafer pick-and-place action is simple, and efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing equipment technology, and in particular to a wafer centering and parameter finding device. Background Technology

[0002] In the wafer manufacturing process, wafers undergo chemical mechanical polishing, single-sided thinning, and edge chamfering, among other processing steps. Before placing the wafer into the corresponding processing equipment, its center and orientation must be precisely determined. The wafer's edges typically feature positioning features such as notches and diced edges, which are used to characterize the wafer's orientation.

[0003] In related technologies, wafer centering and parameter finding devices include a support structure and a component for identifying wafer positioning features. However, the component for identifying wafer positioning features is located on the upper side of the support structure, which makes it impossible for the wafer to be picked up and placed directly from the support structure in the vertical direction. This increases the complexity of wafer picking and placing operations, thereby affecting the overall production efficiency of the wafer. Utility Model Content

[0004] The purpose of this invention is to propose a wafer centering and parameter-finding device, in which the entire bearing and positioning module can move synchronously relative to the laser parameter-finding module, thereby enabling the wafer to be loaded and unloaded vertically. The wafer handling operation is simple and efficient.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A wafer centering and parametric finding device includes a base module, a laser parametric finding module, and a carrier positioning module. The laser parametric finding module is connected to the base module. The carrier positioning module includes a support mechanism, a stage mechanism, a centering mechanism, and a rotation drive mechanism. The stage mechanism is rotatably mounted on the support mechanism and can carry and fix the wafer. The centering mechanism is mounted on the support mechanism and can correct the position of the wafer on the stage mechanism so that the center of the wafer is collinear with the rotation axis of the stage mechanism. The support mechanism and the base module slide in a first direction, allowing the carrier positioning module to move to a first position or a second position. In the first position, the carrier positioning module is away from the laser parametric finding module so that the wafer can be placed vertically on the stage mechanism. In the second position, the carrier positioning module is close to the laser parametric finding module so that part of the wafer is located below the laser parametric finding module. The rotation drive mechanism is connected to the support mechanism and can drive the stage mechanism to rotate so that the positioning features of the wafer edge can be identified by the laser parametric finding module.

[0007] As an optional solution, the base module includes a base plate and a linear drive assembly. The load-bearing positioning module is slidably engaged with the base plate. The linear drive assembly is mounted on the base plate, and its output end is connected to the support mechanism. The linear drive assembly can drive the load-bearing positioning module to move between the first position and the second position.

[0008] As an optional solution, the base module further includes a first guide rail extending along a first direction and mounted on the base plate, and a first slider mounted on the support mechanism, the first slider slidingly engaging with the first guide rail; and / or

[0009] The base module further includes a first positioning detection element and a second positioning detection element. Both the first and second positioning detection elements are communicatively connected to the linear drive assembly and are spaced apart along a first direction on the base plate. A sensing plate is mounted on the support mechanism. When the bearing positioning module reaches the first position, the sensing plate is detected by the first positioning detection element; when the bearing positioning module reaches the second position, the sensing plate is detected by the second positioning detection element; and / or

[0010] The base module further includes a first positioning buffer component and a second positioning buffer component. The first positioning buffer component and the second positioning buffer component are spaced apart on the base plate along a first direction. The first positioning buffer component is configured to contact and buffer the support mechanism when the bearing positioning module reaches the first position, and the second positioning buffer component is configured to contact and buffer the support mechanism when the bearing positioning module reaches the second position.

[0011] As an optional solution, the laser parameter tracing module includes:

[0012] The support assembly is mounted on the platform mechanism at its lower end;

[0013] A first laser sensor, mounted on the upper end of the support assembly, is used to identify reference features of a wafer of a first size specification;

[0014] A second laser sensor, mounted on the upper end of the support assembly, is used to identify reference features of the wafer of the second size specification.

[0015] As an alternative, the centering mechanism includes a centering drive assembly and at least three centering pillars. The at least three centering pillars are disposed around the stage mechanism and arranged in a circular pattern around the rotation axis of the stage mechanism. The centering drive assembly can drive the at least three centering pillars to synchronously approach the rotation axis of the stage mechanism to position the wafer on the stage mechanism.

[0016] As an optional solution, the support mechanism is equipped with at least three second guide rails, which are circumferentially distributed around the rotation axis of the platform mechanism, and each second guide rail extends radially along the circumference formed by the at least three second guide rails. Each centering support is connected to a second slider, and each second slider corresponds to a second guide rail in sliding engagement.

[0017] As an optional solution, the centering mechanism further includes a turntable assembly, which is rotatably coupled with the support mechanism, and the rotation axis of the turntable assembly coincides with the rotation axis of the stage mechanism. The turntable assembly is provided with at least three guide slots, and each centering pillar is correspondingly inserted into one of the guide slots and can slide along the corresponding guide slot. The centering drive assembly can drive the turntable assembly to rotate so that each guide slot pushes the corresponding centering pillar closer to or away from the wafer on the stage mechanism.

[0018] As an optional embodiment, the centering drive assembly includes a first rotary drive assembly and a first belt assembly. The first rotary drive assembly is mounted on the support mechanism. The input end of the first belt assembly is connected to the output end of the first rotary drive assembly, and the output end of the first belt assembly is connected to the turntable assembly, so that the first rotary drive assembly can drive the turntable assembly to rotate; and / or

[0019] The support mechanism includes a lower fixed plate, an upper fixed plate, and a connecting shaft seat. The lower fixed plate and the upper fixed plate are arranged at intervals along the vertical direction, and the connecting shaft seat connects the upper fixed plate and the lower fixed plate. The turntable assembly is disposed between the upper fixed plate and the lower fixed plate, and the turntable assembly is sleeved on the connecting shaft seat and rotatably engaged with the connecting shaft seat. The centering drive assembly is mounted on the lower fixed plate. The platform mechanism passes through the connecting shaft seat and rotatably engages with the connecting shaft seat.

[0020] As an optional solution, the platform mechanism includes:

[0021] A platform rotating shaft passes through the support mechanism and rotates with the support mechanism; a first connecting channel is provided inside the platform rotating shaft.

[0022] A rotary air connector is connected to the lower end of the platform shaft, with one end connected to the first communication channel and the other end configured to be connected to the negative pressure supply component.

[0023] A carrier adsorption component is connected to the upper end of the stage rotation axis and can support the wafer. The carrier adsorption component has an adsorption port on the top and a second connecting channel inside. The second connecting channel is connected to the first connecting channel and the adsorption port respectively. The adsorption port is used to adsorb and lock the wafer.

[0024] As an optional solution, the rotary drive mechanism includes:

[0025] A second rotary drive assembly is mounted on the support mechanism;

[0026] The second belt assembly has its input end connected to the output end of the second rotary drive assembly, and its output end connected to the stage shaft, so that the second rotary drive assembly can drive the stage shaft to rotate.

[0027] The beneficial effects of this utility model are:

[0028] The wafer centering and parameter-finding device of this utility model first moves the entire carrier positioning module to a first position along a first direction; an external robotic arm or a person places the wafer vertically on the stage mechanism; the entire carrier positioning module moves to a second position along the first direction; the centering mechanism operates and corrects the position of the wafer on the stage mechanism, making the center of the wafer collinear with the rotation axis of the stage mechanism, thereby achieving wafer centering; then the stage mechanism fixes the wafer; then the rotation drive mechanism drives the stage mechanism and the wafer on the stage mechanism to rotate; when the positioning feature of the wafer rotates to the underside of the laser parameter-finding module and is recognized by the laser parameter-finding module, the rotation drive mechanism stops driving the stage mechanism to rotate, and the wafer's position at this time has achieved centering and parameter-finding; then the entire carrier positioning module returns to the first position along the first direction, so that the wafer can be removed vertically from the stage mechanism. The wafer centering and parameter finding device of this invention can realize wafer centering and parameter finding. By moving the bearing positioning module horizontally to offset the laser parameter finding module vertically, the wafer can be vertically picked up and placed from the stage mechanism. The wafer picking and placing action is simple and efficient. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the wafer centering and parameter finding device provided in a specific embodiment of this utility model;

[0030] Figure 2 This is a longitudinal cross-sectional schematic diagram of the bearing positioning module provided in a specific embodiment of this utility model;

[0031] Figure 3 This is a horizontal cross-sectional view of the wafer centering and parameter finding device provided in a specific embodiment of this utility model at the turntable assembly.

[0032] In the picture:

[0033] 10. Base module; 11. Base plate; 12. Linear drive assembly; 13. First guide rail; 14. First positioning detection component; 15. Second positioning detection component; 17. First positioning buffer assembly; 171. Buffer bracket; 172. Buffer; 18. Second positioning buffer assembly;

[0034] 20. Laser parameter retrieval module; 21. Support assembly; 211. First horizontal plate; 212. Vertical plate; 213. Second horizontal plate; 214. Reinforcing plate; 22. First laser sensor; 23. Second laser sensor;

[0035] 30. Bearing positioning module;

[0036] 31. Support mechanism; 311. Lower fixed plate; 312. Upper fixed plate; 3121. Clearance hole; 313. Connecting shaft seat; 314. Connecting assembly; 315. Connecting column; 316. First bearing; 317. Second bearing;

[0037] 32. Stage mechanism; 321. Stage rotating shaft; 3211. First connecting channel; 322. Rotary air connector; 323. Bearing adsorption assembly; 3231. Suction cup; 3232. Adsorption pad; 3233. Second connecting channel;

[0038] 33. Centering mechanism; 331. Centering drive assembly; 3311. First rotary drive assembly; 3312. First belt assembly; 3312a. First driving pulley; 3312b. First belt; 3312c. First driven pulley; 332. Centering support column; 333. Second guide rail; 334. Second slider; 335. Turntable assembly; 3351. Turntable base; 3352. Turntable body; 3353. Guide groove; 336. Support bearing;

[0039] 34. Rotary drive mechanism; 341. Second rotary drive assembly; 342. Second belt assembly; 3421. Second drive pulley; 3422. Second belt; 3423. Second driven pulley;

[0040] 41. First slider; 42. Induction plate;

[0041] 51. Wafer A; 511. Edge trimming; 52. Wafer B; 521. Cut. Detailed Implementation

[0042] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not the entire structure.

[0043] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0044] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0045] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0046] This embodiment provides a wafer centering and parameter-finding device, which can perform wafer centering and parameter-finding. For example... Figure 1 As shown, the wafer centering and parametric tracing device includes a base module 10, a laser parametric tracing module 20, and a carrier positioning module 30. The laser parametric tracing module 20 is connected to the base module 10 and is used to identify positioning features on the wafer. Figure 1 As shown, the edge positioning feature of some wafer sizes (hereinafter referred to as wafer A51) is a chamfer 511. The edge positioning feature of other wafer sizes (hereinafter referred to as wafer B52) is a notch 521. The laser parameter locating module 20 can identify the chamfer 511 and the notch 521. The carrier positioning module 30 is used to carry the wafer and locate the center of the wafer (i.e., centering). The carrier positioning module 30 is also used to drive the wafer to rotate after centering, thereby cooperating with the laser parameter locating module 20 to identify the positioning feature of the wafer (i.e., parameter locating).

[0047] Specifically, such as Figure 1 and Figure 2As shown, the carrier positioning module 30 includes a support mechanism 31, a stage mechanism 32, a centering mechanism 33, and a rotation drive mechanism 34. The stage mechanism 32 is rotatably mounted on the support mechanism 31 and can carry and fix the wafer. The centering mechanism 33 is mounted on the support mechanism 31 and can correct the position of the wafer on the stage mechanism 32 so that the center of the wafer is collinear with the rotation axis of the stage mechanism 32. The support mechanism 31 slides with the base module 10 in a first direction, enabling the carrier positioning module 30 to move to a first position or a second position. In the first position, the carrier positioning module 30 is away from the laser parameter retrieval module 20 so that the wafer can be placed vertically on the stage mechanism 32; in the second position, the carrier positioning module 30 is close to the laser parameter retrieval module 20 so that part of the wafer is located below the laser parameter retrieval module 20; the rotation drive mechanism 34 is connected to the support mechanism 31 and can drive the stage mechanism 32 to rotate so that the positioning features of the wafer edge can be identified by the laser parameter retrieval module 20.

[0048] The working process of the wafer centering and parameter finding device in this embodiment is as follows: the entire carrier positioning module 30 moves to the first position along the first direction; an external robot or a person places the wafer vertically on the stage mechanism 32; the entire carrier positioning module 30 moves to the second position along the first direction; the centering mechanism 33 operates and corrects the position of the wafer on the stage mechanism 32, so that the center of the wafer is collinear with the rotation axis of the stage mechanism 32, thereby achieving wafer centering; then the stage mechanism 32 fixes the wafer; then the rotation drive mechanism 34 drives the stage mechanism 32 and the wafer to rotate. When the positioning feature of the wafer rotates to the lower side of the laser parameter finding module 20 and is recognized by the laser parameter finding module 20, the rotation drive mechanism 34 stops driving the stage mechanism 32 to rotate, and the wafer's position at this time achieves centering and parameter finding; then the entire carrier positioning module 30 returns to the first position along the first direction so that the wafer can be removed vertically from the stage mechanism 32. The wafer centering and parameter finding device in this embodiment can realize wafer centering and parameter finding. By moving the bearing positioning module 30 horizontally to offset the laser parameter finding module 20 vertically, the wafer can be vertically picked up and placed from the stage mechanism 32. The wafer picking and placing action is simple and efficient.

[0049] like Figure 1As shown, the base module 10 includes a base plate 11 and a linear drive assembly 12. The bearing positioning module 30 is slidably engaged with the base plate 11. The linear drive assembly 12 is mounted on the base plate 11, and its output end is connected to the support mechanism 31. The linear drive assembly 12 can drive the bearing positioning module 30 to move between a first position and a second position. By setting the linear drive assembly 12, the bearing positioning module 30 can be automatically switched between the first and second positions, improving the automation level of wafer centering and parameter finding operations and reducing manual labor intensity. In this embodiment, the linear drive assembly 12 can be a linear cylinder. Of the cylinder body and piston rod, one is connected to the base plate 11, and the other is connected to the support mechanism 31. The piston rod extends or retracts to drive the bearing positioning module 30 to move between the first and second positions.

[0050] like Figure 1 As shown, the base module 10 also includes a first guide rail 13, which extends along a first direction and is mounted on the base plate 11. A first slider 41 is mounted on the support mechanism 31, and the first slider 41 slides in cooperation with the first guide rail 13. By setting the cooperation between the first guide rail 13 and the first slider 41, the smoothness and accuracy of the movement of the bearing positioning module 30 are improved, thereby ensuring the accuracy of parameter seeking. In this embodiment, the base module 10 includes two first guide rails 13, and two first sliders 41 are connected to the support mechanism 31. Each first slider 41 slides in cooperation with one first guide rail 13. The configuration of two sets of first guide rails 13 and second sliders 334 can further improve the movement accuracy and stability of the bearing positioning module 30.

[0051] like Figure 1As shown, the base module 10 includes a first positioning detection element 14 and a second positioning detection element 15. Both the first positioning detection element 14 and the second positioning detection element 15 are communicatively connected to the linear drive assembly 12 and are spaced apart on the base plate 11 along a first direction. A sensing plate 42 is installed on the support mechanism 31. When the bearing positioning module 30 reaches the first position, the sensing plate 42 is identified by the first positioning detection element 14. When the bearing positioning module 30 reaches the second position, the sensing plate 42 is identified by the second positioning detection element 15. That is, by setting the first positioning detection element 14, it is possible to confirm whether the bearing positioning module 30 has reached the first position. If the first positioning detection element 14 detects that the bearing positioning module 30 has reached the first position, it sends a signal to the linear drive assembly 12 to stop the linear drive assembly 12, ensuring that the bearing positioning module 30 is accurately driven to the first position. Similarly, by setting the second positioning detection element 15, it is possible to confirm whether the carrier positioning module 30 has reached the second position. If the second positioning detection element 15 detects that the carrier positioning module 30 has reached the second position, it sends a signal to the linear drive assembly 12 to stop the linear drive assembly 12, ensuring that the carrier positioning module 30 accurately reaches the second position. Optionally, in this embodiment, both the first positioning detection element 14 and the second positioning detection element 15 can be positioning sensors, and the sensing sheet 42 is a metal sheet.

[0052] like Figure 1 As shown, the base module 10 includes a first positioning buffer component 17 and a second positioning buffer component 18. The first positioning buffer component 17 and the second positioning buffer component 18 are spaced apart on the base plate 11 along a first direction. The first positioning buffer component 17 is configured to contact and buffer the support mechanism 31 when the bearing positioning module 30 reaches the first position, and the second positioning buffer component 18 is configured to contact and buffer the support mechanism 31 when the bearing positioning module 30 reaches the second position. By setting the first positioning buffer component 17 and the second positioning buffer component 18 to buffer the bearing positioning module 30 respectively, rigid collisions between the bearing positioning module 30 and the base module 10 can be avoided, ensuring the positional accuracy of the components of the bearing positioning module 30, and thus ensuring the accuracy of wafer centering. In this embodiment, the first positioning buffer component 17 and the second positioning buffer component 18 have the same structure and both include a buffer bracket 171 and a buffer 172. The buffer bracket 171 is mounted on the base plate 11, and the buffer 172 is mounted on the buffer bracket 171. Optionally, the buffer 172 can be a hydraulic buffer or other existing components that can achieve the buffering function, which is not specifically limited here.

[0053] like Figure 1As shown, the laser reference locator module 20 includes a support assembly 21, a first laser sensor 22, and a second laser sensor 23. The lower end of the support assembly 21 is mounted on the stage mechanism 32, and the first laser sensor 22 is mounted on the upper end of the support assembly 21 to identify reference features of a wafer of a first size specification. The second laser sensor 23 is mounted on the upper end of the support assembly 21 to identify reference features of a wafer of a second size specification. By separately setting the first laser sensor 22 and the second laser sensor 23, reference edge locating can be achieved for two wafers of different sizes, and the calculation is simpler. In this embodiment, the wafer of the first size specification is wafer A51, which can be a 6-inch wafer. The positioning feature on wafer A51 is a chamfer 511, which the first laser sensor 22 is used to identify. The wafer of the second size specification is wafer B52, which can be an 8-inch wafer. The positioning feature on wafer B52 is a notch 521, which the second laser sensor 23 is used to identify.

[0054] In this embodiment, as Figure 1 As shown, the support assembly 21 includes a first horizontal plate 211, a vertical plate 212, and a second horizontal plate 213. The first horizontal plate 211 is attached to the upper side of the base plate 11 and fixedly connected to the base plate 11. The vertical plate 212 is located in a vertical plane and its lower end is fixedly connected to the first horizontal plate 211. The second horizontal plate 213 is parallel to the first horizontal plate 211 and connected to the upper end of the vertical plate 212. The first laser sensor 22 and the second laser sensor 23 are both fixedly mounted on the second horizontal plate 213. In this embodiment, the support assembly 21 also includes a reinforcing plate 214. The reinforcing plate 214 is provided at the connection position between the first horizontal plate 211 and the vertical plate 212, and also at the connection position between the vertical plate 212 and the second horizontal plate 213. This gives the entire support assembly 21 good structural rigidity, ensuring the positional accuracy of the first laser sensor 22 and the second laser sensor 23 under long-term use, thereby ensuring the accuracy of parameter seeking.

[0055] like Figure 1 and Figure 2As shown, the centering mechanism 33 includes a centering drive component 331 and at least three centering supports 332. The at least three centering supports 332 are arranged circumferentially around the stage mechanism 32. The centering drive component 331 can drive the at least three centering supports 332 to simultaneously approach the rotation axis of the stage mechanism 32 to position the wafer on the stage mechanism 32. Since the center of the circle containing the at least three centering supports 332 is coaxial with the stage mechanism 32, when the three centering supports 332 simultaneously approach the stage mechanism 32, the center of the wafer can be positioned on the rotation axis of the stage mechanism 32, thereby achieving wafer centering. It should be noted that this centering structure can achieve centering of wafers of different sizes and specifications. In this embodiment, six centering supports 332 are provided, and the six centering supports 332 are evenly distributed circumferentially.

[0056] like Figure 2 and Figure 3 As shown, the centering mechanism 33 also includes a turntable assembly 335, which is rotatably coupled to the support mechanism 31. The rotation axis of the turntable assembly 335 coincides with the rotation axis of the stage mechanism 32. The turntable assembly 335 is provided with at least three guide slots 3353. Each centering pillar 332 is inserted into a corresponding guide slot 3353 and slides with the corresponding guide slot 3353. The centering drive assembly 331 can drive the turntable assembly 335 to rotate, so that each guide slot 3353 pushes the corresponding centering pillar 332 closer to or away from the wafer on the stage mechanism 32. This configuration allows for the synchronous driving of at least three centering pillars 332 using a single drive assembly, and the structure is simple and low-cost.

[0057] In this embodiment, as Figure 1 and Figure 2 As shown, the support mechanism 31 includes a connecting assembly 314, a lower fixed plate 311, an upper fixed plate 312, and a connecting shaft seat 313. The connecting assembly 314 is fixedly connected to the first slider 41, and the lower fixed plate 311 is fixedly connected to the connecting assembly 314. The lower fixed plate 311 and the upper fixed plate 312 are arranged at intervals along the vertical direction, and the connecting shaft seat 313 connects the upper fixed plate 312 and the lower fixed plate 311. The support mechanism 31 also includes multiple connecting columns 315, which connect the lower fixed plate 311 and the upper fixed plate 312 respectively, thereby giving the entire support mechanism 31 better structural strength. The turntable assembly 335 is disposed between the upper fixed plate 312 and the lower fixed plate 311, and the turntable assembly 335 is sleeved on the connecting shaft seat 313 and rotates in cooperation with the connecting shaft seat 313. The centering drive assembly 331 is mounted on the lower fixed plate 311. The platform mechanism 32 passes through the connecting shaft seat 313 and rotates in cooperation with the connecting shaft seat 313. This arrangement enables the support mechanism 31 to support both the centering mechanism 33 and the platform mechanism 32. For example... Figure 2 and Figure 3 As shown, the turntable assembly 335 includes a base 3351 and a body 3352. The base 3351 is rotatably connected to a connecting shaft seat 313 via a first bearing 316. The body 3352 is fixedly connected to the base 3351, and a guide groove 3353 is disposed on the body 3352. In this embodiment, the guide groove 3353 is an arc-shaped groove; in other embodiments, the guide groove 3353 may also be a straight groove that does not extend along the diametrical direction.

[0058] In this embodiment, as Figure 2 As shown, the centering drive assembly 331 includes a first rotary drive assembly 3311 and a first belt assembly 3312. The first rotary drive assembly 3311 is mounted on the support mechanism 31. The input end of the first belt assembly 3312 is connected to the output end of the rotary drive assembly, and the output end of the first belt assembly 3312 is connected to the turntable assembly 335, so that the first rotary drive assembly 3311 can drive the turntable assembly 335 to rotate. Specifically, the first rotary drive assembly 3311 includes a servo motor and a reducer. The first rotary drive assembly 3311 is mounted on the lower fixed plate 311 via a first connecting plate, and the output end of the first rotary drive assembly 3311 extends between the upper fixed plate 312 and the turntable assembly 335. The first belt assembly 3312 includes a first driving pulley 3312a, a first driven pulley 3312c, and a first belt 3312b. The first driving pulley 3312a is connected to the output end of the first rotary drive assembly 3311, and the first driven pulley 3312c is fixedly connected to the turntable assembly 335. The first belt 3312b is wound around the first driving pulley 3312a and the first driven pulley 3312c, thereby transmitting the rotational motion output by the first rotary drive assembly 3311 to the turntable assembly 335. It is understood that, to ensure reliable transmission of the first belt 3312b, a tensioning component can be provided. The tensioning component can adjust the position of the first connecting plate and the fixed plate 311, thereby adjusting the position of the first driving pulley 3312a relative to the first driven pulley 3312c, to ensure the tension of the first belt 3312b.

[0059] like Figure 2As shown, at least three second guide rails 333 are mounted on the support mechanism 31. These three second guide rails 333 are circumferentially distributed around the rotation axis of the stage mechanism 32, and each second guide rail 333 extends radially along the circumference formed by the at least three second guide rails 333. Each centering pillar 332 is connected to a second slider 334, and each second slider 334 corresponds to a second guide rail 333 in sliding engagement. By setting the second guide rails 333 and the second sliders 334, the movement accuracy of each centering pillar 332 can be improved, thereby ensuring the centering accuracy of the wafer. In this embodiment, the number of second guide rails 333 and the number of second sliders 334 are the same as the number of centering pillars 332. The second guide rail 333 and the second slider 334 are both installed on the lower side of the upper fixed plate 312. The upper fixed plate 312 is provided with clearance holes 3121, and the number of clearance holes 3121 is the same as the number of centering support columns 332. The upper end of each centering support column 332 is located on the upper side of the upper fixed plate 312, and the lower end passes through the corresponding clearance hole 3121 and then through the corresponding second slider 334, and then extends into the guide groove 3353 on the turntable assembly 335. Figure 2 As shown, the centering mechanism 33 also includes a support bearing 336, which is fixed to the lower end of the centering support 332. The support bearing 336 is inserted into the guide groove 3353 and slides in cooperation with the guide groove 3353. By setting the support bearing 336, the wear between the centering support 332 and the groove wall of the guide groove 3353 can be reduced, thereby improving the service life of the entire wafer centering and parametric homing device.

[0060] like Figure 2 As shown, the stage mechanism 32 includes a stage shaft 321, a rotary air connector 322, and a support adsorption assembly 323. The stage shaft 321 passes through and rotatably engages with the support mechanism 31. A first connecting channel 3211 is provided inside the stage shaft 321. The rotary air connector 322 is connected to the lower end of the stage shaft 321, with one end connected to the first connecting channel 3211 and the other end configured to connect to the negative pressure supply assembly. The support adsorption assembly 323 is connected to the upper end of the stage shaft 321 and can support the wafer. The top of the support adsorption assembly 323 is provided with an adsorption port, and a second connecting channel 3233 is provided inside. The second connecting channel 3233 is connected to the first connecting channel 3211 and the adsorption port, respectively. The adsorption port is used to adsorb and lock the wafer. In actual use, after the wafer is centered under the action of the centering mechanism 33, the negative pressure supply component provides negative pressure, thereby generating negative pressure at the adsorption port and adsorbing and fixing the wafer on the carrier adsorption component 323; then the rotation drive mechanism 34 drives the stage mechanism 32 to rotate, thereby driving the wafer to rotate, while the rotary air connector 322 ensures that the first connecting channel 3211 is always connected to the negative pressure supply component during the rotation of the stage mechanism 32. The rotary air connector 322 is an existing component, and its structure will not be described in detail here.

[0061] In this embodiment, the stage rotating shaft 321 passes through the connecting shaft seat 313 and is rotatably engaged with the connecting shaft seat 313 via the second bearing 317. The bearing adsorption assembly 323 includes a suction cup 3231 and an adsorption pad 3232. A second connecting channel 3233 is formed on the suction cup 3231, the adsorption pad 3232 covers the suction cup 3231, and the adsorption port is formed on the adsorption pad 3232. This arrangement facilitates the processing of the second connecting channel 3233 and the adsorption port, and allows for flexible adjustment of the shape and size of the adsorption port.

[0062] like Figure 2 As shown, the rotary drive mechanism 34 includes a second rotary drive assembly 341 and a second belt assembly 342. The second rotary drive assembly 341 is mounted on the support mechanism 31. The input end of the second belt assembly 342 is connected to the output end of the second rotary drive assembly 341, and the output end of the second belt assembly 342 is connected to the platform rotating shaft 321, so that the second rotary drive assembly 341 can drive the platform rotating shaft 321 to rotate. Specifically, the second rotary drive assembly 341 includes a servo motor and a reducer. The second rotary drive assembly 341 is mounted on the lower fixed plate 311 via a second connecting plate, and the output end of the second rotary drive assembly 341 extends between the upper fixed plate 312 and the turntable assembly 335. The second belt assembly 342 includes a second driving pulley 3421, a second driven pulley 3423, and a second belt 3422. The second driving pulley 3421 is connected to the output end of the second rotary drive assembly 341, and the second driven pulley 3423 is fixedly connected to the platform shaft 321. The second belt 3422 is wound around the second driving pulley 3421 and the second driven pulley 3423, thereby transmitting the rotational motion output by the second rotary drive assembly 341 to the platform mechanism 32. It is understood that, to ensure reliable transmission of the second belt 3422, a tensioning component can be provided. This tensioning component can adjust the positions of the second connecting plate and the fixed plate 311, thereby adjusting the position of the second driving pulley 3421 relative to the second driven pulley 3423 to ensure the tension of the second belt 3422.

[0063] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. For those skilled in the art, based on the concept of this utility model, there will be changes in the specific implementation methods and application scope. The content of this specification should not be construed as a limitation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer centering and parameter-finding device, characterized in that, The system includes a base module (10), a laser parameter tracing module (20), and a carrier positioning module (30). The laser parameter tracing module (20) is connected to the base module (10). The carrier positioning module (30) includes a support mechanism (31), a stage mechanism (32), a centering mechanism (33), and a rotation drive mechanism (34). The stage mechanism (32) is rotatably mounted on the support mechanism (31) and can carry and fix the wafer. The centering mechanism (33) is mounted on the support mechanism (31) and can correct the position of the wafer on the stage mechanism (32) so that the center of the wafer is collinear with the rotation axis of the stage mechanism (32). The support mechanism (31) and the stage mechanism (34) are connected to the base module (10). The base module (10) slides along a first direction, enabling the bearing positioning module (30) to move to a first position or a second position. In the first position, the bearing positioning module (30) moves away from the laser parameter retrieval module (20) so that the wafer can be placed vertically on the stage mechanism (32). In the second position, the bearing positioning module (30) moves closer to the laser parameter retrieval module (20) so that part of the wafer is located below the laser parameter retrieval module (20). The rotation drive mechanism (34) is connected to the support mechanism (31) and can drive the stage mechanism (32) to rotate so that the positioning features of the wafer edge are identified by the laser parameter retrieval module (20).

2. The wafer centering and parameter finding device as described in claim 1, characterized in that, The base module (10) includes a base plate (11) and a linear drive assembly (12). The bearing positioning module (30) is slidably engaged with the base plate (11). The linear drive assembly (12) is mounted on the base plate (11). The output end of the linear drive assembly (12) is connected to the support mechanism (31). The linear drive assembly (12) can drive the bearing positioning module (30) to move between the first position and the second position.

3. The wafer centering and parameter finding device as described in claim 2, characterized in that, The base module (10) further includes a first guide rail (13) extending along a first direction and mounted on the base plate (11). A first slider (41) is mounted on the support mechanism (31), and the first slider (41) slides in cooperation with the first guide rail (13); and / or The base module (10) further includes a first positioning detection element (14) and a second positioning detection element (15). Both the first positioning detection element (14) and the second positioning detection element (15) are communicatively connected to the linear drive assembly (12) and are spaced apart along a first direction on the base plate (11). A sensing plate (42) is mounted on the support mechanism (31). When the bearing positioning module (30) reaches the first position, the sensing plate (42) is identified by the first positioning detection element (14); when the bearing positioning module (30) reaches the second position, the sensing plate (42) is identified by the second positioning detection element (15); and / or The base module (10) further includes a first positioning buffer component (17) and a second positioning buffer component (18). The first positioning buffer component (17) and the second positioning buffer component (18) are spaced apart on the base plate (11) along a first direction. The first positioning buffer component (17) is configured to contact and buffer the support mechanism (31) when the bearing positioning module (30) reaches the first position. The second positioning buffer component (18) is configured to contact and buffer the support mechanism (31) when the bearing positioning module (30) reaches the second position.

4. The wafer centering and parameter finding device as described in claim 1, characterized in that, The laser parameter tracing module (20) includes: The support assembly (21) is mounted on the platform mechanism (32) at its lower end; A first laser sensor (22) is mounted on the upper end of the support assembly (21) for identifying reference features of a wafer of a first size specification; A second laser sensor (23) is mounted on the upper end of the support assembly (21) for identifying reference features of the wafer of the second size specification.

5. The wafer centering and parameter finding device according to any one of claims 1-4, characterized in that, The centering mechanism (33) includes a centering drive assembly (331) and at least three centering pillars (332). The at least three centering pillars (332) are arranged around the stage mechanism (32) and are circumferentially arranged around the rotation axis of the stage mechanism (32). The centering drive assembly (331) can drive the at least three centering pillars (332) to synchronously approach the rotation axis of the stage mechanism (32) to position the wafer on the stage mechanism (32).

6. The wafer centering and parameter finding device as described in claim 5, characterized in that, At least three second guide rails (333) are mounted on the support mechanism (31). The at least three second guide rails (333) are circumferentially distributed around the rotation axis of the platform mechanism (32), and each second guide rail (333) extends radially along the circumference formed by the at least three second guide rails (333). Each centering pillar (332) is connected to a second slider (334), and each second slider (334) is slidably engaged with a second guide rail (333).

7. The wafer centering and parameter finding device as described in claim 5, characterized in that, The centering mechanism (33) further includes a turntable assembly (335), which is rotatably engaged with the support mechanism (31), and the rotation axis of the turntable assembly (335) coincides with the rotation axis of the stage mechanism (32). The turntable assembly (335) is provided with at least three guide slots (3353), and each centering pillar (332) is correspondingly inserted into one of the guide slots (3353) and can slide along the corresponding guide slot (3353). The centering drive assembly (331) can drive the turntable assembly (335) to rotate so that each guide slot (3353) pushes the corresponding centering pillar (332) closer to or away from the wafer on the stage mechanism (32).

8. The wafer centering and parameter finding device as described in claim 7, characterized in that, The centering drive assembly (331) includes a first rotary drive assembly (3311) and a first belt assembly (3312). The first rotary drive assembly (3311) is mounted on the support mechanism (31). The input end of the first belt assembly (3312) is connected to the output end of the first rotary drive assembly (3311), and the output end of the first belt assembly (3312) is connected to the turntable assembly (335), so that the first rotary drive assembly (3311) can drive the turntable assembly (335) to rotate; and / or The support mechanism (31) includes a lower fixed plate (311), an upper fixed plate (312), and a connecting shaft seat (313). The lower fixed plate (311) and the upper fixed plate (312) are arranged at intervals in the vertical direction. The connecting shaft seat (313) connects the upper fixed plate (312) and the lower fixed plate (311). The turntable assembly (335) is disposed between the upper fixed plate (312) and the lower fixed plate (311), and the turntable assembly (335) is sleeved on the connecting shaft seat (313) and rotates with the connecting shaft seat (313). The centering drive assembly (331) is mounted on the lower fixed plate (311). The platform mechanism (32) passes through the connecting shaft seat (313) and rotates with the connecting shaft seat (313).

9. The wafer centering and parameter finding device according to any one of claims 1-4, characterized in that, The platform mechanism (32) includes: A platform rotating shaft (321) passes through the support mechanism (31) and rotates in cooperation with the support mechanism (31). A first connecting channel (3211) is provided inside the platform rotating shaft (321). A rotary air connector (322) is connected to the lower end of the platform shaft (321), with one end connected to the first communication channel (3211) and the other end configured to be connected to the negative pressure supply component; A carrier adsorption component (323) is connected to the upper end of the stage rotating shaft (321) and can support the wafer. The carrier adsorption component (323) has an adsorption port on its top and a second connecting channel (3133) inside. The second connecting channel (3133) is connected to the first connecting channel (3211) and the adsorption port respectively. The adsorption port is used to adsorb and lock the wafer.

10. The wafer centering and parameter finding device as described in claim 9, characterized in that, The rotary drive mechanism (34) includes: The second rotary drive assembly (341) is mounted on the support mechanism (31); The second belt assembly (342) has its input end connected to the output end of the second rotary drive assembly (341), and its output end connected to the stage shaft (321) so that the second rotary drive assembly (341) can drive the stage shaft (321) to rotate.

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