Electrostatic chuck assembly

Abstract

The present disclosure relates to an electrostatic chuck assembly. The electrostatic chuck assembly includes an electrostatic chuck, a reinforcement frame, and an actuator. The electrostatic chuck has a first surface configured to attach a substrate and a second surface opposite the first surface. The reinforcement frame has an upper surface portion spaced apart from and facing the second surface of the electrostatic chuck and a connecting portion connecting the upper surface portion with the electrostatic chuck. The actuator is coupled to the electrostatic chuck and the upper surface portion and is configured to generate a pushing force or a pulling force on the electrostatic chuck in a third direction according to a power supply, the third direction intersecting a first direction parallel to the second surface of the electrostatic chuck and a second direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0171118, filed on November 26, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure relate to an electrostatic chuck assembly and a deposition apparatus including an electrostatic chuck assembly. Background Technology

[0004] Electronic devices that provide images to users (such as smartphones, digital cameras, laptops, navigation systems, and smart TVs) include display devices. Display devices generate images and display these images to the user via a screen. Various display panels, such as liquid crystal display (LCD) panels and organic light-emitting diode (OLED) display panels, have been developed for use in display devices.

[0005] Among these display panels, OLED display panels include self-emitting light-emitting diodes (LEDs). Each LED includes an anode, a cathode, and an emission layer. The emission layer comprises an organic material. A deposition process can be used to form the emission layer on the display panel.

[0006] The deposition process may include positioning a mask between a substrate and a deposition source for a display panel, supplying organic material from the deposition source, and depositing the organic material onto the substrate through the mask. If the substrate or mask sags, a shadowed area may form between the substrate and the mask, resulting in deposition defects where the organic material is misaligned with the target location. An electrostatic chuck is a device that uses electrostatic forces to reduce or minimize substrate sag. Utility Model Content

[0007] Embodiments of this disclosure provide an electrostatic chuck assembly for automatically controlling the flatness of an electrostatic chuck and a deposition apparatus including the electrostatic chuck assembly.

[0008] In one embodiment of this disclosure, the electrostatic chuck assembly includes an electrostatic chuck, a reinforcing frame, and an actuator. The electrostatic chuck has a first surface configured to attach to a substrate and a second surface opposite to the first surface. The reinforcing frame has an upper surface portion and a connecting portion, wherein the upper surface portion is spaced apart from and faces the second surface of the electrostatic chuck, and the connecting portion connects the upper surface portion to the electrostatic chuck. The actuator is coupled to the electrostatic chuck and the upper surface portion and configured to generate a thrust or pull force on the electrostatic chuck along a third direction according to a power supply, the third direction intersecting a first direction and a second direction parallel to the second surface of the electrostatic chuck.

[0009] According to one embodiment of this disclosure, the connecting portion can be connected to the opposite end of the electrostatic chuck in a first direction or a second direction.

[0010] According to one embodiment of this disclosure, the upper surface portion may have a third surface facing the electrostatic chuck and a fourth surface opposite to the third surface. The connecting portion can be detachably connected to the upper surface portion by fasteners that penetrate the fourth and third surfaces of the upper surface portion.

[0011] According to one embodiment of this disclosure, the power supply to each of the actuators can be controlled independently.

[0012] According to one embodiment of this disclosure, each of the actuators may include a piezoelectric actuator having a length adjustable according to a power supply.

[0013] According to one embodiment of this disclosure, the actuator may include a first actuator and a second actuator. The first actuator may be arranged in a ring shape along a peripheral region of the second surface of the electrostatic chuck, and the second actuator may be arranged in a central region of the second surface defined by the peripheral region.

[0014] According to one embodiment of this disclosure, the actuators can be arranged in a matrix having at least three rows and three columns.

[0015] According to one embodiment of this disclosure, the second surface may have a first side extending in a first direction and a second side extending in a second direction intersecting the first direction. Each of the second actuators may be arranged along the first direction between a pair of first actuators from the first actuators, and along the second direction between another pair of first actuators from the first actuators.

[0016] According to one embodiment of this disclosure, the actuator can be detachably coupled to the electrostatic chuck via a permanent electromagnet and a magnetic component. The permanent electromagnet can be coupled to an end of the actuator, and the magnetic component can be coupled to the electrostatic chuck, and is detachably coupled to the permanent electromagnet by magnetic force provided by each of the permanent electromagnets.

[0017] According to one embodiment of this disclosure, each of the permanent electromagnets can switch to a magnetically connected state or a magnetically disconnected state each time power is supplied, and can remain in the magnetically connected state or magnetically disconnected state after a power supply interruption.

[0018] According to one embodiment of this disclosure, the electrostatic chuck assembly may further include a first magnetic shielding cap and a second magnetic shielding cap. The first magnetic shielding cap may extend around each of the permanent electromagnets while exposing a first attachment surface of each of the permanent electromagnets. The second magnetic shielding cap may extend around each of the magnetic members while exposing a second attachment surface of each of the magnetic members. The first attachment surface of each of the permanent electromagnets and the second attachment surface of each of the magnetic members may face each other to adhere to each other by magnetic force.

[0019] According to one embodiment of this disclosure, the electrostatic chuck assembly may further include a magnet plate. The magnet plate may be configured to move vertically between the electrostatic chuck and the upper surface portion. The magnet plate may include a plate portion and magnets. The plate portion may have a fifth surface facing the electrostatic chuck and a sixth surface opposite to the fifth surface. Magnets may each be coupled to the fifth surface of the plate portion.

[0020] According to one embodiment of the present disclosure, the plate portion may have a through-hole for accommodating an actuator, and the through-hole may be arranged so as not to overlap with a magnet in a plan view.

[0021] According to another embodiment of this disclosure, an electrostatic chuck assembly may include an electrostatic chuck, a reinforcing frame, and a flatness control structure. The electrostatic chuck has a first surface to which a substrate is attached and a second surface opposite to the first surface. The reinforcing frame has an upper surface portion and a connecting portion, wherein the upper surface portion is spaced apart from and faces the second surface of the electrostatic chuck, and the connecting portion connects the upper surface portion to the electrostatic chuck. The flatness control structure is coupled to the electrostatic chuck and the upper surface portion and configured to generate a push or pull force on the electrostatic chuck along a third direction perpendicular to the second surface of the electrostatic chuck. The flatness control structure is detachably coupled to the electrostatic chuck via permanent electromagnets and magnetic members. The permanent electromagnets are respectively coupled to ends of the flatness control structure. The magnetic members are each coupled to the electrostatic chuck and are detachably coupled to the permanent electromagnets by magnetic force provided by each of the permanent electromagnets.

[0022] According to one embodiment of this disclosure, the upper surface portion may have a third surface facing the electrostatic chuck and a fourth surface opposite to the third surface. A connecting portion may be detachably connected to the upper surface portion by fasteners extending through the fourth and third surfaces of the upper surface portion.

[0023] According to one embodiment of this disclosure, the electrostatic chuck assembly may further include a first magnetic shielding cap and a second magnetic shielding cap. The first magnetic shielding cap may extend around each of the permanent electromagnets while exposing a first attachment surface of each of the permanent electromagnets. The second magnetic shielding cap may extend around each of the magnetic members while exposing a second attachment surface of each of the magnetic members. The first attachment surface of each of the permanent electromagnets and the second attachment surface of each of the magnetic members may face each other to adhere to each other by magnetic force.

[0024] According to another embodiment of this disclosure, a deposition apparatus may include a vacuum chamber, a deposition source, an electrostatic chuck assembly, and a mask holder. The deposition source is disposed within the vacuum chamber and configured to supply deposition material into the vacuum chamber. The electrostatic chuck assembly is located above the deposition source, and a substrate is attached to the electrostatic chuck assembly. The mask holder is supported at both ends of a mask between the deposition source and the substrate. The electrostatic chuck assembly includes an electrostatic chuck, a reinforcing frame, and an actuator. The electrostatic chuck has a first surface to which the substrate is attached and a second surface opposite to the first surface. The reinforcing frame has an upper surface portion and a connecting portion, wherein the upper surface portion is spaced apart from and faces the second surface of the electrostatic chuck, and the connecting portion connects the upper surface portion to the electrostatic chuck. The actuator is coupled to the electrostatic chuck and the upper surface portion and configured to generate a thrust or pull force on the electrostatic chuck along a third direction according to a power supply, the third direction intersecting a first direction and a second direction parallel to the second surface of the electrostatic chuck.

[0025] According to one embodiment of this disclosure, the electrostatic chuck may overlap at least a portion of each of a pair of mask holders in a plan view.

[0026] According to one embodiment of this disclosure, the deposition apparatus may further include sensors and a controller. The sensors may be configured to measure, in a third-order direction, the distance between the electrostatic chuck and the upper surface portion corresponding to each of the actuators. The controller may be configured to automatically adjust the flatness of the electrostatic chuck by individually controlling the power supply to each of the actuators based on measurements from the sensors.

[0027] According to one embodiment of this disclosure, the actuator may include a first actuator and a second actuator. The first actuator may be arranged in a ring shape along a peripheral region of the second surface of the electrostatic chuck, and the second actuator may be arranged in a central region defined by the peripheral region of the second surface. The lifting distance of the second actuator over the second region of the electrostatic chuck may be greater than the lifting distance of the first actuator over the first region of the electrostatic chuck.

[0028] According to embodiments of this disclosure, the flatness of the electrostatic chuck can be automatically adjusted by individually controlling the power supply to each of the actuators.

[0029] In addition, it can reduce or avoid the difficulties of performing flatness adjustment operations in the central area of ​​a large electrostatic chuck due to limited workspace. Attached Figure Description

[0030] These aspects and features and / or other aspects and features of this disclosure will become apparent and more readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which: Figure 1 This is a diagram illustrating an electrostatic chuck assembly according to an embodiment of the present disclosure; Figure 2 yes Figure 1 A plan view of the electrostatic chuck assembly shown; Figure 3 yes Figure 2 A magnified view of region A in the image; Figure 4 yes Figure 1 A plan view of the electrostatic chuck shown; Figure 5 yes Figure 1 A bottom view of a portion of the magnet plate shown; Figure 6 It is along Figure 2 A sectional view taken by line I-I' in the middle; Figure 7 It is shown Figure 6 The diagram shows the permanent electromagnet and magnetic components in a separated state; Figure 8 and Figure 9 An electrostatic chuck assembly according to another embodiment of the present disclosure is shown; Figure 10 This is a diagram illustrating a deposition apparatus according to an embodiment of the present disclosure; Figure 11 It is shown Figure 10 A schematic diagram of the controller of the deposition apparatus shown; Figure 12 and Figure 13 It is a comparison Figure 10 The diagram shows the flatness of the electrostatic chuck in the deposition apparatus before and after automatic flatness adjustment. Figures 14 to 16 This shows attachment and separation. Figure 10 A diagram showing the method of using an electrostatic chuck; and Figure 17 This is a cross-sectional view showing a display panel manufactured using a deposition apparatus according to an embodiment of the present disclosure. Detailed Implementation

[0031] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. Embodiments may take various forms and arrangements, and this disclosure should not be construed as limited to the embodiments described herein. Rather, this disclosure should be understood to encompass all forms, arrangements, equivalents, and alternatives covered by the technical concept and scope of this disclosure. Therefore, only some embodiments are described below with reference to the accompanying drawings to explain aspects and features of this disclosure.

[0032] Identical or similar reference numerals refer to identical or similar elements. Furthermore, in the drawings, the thickness, ratios, and dimensions of elements may not be precise scales and may be exaggerated in order to effectively interpret the technical features associated with these elements. Therefore, this disclosure should not be limited to the thicknesses, ratios, dimensions, etc., shown in the drawings.

[0033] When a component is described as being "set on" another component, "placed on" another component, "arranged on" another component, "connected to" another component, or "attached to" another component, it should be understood as being directly set on, placed on, arranged on, connected to, or attached to another component, but it is also possible that another component is interposed therebetween. On the other hand, if a component is described as being "directly set on" another component, "placed on" another component, "arranged on" another component, "connected to," or "attached to" another component, it should be understood that no other component is interposed between them.

[0034] Furthermore, relative terms such as “below,” “under,” “below,” “bottom,” “above,” “above,” “upper,” “top,” etc., may be used herein to describe the relationship between one element and another, as shown in the accompanying drawings. It should be understood that, in addition to the orientations depicted in the drawings, relative terms are intended to also encompass different orientations of the devices. For example, if a device in one of the drawings is flipped, an element described as being “below” the other element will be oriented “above” the other element. Therefore, the exemplary term “below” can thus encompass both “below” and “upper” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “below” the other element will consequently be oriented “above” the other element. Therefore, the exemplary terms “below” or “below” can thus encompass both “upper” and “lower” orientations.

[0035] Furthermore, when a device or layer is described as being "on," "above," "over," etc., of another device or layer, it should also include the case where another device or layer is disposed on, above, or over the other device or layer, or where another device or layer is inserted between the one device or layer and the other device or layer. Conversely, when a device or layer is described as being "directly on," "directly above," or "directly over," etc., of another device or layer, it will mean that no other device or layer is inserted between the one device or layer and the other device or layer.

[0036] Expressions such as “comprising” or “including” are intended to indicate features, numbers, steps, operations, elements, parts or combinations thereof, and should not be construed as excluding any possibility of the presence or addition of one or more other features, numbers, steps, operations, elements, parts or combinations thereof.

[0037] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Any term defined in a common dictionary shall be understood to have the same meaning as it has in the context of the relevant field, and shall not be construed as having an ideal or overly formal meaning unless expressly specified otherwise.

[0038] Terms such as “first” and “second” may be used to describe various elements, but the elements described above should not be limited to these terms. These terms may be used only to distinguish one element from another. For example, without departing from the scope of the claims of this disclosure, a first element may be named a second element, and vice versa. Unless clearly used otherwise, any expression in the singular form may include the meaning of the plural form. The term “and / or” should include a combination of or any one of the listed items.

[0039] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.” When expressions such as “at least one of…” and “any one of…” follow a list of elements, they modify the entire list of elements rather than individual elements within that list. For example, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof. As used herein, the terms “use,” “using,” and “used” may be considered synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively. As used herein, the terms “substantially,” “about,” and similar terms are used as approximate terms rather than terms of degree and are intended to explain inherent biases in measurements or calculations that would be recognized by one of ordinary skill in the art.

[0040] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, the singular forms “a” and “one” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0041] In light of the entire contents of this disclosure, those skilled in the art will understand that each suitable feature of the various embodiments of this disclosure may be combined in part or in whole, or combined with one another, and may be technically interlocked and operated in a variety of suitable ways, and each embodiment may be implemented independently of one another or in combination with one another in any suitable way, unless otherwise stated or implied.

[0042] Furthermore, any numerical range disclosed and / or stated herein is intended to include all subranges with the same numerical precision within the stated range. For example, the range “1.0 to 10.0” is intended to include all subranges between (and inclusive of) the stated minimum value of 1.0 and the stated maximum value of 10.0, that is, a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limit stated herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit stated herein is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to amend the specification (including the claims) to expressly state any subranges included within the range expressly stated herein. All such ranges are intended to be inherently described in this specification such that amendments to expressly state any such subranges will comply with the applicable requirements.

[0043] In embodiments of this disclosure, reference may be made to directions labeled from a first direction DR1 to a third direction DR3. The first direction DR1 may be parallel to a first side of the second surface of the electrostatic chuck (ESC). The second direction DR2 may intersect (or intersect with) the first direction DR1 and may be parallel to a second side of the second surface of the electrostatic chuck (ESC). The third direction DR3 may be perpendicular to the second surface of the electrostatic chuck (ESC). In embodiments of this disclosure, the phrase "in a plan view" refers to a view taken along the third direction DR3.

[0044] Figure 1 An electrostatic chuck assembly 10 according to an embodiment of the present disclosure is shown. Figure 2 yes Figure 1 The plan view of the electrostatic chuck assembly 10 shown, and Figure 3 yes Figure 2 A magnified view of region A in the image. (Reference) Figures 1 to 3 The electrostatic chuck assembly 10 according to embodiments of the present disclosure may include an electrostatic chuck 100, a reinforcing frame 200, an actuator 300, and a magnet plate 400. However, the electrostatic chuck assembly 10 is not limited to including all of the components listed above, and in various embodiments, one or more of these components may be omitted. Figure 2 and Figure 3 In the plan view, for ease of understanding, the electrostatic chuck 100, the connecting portion 220 of the reinforcing frame 200, and the actuator 300, which are hidden below the upper surface portion 210 of the reinforcing frame 200, are indicated by dashed lines.

[0045] An electrostatic chuck 100 is a device configured to clamp or release a substrate using electrostatic forces (e.g., attach or detach a substrate). The electrostatic chuck 100 may have a first surface 101 and a second surface 102. A substrate can be attached to the first surface 101 by electrostatic forces. The second surface 102 may be the opposite surface of the first surface 101 and may have a first side (e.g., a first edge) 102-1 and a second side (e.g., a second edge) 102-2. The first side 102-1 may extend in a first direction DR1, and the second side 102-2 may extend in a second direction DR2 that intersects (or crosses) the first direction DR1. The first side 102-1 may be the longer side of the electrostatic chuck 100, and the second side 102-2 may be the shorter side. For example, the second surface 102 may have a rectangular shape in which the first side 102-1 is longer than the second side 102-2, but is not limited to this configuration.

[0046] The electrostatic chuck 100 can be a large-area chuck, allowing the length of the first side 102-1 and the second side 102-2 to be several meters, while the thickness of the electrostatic chuck 100 can be only tens of millimeters. As the electrostatic chuck 100 increases in size, problems related to its stiffness and sag may arise.

[0047] The reinforcing frame 200 can serve as a reinforcing structure to supplement (or increase) the rigidity of the electrostatic chuck 100. The reinforcing frame 200 may have an upper surface portion 210 and a connecting portion 220. The upper surface portion 210 may be spaced apart from the second surface 102 of the electrostatic chuck 100 on a third-direction DR3 and arranged to face the second surface 102 of the electrostatic chuck 100. Therefore, there may be a space between the upper surface portion 210 and the electrostatic chuck 100 in which the actuator 300 and the magnet plate 400 are arranged.

[0048] The upper surface portion 210 may have a third surface 211 and a fourth surface 212, wherein the third surface 211 may face the second surface 102 of the electrostatic chuck 100, and the fourth surface 212 may be opposite to the third surface 211. As shown, the upper surface portion 210 may be formed as a single plate, but is not limited to this configuration, and may also have a split structure.

[0049] The connecting portion 220 can connect the upper surface portion 210 to the electrostatic chuck 100. (Reference) Figure 1 The connecting portion 220 can be coupled to both ends (e.g., opposite ends) of the electrostatic chuck 100 in the first direction DR1. The connecting portion 220 is shown as being coupled at four locations along each end in the first direction DR1, but this is merely an example and not a limitation. In another embodiment, the connecting portion 220 can be coupled to both ends (e.g., opposite ends) of the electrostatic chuck 100 in the second direction DR2. In yet another embodiment, the connecting portion 220 can be coupled to both ends (e.g., opposite ends) in both the first direction DR1 and the second direction DR2. The connecting portion 220 may not overlap with the electrostatic chuck 100 in a plan view (e.g., it may not overlap or it may be offset).

[0050] The connecting portion 220 can be detachably attached to the upper surface portion 210 by fasteners such as bolts B. Therefore, the electrostatic chuck 100 can be easily attached and detached (e.g., removably attached or attached). Each bolt B can penetrate (or may pass through) the fourth surface 212 and the third surface 211 of the upper surface portion 210 and can be attached to the connecting portion 220. Bolt holes can be provided at the upper end of the connecting portion 220 for fastening the bolts B.

[0051] Each of the actuators 300 can be coupled to the upper surface portion 210 of the electrostatic chuck 100 and the reinforcing frame 200. Each of the actuators 300 can generate a thrust or pull force on the electrostatic chuck 100 along a third direction DR3 based on a power supply (e.g., according to the supplied electrical energy or current). Furthermore, the power supply to each of the actuators 300 can be individually controlled. For example, the power supply to any one of the actuators 300 can be different from the power supply to the other. Therefore, the magnitude of the force generated by each of the actuators 300 can vary, and the force transmitted to different areas of the electrostatic chuck 100 can be correspondingly different. For example, a relatively higher power supply can be provided to the actuator 300 arranged in the central region, where the sag of the electrostatic chuck 100 is most significant. Therefore, the sag of the electrostatic chuck 100 can be improved, and the flatness of the electrostatic chuck 100 can be adjusted.

[0052] Actuator 300 can constitute one type of flatness control structure. The term "flatness control structure" can refer to every possible type of structure capable of generating a push or pull force on the electrostatic chuck 100 in a third direction DR3 by means of coupling to the upper surface portion 210 of the electrostatic chuck 100 and the reinforcing frame 200, to adjust the flatness of the electrostatic chuck 100. As used herein, the flatness control structure can encompass a broader concept than an actuator 300 activated by an electrical supply and can include manually operated mechanical devices.

[0053] By allowing the flatness of the electrostatic chuck 100 to be adjusted via actuator 300, flatness adjustment can be performed in the central region of the electrostatic chuck 100 even when the workspace is limited. For example, when manually adjusting the flatness of the electrostatic chuck 100, the limited space between the reinforcing frame 200 and the ceiling surface of the deposition chamber may make flatness adjustment in the central region of the electrostatic chuck 100 practically impossible. However, embodiments of this disclosure can mitigate or avoid this problem.

[0054] Actuator 300 may include a piezoelectric actuator having an adjustable length based on a power supply. When the length of the piezoelectric actuator increases, it can provide thrust on the electrostatic chuck 100, and when the length decreases, it can provide pull on the electrostatic chuck 100. The piezoelectric actuator can be miniaturized to minimize or eliminate interference with the arrangement of magnets 420 on the magnet plate 400. However, actuator 300 is not limited to this configuration and may alternatively include a small motor.

[0055] The magnet plate 400 is a device configured to tightly adhere the mask to the substrate using magnetic force, and can be positioned between the electrostatic chuck 100 and the upper surface portion 210 of the reinforcing frame 200 for vertical movement between the electrostatic chuck 100 and the upper surface portion 210 of the reinforcing frame 200. Therefore, compared to positioning the magnet plate 400 on the fourth surface 212 of the upper surface portion 210 of the reinforcing frame 200, tight adhesion between the mask and the substrate can be improved.

[0056] The magnet plate 400 may include a plate portion 410 and a magnet 420. The plate portion 410 may have a fifth surface 411 and a sixth surface 412. The fifth surface 411 may face the second surface 102 of the electrostatic chuck 100, and the sixth surface 412 may be the surface opposite to the fifth surface 411. The magnet 420 may be coupled to the fifth surface 411 of the plate portion 410. The magnet 420 may include a permanent magnet.

[0057] Figure 4 yes Figure 1 The diagram shows a plan view of the electrostatic chuck 100. For ease of understanding, the actuator 300 is also shown. Figure 4 As shown in the image.

[0058] refer to Figure 4 The electrostatic chuck 100 may have a peripheral region 102-3 and a central region 102-4 defined within the peripheral region 102-3. The peripheral region 102-3 may refer to an annular region that contacts (e.g., extends from) a first side 102-1 and a second side 102-2 of the second surface 102 of the electrostatic chuck 100. The central region 102-4 may refer to a rectangular region defined by the peripheral region 102-3 within the second surface 102 of the electrostatic chuck 100. The central region 102-4 may not contact (e.g., be spaced apart from) either the first side 102-1 or the second side 102-2. For clarity, the boundary between the peripheral region 102-3 and the central region 102-4 is indicated by a dashed line.

[0059] The actuator 300 may include a first actuator 310 and a second actuator 320. The first actuator 310 may be arranged in a ring shape along the peripheral region 102-3 of the electrostatic chuck 100. The second actuator 320 may be arranged within the central region 102-4 of the electrostatic chuck 100. Therefore, sagging problems that may occur as the size of the electrostatic chuck 100 increases can be solved and corrected.

[0060] Since the second actuator 320 is located in the central region 102-4, the actuators 300 can be arranged in a matrix form with at least three rows and three columns. For example, as Figure 4As shown, the actuator 300 can be arranged in a matrix form having four rows extending in the first direction DR1 and five columns extending in the second direction DR2. However, the arrangement of the actuator 300 is not limited to the example shown.

[0061] The second actuator 320 can be positioned between a pair of first actuators 310 along the first direction DR1, and between another pair of first actuators 310 along the second direction DR2.

[0062] Figure 5 yes Figure 1 The image shows a bottom view of a portion of the magnet plate 400. For ease of understanding, in... Figure 5 Actuator 300 is also shown in the image. (Reference) Figure 5 The plate portion 410 of the magnet plate 400 may be provided with through holes (e.g., openings) 413. Each of the through holes 413 may accommodate an actuator 300. Therefore, interference between the actuator 300 and the magnet plate 400 can be reduced or minimized. The through holes 413 may be arranged so as not to overlap with the magnet 420 in a plan view (e.g., offset from the magnet 420). In other words, the through holes 413 may be provided in a region in a plan view in which the magnet 420 is not positioned.

[0063] Figure 6 It is along Figure 2 The sectional view taken by line I-I' in the middle, and Figure 7 It is shown Figure 6 The diagram shows the permanent electromagnet 330 and the magnetic component 110 in a separated state. (Reference) Figure 6 and Figure 7 The electrostatic chuck assembly 10 may also include permanent electromagnets 330 and magnetic components 110. The permanent electromagnets 330 may be coupled to the ends of the actuator 300. Each of the permanent electromagnets 330 can switch to a magnetically on or magnetically off state each time power is supplied, and can remain in either the magnetically on or magnetically off state even after a power supply interruption.

[0064] For example, when a first power supply is applied, the permanent electromagnet 330 can enter a magnetically connected state that generates magnetic force, and the permanent electromagnet 330 can remain in the magnetically connected state even after the power supply is interrupted. Furthermore, when a second power supply is applied, the permanent electromagnet 330 can enter a magnetically disconnected state where the magnetic force is canceled, and the permanent electromagnet 330 can remain in the magnetically disconnected state even after the power supply is interrupted. Because the permanent electromagnet 330 is an existing device that includes both permanent magnets and electromagnets, it will not be described in further detail.

[0065] Magnetic component 110 can be coupled to electrostatic chuck 100. Magnetic component 110 can be detachably coupled to permanent electromagnet 330 by magnetic force provided by permanent electromagnet 330. For example, when permanent electromagnet 330 is in a magnetically connected state, magnetic component 110 can adhere to permanent electromagnet 330, and when permanent electromagnet 330 is in a magnetically disconnected state, magnetic component 110 can be easily detached from permanent electromagnet 330. Therefore, actuator 300 can be detachably coupled to electrostatic chuck 100 via permanent electromagnet 330 and magnetic component 110, thereby facilitating the attachment and disengagement of electrostatic chuck 100.

[0066] The diameter (or maximum width) D1 of the permanent electromagnet 330 can be larger than the diameter (or maximum width) D2 of the actuator 300. Considering the small spacing of the magnets 420, this allows the diameter (or maximum width) D2 of the actuator 300 to be reduced or minimized, while ensuring that the permanent electromagnet 330 has a sufficient diameter (or width) D1 to generate magnetic force, thereby maintaining the connection between the permanent electromagnet 330 and the magnetic component 110.

[0067] The second surface 102 of the electrostatic chuck 100 may be provided with a receiving hole (e.g., an opening) 102-5. Magnetic members 110 may be fixed to the bottom surface of the receiving hole 102-5. A permanent electromagnet 330 may be inserted into the receiving hole 102-5 and positioned on the magnetic member 110. The receiving hole 102-5 may be configured to guide the movement of the permanent electromagnet 330 in a third direction DR3 when inserted. Furthermore, the receiving hole 102-5 may reduce or minimize the external exposure of the surface of the permanent electromagnet 330, thereby reducing or minimizing the influence of the magnetic force generated by the permanent electromagnet 330 on the magnetic field generated by the magnet 420.

[0068] The diameter (or maximum width) D3 of the magnetic component 110 can be larger than the diameter (or maximum width) D1 of the permanent electromagnet 330. The magnetic component 110 can cover (or overlap with) the permanent electromagnet 330 in a plan view.

[0069] Each of the receiving holes 102-5 may include a lower region having a diameter (or maximum width) D3 that is substantially equal to the diameter (or maximum width) of the magnetic member 110 and an upper region having a diameter (or maximum width) D1 that is substantially equal to the diameter (or maximum width) of the permanent electromagnet 330.

[0070] Figure 8 and Figure 9 An aspect of an electrostatic chuck assembly 10 according to another embodiment is shown, and is related to... Figure 6 and Figure 7 Corresponding. Reference Figure 8 and Figure 9The electrostatic chuck assembly 10 may also include a first magnetic shielding cap 340 and a second magnetic shielding cap 120.

[0071] A first magnetic shielding cap 340 may be wound (or extended) around each of the permanent electromagnets 330, and may expose a first attachment surface 331 of each of the permanent electromagnets 330. The first attachment surface 331 of the permanent electromagnet 330 may be the surface facing the magnetic member 110. The first magnetic shielding cap 340 may be wound (or extended) around the top and all side surfaces of the permanent electromagnet 330. A second magnetic shielding cap 120 may be wound (or extended) around each of the magnetic members 110, and may expose a second attachment surface 111 of each of the magnetic members 110. The second attachment surface 111 of the magnetic member 110 may be the surface facing the permanent electromagnet 330. The second magnetic shielding cap 120 may be wound (or extended) around the bottom and all side surfaces of the magnetic member 110.

[0072] The first attachment surface 331 of the permanent electromagnet 330 can be adhered to the second attachment surface 111 of the magnetic member 110 by the magnetic force provided by the permanent electromagnet 330.

[0073] The first magnetic shielding cap 340 and the second magnetic shielding cap 120 may include magnetic shielding material. Magnetic shielding material can refer to a material capable of blocking or significantly reducing the propagation of magnetic force. Therefore, the influence of the magnetic force provided by the permanent electromagnet 330 on the magnetic field generated by the magnet 420 can be reduced or eliminated.

[0074] The diameter (or maximum width) D4 of the first magnetic shielding cap 340 can be larger than the diameter (or maximum width) D3 of the magnetic component 110. Therefore, the magnetic shielding effect can be further improved.

[0075] Figure 10 A deposition apparatus 1 according to an embodiment of the present disclosure is shown, and Figure 11 It shows Figure 10 The controller 60 of the deposition apparatus 1 shown. (Reference) Figure 10 and Figure 11 The deposition apparatus 1 according to embodiments of the present disclosure may include an electrostatic chuck assembly 10, a first transfer unit 11, a second transfer unit 12, a vacuum chamber 20, a deposition source 30, a pair of mask holders 40, a third transfer unit 41, a sensor 50, and a controller 60. However, the deposition apparatus 1 is not limited to including all of the components mentioned above, and in various embodiments, one or more of the components may be omitted.

[0076] The electrostatic chuck assembly 10 can be positioned above the deposition source 30 within the vacuum chamber 20. The substrate SUB can be attached to the electrostatic chuck 100 of the electrostatic chuck assembly 10 by electrostatic force. The substrate SUB can be, but is not limited to, a portion of the display panel, as described later. The substrate SUB can be supported at both ends by substrate supports before being attached to the electrostatic chuck assembly 10.

[0077] The electrostatic chuck assembly 10 can have a reference Figures 1 to 9 The same features are described, and therefore will not be described in more detail.

[0078] The first transfer unit 11 can be configured to move the electrostatic chuck 100 for transferring and / or aligning the substrate SUB. The first transfer unit 11 can be coupled to the upper surface portion 210 of the reinforcing frame 200. Therefore, the attachment and detachment of the electrostatic chuck 100 can be facilitated.

[0079] The second transfer unit 12 can be configured to move the magnet plate 400. For example, when the substrate SUB is attached to the electrostatic chuck 100 and lowered onto the mask M, the second transfer unit 12 can lower the magnet plate 400. Therefore, the mask M can be tightly adhered to the substrate SUB by the magnetic force provided by the magnet plate 400. The second transfer unit 12 can be operatively or structurally interlocked with the first transfer unit 11.

[0080] Vacuum chamber 20 provides a sealed internal space in which electrostatic chuck assembly 10, deposition source 30, and a pair of mask holders 40 are arranged. Vacuum pump 21 can be connected to vacuum chamber 20. Vacuum pump 21 can be configured to reduce the pressure inside vacuum chamber 20.

[0081] The deposition source 30 may be arranged within the vacuum chamber 20 and configured to supply deposition material into the vacuum chamber 20. The deposition source 30 may include a crucible, a heater, and a nozzle. The crucible may be configured to store the deposition material. The heater may be configured to heat the deposition material stored in the crucible. The nozzle may be configured to discharge vaporized deposition material from the crucible.

[0082] A pair of mask holders 40 may support the two ends (e.g., opposite ends) of a mask M positioned between a deposition source 30 and a substrate SUB. The pair of mask holders 40 may be spaced apart and separable, but are not limited thereto, but may also be joined to form a monolithic ring. For example, the pair of mask holders 40 may refer to two separate regions facing each other within a monolithic ring.

[0083] The mask M may include a mask frame MF and a mask sheet MS. The mask frame MF may have an annular shape. The mask sheet MS may include patterned holes (or patterned openings) through which deposited material can pass. The mask sheet MS may be fixed to the mask frame MF under tension.

[0084] The third transfer unit 41 may be configured to transfer a pair of mask holders 40 for the transfer and / or alignment of the mask M. In the illustrated embodiment, transfer units 11, 12, 41 may include transfer mechanisms commonly used in the deposition apparatus, such as UVW stages.

[0085] The electrostatic chuck 100 may overlap at least a portion of each of a pair of mask holders 40 in a plan view. For example, a single large-area electrostatic chuck 100 may be used instead of multiple small-area electrostatic chucks to improve substrate sag.

[0086] Sensor 50 can be configured to measure the distance between the electrostatic chuck 100 and the upper surface portion 210 of the reinforcing frame 200 on the third-direction DR3 for each of the actuators 300. For example, sensor 50 may include scales placed adjacent to actuator 300. In another embodiment, sensor 50 may be embedded within actuator 300. For example, if actuator 300 is a piezoelectric actuator, the piezoelectric actuator may include a built-in sensor 50 for measuring changes in length.

[0087] The controller 60 can be configured to individually control the power supply to each of the actuators 300 based on measurements from the sensor 50 to automatically adjust the flatness of the electrostatic chuck 100. Additionally, the controller 60 can be configured to control the first transfer unit 11, the second transfer unit 12, and the third transfer unit 41 according to a preset program based on various sensing information.

[0088] The controller 60 and / or any other related devices or components according to embodiments of the present disclosure described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, and / or suitable combinations of software, firmware, and hardware. For example, various components of the controller 60 can be formed on an integrated circuit (IC) chip or on a separate IC chip. Furthermore, various components of the controller 60 can be implemented on a flexible printed circuit film, tape-on-a-carrier package (TCP), printed circuit board (PCB), or formed on the same substrate as the controller 60. Additionally, various components of the controller 60 can be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions and interacting with other system components to perform the various functions described herein. The computer program instructions are stored in memory, which can be implemented in a computing device using standard memory devices such as, for example, random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media such as, for example, CD-ROMs, flash drives, etc. Furthermore, those skilled in the art should recognize that, without departing from the scope of this disclosure, the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed across one or more other computing devices.

[0089] Figure 12 and Figure 13 It is a comparison Figure 10 The diagram shows the flatness of the electrostatic chuck 100 in the electrostatic chuck assembly 10 before and after automatic flatness adjustment. For simplicity, in... Figure 12 and Figure 13 The magnet plate 400 is omitted from the text.

[0090] refer to Figure 12 The electrostatic chuck 100 may experience sagging due to its own weight before flatness adjustment. This sagging may be more pronounced when the electrostatic chuck 100 is a large-area electrostatic chuck. Furthermore, the sagging distance of the electrostatic chuck 100 in the second region A2 overlapping with the second actuator 320 in the plan view can be greater than the sagging distance of the electrostatic chuck 100 in the first region A1 overlapping with the first actuator 310 in the plan view. The sagging distances in these specific regions can be measured by corresponding sensors 50, and the controller 60 can individually control the power supply to each of the actuators 300 to compensate for the sagging distance.

[0091] refer to Figure 12 and Figure 13The controller 60 can be configured to perform automatic leveling adjustment of the electrostatic chuck 100 by using the actuator 300. The lifting height H2 of the second region A2 of the electrostatic chuck 100, controlled by the second actuator 320, can be greater than the lifting height H1 of the first region A1 of the electrostatic chuck 100, controlled by the first actuator 310.

[0092] Figures 14 to 16 This shows attachment and separation. Figure 10 A diagram illustrating the method of using the electrostatic chuck 100. (See reference) Figure 14 In the step of separating the reinforcing frame 200, the connecting portion 220 of the reinforcing frame 200 can be separated from the upper surface portion 210 by removing bolt B. Before this step, the permanent electromagnet 330 can be switched to a magnetically disconnected state.

[0093] In the step of switching the permanent electromagnet 330 to a magnetically disconnected state, electrical energy can be supplied to the permanent electromagnet 330 to switch each of the permanent electromagnets 330 from a magnetically connected state to a magnetically disconnected state. However, the method is not necessarily limited to this and can be applied in the steps of separating the reinforcing frame 200 and separating... Figure 16 The step of switching the permanent electromagnet 330 to a magnetically disconnected state is performed between the steps of the electrostatic chuck 100 shown.

[0094] refer to Figure 15 After the step of separating the reinforcing frame 200, the magnet plate 400 can be lifted. In the step of lifting the magnet plate 400, the magnet plate 400 can be raised. Therefore, when the electrostatic chuck 100 separates, interference with the magnet plate 400 can be reduced or minimized. However, the method is not necessarily limited to this, and the step of lifting the magnet plate 400 can be omitted or performed before the step of separating the reinforcing frame 200.

[0095] refer to Figure 16 In the step of separating the electrostatic chuck 100, the electrostatic chuck 100 can be released from the constraints of the actuator 300 and the upper surface portion 210 of the reinforcing frame 200. The attachment of the electrostatic chuck 100 can be performed by reversing the method for separating the electrostatic chuck 100 described above. Therefore, the time and labor required for operations such as replacement when the electrostatic chuck 100 is short-circuited are reduced.

[0096] Figure 17 This is a cross-sectional view showing a display panel DP manufactured using a deposition apparatus 1 according to an embodiment of the present disclosure. Reference Figure 17 The display panel DP may include a base substrate BS, a circuit layer CL, a display element layer EDL, and a packaging layer TFE.

[0097] The base substrate BS can be a component that provides a base surface on which circuit layers CL are disposed. The base substrate BS can include materials such as glass, ceramic, metal, or polymer resins such as polyimide. However, the base substrate BS is not limited to these and can be (or can include) inorganic layers, organic layers, and composite layers, and can be formed as a single layer or multiple layers.

[0098] The circuit layer CL can be disposed on the base substrate BS and can include pixel circuitry and signal wiring. The pixel circuitry can include pixel transistors configured to drive light-emitting diodes. Additionally, the circuit layer CL can include peripheral transistors located in the non-display area of ​​the display panel DP to output signals for controlling the pixel transistors of the pixel circuitry.

[0099] A display panel (DP) may have a display area and a non-display area defined therein. The display area is the area where an image is displayed, and the non-display area is the area surrounding the display area (e.g., extending around the perimeter of the display area) where no image is displayed.

[0100] Pixels configured to display an image can be arranged in the display area. Each pixel may include a light-emitting diode (LED) and pixel circuitry. The pixel circuitry can be configured to control the operation of the LED.

[0101] The display element layer (EDL) can be arranged on the circuit layer (CL) and can include light-emitting diodes (LEDs) ED1, ED2, ED3 and a pixel definition layer (PDL). Each of the LEDs ED1, ED2, ED3 can include a first electrode EL1, a hole function layer (HFL), an emitter layer (EML1, EML2, EML3), an electron function layer (EFL), and a second electrode EL2.

[0102] A pixel defining layer (PDL) can be disposed on the circuit layer CL to cover the area between the first electrodes EL1 in a planar view. The pixel defining layer (PDL) can be arranged to correspond to the non-emitting region NPA. The pixel defining layer (PDL) can define emitting regions PA1, PA2, PA3, and can separate light-emitting diodes ED1, ED2, ED3. The pixel defining layer (PDL) can include one or more organic insulating materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0103] The first electrode EL1 can be disposed on the circuit layer CL. The first electrode EL1 can be conductive and can be electrically connected to the pixel transistor to receive electrical signals.

[0104] The hole functional layer HFL can be configured to facilitate the movement of holes from the first electrode EL1 to the emitter layers EML1, EML2, and EML3, while the electron functional layer EFL can facilitate the movement of electrons from the second electrode EL2 to the emitter layers EML1, EML2, and EML3.

[0105] The hole functional layer (HFL) can be disposed between the first electrode EL1 and the emitter layers EML1, EML2, and EML3, and the electron functional layer (EFL) can be disposed between the second electrode EL2 and the emitter layers EML1, EML2, and EML3. However, the arrangement is not limited to this configuration, and the positions of the hole functional layer (HFL) and the electron functional layer (EFL) can be switched according to the polarity of the first electrode EL1 and the second electrode EL2.

[0106] As shown in the figure, the hole functional layer (HFL) and the electron functional layer (EFL) can be provided as common layers, but are not limited to this. However, one or both of the hole functional layer (HFL) and the electron functional layer (EFL) can be patterned to be arranged only within the openings (OH) defined in the pixel-defined layer (PDL).

[0107] The emission layers EML1, EML2, and EML3 can be arranged within the opening OH defined in the pixel definition layer PDL.

[0108] At least some of the emitting layers EML1, EML2, and EML3 can be configured to emit light within different wavelength ranges. For example, the emitting layer EML1 of the first light-emitting diode ED1 can be configured to emit red light, the emitting layer EML2 of the second light-emitting diode ED2 can be configured to emit green light, and the emitting layer EML3 of the third light-emitting diode ED3 can be configured to emit blue light. However, this disclosure is not limited to this configuration, and the emitting layers EML1 of the first light-emitting diode ED1, EML2 of the second light-emitting diode ED2, and EML3 of the third light-emitting diode ED3 can all be configured to emit light within the same wavelength range, such as blue light.

[0109] According to embodiments of the present disclosure, the emissive layers EML1, EML2, and EML3 can be formed using the deposition apparatus 1. However, the present disclosure is not limited to this configuration, and other layers of the display panel DP formed by the deposition process can also be formed using the deposition apparatus 1.

[0110] The second electrode EL2 can be disposed on the emitter layers EML1, EML2, and EML3. The second electrode EL2 can face the first electrode EL1. The second electrode EL2 can have an integral shape extending from the emitter regions PA1, PA2, and PA3 to the non-emitter region NPA. The second electrode EL2 can be a common electrode.

[0111] The encapsulation layer TFE can be disposed on the display element layer EDL and can be configured to protect the light-emitting diodes ED1, ED2, and ED3 of the display element layer EDL from moisture, oxygen, and / or foreign matter. The encapsulation layer TFE may include a glass substrate or a synthetic resin substrate. However, this disclosure is not limited to this configuration, and the encapsulation layer TFE can be an inorganic layer, an organic layer, or a stacked structure of inorganic and organic layers.

[0112] The embodiments of this disclosure have been described above; however, these embodiments are merely examples and are not intended to limit the scope of this disclosure. Those skilled in the art to which this disclosure pertains may make various modifications and alterations to the embodiments by adding, changing, deleting, or supplementing certain elements without departing from the scope of the technical concept set forth in the claims and their equivalents, and such modifications and alterations should also be considered within the scope of this disclosure.

Claims

1. An electrostatic chuck assembly, characterized in that, include: An electrostatic chuck has a first surface configured to attach a substrate and a second surface opposite to the first surface; A reinforcing frame has an upper surface portion and a connecting portion, wherein the upper surface portion is spaced apart from and faces the second surface of the electrostatic chuck, and the connecting portion connects the upper surface portion to the electrostatic chuck. as well as An actuator, coupled to the electrostatic chuck and the upper surface portion, is configured to generate a thrust or pull force on the electrostatic chuck along a third direction according to a power supply, the third direction intersecting a first direction and a second direction parallel to the second surface of the electrostatic chuck.

2. The electrostatic chuck assembly according to claim 1, characterized in that, The power supply to each of the actuators is individually controllable.

3. The electrostatic chuck assembly according to claim 1, characterized in that, Each of the actuators includes a piezoelectric actuator having a length that can be adjusted based on the power supply.

4. The electrostatic chuck assembly according to claim 1, characterized in that, The actuator includes: The first actuator is arranged in a ring shape along the peripheral region of the second surface; and A second actuator is disposed in the central region of the second surface defined by the peripheral region.

5. The electrostatic chuck assembly according to claim 4, characterized in that, The actuators are arranged in a matrix with at least three rows and three columns.

6. The electrostatic chuck assembly according to claim 4, characterized in that, The second surface has a first side extending in the first direction and a second side extending in the second direction intersecting the first direction, and Each of the second actuators is arranged in the first direction between a pair of first actuators from the first actuators, and in the second direction between another pair of first actuators from the first actuators.

7. The electrostatic chuck assembly according to claim 1, characterized in that, The actuator is detachably connected to the electrostatic chuck via a permanent electromagnet and magnetic components. The permanent electromagnet is connected to the corresponding end of the actuator, and The magnetic component is connected to the electrostatic chuck and is detachably connected to the permanent electromagnet by magnetic force provided by the permanent electromagnet.

8. The electrostatic chuck assembly according to claim 7, characterized in that, Also includes: A first magnetic shielding cap extends around each of the permanent electromagnets while exposing a first attachment surface of each of the permanent electromagnets; as well as A second magnetic shielding cap extends around each of the magnetic components, while simultaneously exposing a second attachment surface of each of the magnetic components. The first attachment surface of each of the permanent electromagnets and the second attachment surface of each of the magnetic components are arranged to face each other and are adhered together by magnetic force.

9. The electrostatic chuck assembly according to claim 1, characterized in that, It also includes a magnet plate configured to move vertically between the electrostatic chuck and the upper surface portion, the magnet plate comprising: The plate portion has a fifth surface facing the electrostatic chuck and a sixth surface opposite the fifth surface; and A magnet is attached to the fifth surface of the plate portion.

10. The electrostatic chuck assembly according to claim 9, characterized in that, The plate portion has a through hole for accommodating the actuator, and The through holes are arranged so that they do not overlap with the magnet in the plan view.

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