Wafer clamping device and semiconductor apparatus

Abstract

The utility model discloses a wafer clamping device and semiconductor equipment, including rotation drive component, rotary flange, lift stop component, chuck assembly, conduction baffle, ball head plunger and chuck, this structure meets the clamping of wafer, release and rotation operation, through setting up the chuck, chuck assembly, conduction baffle, ball head plunger, rotary flange, pivot as conductor and electric connection and ground simultaneously, can provide electrostatic discharge path for wafer, and the setting of conduction baffle and ball head plunger can ensure good contact, ensure the coherence of electrostatic discharge path. The utility model discloses a wafer clamping device and semiconductor equipment, need not introduce complex equipment to remove wafer static electricity effectively, thereby can reduce production cost, and can improve production efficiency and production yield.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment and relates to a wafer clamping device and semiconductor equipment. Background Technology

[0002] Wafer clamping devices are key devices used to hold and position wafers in the semiconductor manufacturing process. They use clamping force to hold the wafers to ensure stability and precision during manufacturing.

[0003] In the semiconductor device manufacturing process, the removal of static electricity from wafers is crucial. Excessive static electricity can lead to physical defects on the wafer, such as breakdown problems in the precision circuits on the wafer.

[0004] In semiconductor wet processing, there are two main scenarios that can cause electrostatic discharge (ESD) and form wafer physical defects: one is charge accumulation caused by previous processes, where the charge rapidly accumulates upon contact with the conductive chemical solution, leading to discharge damage; the other is interlayer discharge caused by the inherent limitations of the wet process itself, resulting in continuous charge accumulation on the wafer surface. Defects caused by ESD are mainly divided into general defects and non-visible defects. General defects can be measured by optical equipment, while non-visible defects can cause dielectric layer degradation and failure without significantly damaging the wafer surface morphology, or cause functional and uniformity problems in subsequent wafer surface treatments.

[0005] Therefore, it can be seen that static electricity on the wafer surface directly affects the wafer yield, but existing wafer clamping devices are difficult to effectively remove static electricity from the wafer surface.

[0006] Therefore, it is necessary to propose a wafer clamping device and semiconductor equipment. Utility Model Content

[0007] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a wafer clamping device and semiconductor equipment to solve the problem of removing static electricity from wafers in the prior art.

[0008] To achieve the above and other related objectives, this utility model provides a wafer clamping device, the wafer clamping device comprising:

[0009] A rotary drive assembly, comprising a rotary drive component and a rotating shaft, wherein the rotary drive component drives the rotating shaft to rotate.

[0010] A rotating flange, which is fixed on the rotating shaft and driven to rotate by the rotating shaft;

[0011] A lifting stop assembly, comprising a stop rod and a lifting drive component, wherein the lifting drive component drives the stop rod to move up and down;

[0012] A chuck assembly includes a housing, a chuck, and a telescopic traction member. The housing comprises a lower housing and an upper housing fixed to the lower housing. The lower housing is fixed to a rotating flange and rotates via the rotating flange. The lower housing has a receiving groove corresponding to a stop rod. The chuck is located between the lower housing and the upper housing and is movably connected to the upper housing via bearings. The chuck has a chuck limiting groove corresponding to the stop rod, and the chuck is limited by the lifting and lowering movement of the stop rod based on the lower housing receiving groove and the chuck limiting groove. One end of the telescopic traction member is connected to the chuck, and the other end is connected to the housing.

[0013] A conductive baffle, which is fixed to the chuck;

[0014] A ball-head plunger, which is fixed to the rotary flange, and the ball of the ball-head plunger is in contact with the conductive baffle.

[0015] A chuck is disposed on the housing and is correspondingly disposed with the chuck. The chuck drives the chuck to rotate and carry and clamp the wafer.

[0016] The chuck, the chuck plate, the conductive baffle, the ball plunger, the rotating flange, and the rotating shaft are all conductors, electrically connected, and grounded.

[0017] Optionally, the chuck drives the chuck head to rotate in a manner that includes gear transmission or linkage transmission.

[0018] Optionally, the telescopic traction element includes a spring or a cylinder.

[0019] Optionally, the telescopic traction member is connected to the lower housing and / or to the upper housing.

[0020] Optionally, it includes N card heads, where 3 ≤ N.

[0021] Optionally, the N card heads are distributed at equal intervals along the circumference.

[0022] Optionally, the transmission method of the rotary drive assembly includes bearing transmission, gear transmission, belt transmission, chain transmission, hydraulic transmission, or pneumatic transmission.

[0023] Optionally, the card head includes a card head with a card slot at the end or a card head with a card plate at the end.

[0024] Optionally, the housing is an insulating housing, wherein the upper housing includes a PVDF upper housing and the lower housing includes a PEEK lower housing.

[0025] This utility model also provides a semiconductor device, which includes any of the wafer clamping devices described above.

[0026] As described above, the wafer clamping device and semiconductor equipment of this utility model include a rotary drive assembly, a rotary flange, a lifting stop assembly, a chuck assembly, a conductive baffle, a ball plunger, and a chuck head. This structure satisfies the clamping, releasing, and rotating operations of the wafer. By setting the chuck head, chuck, conductive baffle, ball plunger, rotary flange, and rotating shaft as conductors and electrically connected and grounded, it can provide an electrostatic discharge path for the wafer. Furthermore, the arrangement of the conductive baffle and the ball plunger can ensure good contact and ensure the continuity of the electrostatic discharge path.

[0027] The wafer clamping device and semiconductor equipment of this invention can effectively remove static electricity from wafers without introducing complex equipment, thereby reducing production costs and improving production efficiency and yield. Attached Figure Description

[0028] Figure 1 The diagram shown is a cross-sectional view of the wafer clamping device in an embodiment of this utility model.

[0029] Figure 2 Displayed as Figure 1 A schematic diagram of the structure of region A in the middle.

[0030] Figure 3 The diagram shown is a bottom view of the chuck assembly after removing the lower housing in an embodiment of this utility model.

[0031] Figure 4 The diagram shown is a schematic diagram of a chuck structure with a chuck gear in an embodiment of this utility model.

[0032] Figure 5 The diagram shown is a schematic of a chuck head structure with a chuck head roller in an embodiment of this utility model.

[0033] Figure 6 The diagram shown is a structural schematic of the chuck roller and chuck slot in an embodiment of this utility model.

[0034] Explanation of reference numerals in the attached figures

[0035] 100 pivot 200 Rotary flange 300 Chuck assembly 310 case 311 upper shell 312 Lower housing 320 Chuck 321 Chuck limit slot 322 Chuck gear 323 chuck slot 330 bearings 331 Bearing inner ring pressure ring 332 Bearing outer ring pressure ring 340 Telescopic traction component 400 Conductive baffle 500 Ball head plunger 501 sphere 600 Card Header 601 chuck gear 602 chuck drive rod 603 chuck spindle 604 Card head support platform 605 Claw 606 Card head roller Detailed Implementation

[0036] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0037] Please see Figures 1-6 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0038] This embodiment provides a wafer clamping device, the wafer clamping device comprising:

[0039] A rotary drive assembly, comprising a rotary drive component (not shown) and a rotating shaft 100, wherein the rotary drive component drives the rotating shaft 100 to rotate.

[0040] A rotating flange 200 is fixed on the rotating shaft 100, and the rotating flange 200 is driven to rotate by the rotating shaft 100.

[0041] A lifting stop assembly (not shown) includes a stop rod and a lifting drive component, wherein the lifting drive component drives the stop rod to move up and down.

[0042] A chuck assembly 300 includes a housing 310, a chuck 320, and a telescopic traction member 340. The housing 310 includes a lower housing 312 and an upper housing 311 fixed to the lower housing 312. The lower housing 312 is fixed to a rotating flange 200, and the rotating flange 200 drives the lower housing 312 to rotate. The lower housing 312 has a lower housing receiving groove (not shown) corresponding to the stop rod. The chuck 320 is located within the lower housing 310. The chuck 320 is connected to the upper housing 311 via a bearing 330 and is movably connected to the upper housing 311. The chuck 320 is provided with a chuck limiting groove 321 corresponding to the stop rod. Based on the lower housing receiving groove and the chuck limiting groove 321, the chuck 320 is limited by the lifting and lowering movement of the stop rod. One end of the telescopic traction member 340 is connected to the chuck 320, and the other end of the telescopic traction member 340 is connected to the housing 310.

[0043] Conductive baffle 400, which is fixed to the chuck 320;

[0044] A ball plunger 500 is fixed to the rotary flange 200, and the ball ball 501 of the ball plunger 500 is in contact with the conductive baffle 400.

[0045] A chuck head 600 is disposed on the housing 310 and is correspondingly disposed with the chuck 320. The chuck head 600 is driven to rotate by the chuck 320 to carry and clamp the wafer.

[0046] The chuck head 600, the chuck 320, the conductive baffle 400, the ball plunger 500, the rotating flange 200, and the rotating shaft 100 are all conductors, electrically connected, and grounded.

[0047] The wafer clamping device of this embodiment provides an electrostatic discharge path for the wafer by setting the chuck 600, chuck 320, conductive baffle 400, ball plunger 500, rotating flange 200, and rotating shaft 100 as conductors, electrically connected and grounded. The conductive baffle 400 and the ball plunger 500 are designed to ensure good contact and the continuity of the electrostatic discharge path.

[0048] The wafer clamping device of this invention can effectively remove static electricity from wafers without introducing complex equipment, thereby reducing production costs and improving production efficiency and yield.

[0049] As an example, the housing 310 is an insulating housing, wherein the upper housing 311 comprises a polyvinylidene fluoride (PVDF) upper housing and the lower housing 312 comprises a polyether ether ketone (PEEK) lower housing.

[0050] Specifically, the housing 310 provides a cavity for mounting components to protect them from damage caused by cleaning fluids. Since the upper housing 311 may come into contact with corrosive liquids such as acids, in this embodiment, the upper housing 311 is preferably made of PVDF to improve acid resistance. To improve the mechanical properties of the lower housing 312, the lower housing 312 is preferably made of PEEK, but the choice of materials for the upper housing 311 and the lower housing 312 is not limited to these.

[0051] As an example, the transmission method of the rotary drive assembly includes bearing drive, gear drive, belt drive, chain drive, hydraulic drive, or pneumatic drive.

[0052] For details, please refer to Figure 1 In this embodiment, the rotating shaft 100 is located at the center of the rotary drive assembly. The rotating drive component can drive the rotating shaft 100 to rotate, providing the power required for rotation. The rotary drive assembly can be, for example, a motor. In this embodiment, the rotary drive assembly serves as both a rotational power source for the wafer during processing and a drive for clamping and releasing the wafer, enabling simultaneous clamping and releasing operations of each of the chucks 600. The transmission method of the rotary drive assembly can include bearing drive, gear drive, belt drive, chain drive, hydraulic drive, or pneumatic drive, and can be selected according to specific needs.

[0053] Among them, see Figure 1 The rotating flange 200 can be fixed to the rotating shaft 100 by means of bolts, so that the rotation of the rotating shaft 100 can drive the rotating flange 200 to rotate synchronously. It should be noted that the rotating flange 200 is provided with a groove for accommodating the ball plunger 500, so as to facilitate the installation and adjustment of the ball plunger 500.

[0054] See Figure 1 The lower housing 312 can be fixed to the rotating flange 200 by means of bolts, so that the rotation of the rotating flange 200 drives the lower housing 312 to rotate synchronously. The upper housing 311 can be fixed to the lower housing 312 by means of bolts.

[0055] See Figure 1 and Figure 2 The chuck 320 is disposed between the upper housing 311 and the lower housing 312, and the chuck 320 is fixed to the upper housing 311 by a bearing 330 and is movably connected to the upper housing 311 to ensure that the chuck 320 and the upper housing 311 can generate relative rotational offset.

[0056] For details regarding the fixing method of the chuck 320, please refer to [link / reference needed]. Figure 2 In this embodiment, the chuck 320 is provided with a receiving groove for the bearing 330, and the inner ring of the bearing 330 can be fixed by the bearing inner ring pressure ring 331 fixedly connected to the upper housing 311, and the outer ring of the bearing can be fixed by the bearing outer ring pressure ring 332. Thus, the chuck 320 can be fixed to the upper housing 311 by the bearing 330 and is movably connected to the upper housing 311, so that the chuck 320 and the upper housing 311 can meet the rotational offset caused by the change of angle when performing wafer clamping and release operations. The fixing method of the chuck 320, the bearing 330 and the upper housing 311 is not limited to this.

[0057] Among them, see Figure 2 The conductive baffle 400 is fixed to the chuck 320 to ensure the connection and synchronous operation of the conductive baffle 400 and the chuck 320. It should be noted that... (See also...) Figure 2 The upper and lower surfaces of the chuck 320 and the conductive baffle 400 are separated from the upper housing 311 and the lower housing 312. Only the end of the chuck 320 contacts the chuck head 600 for transmission, thereby driving the chuck head 600 to run. The end of the conductive baffle 400 contacts the ball 501 of the ball plunger 500 for electrostatic transmission.

[0058] Among them, see Figure 3 The chuck 320 is provided with a chuck limiting groove 321 corresponding to the stop rod. Since the chuck 320 is located above the lower housing 312, it can be understood that the lower housing 312 also needs to be provided with a lower housing receiving groove corresponding to the stop rod. Based on the setting of the lower housing receiving groove and the chuck limiting groove 321, when wafer clamping and release operations are required, the chuck 320 can be limited by the lifting and lowering movement of the stop rod. The space of the lower housing receiving groove needs to be larger than the chuck limiting groove 321 to ensure that the housing 310 can rotate relative to the chuck 320.

[0059] In this embodiment, the lifting stop assembly is not illustrated. The lifting stop assembly should at least include the stop rod and the lifting drive component, so that the stop rod can be driven to move up and down by the lifting drive component. The specific structure and position of the lifting stop assembly can be selected as needed, and no excessive restrictions are imposed here.

[0060] Among them, see Figure 3 In this embodiment, the chuck 320 drives the chuck head 600 to rotate via gear transmission, but it is not limited to this method. Figure 6 In another embodiment, the chuck 320 can drive the chuck head 600 to rotate, which will not be described here.

[0061] Among them, see Figure 3 and Figure 4In this embodiment, the chuck 600 includes a chuck gear 601, a chuck transmission rod 602, a chuck rotating shaft 603, a chuck support platform 604, and chuck jaws 605. The chuck gear 601 and the chuck rotating shaft 603 are respectively disposed at opposite ends of the chuck transmission rod 602. The chuck support platform 604 and the chuck jaws 605 are located at the end of the chuck rotating shaft 603 away from the chuck transmission rod 602. The chuck support platform 604 and the chuck jaws 605 are located above the upper housing 311. The chuck support platform 604 is used to support the wafer, and the chuck jaws 605 are disposed on the side of the chuck support platform 604 to clamp the wafer. The chuck gear 601 and the chuck transmission rod 602 are located between the upper housing 311 and the lower housing 312, thereby enabling gear transmission between the chuck gear 601 and the chuck gear 322 on the chuck 320.

[0062] In this embodiment, N clamping heads 600 are included, wherein preferably 3 ≤ N, such as N being 3, 4, 5, 6, etc., and preferably the N clamping heads 600 are distributed at equal intervals along the circumference, so that the wafer clamped by the clamping heads 600 is subjected to uniform force, thereby avoiding the risk of wafer fragmentation due to uneven force. The specific value of N is not excessively limited here.

[0063] Wherein, as needed, the jaw 605 may include a jaw with a slot at its end or a jaw with a plate at its end, so as to limit the wafer by means of the slot or plate. In this embodiment, a slot-type jaw with a relatively simple structure is used, but the types of jaws 605 are not limited to this.

[0064] In this embodiment, the card holder 604 is preferably conical. The inclined conical surface of the card holder 604 can contact the edge of the wafer, so that the wafer can be supported by the multiple card holders 604, making the wafer suspend. The inclined conical surface can avoid friction on the back of the wafer when the card holders 604 rotate, thereby avoiding damage to the back of the wafer.

[0065] See Figure 3 and Figure 4 When the chuck gear 601 rotates under the meshing action of the chuck gear 322, the chuck transmission rod 602 rotates and swings, thereby causing the chuck shaft 603 connected to the other end of the chuck transmission rod 602, the chuck support platform 604 located at the end of the chuck shaft 603, and the chuck jaws 605 to rotate synchronously. Thus, the chuck jaws 605 can be used to clamp and release the wafer located on the chuck support platform 604.

[0066] See Figure 3In this embodiment, the telescopic traction member 340 is a spring, but the types of the telescopic traction member 340 are not limited to this, such as a cylinder, etc., and no excessive limitation is made here.

[0067] The following describes the operation of the wafer clamping device, specifically including:

[0068] When wafer loading or unloading is required, the stop cylinder pushes the stop rod upward. At this time, the stop rod passes through the lower housing receiving groove and then inserts into the chuck limiting groove 321, thereby preventing the chuck 320 from rotating. Then, the rotating shaft 100 rotates, causing the lower housing 312 and the upper housing 311 to rotate synchronously. The chuck 320, located between the lower housing 312 and the upper housing 311, remains stationary because it is blocked by the stop rod. When the spring is in a stretched state, an offset angle will be generated between the upper housing 311 and the chuck 320. The ball 501 will slide along the conductive baffle 400 to ensure good contact. The chuck gear 601 can rotate along the chuck gear 322 under the drive of the upper housing 311. As a result, the chuck support platform 604 and the chuck claw 605 located above the upper housing 311 will swing. The opening and closing size of the chuck claw 605 is just right for the wafer to be put in or taken out.

[0069] When it is necessary to clamp the wafer, the stop rod is pulled back downward under the drive of the stop cylinder, and the telescopic traction member 340 keeps the chuck 320 and the housing 310 relatively stationary. According to the process requirements, the rotating shaft 100 starts to rotate at high speed. Driven by the rotating shaft 100, the chuck assembly 300 and the chuck head 600 that clamps the wafer operate synchronously.

[0070] In this embodiment, the chuck head 600, the chuck 320, the conductive baffle 400, the ball plunger 500, the rotary flange 200, and the rotating shaft 100 are all conductors, electrically connected, and grounded. For example, by grounding the rotating shaft 100, a structure can be formed as follows... Figure 1 The red dashed line indicates the electrostatic discharge path, which releases static electricity from the wafer, thereby preventing damage to the delicate circuits on the wafer caused by static electricity.

[0071] In this embodiment, the card head 600 is a PFA-CF card head, which is made of a high-performance material composed of polytetrafluoroethylene (PFA) and carbon fiber (CF). It has the characteristics of conductivity, high temperature resistance and corrosion resistance, but the types of card heads 600 are not limited to this.

[0072] The chuck 320, the conductive baffle 400, the ball plunger 500, the rotary flange 200, the rotating shaft 100, and connecting parts such as the bearing outer ring pressure ring 332 and bolts along the electrostatic transmission path can all be made of conductive metals, such as stainless steel. Components can be made of materials such as 304 stainless steel or 316L stainless steel, depending on the requirements.

[0073] See Figure 5 and Figure 6 In another embodiment, the chuck 320 can drive the chuck head 600 to rotate using a linkage transmission, which can... Figure 3 The chuck 320 with the chuck gear 322 shown is replaced with a chuck having a chuck slot 323, while... Figure 3 and Figure 4 The chuck 600 with the chuck gear 601 is replaced with a chuck with a chuck roller 600, and the chuck roller 600 is correspondingly set with the chuck groove 323 so that the chuck groove 323 can lock the chuck roller 600, so that the chuck 320 drives the chuck 600 to rotate through the linkage transmission.

[0074] This embodiment also provides a semiconductor device, which includes any of the wafer clamping devices described above. The type of semiconductor device is not excessively limited here, and may include, for example, a single-sided wafer cleaning device or a double-sided wafer cleaning device.

[0075] In summary, the wafer clamping device and semiconductor equipment of this utility model include a rotary drive assembly, a rotary flange, a lifting stop assembly, a chuck assembly, a conductive baffle, a ball plunger, and a chuck head. This structure satisfies the clamping, releasing, and rotating operations of the wafer. By setting the chuck head, chuck, conductive baffle, ball plunger, rotary flange, and rotating shaft as conductors and electrically connected and grounded, it can provide an electrostatic discharge path for the wafer. Furthermore, the arrangement of the conductive baffle and the ball plunger ensures good contact and the continuity of the electrostatic discharge path.

[0076] The wafer clamping device and semiconductor equipment of this invention can effectively remove static electricity from wafers without introducing complex equipment, thereby reducing production costs and improving production efficiency and yield.

[0077] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer clamping device, characterized in that, The wafer clamping device includes: A rotary drive assembly, comprising a rotary drive component and a rotating shaft, wherein the rotary drive component drives the rotating shaft to rotate. A rotating flange, which is fixed on the rotating shaft and driven to rotate by the rotating shaft; A lifting stop assembly, comprising a stop rod and a lifting drive component, wherein the lifting drive component drives the stop rod to move up and down; A chuck assembly includes a housing, a chuck, and a telescopic traction member. The housing comprises a lower housing and an upper housing fixed to the lower housing. The lower housing is fixed to a rotating flange and rotates via the rotating flange. The lower housing has a receiving groove corresponding to a stop rod. The chuck is located between the lower housing and the upper housing and is movably connected to the upper housing via bearings. The chuck has a chuck limiting groove corresponding to the stop rod, and the chuck is limited by the lifting and lowering movement of the stop rod based on the lower housing receiving groove and the chuck limiting groove. One end of the telescopic traction member is connected to the chuck, and the other end is connected to the housing. A conductive baffle, which is fixed to the chuck; A ball-head plunger, which is fixed to the rotary flange, and the ball of the ball-head plunger is in contact with the conductive baffle. A chuck is disposed on the housing and is correspondingly disposed with the chuck. The chuck drives the chuck to rotate and carry and clamp the wafer. The chuck, the chuck plate, the conductive baffle, the ball plunger, the rotating flange, and the rotating shaft are all conductors, electrically connected, and grounded.

2. The wafer clamping device according to claim 1, characterized in that: The chuck drives the chuck head to rotate in either a gear drive or a linkage drive.

3. The wafer clamping device according to claim 1, characterized in that: The telescopic traction component includes a spring or a cylinder.

4. The wafer clamping device according to claim 1, characterized in that: The telescopic traction member is connected to the lower housing and / or to the upper housing.

5. The wafer clamping device according to claim 1, characterized in that: It includes N card heads, where 3 ≤ N.

6. The wafer clamping device according to claim 5, characterized in that: The N card heads are distributed at equal intervals along the circumference.

7. The wafer clamping device according to claim 1, characterized in that: The transmission methods of the rotary drive assembly include bearing transmission, gear transmission, belt transmission, chain transmission, hydraulic transmission, or pneumatic transmission.

8. The wafer clamping device according to claim 1, characterized in that: The card head includes a card head with a card slot at the end or a card head with a card plate at the end.

9. The wafer clamping device according to claim 1, characterized in that: The housing is an insulating housing, wherein the upper housing includes a PVDF upper housing and the lower housing includes a PEEK lower housing.

10. A semiconductor device, characterized in that: The semiconductor device includes the wafer clamping device according to any one of claims 1 to 9.

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