Clamp and wafer holding device

Abstract

The utility model discloses a kind of clamp and wafer fixing device, clamp includes clamp body, buffer layer, adhesive layer and fastener;Clamp body has clamping surface;Adhesive layer is located between clamping surface and buffer layer to connect buffer layer on clamping surface;Fastener is located on clamp body and is used to apply towards the fastening force of clamping surface to buffer layer.Through the double connection structure of setting adhesive layer and fastener, both utilize adhesive layer to ensure the uniformity of buffer layer and clamping surface adhesion, also effectively reduce the risk of wafer fixing device holding force imbalance due to buffer layer separation by means of fastener, and then reduce the probability of wafer drop damage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor substrate material manufacturing technology, and in particular to a fixture and wafer fixing device. Background Technology

[0002] Germanium is an important strategic resource, widely used in semiconductors, aerospace, fiber optic communications, infrared optics, solar cells, chemical catalysts, and biomedicine. Germanium possesses excellent semiconductor properties; high-purity single-element germanium can be used to manufacture semiconductor devices such as transistors, diodes, and triodes. It also has a high refractive index, is transparent to infrared light but opaque to visible and ultraviolet light, making it suitable for use as prisms and lenses that transmit infrared light. Germanium dioxide has high refractive index and low dispersion, making it particularly suitable for use in the manufacture of wide-angle lenses, microscopes, and optical fibers. Simultaneously, germanium dioxide is an important infrared optical material, used to create lens coatings for thermal imaging cameras, and applied in military, automotive night vision systems, and microscope spectrometers. In addition, germanium compounds are used to manufacture fluorescent panels and various high-refractive-index glasses; germanium and niobium compounds are superconducting materials; and germanium trichloride is an additive in novel optical fiber materials. Germanium has wide applications in emerging industrial fields with high technological content and high added value. In the germanium wafer cleaning process, germanium wafers need to be held in place using germanium wafer clamps.

[0003] In related technologies, the adhesive pads on germanium wafer clamps are bonded to the clamp body. However, during the cleaning process, the cleaning solution can easily corrode the adhesive, causing the bond between the adhesive pads and the clamp body to weaken. This not only easily leads to a loosening of the clamping force but can even cause the wafer to fall off and break. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide a clamp that applies a fastening force towards the clamping surface to the buffer layer using fasteners, thereby improving the stability and reliability of the connection between the buffer layer and the clamp body.

[0005] This utility model also proposes a wafer fixing device.

[0006] A first aspect of this utility model provides a clamp, which includes a clamp body, a buffer layer, an adhesive layer, and fasteners; the clamp body has a clamping surface; the adhesive layer is disposed between the clamping surface and the buffer layer to connect the buffer layer to the clamping surface; the fasteners are disposed on the clamp body and are used to apply a clamping force toward the clamping surface to the buffer layer.

[0007] In some embodiments, the fasteners include a plurality of fasteners spaced at a center interval around the clamping surface.

[0008] In some embodiments, the fastener includes a connecting arm and a hook, the hook being connected to the clamp body via the connecting arm and used to apply an elastic force toward the clamping surface to the buffer layer.

[0009] In some embodiments, the buffer layer includes an elastic pad and two mounting sides protruding from opposite sides of the elastic pad; the clamp body is provided with two sets of fasteners corresponding to the positions of the mounting sides, and each set of fasteners includes at least two fasteners spaced apart.

[0010] In some embodiments, the mounting side extends approximately along the long axis direction parallel to the clamping surface, and the length of the mounting side is less than the spacing distance between the connecting arms of the first and last fasteners in the group along the long axis direction, such that a drainage groove is formed between the mounting side and the connecting arm.

[0011] In some embodiments, the connecting arms of the first and last fasteners in each set of fasteners are arranged opposite to each other, and the distance between the two connecting arms in the long axis direction gradually decreases in the short axis direction perpendicular to the long axis direction and away from the adhesive layer.

[0012] In some embodiments, the clamp further includes a pressing portion that abuts against the hook and the mounting side, wherein the minimum distance between the inner surface of the hook and the clamping surface in a direction perpendicular to the clamping surface is less than the sum of the dimension of the pressing portion in that direction and the thickness of the mounting side.

[0013] In some embodiments, the elastic pad and the hook are flush with each other on the side opposite to the clamping surface.

[0014] In some embodiments, the clamp body is further provided with a drainage channel, one end of which passes through the clamping surface and the other end of which passes through the side of the clamp body perpendicular to the clamping surface.

[0015] A first aspect of this utility model provides a wafer fixing device, including at least two clamps as described in the first aspect of this utility model, wherein the clamping surfaces of the two clamps move toward each other to clamp the wafer.

[0016] As can be seen from the technical solution, the embodiments provided by this utility model have the following advantages:

[0017] By setting up a dual connection structure of adhesive layer and fasteners, the adhesive layer ensures the uniformity of the fit between the buffer layer and the clamping surface, while the fasteners effectively reduce the risk of unbalanced holding force of the wafer fixing device caused by the separation of the buffer layer, thereby reducing the probability of wafer falling and being damaged. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an exploded view of the clamp according to an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram showing the connection between the clamp body and the fastener according to an embodiment of the present utility model;

[0021] Figure 3 This is an exploded view of the clamp according to an embodiment of the present utility model;

[0022] Figure 4 This is a cross-sectional view of the clamp body according to an embodiment of the present utility model;

[0023] Figure 5 This is an exploded view of the fixture according to an embodiment of the present utility model.

[0024] Figure label:

[0025] Fixture 100;

[0026] Fixture body 1, clamping surface 11, drainage channel 12;

[0027] Buffer layer 2, elastic pad 21, mounting side 22;

[0028] Fastener 3, first fastener group 301, second fastener group 302, connecting arm 31, hook 32;

[0029] Pressing part 4, first pressing part 41, second pressing part 42;

[0030] L along the major axis. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] The following is for reference. Figures 1-5 The present invention describes a clamp 100 and a wafer fixing device according to an embodiment of the present invention.

[0035] like Figure 1 As shown, a first aspect embodiment of the present invention provides a clamp 100, which includes a clamp body 1, a buffer layer 2, an adhesive layer, and a fastener 3. The clamp body 1 has a clamping surface 11. The adhesive layer is disposed between the clamping surface 11 and the buffer layer 2 to connect the buffer layer 2 to the clamping surface 11. The fastener 3 is disposed on the clamp body 1, and the fastener 3 can apply a tightening force toward the clamping surface 11 to the buffer layer 2.

[0036] In a specific application scenario, two clamps 100 are used together, with their clamping surfaces 11 moving towards each other to clamp the wafer. A buffer layer 2 is connected to the clamping surfaces 11 via an adhesive layer, which effectively reduces the contact stiffness when the clamps 100 contact the wafer, thereby reducing impact on the wafer. It is worth noting that if the cleaning solution flows into the adhesive layer during wafer cleaning, it can easily lead to adhesive layer failure.

[0037] In this application, by setting an adhesive layer, the buffer layer 2 is made to fit tightly against the clamping surface 11, reducing the local loose connection between the two and improving the uniformity of the overall force on the buffer layer 2; at the same time, by setting a fastener 3, the fastener 3 can continuously apply a fastening force toward the clamping surface 11 to the buffer layer 2, so that even if the adhesive layer fails due to cleaning fluid corrosion or other reasons, the buffer layer 2 can still be firmly fixed on the clamping surface 11.

[0038] In summary, the advantages of this utility model embodiment are as follows: by setting a dual connection structure of adhesive layer and fastener 3, the adhesive layer ensures the uniformity of the fit between the buffer layer 2 and the clamping surface 11, and the fastener 3 effectively reduces the risk of unbalanced holding force of the wafer fixing device caused by the separation of the buffer layer 2, thereby reducing the probability of the wafer falling and being damaged.

[0039] like Figure 2 As shown, there are multiple fasteners 3, which are spaced apart around the center of the clamping surface 11. This allows for the application of a fastening force toward the clamping surface 11 to the buffer layer 2 from different directions, thereby further improving the stability and reliability of the connection between the buffer layer 2 and the clamp body 1.

[0040] The center of the clamping surface 11 here refers to the geometric center of the clamping surface 11.

[0041] Alternatively, the clamping surface 11 can be an ellipse, with the center of the clamping surface 11 being the center of the circle. In this case, multiple fasteners 3 are arranged around the center, which may be one fastener 3 every 90 degrees in the circumferential direction.

[0042] Optionally, the clamping surface 11 can be a rectangle, with the center of the rectangle being the intersection of the two diagonals. Then, a fastener 3 is provided at each of the four corners of the rectangle, and the distances of these four fasteners 3 from the center are approximately equal, forming a symmetrical distribution; or, a fastener 3 can be provided at the midpoint of each side.

[0043] like Figure 3 As shown, the fastener 3 further includes a connecting arm 31 and a hook 32. The hook 32 is connected to the clamp body 1 via the connecting arm 31 and is used to apply an elastic force toward the clamping surface 11 to the buffer layer 2.

[0044] Example 2

[0045] like Figure 3 As shown, the fastener 3 further includes a connecting arm 31 and a hook 32. The hook 32 is connected to the clamp body 1 through the connecting arm 31 and can apply an elastic force toward the clamping surface 11 to the buffer layer 2.

[0046] Combination Figure 3Furthermore, the buffer layer 2 includes an elastic pad 21 and two mounting sides 22. The two mounting sides 22 protrude from opposite sides of the elastic pad 21, for example, one mounting side 22 protrudes from the front of the elastic pad 21, and the other mounting side 22 protrudes from the rear of the elastic pad 21; or, for example, one mounting side 22 protrudes from the left side of the elastic pad 21, and the other mounting side 22 protrudes from the right side of the elastic pad 21. The clamp body 1 is provided with two sets of fasteners 3, namely a first fastener set 301 and a second fastener set 302. The first fastener group 301 includes at least two fasteners 3 spaced apart, and the second fastener group 302 includes at least two fasteners 3 spaced apart. The first fastener group 301 is positioned corresponding to one mounting side 22, and the second fastener group 302 is positioned corresponding to the other mounting side 22. The hook 32 in the first fastener group 301 abuts one mounting side 22 against the clamping surface 11, and the hook 32 in the second fastener group 302 abuts the other mounting side 22 against the clamping surface 11.

[0047] This means that the elastic pad 21 provides cushioning when clamping the wafer. By separating the elastic pad 21 from the mounting side 22, the fasteners 3 are prevented from directly acting on the elastic pad 21, thus avoiding deformation of the elastic pad 21 and improving its cushioning effect. Furthermore, each set of at least two spaced fasteners 3 forms multi-point constraints on a single mounting side 22, preventing localized warping of the mounting side 22 due to uneven force. Simultaneously, the two mounting sides 22 are secured by two sets of fasteners (301, 302), further enhancing the stability and reliability of the connection between the buffer layer 2 and the fixture body 1.

[0048] Combination Figure 3 and Figure 4 As shown, the mounting side 22 extends approximately along the long axis direction L parallel to the clamping surface 11, and the length of the mounting side 22 is less than the distance between the connecting arms 31 of the first and last fasteners 3 in the long axis direction L, so that a drainage groove is formed between the mounting side 22 and the connecting arm 31.

[0049] For example, the clamping surface 11 is rectangular.

[0050] This means that, for a mounting side 22 and a first fastener group 301, the mounting side 22 extends along the long axis direction L of the clamping surface 11, and the first fastener group 301 has at least two fasteners 3 spaced apart along the long axis direction L of the clamping surface 11. On the first and last fasteners 3 along the long axis direction L, the distance between the connecting arm 31 of the first fastener 3 and the connecting arm 31 of the last fastener 3 is L1, and the extension length of the mounting side 22 along the long axis direction L is L2. Since L2 is less than L1, when the mounting side 22 is installed between the first and last fasteners 3 along the long axis direction L, there is a gap between the end of the mounting side 22 and the connecting arm 31 along the long axis direction L. This gap can guide the cleaning fluid on the adhesive layer to flow out, reducing the accumulation of cleaning fluid at the adhesive layer.

[0051] For the other mounting side 22 and the second fastener group 302, the other mounting side 22 also extends along the long axis direction L of the clamping surface 11. The second fastener group 302 also has at least two fasteners 3 spaced apart along the long axis direction L of the clamping surface 11. In the long axis direction L, the distance between the connecting arm 31 of the first fastener 3 and the connecting arm 31 of the last fastener 3 in the second fastener group 302 is L3. The extension length of the other mounting side 22 in the long axis direction L is L4, and L4 is less than L3. Therefore, in the long axis direction L, when the other mounting side 22 is installed between the first fastener 3 and the last fastener 3 of the second fastener group 302, there is also a gap between the end of the mounting side 22 in the long axis direction L and the connecting arm 31 of the second fastener group 302. This gap can also guide the cleaning fluid on the adhesive layer to flow out, reducing the accumulation of cleaning fluid at the adhesive layer.

[0052] Combination Figure 3 and Figure 4 As shown, further, the connecting arms 31 of the first and last fasteners in each set of fasteners are arranged opposite each other, and the distance between them gradually decreases along the short axis direction perpendicular to the long axis direction L and on the side away from the adhesive layer.

[0053] Here, both the major axis and the minor axis are parallel to the plane containing the clamping surface 11.

[0054] This means that an installation side 22 extends along the long axis L of the clamping surface 11, and the first fastener group 301 has at least two fasteners 3 spaced apart along the long axis L, with the first fastener 3 and the last fastener 3 located at both ends of the long axis L, each with a connecting arm 31 (i.e., the first connecting arm 31 and the last connecting arm 31). The first connecting arm 31 and the last connecting arm 31 are inclined relative to each other, roughly in a V-shape, with the smaller opening of the V-shape away from the adhesive layer and the larger opening close to the adhesive layer. This change in spacing allows the first and last connecting arms 31 to gradually transition from a wide spacing close to the adhesive layer to a narrow spacing away from the adhesive layer, facilitating the extraction of cleaning fluid.

[0055] Another mounting side 22 also extends along the long axis L of the clamping surface 11. The second fastener group 302 also has at least two fasteners 3 spaced apart along the long axis L. The first fastener 3 and the tail fastener 3 located at both ends of the long axis L each have a connecting arm 31 (i.e., the first connecting arm 31 and the tail connecting arm 31). The first connecting arm 31 and the tail connecting arm 31 are also relatively inclined, forming an overall shape roughly like the number eight. The side closer to the adhesive layer has a larger opening in the number eight shape, and the distance between the two connecting arms 31 is relatively wide. The side away from the adhesive layer has a smaller opening in the number eight shape, and the distance between the two connecting arms 31 is relatively narrow, which facilitates the discharge of cleaning fluid.

[0056] like Figure 3 As shown, the clamp 100 further includes a pressing part 4, which abuts against the hook 32 and the mounting side 22. The minimum distance between the inner surface of the hook 32 and the clamping surface 11 in the direction perpendicular to the clamping surface 11 is H1. The dimension of the pressing part 4 in the direction perpendicular to the clamping surface 11 is H2, and the dimension of the mounting side 22 in the direction perpendicular to the clamping surface 11 is H3, and H1 < H2 + H3. It should be noted that in order for the hook 32 to act on the mounting side 22 through the pressing part 4, before installing the pressing part 4, H1, H2, and H3 need to satisfy H1 < H2 + H3, thereby further improving the stability and reliability of the connection between the buffer layer 2 and the clamp body 1.

[0057] In a specific example, the mounting side 22 and the elastic pad 21 have different dimensions in the direction perpendicular to the clamping surface 11. The dimension of the mounting side 22 in the direction perpendicular to the clamping surface 11 is smaller than the minimum distance between the inner surface of the hook 32 and the clamping surface 11 in the direction perpendicular to the clamping surface 11. At the same time, the dimension of the pressing part 4 in the direction perpendicular to the clamping surface 11 is smaller than the minimum distance between the inner surface of the hook 32 and the clamping surface 11 in the direction perpendicular to the clamping surface 11, i.e., H1 > H2 and H1 > H3. Based on the above embodiments, it can be seen that the V-shaped structure of the connecting arm 31 facilitates the insertion of the pressing part 4 from the wide-spacing end, while also providing a tighter constraint on the pressing part 4 through the narrow-spacing end, preventing the pressing part 4 from shifting in the short axis direction.

[0058] For example, the pressing part 4 includes an integrally formed first pressing part 41 and a second pressing part 42. The first pressing part 41 abuts against the hook 32, and the second pressing part 42 abuts against the mounting side 22. By providing the pressing part 4, even when the mounting side 22 is misaligned with the two fasteners 3 of a fastener group in the long axis direction L, the hook 32 can still apply an elastic force toward the clamping surface 11 to the mounting side 22 through the pressing part 4. In other words, the maximum distance between the two fasteners 3 in a fastener group along the long axis direction L is Smax, the minimum distance between the two fasteners in a fastener group along the long axis direction L is Smin, the extension distance of the pressing part 4 along the long axis direction is Sn, and Smin < Sn ≤ Smax.

[0059] Example 3

[0060] Combination Figure 5 Furthermore, the elastic pad 21 and the hook 32 are flush with each other on the side away from the clamping surface 11, that is, the elastic pad 21 and the hook 32 are flush with each other on the side that is in direct contact with or close to the wafer, which optimizes the contact interface of the wafer fixing device and avoids the impact of the height difference of the components on the clamping safety and stability.

[0061] like Figure 1 As shown, the fixture body 1 is further provided with a drainage channel 12. One end of the drainage channel 12 penetrates the clamping surface 11, and the other end penetrates the side of the fixture body 1 perpendicular to the clamping surface 11. During wafer cleaning, the cleaning fluid may seep into the surface of the clamping surface 11 (especially near the adhesive layer) through the gap between the buffer layer 2 and the clamping surface 11. If this liquid cannot be drained in time, it will accumulate around the adhesive layer for a long time, accelerating the aging and failure of the adhesive layer, which will lead to the loosening of the buffer layer 2. One end of the drainage channel 12 directly penetrates the clamping surface 11, which can catch the cleaning fluid that seeps into the clamping surface 11 and then drain it directly to the outside of the fixture 100 through the other end (penetrating the side of the fixture 100), reducing the erosion of the adhesive layer by the liquid and extending the life of the adhesive layer.

[0062] For example, the elastic pad 21 here can be a rubber material.

[0063] Example 4

[0064] A second aspect of this utility model provides a wafer fixing device, including at least two clamps 100 according to the first aspect of this utility model, wherein the clamping surfaces 11 of the two clamps 100 move toward each other to clamp the wafer.

[0065] For example, one of the clamps 100 is a fixed clamp 100 and the other is a movable clamp 100. The movable clamp 100 is connected to the drive end of the drive member and is oriented towards the fixed clamp 100 under the drive of the drive member.

[0066] For example, both clamps 100 are movable clamps 100, which are connected to the drive end of the drive member and move closer to each other under the drive of the drive member.

[0067] Other configurations and operations of the wafer fixing device according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here. In the description of the present invention, "first feature" and "second feature" may include one or more of the aforementioned features. The vertical, horizontal, and front-back directions are defined as shown in the figures.

[0068] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features not in direct contact but through another feature between them. Moreover, "above," "over," and "on top" of the second feature include the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature.

[0069] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0070] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A clamp, characterized in that, include: The clamp body (1) has a clamping surface (11); A buffer layer (2) and an adhesive layer, wherein the adhesive layer is disposed between the clamping surface (11) and the buffer layer (2) to connect the buffer layer (2) to the clamping surface (11); Fastener (3), provided on the clamp body (1) and used to apply a fastening force toward the clamping surface (11) to the buffer layer (2); The fastener (3) includes a connecting arm (31) and a hook (32), the hook (32) being connected to the clamp body (1) via the connecting arm (31) and used to apply an elastic force toward the clamping surface (11) to the buffer layer (2); The buffer layer (2) includes an elastic pad (21) and two mounting sides (22) protruding from opposite sides of the elastic pad (21); The clamp body (1) is provided with two sets of fasteners corresponding to the position of the mounting side (22), and each set of fasteners includes at least two fasteners (3) spaced apart. The mounting side (22) extends approximately along the long axis direction (L) parallel to the clamping surface (11), and the length of the mounting side (22) is less than the distance between the connecting arms (31) of the first and last fasteners (3) in the group along the long axis direction (L), so that a drainage groove is formed between the mounting side (22) and the connecting arm (31).

2. The clamp according to claim 1, characterized in that, The fasteners (3) include a plurality of fasteners spaced apart at the center around the clamping surface (11).

3. The clamp according to claim 1, characterized in that, In each set of fasteners, the connecting arms (31) of the first and last two fasteners (3) are arranged opposite to each other, and the distance between the two connecting arms (31) in the long axis direction (L) gradually decreases along the short axis direction perpendicular to the long axis direction (L) and away from the adhesive layer.

4. The clamp according to claim 3, characterized in that, The clamp also includes a pressing part (4), which abuts against the hook (32) and the mounting side (22). The minimum distance between the inner surface of the hook (32) and the clamping surface (11) in the direction perpendicular to the clamping surface (11) is less than the sum of the dimensions of the pressing part (4) in that direction and the dimensions of the mounting side (22) in that direction.

5. The clamp according to claim 1, characterized in that, The elastic pad (21) and the hook (32) are flush with each other on the side opposite to the clamping surface (11).

6. The clamp according to claim 1, characterized in that, The clamp body (1) is also provided with a drainage channel (12), one end of which penetrates the clamping surface (11) and the other end of which penetrates the side of the clamp body (1) perpendicular to the clamping surface (11).

7. A wafer fixing device, characterized in that, It includes at least two clamps according to any one of claims 1-6, wherein the clamping surfaces (11) of the two clamps move toward each other to clamp the wafer.

Images