Wafer gripping member and wafer pickup device

Abstract

The embodiment of the present disclosure provides a wafer clamping component and a wafer pickup device. The wafer clamping component is used for connecting a connecting part of the wafer pickup device; the wafer clamping component comprises a boss and a limiting block; the boss has a first side and a second side opposite to each other in a vertical direction, the first side is used for connecting the wafer pickup device, the limiting block protrudes from the second side of the boss, the second side is used for bearing a wafer, and the limiting block is used for abutting against the wafer; and the second side of the boss is provided with a plurality of grooves.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor equipment technology, and more particularly to a wafer clamping component and a wafer picking device. Background Technology

[0002] In modern semiconductor manufacturing processes, wafers need to be frequently transferred and moved between hundreds of process chambers in complex environments involving high vacuum, ultra-cleanliness, high temperatures, and plasma. These processes include Chemical Mechanical Polishing (CMP), Etch, Deposition, and Passivation. Against this backdrop, the application of robots has become an indispensable core component of semiconductor equipment. Robots can precisely, efficiently, and non-destructively perform wafer handling between carriers (such as FOUPs), process chambers, and various transfer locations.

[0003] The gripping accuracy (including positioning accuracy and repeatability) and gripping efficiency (including movement speed and acceleration) of a robot directly determine its wafer per hour (WPH). Insufficient gripping accuracy may cause wafers to collide with the equipment, resulting in defects such as breakage, scratches, and contamination, thus reducing product yield. Conversely, low gripping efficiency directly extends the processing cycle of a single wafer, limiting the upper limit of production capacity and consequently increasing chip manufacturing costs. Utility Model Content

[0004] In view of this, embodiments of the present disclosure provide a wafer clamping component and a wafer picking device.

[0005] On one hand, embodiments of this disclosure provide a wafer gripping component, which is used to connect to the connection portion of a wafer pickup device;

[0006] The wafer gripping component includes a boss and a limiting block. The boss has a first side and a second side facing opposite directions in the vertical direction. The first side is used to connect to the wafer pick-up device. The limiting block protrudes from the second side of the boss. The second side is used to support the wafer and abuts against the wafer.

[0007] The second side of the boss is provided with multiple grooves.

[0008] In some embodiments, one or more of the plurality of grooves extend in a straight line on the second side of the boss, and / or one or more of the plurality of grooves extend in a curve on the second side of the boss; and / or, at least a portion of each groove extends in a straight line on the second side of the boss, and / or at least a portion of each groove extends in a curve on the second side of the boss.

[0009] In some embodiments, the extension directions of one or more of the plurality of grooves are parallel to each other, and / or the extension directions of one or more of the plurality of grooves intersect each other.

[0010] In some embodiments, the inner wall of the groove includes at least one of the following:

[0011] The first and second sidewalls intersect at the bottom;

[0012] Continuous curved surfaces;

[0013] The third sidewall, the fourth sidewall, and the bottom surface connecting the third sidewall and the fourth sidewall.

[0014] In some embodiments, the depth of the groove includes 1 mm to 1.5 mm; and / or, the width of the groove perpendicular to the groove extension direction includes 3 mm to 5 mm; and / or, the projected area of ​​the plurality of grooves on the plane of the surface on the first side is less than or equal to 50% of the projected area of ​​the surface of the second side of the boss on the plane of the surface on the first side.

[0015] In some embodiments, the limiting block has a pickup surface perpendicular to the surface of the second side of the boss, the pickup surface being an arc surface, the pickup surface being used to abut the wafer.

[0016] In some embodiments, the radius of curvature of at least a portion of the pickup surface is equal to the radius of the wafer to be picked up.

[0017] In some embodiments, the surface roughness of the second side of the boss includes a value of 0.1 nm to 0.5 nm.

[0018] In some embodiments, the boss has a chamfer at the edge away from the limiting block.

[0019] On the other hand, embodiments of this disclosure provide a wafer pickup device, the wafer pickup device comprising:

[0020] Multiple wafer clamping components, multiple connecting parts, and abutment members;

[0021] The plurality of wafer clamping components are respectively disposed at the first end of the plurality of connecting portions and are in contact with the first side of the connecting portion;

[0022] The plurality of connecting portions extend along a plurality of directions; the plurality of directions intersect each other;

[0023] The abutment is located at the second end of the connecting portion; the abutment is used to push the wafer to contact the limiting block when picking up the wafer.

[0024] In this embodiment, the second side of the boss is provided with multiple grooves. Due to the presence of these grooves, the wafer pickup device reduces the possibility of mis-picking the wafer caused by the photoresist effect between the second side surface of the boss and the bottom surface of the wafer, thereby reducing the risk of wafer breakage. Simultaneously, because the pickup surface of the limiting block is curved, it can better conform to the side edge of the wafer, thus achieving more stable wafer pickup. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a robotic arm provided in one embodiment;

[0026] Figure 2 for Figure 1 Enlarged view of the wafer clamping component;

[0027] Figure 3 This is a schematic diagram illustrating the photoresist effect formed between the boss and the wafer;

[0028] Figure 4 This is a schematic diagram of the process of a robotic arm successfully picking up a wafer in one embodiment;

[0029] Figure 5 This is a schematic diagram illustrating the process of a robotic arm failing to pick up a wafer in one embodiment;

[0030] Figure 6 This is a schematic diagram of a wafer pickup device provided in an embodiment of the present disclosure;

[0031] Figure 7 for Figure 6 Enlarged view of the wafer clamping component;

[0032] Figure 8 A top view of a first wafer clamping component provided in an embodiment of this disclosure;

[0033] Figure 9 This is a top view of a second type of wafer clamping component provided in an embodiment of the present disclosure;

[0034] Figure 10 A cross-sectional view of a wafer clamping component provided in an embodiment of this disclosure;

[0035] Figure 11 A cross-sectional view of another wafer clamping component provided in an embodiment of this disclosure;

[0036] Figure 12 This is a cross-sectional view of another wafer clamping component provided in an embodiment of the present disclosure. Detailed Implementation

[0037] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0038] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this disclosure. However, it will be apparent to those skilled in the art that this disclosure may be practiced without one or more of these details. In other instances, to avoid confusion with this disclosure, certain technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0039] In the accompanying drawings, for clarity, the dimensions of layers, areas, and elements, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0040] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this disclosure, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this disclosure.

[0041] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprise” and / or “comprising,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0043] To fully understand this disclosure, detailed steps and structures will be presented in the following description to illustrate the technical solutions of this disclosure. Preferred embodiments of this disclosure are described in detail below; however, other embodiments may also be implemented in addition to these detailed descriptions.

[0044] The robot is the core actuator of the wafer transport system, and it includes a multi-degree-of-freedom robotic arm. The robotic arm 101 includes two connecting portions 102 extending along a first direction and a second direction respectively, and a wafer gripping component 103 disposed at one end of the two connecting portions, as shown below. Figure 1 As shown. Two connecting parts 102 are used to extend into the bottom of the wafer and carry the wafer during the picking and transporting process. Two wafer clamping parts 103 are used to abut against the sidewall of the wafer and cooperate with the connecting parts 102 to clamp the wafer during the picking and transporting process.

[0045] In one example, the second end of the connecting portion 102 is provided with a boss 104 protruding from the first surface of the connecting portion 102 and a limiting block 105 protruding from the second surface of the boss 104. During wafer pickup and transfer, the surface of the boss 104 contacts the bottom surface of the wafer, and the boss 104 is used to support the wafer. The surface of the boss 104 is an approximately smooth plane, such as... Figure 1 and Figure 2 As shown.

[0046] Here, the wafers to be picked up can include product wafers and dummy wafers. Product wafers are those that will eventually be polished and used to manufacture chips. Dummy wafers are reclaimed wafers that require high flatness. Dummy wafers can protect product wafers and improve the yield and efficiency of final production through pre-processing polishing pads, stabilizing the process environment, and monitoring parameters.

[0047] In actual production, it was found that when the wafer picked up by the robotic arm 101 is a baffle with a high degree of flatness on the bottom surface, the surface of the boss 104 in the wafer clamping component 103 and the bottom surface of the wafer are both relatively smooth, which makes it easy for a photoresist effect to occur between the boss 104 and the wafer. This creates a vacuum space between the boss 104 and the wafer, which can easily lead to the robotic arm 101 failing to pick up the wafer properly, thereby increasing the risk of wafer breakage.

[0048] Here, the photo-adhesive effect refers to the phenomenon where, when the smoothness of two objects' surfaces exceeds a certain limit, the smoother the surfaces, the greater the friction, causing the two objects to stick together as if they were being attracted to each other. Specifically, the mechanism of the photo-adhesive effect is as follows: when two surfaces are processed to be extremely smooth and flat, they can be brought very close together. At this point, the molecules on both surfaces can enter the effective range of their mutual electromagnetic attraction. The superposition of a large number of molecular attraction forces generates a huge macroscopic attraction, making the two objects difficult to move, as if they were glued together. Figure 3 As shown, a photoadhesive effect is generated between the surface of the boss 104 and the contact surface of the baffle wafer 300, and the two are attracted to each other by the attraction force F.

[0049] Below, in conjunction with Figure 4 and Figure 5 The photopolymerization effect will be further explained.

[0050] In some embodiments, the robot also includes a cylinder ( Figure 4 (Not shown in the image) Components such as abutment 401, slide rail 402, etc. Figure 4As shown. The cylinder provides the initial power to the abutment 401, allowing the abutment 401 to output linear motion under the cylinder's push. The abutment 401 has a groove 404 at its end near the connecting portion 102 for clamping the wafer 403. The slide rail 402 ensures that the abutment 401 moves along a predetermined linear trajectory, guaranteeing motion accuracy.

[0051] During the process of picking up wafer 403, the connector 102 ( Figure 4 (Not shown) The boss 104 extends into the bottom of wafer 403, so that the surface of the boss 104 contacts the bottom surface of wafer 403; then, the control system can send a signal to the cylinder, and compressed air enters the rear chamber of the cylinder. The cylinder pushes the abutment 401 forward until the groove 404 of the abutment 401 contacts wafer 403. At this time, if there is no photoresist effect between the surface of the boss 104 and the bottom surface of wafer 403, the abutment 401 can continue to move forward in a straight line under the guidance of the slide rail 402 and push wafer 403 to move until the side of wafer 403 contacts the limiting block 105 of wafer clamping component 103, so that wafer 403 is stably clamped. Figure 4 As shown.

[0052] However, if there is a photoresist effect between the surface of the boss 104 and the bottom surface of the wafer 403, the photoresist effect will create resistance to the movement of the wafer 403, making it difficult for the abutment 401 to push the wafer 403 to move. This will prevent the side of the wafer 403 from contacting the limiting block 105 of the wafer clamping component 103, resulting in wafer 403 clamping failure or even damage to the wafer 403. Figure 5 As shown.

[0053] In view of this, embodiments of the present disclosure provide a wafer clamping component and a wafer picking device, which can effectively reduce wafer breakage caused by photoresist effect and improve WPH when picking up wafers.

[0054] This disclosure provides a wafer clamping component 600, such as... Figure 6 and Figure 7 As shown, the wafer gripping component is used to connect to the connection part of the wafer pickup device; the wafer gripping component 600 includes a boss 602 and a limiting block 604; the boss 602 has a first side and a second side facing opposite directions in the vertical direction, the first side is used to connect to the wafer pickup device, the limiting block 604 protrudes from the second side of the boss 602, the second side is used to support the wafer, and the limiting block is used to abut against the wafer; the second side of the boss 602 is provided with a plurality of grooves 606.

[0055] In this embodiment, a plurality of grooves 606 are provided on the second side of the boss 602. Due to the presence of the grooves 606, a gap can be formed between the surface of the second side of the boss 602 and the bottom surface of the wafer during the wafer pickup process. This effectively alleviates the situation where the wafer pickup device fails to pick up the wafer due to the photoresist effect generated at the contact surface between the boss 602 and the wafer, and reduces the risk of wafer breakage. In some embodiments, the limiting block 604 has a pickup surface 605 perpendicular to the surface of the second side of the boss 602. The pickup surface 605 is an arc surface and is used to abut the wafer.

[0056] It should be noted that in some examples, the picking surface 106 of the limiting block 105 is a plane, such as... Figure 2 As shown. However, when the pickup surface 106 is a plane, only a small portion of the pickup surface 106 can directly contact the wafer during the wafer pickup process, which results in lower wafer pickup stability.

[0057] In this embodiment, since the pickup surface 605 of the limiting block 604 is an arc surface, the pickup surface 605 can better fit with the side of the wafer, thereby enabling the wafer pickup device to pick up the wafer more stably.

[0058] In some embodiments, at least a portion of the pickup surface 106 has a radius of curvature equal to the radius of the wafer to be picked up. For example, the radius of curvature of the portion of the pickup surface that can contact the wafer is equal to the radius of the wafer to be picked up. This allows the contour of the pickup surface 605 of the limiting block 604 to better conform to the wafer, thereby improving pickup stability.

[0059] In some embodiments, one or more of the plurality of grooves 606 extend in a straight line on the second side of the boss 602, and / or one or more of the plurality of grooves extend in a curve on the second side of the boss.

[0060] Specifically, all of the multiple grooves 606 can extend along a straight path on the second side of the boss, such as... Figure 6 As shown. Alternatively, all of the plurality of grooves 606 may extend along a curved path on the second side of the boss 602. Alternatively, one or more of the plurality of grooves 606 may extend along a straight path, and the remaining grooves 606 may extend along a curved path. In this embodiment of the present disclosure, the extension path of the grooves 606 disposed on the second side of the boss 602 is not limited.

[0061] In some embodiments, at least a portion of each groove 606 extends in a straight line on the second side of the boss 602, and / or at least a portion of each groove 606 extends in a curve on the second side of the boss 602. Exemplarily, the groove may extend in a straight line or in a curve, or the first half of the groove may extend in a straight line and the second half in a curve.

[0062] In some embodiments, the extending directions of one or more of the plurality of grooves 606 are parallel to each other, and / or the extending directions of one or more of the plurality of grooves 606 intersect each other.

[0063] Specifically, the extending directions of all the grooves 606 on the second side of the boss 602 can be parallel to each other. For example... Figure 7 As shown, the extension directions of the plurality of grooves 606 are parallel to each other, and the plurality of grooves 606 extend along the extension direction of the wafer clamping member 600 to which they are located. Figure 8 As shown, the extension directions of the plurality of grooves 606 are parallel to each other, and the plurality of grooves 606 extend along an extension direction perpendicular to the wafer clamping member 600 to which they are located. Alternatively, the extension directions of all the grooves 606 on the second side of the boss 602 intersect each other. Alternatively, the extension directions of one or more of the plurality of grooves 606 on the second side of the boss 602 are parallel to each other, and the extension directions of the remaining grooves 606 intersect each other, such as... Figure 9 As shown. In this embodiment, the extending direction of the groove 606 provided on the second side of the boss 602 is not limited.

[0064] In some embodiments, the inner wall of the groove 606 includes at least one of the following: a first sidewall and a second sidewall that intersect at their bottoms; a continuous curved surface; a third sidewall, a fourth sidewall, and a bottom surface connecting the third sidewall and the fourth sidewall.

[0065] Here, the first sidewall can be a plane or a curved surface, and the second sidewall can also be a plane or a curved surface. For example... Figure 10 As shown, Figure 10 The first and second sidewalls are both planar, and their bottoms intersect. When both the first and second sidewalls are curved surfaces, and their radii of curvature are equal, the first and second sidewalls can form a continuous curved surface, such as... Figure 11 As shown.

[0066] Similarly, the third sidewall can be a plane or a curved surface, and the fourth sidewall can also be a plane or a curved surface. Furthermore, the third and fourth sidewalls can be parallel or non-parallel. For example... Figure 12As shown, both the third and fourth sidewalls are planar, and they are not parallel. In some embodiments, both the third and fourth sidewalls are planar, and they are parallel. In this case, both the third and fourth sidewalls can be perpendicular to the bottom surface of the groove 606, as shown. Figure 7 As shown.

[0067] It is understood that when the surface of the second side of the boss has a groove 606, regardless of the specific structure of the groove 606, the wafer pickup device can achieve the effect of breaking the photoresist effect when picking up the wafer. Therefore, any groove 606 that can achieve the breaking of the photoresist effect falls within the protection scope of this disclosure.

[0068] In some embodiments, the depth h of the groove 606 includes 1 mm to 1.5 mm. For example, the depth h of the groove 606 can be 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm or 1.5 mm.

[0069] In some embodiments, the width x of the groove 606 perpendicular to the extending direction of the groove 606 includes 3 mm to 5 mm. For example, the width x of the groove 606 can be 3 mm, 3.5 mm, 4 mm, 4.5 mm or 5 mm.

[0070] In some embodiments, the projected area of ​​the plurality of grooves 606 on the plane of the surface on the first side of the boss 602 is less than or equal to 50% of the projected area of ​​the surface on the second side of the boss 602 on the plane of the surface on the first side.

[0071] In other words, the sum of the bottom areas of the plurality of grooves 606 is less than or equal to 50% of the area of ​​the projection of the surface of the second side of the boss onto the surface direction perpendicular to the first side. For example, the projected area of ​​the plurality of grooves 606 onto the plane containing the surface of the first side of the boss 602 is 50%, 40%, or 30% of the projected area of ​​the surface of the second side of the boss onto the plane containing the surface of the first side.

[0072] In some embodiments, the surface roughness of the second side of the boss 602 includes a value of 0.1 nm to 0.5 nm. For example, the surface roughness of the second side of the boss is 0.1 nm, 0.2 nm, 0.3 nm, 0.4 nm, or 0.5 nm.

[0073] It should be noted that the surface roughness of the second side here specifically refers to the surface roughness of the second side of the part that contacts the bottom surface of the wafer when the wafer pickup device picks up the wafer, rather than the surface roughness of the second side of the groove part.

[0074] Here, the surface roughness on the second side can be understood using the parameter of arithmetic mean deviation (Ra). Ra represents the arithmetic mean of the absolute values ​​of the profile deviations over the sampling length. In other words, Ra represents the average distance from all the "peaks" and "troughs" on a measured section of the surface to the center line. The smaller the Ra value, the smoother the surface.

[0075] In some embodiments, the boss 602 has a chamfer at the edge away from the limiting block 604.

[0076] Specifically, the boss 602 may have a rounded chamfer on the edge away from the limiting block 604, which can reduce the scratching and wear caused by the boss 602 on the back of the wafer when picking up the wafer.

[0077] This disclosure also provides a wafer pickup device, which includes: a plurality of wafer gripping components 600 as described in the above embodiments, a plurality of connecting portions 601, and an abutment member; the plurality of wafer gripping components 600 are respectively disposed at the first ends of the plurality of connecting portions 601 and are in contact with the first side of the connecting portions 601; the plurality of connecting portions 601 extend along a plurality of directions; the plurality of directions intersect each other; the abutment member is located at the second end of the connecting portion; the abutment member is used to push the wafer to contact the limiting block 604 when picking up the wafer.

[0078] Here, the number of connectors in the wafer pickup device is the same as the number of wafer clamping components, and each connector is connected to a wafer clamping component in a one-to-one correspondence.

[0079] In some embodiments, the wafer gripping components 600 in the wafer pickup device may specifically be two, three or four. In this embodiment of the present disclosure, the number of wafer gripping components 600 in the wafer pickup device is not limited.

[0080] The wafer gripping component 600 in the wafer pickup device can be understood with reference to the above-described embodiments of the wafer gripping component, and will not be repeated here.

[0081] In some embodiments, the wafer gripping component 600 is detachably connected to the connecting portion 601. Exemplarily, the wafer gripping component 600 is connected to the connecting portion 601 by means of threaded connection, snap-fit ​​connection, adhesive bonding, etc. It should be noted that the wafer gripping component 600 may experience wear and tear with repeated use. Therefore, the wafer gripping component 600 needs to be replaced periodically or when it is determined by manual inspection that the wafer gripping component 600 no longer meets the usage requirements, in order to ensure the normal operation of the wafer pickup device. Here, the wafer gripping component 600 can be considered a consumable; timely replacement of the wafer gripping component 600 ensures the normal operation of the wafer pickup device.

[0082] In other embodiments, the wafer gripping component 600 is fixedly connected to the connecting portion 601. Exemplarily, the wafer gripping component 600 is connected to the connecting portion 601 by means of welding, riveting, or other connection methods. Alternatively, the wafer gripping component 600 may be integrally formed with the connecting portion 601.

[0083] The connecting part 601 can be used to extend into the bottom of the wafer and carry the wafer during the picking and transporting process.

[0084] The abutment can move linearly under the push of a cylinder, pushing the wafer into contact with the pickup surface of the limiting block. In this way, the robotic arm and the abutment cooperate to pick up the wafer. The specific structure and function of the connecting part 601 and the abutment can be further customized according to... Figure 1 and Figure 4 The descriptions in the text are for reference only and will not be elaborated upon here.

[0085] It should be understood that the phrase "an embodiment" or "one embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this disclosure. Therefore, "in one embodiment" or "one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this disclosure, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure. The sequence numbers of the above-described embodiments are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0086] The above description is only a preferred embodiment of this disclosure and does not limit the patent scope of this disclosure. All equivalent structural transformations made under the concept of this disclosure using the contents of this specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this disclosure.

Claims

1. A wafer clamping component, characterized in that, The wafer gripping component is used to connect to the connection part of the wafer pickup device; The wafer gripping component includes a boss and a limiting block. The boss has a first side and a second side facing opposite directions in the vertical direction. The first side is used to connect to the wafer pick-up device. The limiting block protrudes from the second side of the boss. The second side is used to support the wafer and abuts against the wafer. The second side of the boss is provided with multiple grooves.

2. The wafer clamping component according to claim 1, characterized in that, One or more of the plurality of grooves extend in a straight line on the second side of the boss, and / or one or more of the plurality of grooves extend in a curve on the second side of the boss; and / or at least a portion of each of the grooves extends in a straight line on the second side of the boss, and / or at least a portion of each of the grooves extends in a curve on the second side of the boss.

3. The wafer clamping component according to claim 2, characterized in that, One or more of the plurality of grooves extend in parallel directions, and / or one or more of the plurality of grooves extend in directions that intersect each other.

4. The wafer clamping component according to claim 1, characterized in that, The inner wall of the groove includes at least one of the following: The first and second sidewalls intersect at the bottom; Continuous curved surfaces; The third sidewall, the fourth sidewall, and the bottom surface connecting the third sidewall and the fourth sidewall.

5. The wafer clamping component according to claim 1, characterized in that, The depth of the groove includes 1 mm to 1.5 mm; and / or, the width of the groove perpendicular to the groove extension direction includes 3 mm to 5 mm; and / or, the projected area of ​​the plurality of grooves on the plane where the surface of the first side is located is less than or equal to 50% of the projected area of ​​the surface of the second side of the boss on the plane where the surface of the first side is located.

6. The wafer clamping component according to claim 1, characterized in that, The limiting block has a pickup surface perpendicular to the surface of the second side of the boss. The pickup surface is an arc surface and is used to abut the wafer.

7. The wafer clamping component according to claim 6, characterized in that, The radius of curvature of at least a portion of the picking surface is equal to the radius of the wafer to be picked.

8. The wafer clamping component according to any one of claims 1 to 7, characterized in that, The surface roughness value of the second side of the boss includes 0.1 nm to 0.5 nm.

9. The wafer clamping component according to any one of claims 1 to 7, characterized in that, The boss has a chamfer on the edge away from the limiting block.

10. A wafer pickup device, characterized in that, The wafer pickup device includes: Multiple wafer clamping components as described in any one of claims 1 to 9, multiple connecting portions, and abutting members; The plurality of wafer clamping components are respectively disposed at the first end of the plurality of connecting portions and are in contact with the first side of the connecting portion; The plurality of connecting portions extend along a plurality of directions; the plurality of directions intersect each other; The abutment is located at the second end of the connecting portion; the abutment is used to push the wafer to contact the limiting block when picking up the wafer.

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