Ejector pin system and patch packaging apparatus
Patent Information
- Application Number
- CN202522342755.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-05
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-11-05
AI Technical Summary
若顶针速度太低或者顶升力太小，芯片与蓝膜的分离角度太小，难以实现分离；若顶针速度太高或者顶升力太大，顶针对芯片的冲击增大，容易导致分离时芯片碎裂
该顶针系统包括机座、顶针帽、支撑环和顶针座，顶针帽盖合于机座的顶部，支撑环套设于顶针帽的外壁，机座内设置有第一真空腔室，顶针帽内设置有第二真空腔室，支撑环内设置有第三真空腔室，第一真空腔室、第二真空腔室和第三真空腔室依次连通，顶针座设置于第一真空腔室内，顶针座用于固定顶针，顶针帽上设置有与第二真空腔室连通的顶针孔，顶针穿过顶针孔伸出顶针帽外以顶起蓝膜，支撑环上设置有与第三真空腔室连通的吸附孔，第一真空腔室用于与真空设备连通，以使顶针孔和吸附孔共同配合吸附蓝膜。相较于现有技术，本申请提供的顶针系统，通过支撑环增大了顶针系统与蓝膜的吸附面积，从而增大了顶针系统对蓝膜的吸附作用，并且，由于支撑环沿环形吸附蓝膜的边缘区域，因此，还可以避免芯片与蓝膜分离时发生应力集中问题，从而避免芯片发生破碎现象。
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Figure CN224924192U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a pin system and a surface mount packaging device. Background Technology
[0002] With the rapid development of the semiconductor industry, surface mount packaging equipment commonly uses a method where a ejector pin lifts the blue film to separate the chip from the blue film via a ejector pin. The blue film around the ejector pin is then adsorbed through a vacuum hole in the pin cap, thus achieving separation. If the ejector pin speed is too low or the lifting force is too small, the separation angle between the chip and the blue film will be too small, making separation difficult. If the ejector pin speed is too high or the lifting force is too large, the impact on the chip increases, which can easily lead to chip breakage during separation. Utility Model Content
[0003] The purpose of this application is to provide a pin system and a surface mount packaging device, which uses a pin cap and a support ring to vacuum adsorb the blue film, which helps to separate the chip from the blue film and avoids chip breakage.
[0004] The embodiments of this application are implemented as follows: A first aspect of this application provides a ejector pin system, including a base, an ejector pin cap, a support ring, and an ejector pin seat. The ejector pin cap covers the top of the base, and the support ring is sleeved on the outer wall of the ejector pin cap. A first vacuum chamber is provided inside the base, a second vacuum chamber is provided inside the ejector pin cap, and a third vacuum chamber is provided inside the support ring. The first, second, and third vacuum chambers are sequentially connected. The ejector pin seat is disposed in the first vacuum chamber and is used to fix the ejector pin. The ejector pin cap has an ejector pin hole communicating with the second vacuum chamber. The ejector pin extends out of the ejector pin cap through the ejector pin hole to lift a blue film. The support ring has an adsorption hole communicating with the third vacuum chamber. The first vacuum chamber is used to communicate with a vacuum device so that the ejector pin hole and the adsorption hole cooperate to adsorb the blue film. This ejector pin system uses the ejector pin cap and support ring to vacuum adsorb the blue film, which helps to separate the chip from the blue film and avoids chip breakage.
[0005] In one possible implementation, the base has a cylindrical structure, the inner wall of the cylindrical structure forms the first vacuum chamber, the ejector cap has an inverted U-shaped structure, the interior of the inverted U-shaped structure forms the second vacuum chamber, and the support ring has a positive U-shaped structure with a through hole at the bottom, the interior of the positive U-shaped structure forms the third vacuum chamber.
[0006] In one possible implementation, the first vacuum chamber is connected to the second vacuum chamber through the ejector pin hole, the inner wall of the ejector pin cap is provided with a first connecting hole, the inner wall of the support ring is provided with a second connecting hole, and the second vacuum chamber is connected to the third vacuum chamber through the first connecting hole and the second connecting hole.
[0007] In one possible implementation, the first vacuum chamber is connected to the second vacuum chamber through the ejector pin hole, a notch is provided on the side wall of the ejector pin cap, a connector is provided on the bottom wall of the support ring, and the second vacuum chamber is connected to the third vacuum chamber through the notch and the connector.
[0008] In one possible implementation, the top of the base is provided with a mounting groove having a connecting rod, and the bottom of the ejector cap is provided with a connecting lug having an assembly hole. The connecting lug is accommodated in the mounting groove, and the connecting rod is inserted into the assembly hole, so that the base and the ejector cap are fixedly connected.
[0009] In one possible implementation, the top surface of the support ring is flush with the top surface of the ejector pin cap.
[0010] As one possible implementation, the inner wall of the base is provided with a stepped structure, the ejector pin seat is disposed on the platform of the stepped structure, and the top surface of the ejector pin seat is flush with the top surface of the base.
[0011] As one possible implementation, the ejector seat is provided with a fixing groove, and the ejector pin is disposed in the fixing groove.
[0012] In one possible implementation, a mounting base is provided at the bottom of the base, the mounting base extending from near the base to away from the base, and the base is fixedly mounted on the machine platform of the surface mount packaging equipment via the mounting base.
[0013] A second aspect of this application provides a surface mount packaging apparatus, including the aforementioned ejector pin system. This ejector pin system uses ejector pin caps and support rings to vacuum-adsorb the blue film, facilitating separation of the chip from the blue film and preventing chip breakage.
[0014] The beneficial effects of the embodiments of this application include: The ejector system includes a base, an ejector cap, a support ring, and an ejector seat. The ejector cap covers the top of the base, and the support ring is fitted onto the outer wall of the ejector cap. A first vacuum chamber is provided inside the base, a second vacuum chamber is provided inside the ejector cap, and a third vacuum chamber is provided inside the support ring. The first, second, and third vacuum chambers are connected in sequence. The ejector seat is located inside the first vacuum chamber and is used to fix the ejector. The ejector cap has an ejector hole that communicates with the second vacuum chamber. The ejector passes through the ejector hole and extends out of the ejector cap to lift the blue film. The support ring has an adsorption hole that communicates with the third vacuum chamber. The first vacuum chamber is used to communicate with a vacuum device so that the ejector hole and the adsorption hole work together to adsorb the blue film. Compared to existing technologies, the ejector pin system provided in this application increases the adsorption area between the ejector pin system and the blue film through the support ring, thereby increasing the adsorption effect of the ejector pin system on the blue film. Furthermore, since the support ring is along the edge area of the annular adsorption of the blue film, stress concentration problems can be avoided when the chip separates from the blue film, thus preventing chip breakage. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is one of the structural schematic diagrams of the ejector pin system provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of the ejector pin system provided in the embodiments of this application; Figure 3 This is the third schematic diagram of the structure of the ejector pin system provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the base provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the thimble cap provided in an embodiment of this application; Figure 6 This is a schematic diagram of the support ring provided in an embodiment of this application.
[0017] Icons: 100-Ejector system; 10-Base; 11-First vacuum chamber; 12-Mounting groove; 121-Connecting rod; 13-Stepped structure; 14-Fixing seat; 20-Ejector cap; 21-Second vacuum chamber; 22-Ejector hole; 23-First connecting hole; 24-Connecting ear; 241-Assembly hole; 30-Support ring; 31-Third vacuum chamber; 32-Adsorption hole; 33-Through hole; 34-Second connecting hole; 40-Ejector seat; 41-Fixing groove; 50-Ejector. Detailed Implementation
[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.
[0019] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0020] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0021] Please refer to the reference. Figures 1 to 6This application provides an ejector pin system 100, including a base 10, an ejector pin cap 20, a support ring 30, and an ejector pin seat 40. The ejector pin cap 20 covers the top of the base 10, and the support ring 30 is sleeved on the outer wall of the ejector pin cap 20. A first vacuum chamber 11 is provided inside the base 10, a second vacuum chamber 21 is provided inside the ejector pin cap 20, and a third vacuum chamber 31 is provided inside the support ring 30. The first vacuum chamber 11, the second vacuum chamber 21, and the third vacuum chamber 31 are... The system is sequentially connected, with a pin holder 40 disposed within the first vacuum chamber 11 to fix the pin 50. A pin cap 20 has a pin hole 22 communicating with the second vacuum chamber 21. The pin 50 extends out of the pin cap 20 through the pin hole 22 to lift the blue film. A support ring 30 has an adsorption hole 32 communicating with the third vacuum chamber 31. The first vacuum chamber 11 is connected to a vacuum device so that the pin hole 22 and the adsorption hole 32 work together to adsorb the blue film. This pin system 100 uses the pin cap 20 and support ring 30 to vacuum-adsorb the blue film, facilitating separation of the chip from the blue film and preventing chip breakage.
[0022] It should be noted that the ejector system 100 includes a base 10, an ejector cap 20, a support ring 30, and an ejector seat 40. The base 10 serves as the basic carrier of the ejector system 100, and has a first vacuum chamber 11 inside and a vacuum interface at the bottom for connecting to vacuum equipment (such as a vacuum pump) to introduce negative vacuum pressure into the entire ejector system 100. The ejector cap 20 covers the top of the base 10 and has a second vacuum chamber 21 inside. An ejector hole 22 is formed in the central area of the ejector cap 20, serving as a channel for the ejector 50 to extend out of the ejector cap 20. Simultaneously, the ejector hole 22 connects the second vacuum chamber 21 with the first vacuum chamber 11, thereby enabling… The blue film is attracted by the annular gap between the inner wall of the ejector hole 22 and the outer wall of the ejector 50. The support ring 30 is an annular component so that it can be fitted onto the outer wall of the ejector cap 20. A third vacuum chamber 31 is provided inside the support ring 30 and is connected to the second vacuum chamber 21. An adsorption hole 32 connected to the third vacuum chamber 31 is provided on the annular side wall of the support ring 30, so that the adsorption hole 32 can attract the blue film. The ejector seat 40 is fixedly set in the first vacuum chamber 11 to fix the ejector 50. The ejector seat 40 can ensure the coaxiality of the ejector 50 and the ejector hole 22 to avoid friction between the ejector 50 and the inner wall of the ejector hole 22.
[0023] The first vacuum chamber 11 of the base 10, the second vacuum chamber 21 of the ejector cap 20, and the third vacuum chamber 31 of the support ring 30 are sequentially connected through their internal air channels, forming a double-layer adsorption structure of "central negative pressure + annular negative pressure". The central negative pressure acts on the central region of the blue film through the ejector pin hole 22, while the annular negative pressure acts on the edge region of the blue film through the adsorption hole 32 of the support ring 30. The negative pressure values of both are consistent, allowing the ejector cap 20 and the support ring 30 to collaboratively adsorb and fix the blue film. Sealing grooves can be provided at the connections of the various components, and sealing rings can be embedded inside the sealing grooves to prevent vacuum leakage, maintain stable negative pressure, and thus avoid unstable adsorption force due to vacuum leakage. In actual use, when the vacuum equipment is started, the first vacuum chamber 11, the second vacuum chamber 21, and the third vacuum chamber 31 simultaneously form a negative pressure. The ejector pin hole 22 of the ejector pin cap 20 generates an adsorption force on the central area of the blue film. At the same time, the adsorption hole 32 of the support ring 30 generates an adsorption force on the edge area of the blue film. The ejector pin seat 40 is driven to rise, which drives the ejector pin 50 to extend out of the ejector pin cap 20 along the height direction of the base 10. The lifting force of the ejector pin 50 lifts the blue film. Since the blue film is adsorbed and fixed by the ejector pin cap 20 and the support ring 30, the lifting force of the ejector pin 50 will separate the chip from the blue film, thereby completing the chip pick-up and drop operation.
[0024] Compared with the prior art, the ejector pin system 100 provided in this application increases the adsorption area between the ejector pin system 100 and the blue film through the support ring 30, thereby increasing the adsorption effect of the ejector pin system 100 on the blue film. Furthermore, since the support ring 30 is along the edge area of the annular adsorption of the blue film, stress concentration problems can be avoided when the chip separates from the blue film, thereby preventing chip breakage.
[0025] As one possible implementation method, such as Figures 2 to 6 As shown, the base 10 has a cylindrical structure, and the inner wall of the cylindrical structure forms a first vacuum chamber 11. The ejector cap 20 has an inverted U-shaped structure, and the interior of the inverted U-shaped structure forms a second vacuum chamber 21. The support ring 30 has a positive U-shaped structure with a through hole 33 at the bottom, and the interior of the positive U-shaped structure forms a third vacuum chamber 31.
[0026] It should be noted that the base 10, ejector cap 20, and support ring 30 adopt a differentiated structural design of "cylindrical-inverted U-shape-normal U-shape". Through shape adaptation, a three-level interconnected vacuum chamber is precisely constructed, ensuring efficient negative pressure transmission and achieving stable assembly and functional zoning between components. Specifically, the base 10 is a cylindrical structure with open ends, and its cross-sectional shape can be circular. The inner wall of the base 10 is cylindrical, directly forming the boundary of the first vacuum chamber 11. The cylindrical structure makes the first vacuum chamber 11 an axially continuous cylindrical space, ensuring that the negative pressure of the vacuum pump can be quickly transmitted upstream. The ejector cap 20 has an inverted U-shape structure and is fitted on the top of the base 10. A sealing ring can be set at the connection between the ejector cap 20 and the base 10. The second vacuum chamber 21 is set inside, and an ejector hole 22 is opened in the center area of the top. The diameter of the ejector hole 22 is slightly larger than that of the ejector pin 50. The diameter of the pin hole 22 and the second vacuum chamber 21 can be connected along the axial direction of the base 10; the support ring 30 has a U-shaped structure, and a third vacuum chamber 31 is provided inside it. A through hole 33 is provided in the central area of the bottom so that the support ring 30 can be fitted onto the outer wall of the pin cap 20. Multiple adsorption holes 32 are evenly distributed along the annular area at the top. The adsorption holes 32 and the third vacuum chamber 31 can be connected along the axial direction of the base 10. Sealing grooves can be provided at the connection between the top of the support ring 30 and the pin cap 20 and the bottom of the support ring 30 and the base 10, and sealing rings are embedded in the sealing grooves.
[0027] As one possible implementation method, such as Figures 2 to 6 As shown, the first vacuum chamber 11 is connected to the second vacuum chamber 21 through the ejector pin hole 22. The inner wall of the ejector pin cap 20 is provided with a first connecting hole 23, and the inner wall of the support ring 30 is provided with a second connecting hole 34. The second vacuum chamber 21 is connected to the third vacuum chamber 31 through the first connecting hole 23 and the second connecting hole 34.
[0028] It should be noted that the center area of the ejector cap 20 is provided with an ejector hole 22, which is fitted with the ejector pin 50 with a clearance. After the ejector pin 50 is inserted into the ejector hole 22, the first vacuum chamber 11 can still communicate with the second vacuum chamber 21 through the annular gap between the ejector hole 22 and the ejector pin 50, so as to ensure that the vacuum negative pressure can be transmitted from the first vacuum chamber 11 to the second vacuum chamber 21. The inner wall of the ejector cap 20 is provided with a first connecting hole 23, and the inner wall of the support ring 30 is provided with a second connecting hole 34. When installing the ejector cap 20 and the support ring 30, the first connecting hole 23 and the second connecting hole 34 must be precisely aligned so that the second vacuum chamber 21 communicates with the third vacuum chamber 31 through the first connecting hole 23 and the second connecting hole 34, thereby ensuring that the vacuum negative pressure can be transmitted from the second vacuum chamber 21 to the third vacuum chamber 31, and then adsorbed and fixed through the adsorption hole 32.
[0029] To improve the accuracy of the alignment between the first connecting hole 23 and the second connecting hole 34, in this embodiment, a protrusion is first provided at the bottom of the support ring 30, and the second connecting hole 34 is disposed through the protrusion. Thus, when installing the support ring 30 and the ejector cap 20, simply inserting the protrusion into the first connecting hole 23 will align the first connecting hole 23 and the second connecting hole 34. Alternatively, in other embodiments, both the first connecting hole 23 and the second connecting hole 34 can extend radially along the base 10. When the first connecting hole 23 and the second connecting hole 34 are precisely aligned, the second vacuum chamber 21 and the third vacuum chamber 31 can also be connected.
[0030] As one possible implementation, similar to the above embodiment, the first vacuum chamber 11 is connected to the second vacuum chamber 21 through the ejector pin hole 22 to ensure that the vacuum negative pressure can be transmitted from the first vacuum chamber 11 to the second vacuum chamber 21. Unlike the above embodiment, the ejector pin cap 20 has a notch on its side wall. In other words, the original annular side wall of the ejector pin cap 20 is directly partially or completely broken at the notch location. The bottom wall of the support ring 30 has a connector. In this way, when installing the support ring 30 and the ejector pin cap 20, it is only necessary to insert the connector into the notch location to allow the second vacuum chamber 21 to be connected to the third vacuum chamber 31 through the notch and the connector.
[0031] As one possible implementation method, such as Figure 4 and Figure 5 As shown, the top of the base 10 is provided with a mounting groove 12 having a connecting rod 121, and the bottom of the ejector cap 20 is provided with a connecting ear 24 having an assembly hole 241. The connecting ear 24 is accommodated in the mounting groove 12, and the connecting rod 121 is inserted into the assembly hole 241 so that the base 10 and the ejector cap 20 are fixedly connected.
[0032] It should be noted that the top of the base 10 is provided with mounting grooves 12 distributed in a ring or symmetrically. A connecting rod 121 protrudes from the bottom of the mounting groove 12. The mounting groove 12 and the connecting rod 121 can be integrally formed. A chamfer can be provided on the top of the connecting rod 121 to make the end of the connecting rod 121 round and smooth. The bottom of the ejector cap 20 is provided with connecting ears 24. The number and position of the connecting ears 24 correspond one-to-one with the number and position of the mounting grooves 12. Assembly holes 241 are provided through the surface of the connecting rod 121. The number and position of the assembly holes 241 correspond one-to-one with the number and position of the connecting rod 121. When the ejector cap 20 is assembled to the base 10, the connecting ears 24 need to be accommodated in the mounting groove 12. At the same time, the connecting rod 121 needs to be inserted into the assembly hole 241. In this way, a nested connection structure can be formed, thereby improving the reliability of the fixed connection between the base 10 and the ejector cap 20, without the need for separate fasteners.
[0033] As one possible implementation method, such as Figure 1 As shown, the top surface of the support ring 30 is flush with the top surface of the ejector cap 20, so that when the chip with the blue film is placed on the surface of the ejector cap 20 and the support ring 30, the ejector cap 20 and the support ring 30 can simultaneously provide stable support for the chip, and under the action of negative pressure, they can adsorb and fix the blue film. In addition, it can also ensure that the chip will not tilt or shake after being placed.
[0034] As one possible implementation method, such as Figures 2 to 4 As shown, the inner wall of the base 10 is provided with a stepped structure 13, and the ejector pin seat 40 is set on the platform of the stepped structure 13 so that the platform of the stepped structure 13 can support the ejector pin seat 40. The depth of the stepped structure 13 can be reasonably selected and designed according to the length of the ejector pin 50. It is only necessary to enable the ejector pin seat 40 to drive the ejector pin 50 to extend out of the ejector pin cap 20 so that the ejector pin 50 can lift the blue film.
[0035] As one possible implementation method, such as Figures 2 to 4 As shown, the top surface of the ejector seat 40 is flush with the top surface of the base 10 to prevent the ejector seat 40 from protruding from the base 10, which would cause the ejector cap 20 on the top of the base 10 to be lifted up, thereby affecting the airtightness between the base 10 and the ejector cap 20 and causing negative pressure leakage at the connection between the two.
[0036] As one possible implementation method, such as Figure 2 and Figure 3 As shown, the ejector seat 40 is provided with a fixing groove 41, and the ejector pin 50 is disposed in the fixing groove 41 so that the ejector pin 50 can be partially embedded in the fixing groove 41, thereby stably supporting the ejector pin 50 through the ejector seat 40. Those skilled in the art should understand that the number of fixing grooves 41 should be greater than the number of ejector pins 50 to ensure that after the ejector pin 50 is installed, the first vacuum chamber 11 and the second vacuum chamber 21 can be connected through the empty fixing grooves 41 where the ejector pin 50 is not installed.
[0037] As one possible implementation method, such as Figure 1 , Figure 2 and Figure 5 As shown, a mounting base 14 is provided at the bottom of the base 10. The mounting base 14 extends from the base 10 towards the distance from the base 10, and the base 10 is fixedly mounted on the machine platform of the surface mount packaging equipment via the mounting base 14. For example, the mounting base 14 can be a fixing flange as in the prior art, so as to fix the base 10 to the machine platform via the fixing flange.
[0038] This application also provides a surface mount packaging device, including the ejector pin system 100 described above. Since the structure and beneficial effects of the ejector pin system 100 have been described in detail in the foregoing embodiments, they will not be repeated here.
[0039] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0040] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.
Claims
1. A pin system, characterized in that, The device includes a base, a pin cap, a support ring, and a pin seat. The pin cap covers the top of the base, and the support ring is fitted onto the outer wall of the pin cap. A first vacuum chamber is provided inside the base, a second vacuum chamber is provided inside the pin cap, and a third vacuum chamber is provided inside the support ring. The first, second, and third vacuum chambers are sequentially connected. The pin seat is located inside the first vacuum chamber and is used to fix the pin. The pin cap has a pin hole that communicates with the second vacuum chamber. The pin extends out of the pin cap through the pin hole to lift the blue film. The support ring has an adsorption hole that communicates with the third vacuum chamber. The first vacuum chamber is used to communicate with a vacuum device so that the pin hole and the adsorption hole work together to adsorb the blue film.
2. The ejector pin system according to claim 1, characterized in that, The base has a cylindrical structure, and the inner wall of the cylindrical structure forms the first vacuum chamber. The ejector cap has an inverted U-shaped structure, and the interior of the inverted U-shaped structure forms the second vacuum chamber. The support ring has a positive U-shaped structure with a through hole at the bottom, and the interior of the positive U-shaped structure forms the third vacuum chamber.
3. The ejector pin system according to claim 1, characterized in that, The first vacuum chamber is connected to the second vacuum chamber through the ejector pin hole. The inner wall of the ejector pin cap is provided with a first connecting hole, and the inner wall of the support ring is provided with a second connecting hole. The second vacuum chamber is connected to the third vacuum chamber through the first connecting hole and the second connecting hole.
4. The ejector pin system according to claim 2, characterized in that, The first vacuum chamber is connected to the second vacuum chamber through the ejector pin hole. A notch is provided on the side wall of the ejector pin cap, and a connector is provided on the bottom wall of the support ring. The second vacuum chamber is connected to the third vacuum chamber through the notch and the connector.
5. The ejector pin system according to claim 1, characterized in that, The top of the base is provided with a mounting groove with a connecting rod, and the bottom of the ejector cap is provided with a connecting lug with an assembly hole. The connecting lug is accommodated in the mounting groove, and the connecting rod is inserted into the assembly hole so that the base and the ejector cap are fixedly connected.
6. The ejector pin system according to claim 1, characterized in that, The top surface of the support ring is flush with the top surface of the ejector pin cap.
7. The ejector pin system according to claim 1, characterized in that, The inner wall of the base is provided with a stepped structure, and the ejector pin seat is disposed on the platform of the stepped structure, with the top surface of the ejector pin seat being flush with the top surface of the base.
8. The ejector pin system according to claim 1, characterized in that, The ejector pin seat is provided with a fixing groove, and the ejector pin is disposed in the fixing groove.
9. The ejector pin system according to claim 1, characterized in that, The base is provided with a fixing seat at its bottom. The fixing seat extends from the base to the side away from the base. The base is fixedly mounted on the machine platform of the surface mount packaging equipment via the fixing seat.
10. A surface mount packaging device, characterized in that, Includes the ejector pin system as described in any one of claims 1 to 9.