Wafer chuck for semiconductor metal film etching
Patent Information
- Application Number
- CN202522436459.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-17
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-11-17
AI Technical Summary
然而在半导体金属膜刻蚀的工艺过程中，真空硅脂和高温胶带极容易对晶圆表面造成污染和损伤，导致金属膜电极图形缺失或不完整
上述技术方案所提供的半导体金属膜刻蚀用晶圆夹具，包括下托盘主体、上托盘主体以及螺丝；所述下托盘主体上设有圆形浅凹槽，该圆形浅凹槽形成晶圆放置区；所述圆形浅凹槽上开凿有深凹槽，该深凹槽为晶圆快捷取放处；所述上托盘主体具有定位柱，该定位柱与下托盘主体的定位孔形成定位与连接结构，上托盘主体压住并固定晶圆。所述上托盘主体中部为开凿打穿的圆形，该开凿打穿的圆形露出晶圆工艺加工面；所述螺丝起到固定作用，解决下托盘主体与上托盘主体脱离问题；本实用新型实现了晶圆的便捷和快速上下样，避免了真空硅脂和高温胶带在半导体金属膜刻蚀工艺过程中的使用，并提升了刻蚀工艺的良率、效率、稳定性及可靠性。
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Figure CN224924193U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of wafer fixtures for semiconductor production, and relates to a wafer fixture for etching semiconductor metal films. Background Technology
[0002] Semiconductor metal film etching, also known as plasma physical etching, includes argon ion etching and reactive ion etching. Metal film etching is a crucial step in the fabrication of semiconductor metal film electrodes, and the quality of these electrodes is one of the key factors affecting the performance of semiconductor devices.
[0003] With the rapid development of the semiconductor industry, the requirements for the cleanliness of wafer surfaces are becoming increasingly stringent. To prevent particles and metal debris from falling from the equipment chamber onto the wafer surface or into the ion source, wafer workpiece disks are typically placed vertically.
[0004] Currently, wafer workpiece trays used for semiconductor metal film etching generally employ single-layer planar trays, which require vacuum silicone grease or high-temperature tape to fix the wafer. However, during the semiconductor metal film etching process, vacuum silicone grease and high-temperature tape are highly susceptible to contamination and damage to the wafer surface, leading to missing or incomplete metal film electrode patterns. These quality issues with semiconductor metal film electrodes will consequently reduce semiconductor device yield and increase costs.
[0005] Therefore, it is necessary to design an improved wafer fixture structure to avoid the use of vacuum grease and high-temperature tape in the semiconductor metal film etching process, and to improve the yield, efficiency, stability and reliability of the etching process. Utility Model Content
[0006] (a) Purpose of the utility model The purpose of this invention is to provide a wafer jig for semiconductor metal film etching, so as to avoid the use of vacuum silicone grease and high-temperature tape in the semiconductor metal film etching process, and improve the yield, efficiency, stability and reliability of the etching process.
[0007] (II) Technical Solution To address the aforementioned technical problems, this utility model provides a wafer jig for etching semiconductor metal films, comprising a lower tray body and an upper tray body arranged in parallel. The lower tray body has a lower tray protrusion on its outer peripheral edge and a shallow circular groove at its center. The edge of the shallow circular groove is carved with a deep groove. The top outer ring of the lower tray body has a positioning hole and a threaded hole. The upper tray body has an upper tray protrusion on its outer peripheral edge and a circular hole carved through its center. The top outer ring of the upper tray body has a circular hole. The bottom surface of the upper tray body has a positioning post that matches the positioning hole. A screw passes through the circular hole and connects to the threaded hole.
[0008] Furthermore, the lower tray body, upper tray body, and screws are all made of titanium alloy.
[0009] Furthermore, the center of the positioning hole coincides with the center of the positioning post; the threaded hole, the round hole, and the screw are coaxial; the center of the circular shallow groove coincides with the center of the drilled circle.
[0010] Furthermore, the upper tray protrusion and the lower tray protrusion are vertically aligned; the outer contour of the lower tray body is consistent with the outer contour of the upper tray body.
[0011] Furthermore, the center of the deep groove is located on the edge of the circular shallow groove.
[0012] Furthermore, the circular opening in the upper tray body is chamfered with a tangent of α, and the tangent of the chamfer α is 0.5.
[0013] Furthermore, the radius of the circle that is chiseled through the upper tray body is smaller than the radius of the shallow circular groove; the depth of the shallow circular groove is smaller than the depth of the deep groove.
[0014] Furthermore, the height of the positioning post is the same as the depth of the positioning hole; the radius of the positioning post is smaller than the radius of the positioning hole.
[0015] Furthermore, the lower tray body is provided with machine tool positioning holes, and the machine tool positioning holes and positioning holes are on two opposite sides of the lower tray body.
[0016] Furthermore, the lower tray body and the lower tray protrusion are integrally formed; the upper tray body and the upper tray protrusion are integrally formed; the upper tray body and the positioning post are connected by welding and then polished; there are 3 positioning holes and 3 positioning posts, which are evenly distributed on the edges of the lower tray body and the upper tray body; there are 6 threaded holes, which are evenly distributed on the edges of the lower tray body; and there are 12 machine tool locking holes, which are evenly distributed on the edges of the lower tray body.
[0017] (III) Beneficial Effects The semiconductor metal film etching wafer jig provided by the above technical solution includes a lower tray body, an upper tray body, and screws. The lower tray body has a shallow circular groove forming a wafer placement area. A deep groove is carved into the shallow circular groove, serving as a quick wafer loading and unloading area. The upper tray body has positioning posts, which, together with positioning holes in the lower tray body, form a positioning and connection structure, allowing the upper tray body to press and fix the wafer. The upper tray body has a perforated circular section in the center, exposing the wafer's processing surface. The screws provide a fixing function, solving the problem of the lower tray body detaching from the upper tray body. This invention achieves convenient and rapid wafer loading and unloading, avoids the use of vacuum silicone grease and high-temperature tape in the semiconductor metal film etching process, and improves the yield, efficiency, stability, and reliability of the etching process. Attached Figure Description
[0018] Figure 1 This is one of the three-dimensional structural schematic diagrams of the wafer fixture for etching semiconductor metal films according to this utility model.
[0019] Figure 2 for Figure 1 A magnified view of region A in the image.
[0020] Figure 3 This is the second three-dimensional structural schematic diagram of the wafer fixture for etching semiconductor metal films according to this utility model.
[0021] Figure 4 This is a three-dimensional cross-sectional schematic diagram of the wafer fixture for etching semiconductor metal films according to this utility model.
[0022] Figure 5 for Figure 4 A magnified view of region B in the image.
[0023] Figure 6 This is a three-dimensional structural diagram of the back side of the lower tray body of the wafer jig for etching semiconductor metal films according to this utility model. Detailed Implementation
[0024] To make the objectives, contents, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples.
[0025] Combination Figures 1 to 3 As shown, this utility model discloses a wafer jig for etching semiconductor metal films, including a lower tray body 1, an upper tray body 2, and screws 10; there is one lower tray body 1 and one upper tray body 2; there are a total of 6 screws 10, which are evenly distributed on the circumference at a 60° interval.
[0026] The lower tray body 1 has a lower tray protrusion 32, which is semi-circular and serves to facilitate the handling of wafer jigs for semiconductor metal film etching. The lower tray body 1 has a circular shallow groove 5, forming an area suitable for placing wafers. The groove depth is slightly less than the commonly used wafer thickness, approximately 50-100 μm smaller. The diameter of the circular shallow groove 5 is also adjusted and set according to the commonly used wafer size. A deep groove 4 is carved into the circular shallow groove 5, and its groove depth is greater than the groove depth of the circular shallow groove 5, approximately 500 μm greater, to facilitate the use of tweezers to handle the wafers. The lower tray body 1 has a positioning hole 6, which serves to position and fix the wafer jig. The lower tray body 1 has a threaded hole 8, which, together with the screw 10, also serves to position and fix the wafer jig.
[0027] The upper tray body 2 has an upper tray protrusion 31, which is semi-circular and serves to facilitate the handling of wafer jigs for semiconductor metal film etching. The upper tray body 2 has a circular hole 7 in the middle, which exposes the wafer processing part. The upper tray body 2 has a circular hole 9, which, together with the threaded hole 8 and screw 10, serves to position and fix the wafer jig. The upper tray body 2 has positioning posts 12, which serve to position and fix the wafer jig. There are three positioning holes 6 and three positioning posts 12, which are evenly distributed on the edges of the lower tray body 1 and the upper tray body 2.
[0028] The screw 10 has an internal hexagonal groove 11, which facilitates tightening the screw 10 with an internal hexagonal wrench; note that the screw 10 should not be over-tightened with an internal hexagonal wrench, just clamp the wafer securely.
[0029] The lower tray body 1, the upper tray body 2, and the screw 10 are all made of titanium alloy, which has corrosion resistance and ensures the service life of the wafer fixture.
[0030] Combination Figures 1 to 3 As shown, when assembling the wafer fixture, the center of the positioning hole 6 coincides with the center of the positioning post 12, and the positioning post 12 falls into the positioning hole 6, which plays a role in positioning and fixing; subsequently, the centers of the threaded hole 8 and the circular hole 9 coincide, so that the screw 10 can be screwed in; the center of the circular shallow groove 5 coincides with the center of the drilled circular 7.
[0031] Preferably, the upper tray protrusion 31 and the lower tray protrusion 32 coincide; the outer contour of the lower tray body 1 is consistent with the outer contour of the upper tray body 2. The purpose of this arrangement is to achieve rapid and accurate positioning of the positioning post and the positioning hole.
[0032] Combination Figures 1 to 5As shown, the center of the deep groove 4 is located on the edge of the circular shallow groove 5, so that a small area is exposed below the wafer, making it convenient for tweezers to pick up. The shape of the deep groove 4 is not limited and can be circular, square or rounded rectangle, as long as it meets the process requirements, all of which are within the protection scope of this utility model.
[0033] The circular 7 that has been drilled through is chamfered, with a tangent of 0.5 for the chamfer α. Sharp right angles in the wafer fixture can form electromagnetic field concentration areas, resulting in excessively high local electric field strength and interfering with the uniformity of the etching process. Chamfering can smoothly transition the electric field distribution at the edge, ensuring that the etching rate at the wafer edge is consistent with that at the center. There are various forms of chamfers, such as the beveled chamfer or rounded chamfer in the preferred embodiment of this disclosure, all of which fall within the protection scope of this utility model.
[0034] Preferably, the radius of the drilled circle 7 is smaller than the radius of the shallow circular groove 5, so that the wafer can be pressed down by the upper tray body 2 after being placed in the shallow circular groove 5.
[0035] Preferably, the height of the positioning post 12 is the same as the depth of the positioning hole 6; the radius of the positioning post 12 is smaller than the radius of the positioning hole 6; the specific dimensions of the positioning post 12 and the positioning hole 6 are set according to actual needs and meet the process requirements, and all of them fall within the protection scope of this utility model.
[0036] like Figures 4 to 6 As shown, the lower tray body 1 is provided with machine tool positioning holes 13, and the machine tool positioning holes 13 and the positioning holes 6 are on two opposite sides of the lower tray body 1. The machine tool positioning holes 13 are used for placing and positioning the wafer fixture and the machine tool. It should be noted that the length of the screw 10 is greater than the thickness of the wafer fixture, so that the screw 10 can pass through the threaded hole 8 and connect with the machine tool, thereby fixing and positioning the wafer fixture. There are a total of 12 machine tool positioning holes 13, which are evenly distributed on the edge of the lower tray body 1.
[0037] Preferably, the lower tray body 1 and the lower tray protrusion 32 are integrally formed; the upper tray body 2 and the upper tray protrusion 31 are integrally formed; the upper tray body 2 and the positioning post 12 are connected by welding and then polished.
[0038] In summary, the wafer jig for semiconductor metal film etching of this utility model includes a lower tray body 1, an upper tray body 2, and screws 10. The lower tray body 1 has a shallow circular groove 5, which forms a wafer placement area. A deep groove 4 is carved into the shallow circular groove 5, serving as a quick wafer loading and unloading area. The upper tray body 2 has a positioning post 12, which, together with the positioning hole 6 of the lower tray body 1, forms a positioning and connection structure, allowing the upper tray body 2 to press and fix the wafer. The upper tray body 2 has a perforated circular section 7 in the center, exposing the wafer's processing surface. The screws 10 provide a fixing function, solving the problem of the lower tray body 1 detaching from the upper tray body 2. The wafer jig for semiconductor metal film etching provided by this utility model enables convenient and rapid wafer loading and unloading, avoids the use of vacuum silicone grease and high-temperature tape in the semiconductor metal film etching process, and improves the yield, efficiency, stability, and reliability of the etching process.
[0039] The dimensions and shapes of the wafers involved in this invention are all conventional dimensions well known to those skilled in the art, and will not be described in detail here.
[0040] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A wafer jig for etching semiconductor metal films, characterized in that, The device includes a lower tray body and an upper tray body arranged in parallel. The lower tray body has a lower tray protrusion on its outer periphery and a shallow circular groove in its center. The edge of the shallow circular groove is carved with a deep groove. The top outer ring of the lower tray body has a positioning hole and a threaded hole. The upper tray body has an upper tray protrusion on its outer periphery and a circular hole carved through its center. The top outer ring of the upper tray body has a circular hole. The bottom surface of the upper tray body has a positioning post that matches the positioning hole. A screw passes through the circular hole and connects to the threaded hole.
2. The wafer jig for etching semiconductor metal films as described in claim 1, characterized in that, The lower tray body, upper tray body, and screws are all made of titanium alloy.
3. The wafer jig for etching semiconductor metal films as described in claim 2, characterized in that, The center of the positioning hole coincides with the center of the positioning post; the threaded hole, the round hole, and the screw are coaxial; the center of the shallow circular groove coincides with the center of the drilled-through circle.
4. The wafer jig for etching semiconductor metal films as described in claim 3, characterized in that, The upper tray protrusion and the lower tray protrusion are aligned vertically; the outer contour of the lower tray body is consistent with the outer contour of the upper tray body.
5. The wafer jig for etching semiconductor metal films as described in claim 4, characterized in that, The center of the deep groove is located on the edge of the circular shallow groove.
6. The wafer jig for etching semiconductor metal films as described in claim 5, characterized in that, The circular opening in the upper tray body has a chamfer α, and the tangent of the chamfer α is 0.
5.
7. The wafer jig for etching semiconductor metal films as described in claim 6, characterized in that, The radius of the circle that is chiseled through the upper tray body is smaller than the radius of the shallow circular groove; the depth of the shallow circular groove is smaller than the depth of the deep groove.
8. The wafer jig for etching semiconductor metal films as described in claim 7, characterized in that, The height of the positioning post is the same as the depth of the positioning hole; the radius of the positioning post is smaller than the radius of the positioning hole.
9. The wafer jig for etching semiconductor metal films as described in claim 8, characterized in that, The lower tray body is provided with machine tool locking holes, and the machine tool locking holes and positioning holes are on two opposite sides of the lower tray body.
10. The wafer jig for etching semiconductor metal films as described in claim 9, characterized in that, The lower tray body is integrally formed with the lower tray protrusion; the upper tray body is integrally formed with the upper tray protrusion; the upper tray body and the positioning post are connected by welding and then polished; there are 3 positioning holes and 3 positioning posts, which are evenly distributed on the edges of the lower tray body and the upper tray body; there are 6 threaded holes, which are evenly distributed on the edges of the lower tray body; there are 12 machine tool locking holes, which are evenly distributed on the edges of the lower tray body.