Wafer clamping device for backside inspection

Abstract

The utility model belongs to the technical field of semiconductor equipment, concretely is a kind of wafer clamping device for back detection, including bearing plate, clamping driving part, clamping transmission structure, movable clamping push block, fixed clamping push block.The wafer clamping device proposed in the utility model can greatly reduce the shielding area of the back of wafer, and effectively ensure the position stability of wafer, since the outer peripheral contour size of wafer accommodating port of bearing plate is greater than the corresponding wafer outer peripheral contour size, and wafer is only supported and clamped by movable clamping push block and fixed clamping push block.The wafer clamping device itself can be directly arranged above the corresponding external industrial camera assembly or be stably moved to the upper side of the corresponding external industrial camera assembly, so that the external industrial camera assembly can fully and reliably detect the back of wafer, without using the form of patch ring to adhere wafer, effectively reducing process cost and complexity and avoiding secondary damage to wafer.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment technology, specifically a wafer clamping device for back inspection. Background Technology

[0002] To avoid the impact of defects such as scratches, impurities, and metal contamination on the wafer surface, as well as process abnormalities such as uneven coating, on chip manufacturing yield, it is essential to inspect not only the front side of the wafer but also the back side for defects.

[0003] Currently, wafer back inspection commonly uses a chip ring to bond the wafer. However, this method has significant drawbacks: 1. Increased process cost and complexity: Chip rings require accompanying tape cutting and bonding equipment, and the bonding / removal process necessitates additional manual or automated steps, increasing costs and potentially reducing production line capacity. 2. Potential secondary wafer damage: Improper bonding / removal operations may result in adhesive residue on the wafer back side. 3. Obstruction of the wafer back side: Chip rings typically obscure a 1-2mm thick area at the wafer edge, leading to missed detection of minute defects. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this invention is to provide a wafer clamping device for back inspection.

[0005] The objective of this utility model is achieved through the following technical solution: A wafer clamping device for back inspection includes a carrier plate, a clamping drive unit, a clamping transmission structure, a movable clamping push block, and a fixed clamping push block; One end of the support plate is recessed inward to form a wafer receiving opening, the outer perimeter of which is larger than the outer perimeter of the corresponding wafer. The clamping drive has a fixed end and a driving end. The fixed end of the clamping drive is disposed on the support plate, and the driving end is connected to the movable clamping push block through the clamping transmission structure. Several fixed clamping push blocks are provided and fixedly fixed to the support plate. One end of the movable clamping push block and one end of each fixed clamping push block extend toward the center of the wafer receiving opening and are located inside the wafer receiving opening. The end of the movable clamping push block located inside the wafer receiving opening and the end of each fixed clamping push block located inside the wafer receiving opening are used together to receive and support the corresponding wafer located inside the wafer receiving opening. The driving end of the clamping drive unit drives the movable clamping push block to move closer to the corresponding wafer or further away from the corresponding wafer, so as to clamp or release the wafer.

[0006] The clamping drive is a linear cylinder or piezoelectric ceramic actuator that outputs linear power; when the movable clamping push block moves toward the corresponding wafer, the end of the movable clamping push block located inside the wafer receiving port and the end of each of the fixed clamping push blocks located inside the wafer receiving port together clamp the corresponding wafer; when the movable clamping push block moves away from the corresponding wafer, the end of the movable clamping push block located inside the wafer receiving port and the end of each of the fixed clamping push blocks located inside the wafer receiving port release the corresponding wafer.

[0007] The clamping transmission structure includes an adapter frame and a movable clamping push block mounting base; the adapter frame is connected to the movable clamping push block mounting base and the driving end of the clamping drive component respectively, and the movable clamping push block mounting base is connected to the other end of the movable clamping push block that is away from the wafer receiving port.

[0008] A slider is mounted on the movable clamping push block mounting base, and a linear slide rail is mounted on the carrier plate. The linear slide rail is slidably connected to the slider. The length direction of the linear slide rail corresponds to the moving direction of the movable clamping push block and is parallel to a corresponding radial direction of the wafer.

[0009] Two position detection sensors are also installed on the support plate. The two position detection sensors are arranged sequentially along a direction parallel to the linear slide rail. A position detection rod is also installed on the movable clamping push block mounting base. The position detection rod is used in conjunction with the two position detection sensors. The end of the position detection rod away from the movable clamping push block mounting base serves as the detection end. When a position detection sensor located away from the wafer receiving port detects that the detection end of the position detection rod is in place, the wafer is determined to be in an unclamped state, which is also the initial state. When a position detection sensor located near the wafer receiving port detects that the detection end of the position detection rod is in place, the wafer is determined to be in an overclamped state. When neither of the two position detection sensors detects that the detection end of the position detection rod is in place, the wafer is determined to be in a clamped state.

[0010] The other end of the carrier plate, away from the opening of the wafer receiving port, serves as the fixed connection end of the carrier plate.

[0011] One movable clamping push block is provided, and two fixed clamping push blocks are provided; a wafer receiving notch is recessed at the upper part of one end of the movable clamping push block located inside the wafer receiving port and at the upper part of one end of each fixed clamping push block located inside the wafer receiving port, and each wafer receiving notch is formed by connecting a clamping vertical surface and a receiving bottom surface; The upper end of the clamping face of each wafer receiving notch is flush with the top surface of the corresponding movable or fixed clamping push block. The lower end of the clamping face of each wafer receiving notch is connected to the end of the receiving bottom surface of the wafer receiving notch away from the center of the wafer receiving port. The end of the receiving bottom surface of each wafer receiving notch near the center of the wafer receiving port is flush with the end face of the corresponding movable or fixed clamping push block.

[0012] The clamping facets of each wafer receiving notch gradually slope away from the center of the wafer receiving opening from the top to the bottom; the clamping facets on the movable clamping push block and the clamping facets on each of the fixed clamping push blocks are used together to clamp the wafer directly from the outer peripheral edge of the wafer.

[0013] Each wafer receiving notch has a supporting ridge protruding from the center of its receiving bottom surface. The length direction of the supporting ridge on the receiving bottom surface of each wafer receiving notch is parallel to a corresponding radial direction of the wafer. The receiving bottom surface of each wafer receiving notch gradually slopes downward from the supporting ridge on both sides. The supporting ridges on the movable clamping push block and the supporting ridges on each of the fixed clamping push blocks are used together to support the wafer directly from the bottom surface of the wafer through line contact.

[0014] Each of the fixed clamping push blocks has a positioning groove recessed at the lower part of the end away from the wafer receiving port.

[0015] The advantages and positive effects of this utility model are as follows: 1. The wafer clamping device proposed in this utility model has a wafer receiving port on the carrier plate with a larger outer periphery than the corresponding wafer, and the wafer is supported and clamped only by the movable clamping push block and the fixed clamping push block. This can significantly reduce the area of ​​the back of the wafer being obstructed and can effectively ensure the stability of the wafer position. The overall structure is relatively simple, easy to disassemble and maintain, and has low manufacturing cost.

[0016] 2. The wafer clamping device proposed in this utility model can be directly set above the corresponding external industrial camera assembly or can be stably moved above the corresponding external industrial camera assembly, so that the external industrial camera assembly can perform stable and reliable back inspection of the back side of the wafer without using a chip ring to bond the wafer, effectively reducing process costs and complexity and avoiding secondary damage to the wafer. Attached Figure Description

[0017] Figure 1 This is a top view of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of this utility model when supporting a wafer; Figure 3This is one of the structural schematic diagrams of the fixing and clamping push block of this utility model; Figure 4 This is the second schematic diagram of the structure of the fixed clamping push block of this utility model.

[0018] In the diagram: 1 is the carrier plate, 100 is the wafer receiving port, 2 is the clamping drive component, 3 is the movable clamping push block, 4 is the fixed clamping push block, 401 is the positioning slot, 5 is the adapter frame, 6 is the movable clamping push block mounting base, 7 is the linear slide rail, 8 is the position detection sensor, 9 is the position detection rod, 1000 is the clamping vertical surface, 2000 is the receiving bottom surface, and 2001 is the support edge; 001 represents a wafer. Detailed Implementation

[0019] The following is in conjunction with the appendix Figures 1-4 The present invention will be described in further detail.

[0020] A wafer clamping device for back inspection, such as Figures 1-4 As shown, this embodiment includes a support plate 1, a clamping drive component 2, a clamping transmission structure, a movable clamping push block 3, and a fixed clamping push block 4.

[0021] One end of the support plate 1 is recessed to form a wafer receiving port 100, the outer periphery of which is larger than that of the corresponding wafer 001. In this embodiment, the other end of the support plate 1 away from the opening of the wafer receiving port 100 serves as the fixed connection end of the support plate 1, which can be connected to an external frame or robotic arm via screws. The wafer receiving port 100 can be positioned or moved above an external industrial camera assembly used for back inspection, the external industrial camera assembly being controlled by a semiconductor device control system. The clamping drive 2 has a fixed end and a driving end. The fixed end of the clamping drive 2 is located on the support plate 1, and the driving end of the clamping drive 2 is connected to the movable clamping push block 3 via a clamping transmission structure. In this embodiment, the clamping drive 2 uses a commercially available linear cylinder or piezoelectric ceramic actuator with linear power output, which can provide sufficient but not excessive clamping force, and is controlled by a semiconductor device control system.

[0022] Each fixed clamping push block 4 is fixedly attached to the support plate 1. One end of the movable clamping push block 3 and one end of each fixed clamping push block 4 extend toward the center of the wafer receiving port 100 and are located inside the wafer receiving port 100. The end of the movable clamping push block 3 located inside the wafer receiving port 100 and the end of each fixed clamping push block 4 located inside the wafer receiving port 100 are used together to receive and support the corresponding wafer 001 located inside the wafer receiving port 100.

[0023] The driving end of the clamping drive unit 2 drives the movable clamping push block 3 to move towards or away from the corresponding wafer 001, thereby clamping or releasing the wafer 001. When the movable clamping push block 3 moves towards the corresponding wafer 001, the end of the movable clamping push block 3 located inside the wafer receiving port 100 and the end of each fixed clamping push block 4 located inside the wafer receiving port 100 together clamp the corresponding wafer 001. When the movable clamping push block 3 moves away from the corresponding wafer 001, the end of the movable clamping push block 3 located inside the wafer receiving port 100 and the end of each fixed clamping push block 4 located inside the wafer receiving port 100 release the corresponding wafer 001.

[0024] In this embodiment, one movable clamping push block 3 and two fixed clamping push blocks 4 are provided, which can provide the most basic and reliable support and clamping effect. When the wafer 001 is clamped and supported inside the wafer receiving port 100, since the outer periphery of the wafer receiving port 100 is larger than the outer periphery of the corresponding wafer 001 and the wafer 001 is only supported and clamped by the movable clamping push block 3 and the fixed clamping push block 4, the occlusion area on the back of the wafer 001 can be greatly reduced, and the position of the wafer 001 can be effectively guaranteed. In addition, the wafer 001 can be automatically positioned during the clamping process, so that the external industrial camera assembly can fully inspect the back of the wafer 001.

[0025] Specifically, in this embodiment, the clamping transmission structure includes an adapter frame 5 and a movable clamping push block mounting base 6. The adapter frame 5 is connected to both the movable clamping push block mounting base 6 and the driving end of the clamping drive component 2. The movable clamping push block mounting base 6 and the other end of the movable clamping push block 3 away from the wafer receiving port 100 are connected by screws. In this embodiment, a slider is mounted on the movable clamping push block mounting base 6, and a linear slide rail 7 is mounted on the support plate 1. The linear slide rail 7 is slidably connected to the slider. The length direction of the linear slide rail 7 corresponds to the moving direction of the movable clamping push block 3 and is parallel to a corresponding radial direction of the wafer 001. The linear slide rail 7 and the slider ensure accurate and stable telescopic movement of the movable clamping push block mounting base 6 and the movable clamping push block 3.

[0026] In this embodiment, two position detection sensors 8 are also installed on the support plate 1. Both position detection sensors 8 are commercially available laser switch products and are connected and communicated with the conductor equipment control system. The two position detection sensors 8 are arranged sequentially along a direction parallel to the linear slide rail 7. A position detection rod 9 is also installed on the movable clamping push block mounting base 6 by screws. The position detection rod 9 works in conjunction with the two position detection sensors 8, and the end of the position detection rod 9 away from the movable clamping push block mounting base 6 serves as the detection end. When a position detection sensor 8 located away from the wafer receiving port 100 detects that the detection end of the position detection rod 9 is in place, the wafer 001 is determined to be in an unclamped state, which is also the initial state. When a position detection sensor 8 located near the wafer receiving port 100 detects that the detection end of the position detection rod 9 is in place, the wafer 001 is determined to be in an over-clamped state, and the wafer 001 may break. When neither of the two position detection sensors 8 detects that the detection end of the position detection rod 9 is in place, the detection end of the position detection rod 9 is actually located between the two position detection sensors 8, thus determining that the wafer 001 is in a clamping state.

[0027] Specifically, such as Figure 3 and Figure 4As shown, in this embodiment, the upper part of the movable clamping push block 3 located inside the wafer receiving port 100 and the upper part of the fixed clamping push block 4 located inside the wafer receiving port 100 are both recessed with wafer receiving notches. Each wafer receiving notch is formed by connecting a clamping surface 1000 and a receiving bottom surface 2000. The upper end of the clamping surface 1000 of each wafer receiving notch is flush with the top surface of the corresponding movable clamping push block 3 or fixed clamping push block 4. The lower end of the clamping surface 1000 of each wafer receiving notch is connected to the end of the receiving bottom surface 2000 of the wafer receiving notch away from the center of the wafer receiving port 100. The end of the receiving bottom surface 2000 of each wafer receiving notch near the center of the wafer receiving port 100 is flush with the end face of the corresponding movable clamping push block 3 or fixed clamping push block 4. The clamping surfaces 1000 on the movable clamping pusher 3 and the clamping surfaces 1000 on each fixed clamping pusher 4 are used together to directly clamp the wafer 001 from its outer peripheral edge. Each clamping surface 1000 at the wafer receiving notch gradually tilts away from the center of the wafer receiving port 100 from its top to its bottom to prevent the wafer 001 from detaching from the clamp during clamping, ensuring reliable clamping performance. Specifically, in this embodiment, the projection of the clamping surface 1000's outline onto the vertical plane is a small arc shape with a radius of 150mm. The center of this arc is located 150mm away from the center of the wafer receiving port 100, starting from the junction between the lower end of the clamping surface 1000 and the end of the receiving bottom surface 2000 furthest from the center of the wafer receiving port 100. Each wafer receiving notch has a supporting ridge 2001 protruding from its center on the receiving bottom surface 2000. The length direction of the supporting ridge 2001 on the receiving bottom surface 2000 of each wafer receiving notch is parallel to a corresponding radial direction of the wafer 001. The receiving bottom surface 2000 of each wafer receiving notch gradually slopes downward from the supporting ridge 2001 to both sides. Specifically, in this embodiment, the included angle between the receiving bottom surfaces 2000 on both sides of each supporting ridge 2001 is 172 degrees. The supporting ridges 2001 on the movable clamping push block 3 and the supporting ridges 2001 on each fixed clamping push block 4 are used together to directly support the wafer 001 from the bottom surface of the wafer 001 through line contact, which can effectively reduce the impact on the bottom surface of the wafer 001. Each fixed clamping push block 4 has a positioning groove 401 recessed at the lower part of the other end away from the wafer receiving port 100, which facilitates the installation and positioning of each fixed clamping push block 4 on the carrier plate 1. The other end of each fixed clamping push block 4 away from the wafer receiving port 100 is fixed to the carrier plate 1 by screws, which makes disassembly and assembly convenient.

Claims

1. A wafer clamping device for back inspection, characterized in that: Includes a support plate (1), a clamping drive component (2), a clamping transmission structure, a movable clamping push block (3), and a fixed clamping push block (4); One end of the support plate (1) is recessed to form a wafer receiving port (100), and the outer periphery of the wafer receiving port (100) is larger than the outer periphery of the corresponding wafer (001). The clamping drive (2) has a fixed end and a driving end. The fixed end of the clamping drive (2) is disposed on the support plate (1), and the driving end of the clamping drive (2) is connected to the movable clamping push block (3) through the clamping transmission structure. The fixed clamping push block (4) has several of them, which are respectively fixed to the support plate (1). On the carrier plate (1), one end of the movable clamping push block (3) and one end of each of the fixed clamping push blocks (4) extend toward the center of the wafer receiving port (100) and are located inside the wafer receiving port (100). The end of the movable clamping push block (3) located inside the wafer receiving port (100) and the end of each of the fixed clamping push blocks (4) located inside the wafer receiving port (100) are used together to receive and support the corresponding wafer (001) located inside the wafer receiving port (100). The driving end of the clamping drive (2) drives the movable clamping push block (3) to move closer to the corresponding wafer (001) or away from the corresponding wafer (001) to achieve clamping or releasing of the wafer (001).

2. The wafer clamping device for back inspection according to claim 1, characterized in that: The clamping drive (2) adopts a linear cylinder or piezoelectric ceramic actuator that outputs linear power; when the movable clamping push block (3) moves toward the corresponding wafer (001), the end of the movable clamping push block (3) located inside the wafer receiving port (100) and the end of each of the fixed clamping push blocks (4) located inside the wafer receiving port (100) jointly clamp the corresponding wafer (001); when the movable clamping push block (3) moves away from the corresponding wafer (001), the end of the movable clamping push block (3) located inside the wafer receiving port (100) and the end of each of the fixed clamping push blocks (4) located inside the wafer receiving port (100) release the corresponding wafer (001).

3. A wafer clamping device for back inspection according to claim 1, characterized in that: The clamping transmission structure includes an adapter frame (5) and a movable clamping push block mounting base (6); the adapter frame (5) is connected to the movable clamping push block mounting base (6) and the driving end of the clamping drive (2) respectively, and the movable clamping push block mounting base (6) is connected to the other end of the movable clamping push block (3) away from the wafer receiving port (100).

4. A wafer clamping device for back inspection according to claim 3, characterized in that: A slider is installed on the movable clamping push block mounting base (6), and a linear slide rail (7) is installed on the bearing plate (1). The linear slide rail (7) is slidably connected to the slider. The length direction of the linear slide rail (7) corresponds to the moving direction of the movable clamping push block (3) and is parallel to a corresponding radial direction of the wafer (001).

5. A wafer clamping device for back inspection according to claim 4, characterized in that: Two position detection sensors (8) are also installed on the support plate (1). The two position detection sensors (8) are arranged in sequence along the direction parallel to the linear slide rail (7). A position detection rod (9) is also installed on the movable clamping push block mounting base (6). The position detection rod (9) is used in conjunction with the two position detection sensors (8). The end of the position detection rod (9) away from the movable clamping push block mounting base (6) serves as the detection end. When one of the position detection sensors (8) located away from the wafer receiving port (100) detects that the detection end of the position detection rod (9) is in place, the wafer (001) is determined to be in an unclamped state, which is also the initial state; when one of the position detection sensors (8) located near the wafer receiving port (100) detects that the detection end of the position detection rod (9) is in place, the wafer (001) is determined to be in an overclamped state; when neither of the two position detection sensors (8) detects that the detection end of the position detection rod (9) is in place, the wafer (001) is determined to be in a clamped state.

6. A wafer clamping device for back inspection according to claim 1, characterized in that: The other end of the carrier plate (1) away from the opening of the wafer receiving port (100) serves as the fixed connection end of the carrier plate (1).

7. A wafer clamping device for back inspection according to claim 1, characterized in that: One movable clamping push block (3) is provided, and two fixed clamping push blocks (4) are provided; the upper part of the movable clamping push block (3) located on the inner side of the wafer receiving port (100) and the upper part of the fixed clamping push block (4) located on the inner side of the wafer receiving port (100) are both provided with a wafer receiving notch, and each wafer receiving notch is formed by connecting a clamping vertical surface (1000) and a receiving bottom surface (2000); The upper end of the clamping facet (1000) of each wafer receiving notch is flush with the top surface of the corresponding movable clamping push block (3) or fixed clamping push block (4). The lower end of the clamping facet (1000) of each wafer receiving notch is connected to the end of the receiving bottom surface (2000) of the wafer receiving notch away from the center of the wafer receiving port (100). The end of the receiving bottom surface (2000) of each wafer receiving notch near the center of the wafer receiving port (100) is flush with the end face of the corresponding movable clamping push block (3) or fixed clamping push block (4).

8. A wafer clamping device for back inspection according to claim 7, characterized in that: The clamping facet (1000) of each wafer receiving notch gradually slopes away from the center of the wafer receiving port (100) from the top to the bottom. The clamping facet (1000) on the movable clamping push block (3) and the clamping facet (1000) on each of the fixed clamping push blocks (4) are used together to clamp the wafer (001) directly from the outer peripheral edge of the wafer (001).

9. A wafer clamping device for back inspection according to claim 7, characterized in that: Each wafer receiving notch has a support ridge (2001) protruding from the center of its receiving bottom surface (2000). The length direction of the support ridge (2001) on the receiving bottom surface (2000) of each wafer receiving notch is parallel to a corresponding radial direction of the wafer (001). The receiving bottom surface (2000) of each wafer receiving notch gradually slopes downward from the support ridge (2001) on both sides. The support ridge (2001) on the movable clamping push block (3) and the support ridge (2001) on each of the fixed clamping push blocks (4) are used together to support the wafer (001) directly from the bottom surface of the wafer (001) through line contact.

10. A wafer clamping device for back inspection according to claim 1, characterized in that: Each of the fixed clamping push blocks (4) has a positioning groove (401) recessed at the lower part of the other end away from the wafer receiving port (100).

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