An improved vacuum chip sensitive membrane breakage clamping jig

Abstract

The utility model discloses an improve and take out chip sensitive membrane breakage's clamp fixture relates to IC manufacturing semiconductor packaging equipment technical field, include: bottom plate, set up in the lower part of substrate, bottom plate is provided with exhaust groove to the upper surface of substrate, exhaust groove sets up in substrate through -hole corresponding position area and even distribution, the depth of exhaust groove is lower than the height of bottom plate upper surface, hot pressboard, set up in the upper part of substrate, the middle part of hot pressboard is provided with openwork groove, openwork groove sets up corresponding the bonding area of substrate, and hot pressboard is parallel to the block four end of substrate step -by -step direction and is provided with the press bead. The utility model is applicable to when product normal suction vacuum, unable substrate back pasting film, vacuum hole will be adsorbed with the bottom surface of substrate, will be adsorbed to level completely to substrate, hot pressboard pressure bonding is stable, guarantees substrate and heating block effective flat pasting, will not cause substrate warping, can carry out the packaging steadily continuously.

Description

Technical Field

[0001] This utility model relates to the field of IC manufacturing semiconductor packaging equipment technology, specifically to a jig for improving the performance of vacuum chip sensitive film damage. Background Technology

[0002] Wire bonding, also known as pressure bonding, is a crucial step in semiconductor packaging, significantly impacting package reliability and final product yield. It's a process that connects the pads of a bare chip to the pins of the package frame or the metal wiring pads on the substrate using metal leads, such as gold, copper, or aluminum wires. Thermostatic bonding utilizes pressure and heat to achieve atomic attraction between the atoms at the contact surfaces of the metal leads and the bonding pads, thus achieving bonding. In the electronics world, connecting chips and packaging substrates is a delicate process, and wire bonding technology is key to this delicate work. This technology is like weaving a net in the microscopic world, tightly connecting the chip's electrodes to external circuits, ensuring unimpeded information flow.

[0003] However, the chip's sensitive film is quite fragile. During the bonding process, if the substrate is not covered with high-temperature tape, the height difference between the green solder mask and other structural layers on the substrate surface can cause the sensitive film to rupture during vacuum adsorption at the substrate position during bonding. Alternatively, if high-temperature tape is applied to the substrate during bonding, a sealed cavity is formed between the tape and the substrate / chip sensitive film. The high temperature within this sealed cavity during bonding can also cause the sensitive film to rupture. This type of product has a unique design structure, and traditional processing methods cannot meet the product quality requirements. Because the product cannot meet customer standards and will hinder the normal introduction of customer products, it causes significant problems for the company. Therefore, we need a product processing method that uses vacuum adsorption and does not involve a substrate covered with a film to solve these problems. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a fixture for improving the performance of vacuum-assisted chip sensitive film repair. This invention is applicable when a product is being vacuum-assisted normally but the back of the substrate cannot be laminated. The vacuum hole will adhere to the bottom surface of the substrate, completely adsorbing the substrate to a horizontal position, and the hot press plate will ensure stable bonding.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a jig for improving the protection of the sensitive film of a vacuum chip, comprising: a base plate disposed on the lower part of a substrate, wherein an exhaust groove is provided on the upper surface of the base plate facing the substrate, the exhaust groove is disposed in the position area corresponding to the through hole of the substrate and is horizontally and evenly distributed, and the depth of the exhaust groove is lower than the height of the upper surface of the base plate; a hot press plate disposed on the upper part of the substrate, wherein a hollow groove is provided in the middle of the hot press plate, the hollow groove is provided corresponding to the bonding area of ​​the substrate, and pressure ribs are provided at all four ends of the block parallel to the stepping direction of the substrate.

[0006] Optionally, the venting groove is vertically disposed on the upper surface of the base plate and perpendicular to the stepping direction of the substrate.

[0007] Optionally, the bottom surface of the venting groove is parallel to the surface of the substrate.

[0008] Optionally, the width of the venting groove is not greater than the diameter of the through hole in the substrate.

[0009] Optionally, the venting groove is arranged at the middle position of the bottom through hole of the chip on the substrate, and communicates with the bottom surface of the through hole of the substrate.

[0010] Optionally, the length of the reinforcing rib is not less than the length of the block region of the substrate in the substrate stepping direction.

[0011] Optionally, the cross-section of the hollowed-out groove in the middle of the hot press plate is trapezoidal, and the opening area of ​​the hollowed-out groove on the side facing the substrate is smaller than the opening area on the other side.

[0012] Optionally, the base plate is provided with multiple unit areas, and each unit area is provided with exhaust grooves of different distribution forms.

[0013] Optionally, a pressure post is provided on the lower surface of the hot press plate opposite to the substrate. The pressure post is vertically fixed to the lower surface of the hot press plate and is perpendicular to the stepping direction of the substrate.

[0014] Optionally, the pressure post is positioned corresponding to the edge of the substrate, and the height of the pressure post is greater than the unit height of the chip mounted on the substrate.

[0015] The beneficial effects of this utility model are:

[0016] This invention, by setting venting grooves on the base plate, enables effective vacuum adsorption during the pressure welding process and allows for products without substrate film. It also effectively presses / adsorbs products for mass production. The vacuum holes on the base plate adsorb to the bottom surface of the substrate, completely adsorbing it to a horizontal position. The hot press plate ensures stable pressing. The venting grooves, connected to the bottom surface of the substrate's through-holes, allow for continuous and stable encapsulation operations under normal vacuum conditions without damaging the chip's sensitive film. During the pressure welding process, the heating unit performs normal vacuum adsorption without applying high-temperature adhesive film, ensuring effective and flat adhesion between the substrate and the heating block, preventing substrate warping and allowing for stable and continuous encapsulation operations. The absence of high-temperature adhesive film on the substrate avoids creating a high-temperature sealed cavity between the substrate and the base plate, which could lead to rupture of the product's sensitive film. Attached Figure Description

[0017] Figure 1 This is an overall front view of the clamping fixture's hot press plate and base plate of this utility model;

[0018] Figure 2 This is a schematic diagram of the main structure of the hot pressing plate of the clamping fixture of this utility model;

[0019] Figure 3 This is a top view of the hot press plate of the clamping fixture of this utility model;

[0020] Figure 4 This is a schematic diagram of the main structure of the base plate of the jig of this utility model;

[0021] Figure 5 This is a top view of the base plate of the jig of this utility model;

[0022] Figure 6 This is a side view of the base plate of the jig of this utility model;

[0023] Figure 7 This is a schematic diagram of a derivative structure of the base plate of the fixture of this utility model.

[0024] Reference numerals: 1. Base plate; 11. First through hole; 12. Second through hole; 13. Venting groove; 2. Hot press plate; 21. Hollowed-out groove; 22. Rib. Detailed Implementation

[0025] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of the present invention.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0027] This invention provides a fixture for improving the protection against damage to the sensitive film of vacuum-sealed chips. Wire bonding, also known as pressure bonding, is a critical step in semiconductor packaging, significantly impacting packaging reliability and final product yield. Wire bonding is a process that connects the pads of a bare chip to the pins of the package frame or the metal wiring bonding area on the substrate using metal leads, such as gold, copper, or aluminum wires. Thermostatic bonding achieves bonding by applying pressure and heat to bring the atoms at the contact surface between the metal leads and the bonding area into a state of atomic attraction. Chip pressure bonding is a technique that uses high temperature and pressure to attach a chip to a substrate. It is a method that uses metal foil or gold wire to fix the chip to the substrate. Other commonly used connection methods include surface mount technology and through-hole technology. However, chip pressure bonding is more commonly used because it can improve parallel connection performance while preventing chip detachment, and it can also control residual stress in the chip by controlling pressure and temperature. Chip pressure bonding technology is suitable for a variety of chip and substrate materials, including aluminum, copper, ceramics, polysilicon, and quartz. It is a high-precision process widely used in the manufacturing of chips and chipsets. Chip bonding offers the following advantages: Strong connection performance; high bonding strength prevents chip failure or detachment; high precision, achieving millimeter-level accuracy; and good anti-interference performance, exhibiting good vibration and shock resistance, allowing for long-term stable operation in harsh environments. However, several points need attention during chip bonding: Precise temperature control is crucial, as welding temperature significantly impacts chip quality and lifespan; appropriate welding pressure is essential, as excessively high or low pressure can negatively affect welding quality; and careful selection of bonding equipment is vital, as suitable equipment improves welding quality and efficiency, preventing quality issues.

[0028] In one specific embodiment of this application, as follows: Figures 1-7 The system includes: a base plate 1, disposed at the lower part of the substrate, with venting grooves 13 on the surface of the base plate 1 facing the substrate. The venting grooves 13 are evenly distributed in the venting hole area of ​​the base plate 1 and are horizontally distributed corresponding to the positions of the substrate through holes; a hot press plate 2, disposed at the upper part of the substrate, with pressure posts on the surface of the hot press plate 2 opposite to the substrate. The pressure posts are vertically fixed to the surface of the hot press plate, perpendicular to the substrate stepping direction, and corresponding to the edge of the substrate. The height of the pressure posts is greater than the height of the chip mounting unit. The pressure posts can press the substrate firmly. The pressure posts will contact the four sides of each block on the front side of the substrate, pressing the substrate down to a horizontal position, ensuring stable pressing, and normal vacuum adsorption, so that each product substrate is fully bonded to the base plate. The venting grooves release excess vacuum suction, making full use of the gap between the chips mounted on the substrate. This allows for continuous and stable encapsulation operations without vacuum suction, without applying high-temperature adhesive films, and without causing damage to sensitive films.

[0029] In one specific embodiment of this application, the four ends of the unit blocks of the hot press plate 2 parallel to the stepping direction of the substrate are provided with pressure ribs 22. The pressure ribs 22 connect the pads of the bare chip to the pins of the package frame or the metal wiring soldering area on the substrate through metal leads, such as gold wires, copper wires, aluminum wires, etc. The base plate 1 is used to provide the pressure bonding platform and the temperature required during pressure bonding. The substrate is located between the base plate 1 and the hot press plate 2 and steps on a horizontal track.

[0030] In one specific embodiment of this application, a hollowed-out groove 21 is provided in the middle of the hot press plate 2, and the hollowed-out groove 21 is provided corresponding to the bonding area of ​​the substrate. During the pressure bonding process, a certain pressure needs to be applied to tightly bond the chip to the bonding area of ​​the substrate. This step can be achieved in various ways, such as using a pressing machine, a hot press, or other equipment. The purpose of applying pressure is to ensure good adhesion between the chip and the conductive silver paste or epoxy resin, thereby achieving a stable electrical connection between the chip and the external circuit. This application uses the hot press plate 2 to tightly bond the chip to the substrate after applying pressure. The entire chip mounting and bonding process is repeated cyclically. This includes steps such as reapplying conductive silver paste or epoxy resin, picking up and handling the chip again, and applying pressure again for bonding. The entire process is carried out in a cycle until all the chips that need to be bonded are fixed to the substrate. Through the cyclical repetition of key steps, the chip mounting and bonding process can efficiently fix a large number of chips to the substrate and achieve a stable electrical connection with the external circuit.

[0031] In one specific embodiment of this application, the venting groove 13 is perpendicular to the substrate stepping direction. The venting groove 13 is vertically fixed to the surface of the base plate 1, corresponding to the through-holes at the bottom of the chip mounted on the substrate. The venting groove 13 can release excess vacuum suction. This avoids the occurrence of sensitive film damage caused by the vacuum adsorption of the base plate 1 without the venting groove 13 and the formation of a high-temperature sealed cavity due to the application of a high-temperature adhesive film on the back of the substrate, while also increasing the options for handling abnormal problems. The base plate 1, through its internal air passages, uses atmospheric pressure during vacuuming to firmly and smoothly adsorb the circuit board onto the fixture surface.

[0032] Chip adsorption devices primarily use vacuum adsorption or electrostatic adsorption to securely fix chips for subsequent processing, testing, and packaging. These devices typically consist of an adsorption head, a control system, and a pneumatic system, enabling precise control of the adsorption force to ensure the chips are not damaged during processing.

[0033] In one specific embodiment of this application, the length of the pressure rib 22 is not less than the length of the unit block region of the substrate in the substrate stepping direction. This ensures stable pressing of the pressure rib 22 and high bonding quality through pressing with the hot press plate 2: chip hot pressing can achieve bonding between the chip and the carrier material at lower temperatures and pressures, thereby reducing thermal stress and material deformation, and ensuring high consistency in bonding quality. High reliability: chip hot pressing can precisely control the stability and reliability of the bonding process by controlling parameters such as temperature, pressure, and time, thereby ensuring the quality and reliability of chip hot pressing. Wide applicability: chip hot pressing is applicable to the bonding of various chips and carrier materials, possessing high versatility and flexibility. Low cost: chip hot pressing can achieve bonding between the chip and the carrier material by controlling parameters such as temperature and pressure, thereby reducing the precision components and equipment required in the welding process and lowering costs.

[0034] In one specific embodiment of this application, the bottom surface of the venting groove 13 is parallel to the surface of the substrate. This ensures that air is completely eliminated from the encapsulation materials and equipment used during the encapsulation process, forming a complete vacuum environment and preventing the formation of air bubbles.

[0035] In one specific embodiment of this application, the width of the venting groove 13 is no greater than the diameter of the substrate via. Ensuring complete vacuum is crucial: many advanced packaging processes, such as flip-chip packaging and wafer-level packaging, require operation in a vacuum environment. If the vacuum is insufficient or the time is not long enough, the gas inside the package may not be completely removed, potentially leading to bubble formation during the packaging process.

[0036] In one specific embodiment of this application, the venting groove 13 is positioned at the center of the bottom through-hole of the chip mounted on the substrate and communicates with the through-hole. By fully utilizing the fact that the venting groove 13 communicates with the bottom surface of the through-hole, continuous and stable packaging operations can be performed under normal vacuum conditions without damaging the sensitive film of the chip.

[0037] In one specific embodiment of this application, the cross-section of the hollowed-out groove 21 in the middle of the hot press plate 2 is trapezoidal, and the opening area of ​​the hollowed-out groove 21 facing the substrate is smaller than the opening area of ​​the other side. The base plate 1 is used to provide the bonding platform and the temperature required for bonding; typically, the substrate is heated to between 150°C and 200°C. The substrate is vacuum-bound on a very flat base plate 1, thus the warpage of the substrate is well controlled. The chip is also vacuum-bound on a very flat substrate, and the warpage of the chip is also well controlled. The alignment between the chip and the substrate needs to be very precise, including alignment in the XY plane, distance between the chip and the substrate, control in the Z direction, and relative tilt. Typically, the alignment accuracy requirement is ±3μm 3sigma. Excessive oxygen concentration in the bonding region can adversely affect bonding, such as the formation of voids, thus affecting the bonding strength.

[0038] In one specific embodiment of this application, the base plate 1 is provided with multiple vent areas, and each vent area is provided with exhaust channels 13 in various distribution patterns. Specifically, as shown below... Figure 7 As shown, three ventilation areas are set, and the exhaust grooves 13 in each ventilation area are different, which can be selected according to different chip models and processes, greatly improving the applicability of the base plate 1. Through the air passage at the bottom of the fixture and the numerous small holes on the surface, a vacuum pump generates negative pressure during the reflow soldering process, firmly adhering the PCB to the surface of the fixture.

[0039] In one specific embodiment of this application, the base plate 1 is provided with a first through hole 11 penetrating the upper and lower surfaces, and a second through hole 12 penetrating both sides, wherein the first through hole 11 and the second through hole 12 are connected. Vacuum adsorption on a chassis is a common wafer adsorption technology. It uses vacuum adsorption force to fix the chip onto the substrate. The chassis typically consists of multiple small holes, creating a vacuum within the holes to generate adsorption force. This vacuum adsorption offers reliability: mechanical vacuum adsorption provides stable adsorption force, ensuring the stability of the wafer during processing. It is also versatile: this method is applicable to wafers of different sizes and types, offering high flexibility. Maintenance is simple: the mechanical vacuum adsorption system is relatively easy to maintain. Multiple vacuum holes are provided at the edge of the heating zone, and exhaust grooves 13 are provided at the edge of the heating zone. These vacuum holes adsorb and fix the bottom surface of the substrate, effectively increasing the vacuum adsorption capacity of the pressure bonding fixture, ensuring a tight fit with the substrate, guaranteeing optimal bonding, improving the stability and welding strength of the wire bonding process, reducing the defect rate, and improving welding quality and product quality.

[0040] In one specific embodiment of this application, a method for encapsulation using the above-described encapsulation wire bonding heating assembly unit includes:

[0041] The equipment is powered on and the substrate is moved along the horizontal track to the bonding area;

[0042] Raise the base plate to a preset height until it contacts the back of the substrate;

[0043] Lower the hot plate to the preset height and make contact with the front of the substrate;

[0044] Press the base plate and the substrate together completely, and firmly press the front side of the substrate together;

[0045] The base plate and the hot press plate work together to fully press the substrate together, completing the pressure welding;

[0046] The base plate and hot press plate are retracted, and the substrate moves along the horizontal track. The base plate and hot press plate move to the preset height again, and the base plate and hot press plate together press the substrate completely together to complete the pressure welding. This process is repeated until the pressure welding and encapsulation are completed, and the equipment stops.

[0047] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A jig for improving the performance of vacuum chip sensitive film damage, characterized in that, include: A base plate is disposed at the lower part of the substrate. The base plate has venting grooves on its upper surface facing the substrate. The venting grooves are disposed in the area corresponding to the through holes of the substrate and are horizontally and evenly distributed. The depth of the venting grooves is lower than the height of the upper surface of the base plate. A hot press plate is disposed on the upper part of the substrate. A hollow groove is provided in the middle of the hot press plate, which corresponds to the bonding area of ​​the substrate. Pressure ribs are provided at all four ends of the block parallel to the stepping direction of the substrate.

2. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 1, characterized in that, The exhaust groove is vertically disposed on the upper surface of the base plate and is perpendicular to the stepping direction of the substrate.

3. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 2, characterized in that, The bottom surface of the exhaust groove is parallel to the surface of the substrate.

4. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 3, characterized in that, The width of the venting groove is not greater than the diameter of the through hole in the substrate.

5. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 4, characterized in that, The venting groove is positioned at the middle of the bottom through-hole of the chip mounted on the substrate, and communicates with the bottom surface of the through-hole of the substrate.

6. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 1, characterized in that, The length of the rib is not less than the length of the block region of the substrate in the stepping direction of the substrate.

7. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 1, characterized in that, The cross-section of the hollowed-out groove in the middle of the hot press plate is trapezoidal, and the opening area of ​​the hollowed-out groove on the side facing the substrate is smaller than the opening area on the other side.

8. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 1, characterized in that, The base plate is provided with multiple unit areas, and each unit area is provided with exhaust channels in different distribution forms.

9. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 1, characterized in that, A pressure post is provided on the lower surface of the hot press plate opposite to the substrate. The pressure post is vertically fixed to the lower surface of the hot press plate and is perpendicular to the stepping direction of the substrate.

10. The jig for improving the protection of the sensitive film of a vacuum chip according to claim 9, characterized in that, The pressure post is positioned corresponding to the edge of the substrate, and the height of the pressure post is greater than the unit height of the chip mounted on the substrate.

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