Wafer vacuum chuck plate

Abstract

The utility model relates to wafer processing technical field, concretely is a kind of wafer vacuum adsorption plate, including pedestal, vacuum pipe and adsorption mechanism, vacuum pipe and the inner wall of pedestal are connected through, and adsorption mechanism is set on the surface of pedestal;Adsorption mechanism includes adjusting assembly, fixed assembly and auxiliary assembly, adjusting assembly includes adsorption tray one, and the surface fixed connection of adsorption tray one and pedestal, the surface rotationally connected with adsorption tray two of adsorption tray one, the surface rotationally connected with adsorption tray three of adsorption tray two, and the surface of adsorption tray one, adsorption tray two and adsorption tray three are all set with adsorption hole;The inside of adsorption tray one, adsorption tray two and adsorption tray three are all set with adsorption cavity.The utility model, by setting adsorption mechanism, utilize adjustable use's adsorption tray one, adsorption tray two and adsorption tray three, it is convenient to adsorb the wafer of different sizes according to needs, and whole adjusting process is more time-saving and labor-saving, and the applicability of equipment is effectively improved to this.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer vacuum adsorption plate. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Various circuit element structures can be fabricated on silicon wafers to become IC products with specific electrical functions. When wafers need to be fixed during the processing, vacuum adsorption is often used for fixing.

[0003] Existing technologies, such as Chinese Patent Publication No. CN219917117U, disclose a wafer vacuum adsorption and fixing mechanism, including a wafer vacuum adsorption machine base, a wafer adsorption disk, and an external adsorption disk. The wafer vacuum adsorption machine base has a vacuum adsorption pump inside, and a support frame is located above the base. A cable board is located at one end of the support frame, and a thick flexible tube and a thin flexible tube are sequentially arranged inside the cable board. One end of the thick and thin flexible tubes is connected to the vacuum adsorption pump, and the other end passes through a positioning plate and connects to a fixing plate. The fixing plate and the positioning plate are fixedly connected by a support rod. This invention features four pre-reserved fixing interfaces inside the fixing plate, providing interface positions in all four directions (front, back, left, and right). External adsorption disks can be added according to the wafer size, thereby expanding the size of the wafer adsorption disk and enabling the adsorption and fixing of wafers of various sizes, thus broadening its applicability. However, when adsorbing wafers of different sizes, this utility model requires the removal and installation of multiple bolts to install multiple adsorption plates, making the entire operation process quite cumbersome. Furthermore, the need to reserve space and interfaces for installation results in a large size of the equipment, which is not conducive to its use.

[0004] To address the issue that wafer vacuum adsorption plates are not suitable for adsorbing and fixing wafers of different sizes, existing wafer vacuum adsorption mechanisms generally have fixed adsorption plate sizes, which can only adsorb wafers of one size. If a larger wafer is adsorbed, the suction force will be insufficient, causing the wafer to loosen, shift, or slip during the adsorption and fixing process, thus compromising the safety of wafer fixation. Although a few adsorption mechanisms can be equipped with adsorption plates, the installation process is cumbersome, time-consuming, and labor-intensive. Therefore, improvements are needed. Utility Model Content

[0005] The purpose of this invention is to solve the problem that existing wafer vacuum adsorption plates are not convenient for adsorbing and fixing wafers of different sizes, and to propose a wafer vacuum adsorption plate.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wafer vacuum adsorption plate, comprising a base, a vacuum tube and an adsorption mechanism, wherein the vacuum tube is connected to the inner wall of the base, and the adsorption mechanism is disposed on the surface of the base; The adsorption mechanism includes an adjustment component, a fixing component, and an auxiliary component. The adjustment component includes an adsorption disk one, which is fixedly connected to the surface of the base. An adsorption disk two is rotatably connected to the surface of the adsorption disk one, and an adsorption disk three is rotatably connected to the surface of the adsorption disk two. Adsorption holes are provided on the surfaces of the adsorption disk one, adsorption disk two, and adsorption disk three. The adsorption disk 1, adsorption disk 2 and adsorption disk 3 are all provided with adsorption chambers inside. The surface of adsorption disk 1 is connected to a connecting hole 1, which is fixedly connected to the surface of the vacuum tube. The surface of adsorption disk 2 is connected to a connecting hole 2, and the surface of adsorption disk 3 is provided with a connecting hole 3.

[0007] Furthermore, the number of adsorption pores is multiple and evenly distributed around the circumference. The adsorption pores are connected to the adsorption cavity, and the first connecting hole, the second connecting hole, and the third connecting hole are all connected to the adsorption cavity.

[0008] Furthermore, the fixing component includes a sliding groove, which is formed on the surface of the base. A retaining plate is slidably connected to the surface of the sliding groove. The surfaces of the first adsorption plate, the second adsorption plate, and the third adsorption plate are all provided with retaining grooves, and the retaining plate is engaged with the surface of the retaining groove.

[0009] Furthermore, a telescopic rod is fixedly connected to the surface of the slide groove, the telescopic rod is fixedly connected to the surface of the clamping plate, a spring is sleeved on the surface of the telescopic rod, one end of the spring is fixedly connected to the surface of the slide groove, and the other end of the spring is fixedly connected to the surface of the clamping plate.

[0010] Furthermore, the number of the slide, the plate, the slot, the telescopic rod and the spring are all two sets, the two sets of the slot are symmetrically arranged, and the slide and the plate are both set in a "T" shape.

[0011] Furthermore, the auxiliary component includes a positioning block, which is fixedly connected to the surface of the first adsorption plate, and positioning grooves are provided on the surfaces of the second and third adsorption plates.

[0012] Furthermore, the positioning block cooperates with the positioning groove, and sealing rings are fixedly connected to the surfaces of both the first and second adsorption plates.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows: 1. In this utility model, by setting up an adsorption mechanism, the vacuum tube is connected to an external vacuuming device. A pair of adsorption chambers are evacuated using the connection hole connected to the vacuum tube, and the wafer is adsorbed using the adsorption hole of adsorption plate one. When it is necessary to adsorb a larger wafer, simply push the two sets of clamping plates to slide along the slide groove and disengage from the clamping slot, so that the telescopic rod shortens and presses the spring. At this time, adsorption plates two and three can rotate. When adsorption plate two is rotated so that its positioning groove is aligned with the positioning block, connection hole two is aligned with connection hole one, and adsorption plates one and two can be used together to adsorb the wafer. When adsorption plates two and three are rotated so that their positioning grooves are aligned with the positioning block, connection holes two and three are aligned with connection hole one, and adsorption plates one, two, and three can be used together to adsorb the wafer. After adjustment, the clamping plates are released, and the telescopic rod extends under the spring rebound, so that the clamping plates are locked back into the clamping slot, thus fixing the equipment.

[0014] 2. In this utility model, by setting up an adsorption mechanism, and using adjustable adsorption plates one, two, and three, it is convenient to adsorb wafers of different sizes as needed, and the whole adjustment process is relatively time-saving and labor-saving, thus effectively improving the applicability of the equipment. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of a wafer vacuum adsorption plate is provided for this utility model; Figure 2 This invention provides an exploded view of the adsorption mechanism in a wafer vacuum adsorption plate. Figure 3 This utility model provides a cross-sectional view of the adjustment component of the adsorption mechanism in a wafer vacuum adsorption plate. Figure 4 This utility model provides a cross-sectional view of the fixing component of the adsorption mechanism in a wafer vacuum adsorption plate. Figure 5 This utility model proposes a wafer vacuum adsorption plate. Figure 4 A schematic diagram of the structure at point A; Figure 6 This utility model proposes a wafer vacuum adsorption plate. Figure 4 A schematic diagram of the structure at point B.

[0016] Legend: 1. Base; 2. Vacuum tube; 3. Adsorption mechanism; 31. Adjustment component; 311. Adsorption plate one; 312. Adsorption plate two; 313. Adsorption plate three; 314. Adsorption hole; 315. Adsorption chamber; 316. Connection hole one; 317. Connection hole two; 318. Connection hole three; 32. Fixing component; 321. Slide groove; 322. Clamping plate; 323. Clamping slot; 324. Telescopic rod; 325. Spring; 33. Auxiliary component; 331. Positioning block; 332. Positioning groove; 333. Sealing ring. Detailed Implementation

[0017] Please see Figures 1-6 This utility model provides a technical solution: a wafer vacuum adsorption plate, including a base 1, a vacuum tube 2 and an adsorption mechanism 3, wherein the vacuum tube 2 is connected to the inner wall of the base 1, and the adsorption mechanism 3 is disposed on the surface of the base 1.

[0018] The specific setup and function of its adsorption mechanism 3 will be explained below.

[0019] In this embodiment: the adsorption mechanism 3 includes an adjustment component 31, a fixing component 32 and an auxiliary component 33. The adjustment component 31 includes an adsorption disk 311, which is fixedly connected to the surface of the base 1. An adsorption disk 312 is rotatably connected to the surface of the adsorption disk 311, and an adsorption disk 313 is rotatably connected to the surface of the adsorption disk 312. Adsorption holes 314 are opened on the surfaces of the adsorption disks 311, 312 and 313. Adsorption chambers 315 are provided inside the adsorption disks 311, 312, and 313. A connecting hole 316 is provided through the surface of the adsorption disk 311, and the connecting hole 316 is fixedly connected to the surface of the vacuum tube 2. A connecting hole 317 is provided through the surface of the adsorption disk 312, and a connecting hole 318 is provided on the surface of the adsorption disk 313.

[0020] The effects achieved by the above components are as follows: Adsorption disk one 311, adsorption disk two 312, and adsorption disk three 313 are provided to facilitate the adsorption of wafers of different sizes through rotational adjustment; adsorption holes 314, adsorption chambers 315, and connection hole one 316 are provided so that when vacuum tube 2 is connected to external vacuum equipment, the adsorption chamber 315 can be evacuated using connection hole one 316 connected to vacuum tube 2, thereby allowing adsorption holes 314 to adsorb wafers under negative pressure; connection hole two 31... 7 and the third connection hole 318 are designed so that when the second adsorption disk 312 is rotated to align the second connection hole 317 with the first connection hole 316, the adsorption disk 311 and the adsorption hole 314 on the second adsorption disk 312 can be used to adsorb the wafer together. When the second adsorption disk 312 and the third adsorption disk 313 are rotated to align the second connection hole 317, the third connection hole 318 and the first connection hole 316, the adsorption disk 311, the second adsorption disk 312 and the third adsorption disk 313 can be used to adsorb the wafer together.

[0021] Specifically, there are multiple sets of adsorption holes 314, which are evenly distributed around the circumference. The adsorption holes 314 are connected to the adsorption cavity 315. Connecting holes 1 316, 2 317 and 3 318 are all connected to the adsorption cavity 315.

[0022] The effect achieved by the above components is that setting multiple sets of adsorption holes 314 is to increase the adsorption effect and adsorption area, so as to perform uniform and stable adsorption on the wafer.

[0023] Specifically, the fixing component 32 includes a slide groove 321, which is formed on the surface of the base 1. A retaining plate 322 is slidably connected to the surface of the slide groove 321. The surfaces of the first adsorption plate 311, the second adsorption plate 312, and the third adsorption plate 313 are all provided with retaining grooves 323, and the retaining plate 322 is engaged with the surface of the retaining groove 323.

[0024] The effects achieved by the above components are as follows: the sliding groove 321 is provided to facilitate the sliding of the clamping plate 322, and the clamping plate 322 and the clamping groove 323 are provided to facilitate the fixing of the second adsorption plate 312 and the third adsorption plate 313.

[0025] Specifically, a telescopic rod 324 is fixedly connected to the surface of the slide 321, the telescopic rod 324 is fixedly connected to the surface of the clamping plate 322, and a spring 325 is sleeved and connected to the surface of the telescopic rod 324. One end of the spring 325 is fixedly connected to the surface of the slide 321, and the other end of the spring 325 is fixedly connected to the surface of the clamping plate 322.

[0026] The effects achieved by the above components are as follows: the telescopic rod 324 provides guidance and limit for the movement of the clamping plate 322, and the spring 325 not only ensures that the clamping plate 322 is clamped in the clamping groove 323, but also facilitates the reset of the clamping plate 322 by utilizing its rebound effect.

[0027] Specifically, there are two sets of slide rails 321, clamping plates 322, clamping slots 323, telescopic rods 324, and springs 325. The two sets of clamping slots 323 are arranged symmetrically, and both slide rails 321 and clamping plates 322 are set in a "T" shape.

[0028] The effects achieved by the above components are as follows: the two sets of slots 323 and the card plate 322 are provided so that the two sets of card plates 322 can be disengaged from the slots 323 at the same time to rotate the second adsorption plate 312 and the third adsorption plate 313, thus avoiding accidental contact. The card plate 322 is set in a "T" shape so that when the card plate 322 is inserted into the slot 323, it not only restricts the rotation of the second adsorption plate 312 and the third adsorption plate 313, but also prevents the second adsorption plate 312 and the third adsorption plate 313 from moving up and down.

[0029] Specifically, the auxiliary component 33 includes a positioning block 331, which is fixedly connected to the surface of the first adsorption plate 311, and the surfaces of the second adsorption plate 312 and the third adsorption plate 313 are both provided with positioning grooves 332.

[0030] The effect achieved by the above components is as follows: the positioning block 331 and the positioning groove 332 are set to visually show whether the second connection hole 317 and the third connection hole 318 are aligned with the first connection hole 316, which is more conducive to quick adjustment operations.

[0031] Specifically, the positioning block 331 cooperates with the positioning groove 332, and the surfaces of the first adsorption plate 311 and the second adsorption plate 312 are both fixedly connected with sealing rings 333.

[0032] The effect achieved by the above components is as follows: the sealing ring 333 is set to increase the sealing between adsorption disk 1 311, adsorption disk 2 312 and adsorption disk 313, thereby improving the adsorption effect.

[0033] Working principle: The adsorption mechanism 3 is set up, and the vacuum tube 2 is connected to an external vacuum pumping device. A vacuum is drawn into the adsorption chamber 315 using the connection hole 316 connected to the vacuum tube 2. The wafer is then adsorbed using the adsorption holes 314 of the adsorption plate 311. When a larger wafer needs to be adsorbed, simply push the two sets of clamping plates 322, causing them to slide along the slide groove 321 and disengage from the clamping slot 323. This shortens the telescopic rod 324 and compresses the spring 325. At this time, the adsorption plates 312 and 313 can rotate. When the adsorption plate 312 is rotated so that its positioning groove 332 aligns with the positioning block 331, the wafer is fully oriented. When the second connection hole 317 is aligned with the first connection hole 316, the first adsorption plate 311 and the second adsorption plate 312 can be used together to adsorb the wafer. When the second adsorption plate 312 and the third adsorption plate 313 are rotated so that the positioning grooves 332 on them are aligned with the positioning blocks 331, the second connection hole 317 and the third connection hole 318 are aligned with the first connection hole 316. The first adsorption plate 311, the second adsorption plate 312 and the third adsorption plate 313 can be used together to adsorb the wafer. After the adjustment is completed, the clamping plate 322 is released. Under the action of the spring 325, the telescopic rod 324 extends, so that the clamping plate 322 is locked into the clamping groove 323 again, thereby fixing the equipment.

[0034] By setting up the adsorption mechanism 3, and utilizing the adjustable adsorption disks 311, 312, and 313, it is convenient to adsorb wafers of different sizes as needed. The entire adjustment process is time-saving and labor-saving, which effectively improves the applicability of the equipment.

Claims

1. A wafer vacuum adsorption plate, comprising a base (1), a vacuum tube (2), and an adsorption mechanism (3), characterized in that: The vacuum tube (2) is connected to the inner wall of the base (1), and the adsorption mechanism (3) is disposed on the surface of the base (1). The adsorption mechanism (3) includes an adjustment component (31), a fixing component (32), and an auxiliary component (33). The adjustment component (31) includes an adsorption disk one (311), which is fixedly connected to the surface of the base (1). An adsorption disk two (312) is rotatably connected to the surface of the adsorption disk one (311), and an adsorption disk three (313) is rotatably connected to the surface of the adsorption disk two (312). Adsorption holes (314) are provided on the surfaces of the adsorption disk one (311), the adsorption disk two (312), and the adsorption disk three (313). The adsorption chamber (315) is provided inside the adsorption disk one (311), adsorption disk two (312) and adsorption disk three (313). The surface of the adsorption disk one (311) is connected to the connecting hole one (316), and the connecting hole one (316) is fixedly connected to the surface of the vacuum tube (2). The surface of the adsorption disk two (312) is connected to the connecting hole two (317), and the surface of the adsorption disk three (313) is provided with the connecting hole three (318).

2. The wafer vacuum adsorption plate according to claim 1, characterized in that: The number of adsorption holes (314) is multiple and they are evenly distributed in a circle. The adsorption holes (314) are connected to the adsorption cavity (315). The first connecting hole (316), the second connecting hole (317) and the third connecting hole (318) are all connected to the adsorption cavity (315).

3. The wafer vacuum adsorption plate according to claim 1, characterized in that: The fixing component (32) includes a slide groove (321), which is formed on the surface of the base (1). A retaining plate (322) is slidably connected to the surface of the slide groove (321). The surfaces of the first adsorption plate (311), the second adsorption plate (312), and the third adsorption plate (313) are all provided with retaining grooves (323). The retaining plate (322) is engaged with the surface of the retaining groove (323).

4. A wafer vacuum adsorption plate according to claim 3, characterized in that: A telescopic rod (324) is fixedly connected to the surface of the slide groove (321). The telescopic rod (324) is fixedly connected to the surface of the clamping plate (322). A spring (325) is sleeved and connected to the surface of the telescopic rod (324). One end of the spring (325) is fixedly connected to the surface of the slide groove (321), and the other end of the spring (325) is fixedly connected to the surface of the clamping plate (322).

5. A wafer vacuum adsorption plate according to claim 4, characterized in that: The number of the slide (321), the card plate (322), the card slot (323), the telescopic rod (324) and the spring (325) are all in two sets. The two sets of card slots (323) are symmetrically arranged. The slide (321) and the card plate (322) are both set in a "T" shape.

6. A wafer vacuum adsorption plate according to claim 1, characterized in that: The auxiliary component (33) includes a positioning block (331), which is fixedly connected to the surface of the first adsorption plate (311), and the surfaces of the second adsorption plate (312) and the third adsorption plate (313) are provided with positioning grooves (332).

7. A wafer vacuum adsorption plate according to claim 6, characterized in that: The positioning block (331) cooperates with the positioning groove (332), and the surfaces of the first adsorption plate (311) and the second adsorption plate (312) are fixedly connected with sealing rings (333).

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