Wafer vacuum detection apparatus

Abstract

The utility model provides a kind of vacuum detection equipment of wafer, including vacuum cavity one, vacuum cavity two, vacuum valve group one, vacuum cavity one is equipped with stage one, stage one is used for up and down material transfer, including multiple upper and lower laminated support table, and support table is used to place wafer;Vacuum valve group one is located between vacuum cavity one and vacuum cavity two, for connecting or isolating vacuum cavity one and vacuum cavity two;Vacuum cavity two is equipped with detection module, and detection module includes stage two, transplanting mechanism, material taking mechanical arm, detection mechanism, stage two is used for positioning wafer, and the output end of transplanting mechanism is equipped with stage two, for driving stage two moves between detection station and material taking station, detection mechanism is located in detection station, for detecting wafer, and material taking mechanical arm is used to transport wafer.The utility model can greatly reduce vacuum time by setting up and down material transfer small vacuum cavity and reducing detection vacuum cavity volume, improves detection efficiency, saves resource and production cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a vacuum inspection device for wafers. Background Technology

[0002] In modern semiconductor wafer manufacturing, wafer inspection is one of the key processes to ensure product quality. Wafer inspection generally involves checking the wafer surface for any defects, contaminants, or other features that may affect the performance and reliability of semiconductor devices. To ensure the accuracy of the inspection results, the wafer is typically inspected in a vacuum environment.

[0003] Currently, in vacuum testing, the wafer and wafer inspection equipment are placed in a large cavity, and then the air inside the cavity is evacuated by a vacuum pump to achieve the required vacuum level. Because the cavity is large, it takes a significant amount of time to reach the required vacuum level, and vacuuming is required every time a wafer is loaded or unloaded. This vacuuming time accounts for a large portion of the testing process, resulting in long downtime for the wafer inspection equipment, severely impacting testing efficiency. This not only reduces the overall production efficiency of wafer manufacturing but also increases equipment energy consumption and production costs. Utility Model Content

[0004] The present invention aims to provide a vacuum inspection device for wafers to overcome the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: a vacuum inspection device for wafers, including a vacuum chamber one, a vacuum chamber two, and a vacuum valve group one. A stage one is provided inside the vacuum chamber one, the size of which is adapted to the inner cavity of the vacuum chamber one. The stage one is used for loading and unloading transfer and includes multiple stacked support platforms for placing wafers. The vacuum valve group one is located between the vacuum chamber one and the vacuum chamber two, used to connect or isolate the two chambers. A detection module is provided inside the vacuum chamber two, the size of which is adapted to the inner cavity of the vacuum chamber two. The detection module includes a stage two, a transfer mechanism, a picking robot arm, and a detection mechanism. The stage two is used to position the wafer. The output end of the transfer mechanism is equipped with the stage two, used to drive the stage two to move between the detection station and the picking station. The detection mechanism is located at the detection station and used to inspect the wafer. The picking robot arm is used to transport the wafer between the vacuum chamber one and the vacuum chamber two.

[0006] Preferably, the outer side of the vacuum chamber one is provided with a window for loading and unloading materials, the outer side of the window is provided with a vacuum valve group two, and the top of the vacuum chamber one is provided with a chamber cover that is detachably connected to the main body of the vacuum chamber one, and the chamber cover is provided with a handle.

[0007] Preferably, the bottom surface of vacuum chamber one and vacuum chamber two is also provided with an integrated flange, on which a gas pipe connector, an optical fiber vacuum connector and a vacuum flange are integrated and installed. The integrated installation makes the appearance more beautiful and facilitates maintenance. The vacuum flange is connected to a vacuum angle valve, and the vacuum angle valve is connected to a vacuum pump through a metal bellows.

[0008] Furthermore, in the aforementioned wafer vacuum inspection equipment, there are two support stages, which are respectively used to place wafers to be inspected and wafers that have been inspected. The first stage also includes a stage base plate. The outer periphery of the stage base plate is provided with multiple vertical support plates. The support stage includes multiple horizontal support plates that are arranged one-to-one with the vertical support plates. The horizontal support plates are arranged inside the corresponding vertical support plates.

[0009] Furthermore, in the aforementioned wafer vacuum inspection equipment, the bottom of the vacuum chamber is also provided with a lifting mechanism. The lifting mechanism is used to drive the stage to move up and down, and includes a lifting rod, a lifting plate, a lifting seat, and a lifting linear module. The lifting seat is located below the vacuum chamber and has the lifting linear module on it. The output end of the lifting linear module has a lifting plate. The top end of the lifting rod is connected to the stage and the bottom end is connected to the lifting plate. A plurality of guide rods are also provided between the lifting seat and the vacuum chamber, surrounding the lifting linear module. The guide rods are inserted into the lifting plate and slidably connected to the lifting plate.

[0010] Furthermore, in the aforementioned wafer vacuum inspection equipment, the stage two includes a stage connecting ring and multiple extension plates disposed on the stage connecting ring. The multiple extension plates are disposed along the inner circumference of the stage connecting ring and extend radially toward the stage connecting ring. The radially extending end of the extension plate is provided with a support column, and the top of the support column is provided with a friction pad. The multiple friction pads cooperate to adsorb the wafer.

[0011] Furthermore, in the aforementioned vacuum inspection equipment for wafers, the stage two further includes a rotating assembly, which includes a rotating base plate, a large gear, and a servo motor. The rotating base plate has a large gear rotatably connected to it in the middle. The servo motor is installed at the bottom of the rotating base plate, and its output end has a small gear. The large gear and the small gear are meshed and connected. The stage connecting ring is located on the top of the large gear.

[0012] Furthermore, in the aforementioned wafer vacuum inspection equipment, the transfer mechanism includes a movable base plate and a linear module 1 disposed above the movable base plate. The linear module 1 has guide rails 1 on both sides, a movable plate 1 at the output end of the linear module 1, and sliders slidably connected to the guide rails 1 on both sides of the movable plate 1. The stage 2 is disposed on the movable plate 1.

[0013] Furthermore, in the aforementioned wafer vacuum inspection equipment, the picking robot arm includes a mounting base and a linear module three mounted on the mounting base. The output end of the linear module three is provided with an extension arm extending to the middle of the stage two. The end of the extension arm is provided with a picking arm, and the end of the picking arm is provided with multiple friction pads two, which cooperate to adsorb the wafer. The picking arm is fixedly connected to the extension arm via a pressure plate.

[0014] Furthermore, the aforementioned wafer vacuum inspection equipment also includes a lifting mechanism, which includes a second movable plate and a second linear module for driving the second movable plate to move horizontally. The second linear module is connected to the output end of the transfer mechanism, and the two sides of the second linear module are also provided with guide rails slidably connected to the second movable plate. The front and rear sides of the second movable plate are provided with transmission components connected to the rotating seat plate of the second platform. The transmission components can convert the horizontal movement of the second movable plate into the vertical movement of the second platform.

[0015] Furthermore, in the aforementioned wafer vacuum inspection equipment, the transmission assembly includes an upper wedge block, a lower wedge block, an upper support arm, and a lower support arm. Both the upper and lower wedge blocks are triangular. The upper wedge block is connected to the second platform, and the lower wedge block is disposed on the second movable plate. The wedge-shaped inclined surfaces of the upper and lower wedge blocks are provided with matching cross guide rails. The upper support arm is disposed on both sides of the upper wedge block, and the side of the upper support arm closest to the lower support arm is provided with a guide rail three arranged in the vertical direction. The lower support arm is disposed on both sides of the lower wedge block, and the lower support arm is provided with a slider that is slidably connected to the guide rail three.

[0016] Furthermore, in the aforementioned wafer vacuum testing equipment, the testing mechanism includes a reflectance spectrometer and a transmission spectrometer. Both the reflectance spectrometer and the transmission spectrometer are installed in the vacuum chamber two via mounting components. The reflectance spectrometer is positioned above the stage two, and the transmission spectrometer includes an optical path one positioned above the stage two and an optical path two positioned below the stage two.

[0017] Compared with the prior art, the beneficial effects of this utility model are: by setting up a small vacuum chamber for loading and unloading and reducing the volume of the detection vacuum chamber, this utility model can greatly reduce the vacuuming time, reduce equipment downtime, improve detection efficiency, and save resources and production costs. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the vacuum testing equipment for wafers according to this utility model; Figure 2 This is a partial structural diagram of the vacuum inspection equipment for wafers according to this utility model. Figure 1 ; Figure 3 This is a schematic diagram showing the connection between the lifting mechanism and the stage of the vacuum testing equipment for wafers according to this utility model; Figure 4 This is a schematic diagram of the interior of the vacuum chamber 2 of the wafer vacuum testing device of this utility model; Figure 5 This is a partial structural diagram of the vacuum inspection equipment for wafers according to this utility model. Figure 2 ; Figure 6 This is a partial structural diagram of the vacuum inspection equipment for wafers according to this utility model. Figure 3 ; In the diagram: 11. Vacuum chamber one; 111. Vacuum valve assembly two; 112. Vacuum flange; 113. Integrated flange; 12. Vacuum chamber two; 13. Vacuum valve assembly one; 2. Platform 1; 21. Support platform; 22. Platform base plate; 23. Support vertical plate; 3. Platform 2; 31. Platform connecting ring; 32. Extension plate; 33. Support column; 34. Friction pad 1; 35. Rotary seat plate; 36. Large gear; 37. Servo motor; 4. Transplanting mechanism; 41. Movable base plate; 42. Linear module one; 43. Guide rail one; 44. Movable plate one; 5. Material handling robotic arm; 51. Mounting support; 52. Linear module three; 53. Extension arm; 54. Material handling arm; 55. Friction pad two; 6. Testing institution; 61. Reflectance spectrometer; 62. Transmission spectrometer; 621. Optical path one; 622. Optical path two; 7. Lifting mechanism; 71. Lifting rod; 72. Lifting plate; 73. Lifting seat; 74. Lifting linear module; 75. Guide rod; 8. Lifting mechanism; 81. Moving plate II; 82. Linear module II; 83. Guide rail II; 84. Upper wedge block; 85. Lower wedge block; 86. Upper support arm; 87. Lower support arm; 88. Cross guide rail; 89. Guide rail III. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1 like Figure 1-6 As shown, a vacuum inspection device for wafers includes a vacuum chamber 11, a vacuum chamber 2 12, and a vacuum valve assembly 13. A stage 2 is disposed within the vacuum chamber 11, the inner cavity of which is adapted to the size of the stage 2. The stage 2 is used for loading and unloading and includes multiple stacked support platforms 21 for placing wafers. The vacuum valve assembly 13 is located between the vacuum chamber 11 and the vacuum chamber 2 12, used to connect or isolate the two chambers. The second cavity 12 is equipped with a detection module. The inner cavity of the second vacuum cavity 12 is adapted to the size of the detection module, which is a detection vacuum cavity. The detection module includes a second stage 3, a transfer mechanism 4, a picking robot arm 5, and a detection mechanism 6. The second stage 3 is used to position the wafer. The output end of the transfer mechanism 4 is equipped with the second stage 3, which is used to drive the second stage 3 to move between the detection station and the picking station. The detection mechanism 6 is located at the detection station and is used to detect the wafer. The picking robot arm 5 is used to transport the wafer between the first vacuum 11 and the second vacuum cavity 12.

[0022] Corresponding to vacuum valve assembly one, vacuum chamber one and vacuum chamber two are respectively provided with a conveying port and a conveying port two. Both sides of vacuum valve assembly one are provided with sealing parts that are sealed to the conveying ports and conveying ports two. A gate is provided inside the sealing part. The gate is driven to open and close by a driving component, which can connect or isolate vacuum chamber one and vacuum chamber two; in addition, such as Figure 1-2 As shown, the outer side of vacuum chamber one is provided with a window for loading and unloading materials, and a vacuum valve group two is provided outside the window. The top of vacuum chamber one is provided with a chamber cover that is detachably connected to the main body of vacuum chamber one, and a handle is provided on the chamber cover.

[0023] Initially, vacuum valve assembly 13 isolates vacuum chamber 11 from vacuum chamber 2. Vacuum chamber 2 is evacuated. The wafer to be tested is loaded into vacuum chamber 11 through the loading / unloading window. After loading, vacuum valve assembly 2 is closed and vacuum chamber 11 is evacuated. Then, vacuum valve assembly 13 is opened to connect vacuum chamber 11 and vacuum chamber 2. At this time, the picking robot arm 5 passes through vacuum valve assembly 13 into vacuum chamber 11, picks up the wafer to be tested, and transports it to the picking station. Vacuum valve assembly 13 is then closed. At this time, stage 2 3 moves... The loading mechanism 4 also moves to the unloading station, and the unloading robotic arm 5 places the wafer onto the second stage 3. The second stage 3, loaded with the wafer, moves to the testing station to begin testing. After testing, the second stage 3 moves to the unloading station, and the unloading robotic arm 5 removes the tested wafer. After confirming that the first vacuum chamber 11 is in a vacuum state, the vacuum valve group 13 is opened, and the unloading robotic arm 5 transports the tested wafer to the first stage 2. At the same time, it unloads another wafer to be tested from the first stage and transports it to the second stage 3. This cycle is repeated to complete the testing of all wafers. Since the first vacuum chamber is only used for loading and unloading transfer, its space is very small and much smaller than the inner cavity of the second vacuum chamber. The vacuuming time is short, which can greatly reduce the vacuuming time during loading and unloading, and greatly improve the testing efficiency. In addition, since the unloading robotic arm needs to penetrate deep into the first vacuum chamber to retrieve the wafer, the unloading arm is relatively long. By setting up a transfer mechanism, the unloading stroke of the unloading robotic arm can be reduced, thereby reducing the volume of the second vacuum chamber and the vacuuming time of the second vacuum chamber, further improving the testing efficiency.

[0024] In summary, by setting up a small vacuum chamber for loading and unloading and reducing the volume of the detection vacuum chamber, this utility model can greatly reduce the vacuuming time, reduce equipment downtime, improve detection efficiency, and save resources and production costs.

[0025] In addition, the vacuum chamber 212 is equipped with an observation window corresponding to the detection station, and the observation window is equipped with a flange sight glass to facilitate the detection of tube wiping.

[0026] like Figure 1-2 and Figure 4 As shown, vacuum flanges 112 are provided on the bottom surface of vacuum chamber 11 and vacuum chamber 2 12. Vacuum flanges 112 are connected to vacuum angle valves. Vacuum angle valves are connected to vacuum pumps through metal bellows. Vacuum gauges are also provided on the bottom surface of vacuum chamber 11 and the side surface of vacuum chamber 2 12 to monitor the vacuum status in real time.

[0027] The bottom surface of vacuum chamber 11 and vacuum chamber 2 12 is also provided with an integrated flange 113. The integrated flange 113 is equipped with a gas pipe connector, a fiber optic vacuum connector and a vacuum flange, etc. The integrated installation makes the appearance more beautiful and facilitates maintenance.

[0028] like Figure 3As shown, there are two support stages 21, one for placing wafers to be inspected and the other for placing wafers that have completed inspection. The stage 2 also includes a stage base plate 22, and multiple vertical support plates 23 are provided on the outer periphery of the stage base plate 22. The support stage 21 includes multiple horizontal support plates that correspond one-to-one with the vertical support plates 23, and the horizontal support plates are located inside the corresponding vertical support plates 23. In addition, one of the horizontal support plates of each support stage 21 is provided with an in-situ detection sensor. The optical fiber of the in-situ detection sensor is sealed to the vacuum chamber 11 through a vacuum connector, and the vacuum connector is mounted on the integrated flange 113.

[0029] like Figure 1-3 As shown, a lifting mechanism 7 is also provided at the bottom of the vacuum chamber 11. The lifting mechanism 7 is used to drive the platform 2 to move up and down. It includes a lifting rod 71, a lifting plate 72, a lifting seat 73, and a lifting linear module 74. The lifting seat 73 is located below the vacuum chamber 11, and the lifting linear module 74 is provided on it. The lifting plate 72 is provided at the output end of the lifting linear module 74. The top end of the lifting rod 71 is connected to the platform 2, and the bottom end is connected to the lifting plate 72. A plurality of guide rods 75 are also provided between the lifting seat 73 and the vacuum chamber 11, surrounding the lifting linear module 74. The guide rods 75 are inserted into the lifting plate 72 and slidably connected to the lifting plate 73. The lifting linear module 74 can be an electric cylinder, a pneumatic cylinder, a lead screw driven linear module, etc. In this embodiment, the lifting linear module 74 is a lead screw driven linear module. The lifting mechanism 7 allows the two support platforms to dock with the picking robot arm 5 respectively, realizing the interaction of loading and unloading and improving the loading and unloading efficiency. In addition, the lifting mechanism 7 can also release the friction pad 55 from the wafer, so that the wafer can be separated from the picking robot arm.

[0030] Example 2 Based on the structure of Example 1, such as Figure 5-6 As shown, the stage 2 3 includes a stage connecting ring 31 and a plurality of extension plates 32 disposed on the stage connecting ring 31. The plurality of extension plates 32 are disposed along the inner circumferential side of the stage connecting ring 31 and extend radially toward the stage connecting ring 31. The radially extending end of the extension plate 32 is provided with a support column 33, and the top of the support column 33 is provided with a friction pad 34. The plurality of friction pads 34 cooperate to adsorb the wafer.

[0031] In this embodiment, four friction pads 34 are provided, symmetrically arranged. The material handling robot arm 5 is inserted between the two extension plates 32 in the middle to pick up the material. The friction pads 34 adsorb and fix the wafer, but the coaxiality between the wafer and the stage 3 is determined by the docking point of the transfer mechanism 4 and the material handling robot arm 5. This docking point is determined by manual adjustment before testing. During adjustment, a 6-inch wafer is used. The wafer is manually placed on the stage 3, and the outer edge of the 6-inch wafer coincides with the outer edge of each friction pad 34 in this embodiment. By positioning the coaxiality between the wafer and the stage 2, the position of the wafer on the stage 2 is determined, and then the position is determined by adjustment.

[0032] like Figure 6 As shown, stage 2 3 also includes a rotating assembly, which includes a rotating base plate 35, a large gear 36, and a servo motor 37. The large gear 36 is rotatably connected to the rotating base plate 35 in the middle. The servo motor 37 is mounted on the bottom of the rotating base plate 35, and its output end has a small gear. The large gear 36 meshes with the small gear, and the stage connecting ring 31 is located on top of the large gear 36. During inspection, the wafer rotates while being inspected, resulting in high inspection efficiency.

[0033] The transplanting mechanism 4 includes a movable base plate 41 and a linear module 42 disposed above the movable base plate 41. The linear module 42 is provided with guide rails 43 on both sides. The output end of the linear module 42 is provided with a movable plate 44. The movable plate 44 is provided with sliders that are slidably connected to the guide rails 43 on both sides. The platform 3 is disposed on the movable plate 44.

[0034] The robotic arm 5 includes a mounting base 51 and a linear module 52 mounted on the mounting base 51. The output end of the linear module 52 has an extension arm 53 extending to the middle of the platform 3. The end of the extension arm 53 has a picking arm 54, and the end of the picking arm 54 has multiple friction pads 55. These friction pads 55 work together to adsorb and hold the wafer. The picking arm 54 is fixedly connected to the extension arm 53 via a pressure plate. In this embodiment, four friction pads 55 are provided.

[0035] like Figure 5-6 As shown, the aforementioned wafer vacuum testing equipment also includes a lifting mechanism 8. The lifting mechanism 8 includes a second movable plate 81 and a second linear module 82 that drives the second movable plate 81 to move horizontally. The second linear module 82 is connected to the output end of the transfer mechanism 4, i.e., the second linear module 82 is mounted on the first movable plate 44. Guide rails 83 that are slidably connected to the second movable plate 81 are also provided on both sides of the second linear module 82. Transmission components connected to the rotating base plate 35 of the second platform 3 are provided on the front and rear sides of the second movable plate 81. The transmission components can convert the horizontal movement of the second movable plate 81 into the vertical movement of the second platform 3. In this embodiment, the second linear module 82 and the first linear module 42 are arranged in parallel, both being screw-driven linear modules. They can also be electric cylinders, pneumatic cylinders, etc. The transmission components convert the horizontal movement of the second linear module 82 into the lifting motion of the second platform 3, resulting in a more compact structure, reducing the space occupied by the testing module, thereby minimizing the volume of the second vacuum chamber 12 and reducing the vacuuming time.

[0036] The transmission assembly is a wedge-shaped transmission structure, including an upper wedge block 84, a lower wedge block 85, an upper support arm 86, and a lower support arm 87. Both the upper wedge block 84 and the lower wedge block 85 are triangular, and the upper wedge block 84 is connected to the platform 2 3. The lower wedge block 85 is located on the movable plate 2 81. The wedge-shaped inclined surfaces of the upper wedge block 84 and the lower wedge block 85 are provided with matching cross guide rails 88. The upper support arm 86 is located on both sides of the upper wedge block 84, and the side of the upper support arm 86 closest to the lower support arm 87 is provided with a guide rail 3 89 arranged in the vertical direction. The lower support arm 87 is located on both sides of the lower wedge block 85, and the lower support arm 87 is provided with a slider that is slidably connected to the guide rail 3 89. The cross guide rail has higher rigidity and precision due to multi-point contact, making the lifting of the second platform more stable. When the second platform moves to the inspection station, the lifting mechanism 8 drives the second platform 3 to rise, releasing the friction pad 55 from the wafer and interacting with the picking robot arm 5 to exchange wafers. Then the second platform 3 descends and moves to the inspection station to avoid collision with the picking robot arm 5.

[0037] like Figure 4 As shown, the detection mechanism 6 includes a reflectance spectrometer 61 and a transmission spectrometer 62. Both the reflectance spectrometer 61 and the transmission spectrometer 62 are mounted inside the vacuum chamber 12 via mounting components. The reflectance spectrometer 61 is positioned above the stage 3, and the transmission spectrometer 62 includes an optical path 621 positioned above the stage 3 and an optical path 622 positioned below the stage 3. This detection module is mainly used to detect the thickness and elemental concentration of the epitaxial layer on a wafer. The reflectance spectrometer 61 detects the epitaxial layer thickness, and the transmission spectrometer 62 detects the elemental concentration, providing a wide detection range.

[0038] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A vacuum inspection device for wafers, characterized in that: The system includes a vacuum chamber one, a vacuum chamber two, and a vacuum valve assembly one. Vacuum chamber one contains a platform one for loading and unloading wafers and includes multiple stacked support platforms for placing wafers. Vacuum valve assembly one is located between vacuum chamber one and vacuum chamber two to connect or isolate them. Vacuum chamber two contains a detection module, which includes a platform two, a transfer mechanism, a picking robot arm, and a detection mechanism. Platform two is used to position wafers. The output end of the transfer mechanism is connected to platform two for driving platform two to move between the detection station and the picking station. The detection mechanism is located at the detection station for detecting wafers. The picking robot arm is used to transport wafers between vacuum chamber one and vacuum chamber two.

2. The vacuum inspection equipment for wafers according to claim 1, characterized in that: The support platform is provided in two places, which are used to place the wafers to be tested and the wafers that have been tested. The first platform also includes a platform base plate. The outer periphery of the platform base plate is provided with multiple vertical support plates. The support platform includes multiple horizontal support plates that are arranged one-to-one with the vertical support plates. The horizontal support plates are arranged inside the corresponding vertical support plates.

3. The vacuum inspection equipment for wafers according to claim 2, characterized in that: The bottom of the vacuum chamber is also provided with a lifting mechanism, which is used to drive the platform to move up and down. The lifting mechanism includes a lifting rod, a lifting plate, a lifting seat, and a lifting linear module. The lifting seat is located below the vacuum chamber and has the lifting linear module on it. The output end of the lifting linear module has a lifting plate. The top end of the lifting rod is connected to the platform and the bottom end is connected to the lifting plate. A plurality of guide rods are also provided between the lifting seat and the vacuum chamber, surrounding the lifting linear module. The guide rods are inserted into the lifting plate and slidably connected to the lifting plate.

4. The vacuum inspection equipment for wafers according to claim 1, characterized in that: The second stage includes a stage connecting ring and multiple extension plates disposed on the stage connecting ring. The multiple extension plates are disposed along the inner circumference of the stage connecting ring and extend radially toward the stage connecting ring. The radially extending end of the extension plate is provided with a support column, and the top of the support column is provided with a friction pad. The multiple friction pads cooperate to adsorb the wafer.

5. The vacuum inspection equipment for wafers according to claim 4, characterized in that: The second platform also includes a rotating assembly, which includes a rotating base plate, a large gear, and a servo motor. The rotating base plate has a large gear rotatably connected to it in the middle. The servo motor is installed at the bottom of the rotating base plate and has a small gear at its output end. The large gear and the small gear are meshed and connected. The platform connecting ring is located on the top of the large gear.

6. The vacuum inspection equipment for wafers according to claim 1, characterized in that: The transplanting mechanism includes a movable base plate and a linear module 1 disposed above the movable base plate. The linear module 1 has guide rails on both sides and a movable plate at its output end. The movable plate 1 has sliders on both sides that are slidably connected to the guide rails. The platform 2 is disposed on the movable plate 1.

7. The vacuum inspection equipment for wafers according to claim 1, characterized in that: The material handling robotic arm includes a mounting support and a linear module three mounted on the mounting support. The output end of the linear module three is provided with an extension arm extending to the middle of the platform two. The end of the extension arm is provided with a material handling arm. The end of the material handling arm is provided with multiple friction pads two, which cooperate to adsorb wafers.

8. The vacuum inspection equipment for wafers according to claim 1 or 6, characterized in that: It also includes a lifting mechanism, which includes a second movable plate and a second linear module for driving the second movable plate to move horizontally. The second linear module is connected to the output end of the transplanting mechanism. The two sides of the second linear module are also provided with guide rails that are slidably connected to the second movable plate. The front and rear sides of the second movable plate are provided with transmission components that are connected to the rotating seat plate of the second platform. The transmission components can convert the horizontal movement of the second movable plate into the vertical movement of the second platform.

9. The vacuum inspection equipment for wafers according to claim 8, characterized in that: The transmission assembly includes an upper wedge block, a lower wedge block, an upper support arm, and a lower support arm. Both the upper and lower wedge blocks are triangular. The upper wedge block is connected to the second platform, and the lower wedge block is disposed on the second movable plate. The wedge-shaped inclined surfaces of the upper and lower wedge blocks are provided with matching cross guide rails. The upper support arm is disposed on both sides of the upper wedge block, and the side of the upper support arm closest to the lower support arm is provided with a guide rail three arranged in the vertical direction. The lower support arm is disposed on both sides of the lower wedge block, and the lower support arm is provided with a slider that is slidably connected to the guide rail three.

10. The vacuum inspection equipment for wafers according to claim 1, characterized in that: The detection mechanism includes a reflectance spectrometer and a transmission spectrometer. Both the reflectance spectrometer and the transmission spectrometer are installed in the vacuum chamber 2 via mounting components. The reflectance spectrometer is located above the stage 2, and the transmission spectrometer includes an optical path 1 located above the stage 2 and an optical path 2 located below the stage 2.

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