Chip heat dissipation system, circuit board assembly and electronic module

Abstract

The present disclosure relates to a chip cooling system, a circuit board assembly and an electronic module. The chip cooling system comprises a chip body, a plurality of high-power devices, a plurality of low-power devices and a cooling assembly. Each high-power device and each low-power device is arranged on the chip body. Each high-power device forms a high-power density area on the chip body. Each low-power device forms a low-power density area on the chip body. The cooling assembly is used to cool the high-power density area and the low-power density area. The cooling fluid of the cooling assembly can flow through the high-power density area and the low-power density area in sequence. The cooling fluid first flows through the high-power density area. At this time, the temperature of the cooling fluid is low, and the temperature difference with the high-power density area is large, so more heat can be taken away, ensuring that the key heat generating parts of the chip can be fully cooled. The cooling fluid after flowing through the high-power density area exchanges heat with the low-power density area, realizing the rational use of cold energy.

Description

Technical Field

[0001] This disclosure relates to the field of chip heat dissipation, specifically to a chip heat dissipation system, a circuit board assembly, and an electronic module. Background Technology

[0002] With the development of electronic technology, the need for heat dissipation in chips is becoming increasingly urgent. Related technologies typically involve placing cooling devices on the chip, with circulating cooling fluid inside to continuously cool the chip. However, the heat dissipation conditions vary across different parts of the chip. Using these technologies often results in insufficient cooling in some areas (such as high-power-density regions), while other areas (such as low-power-density regions) experience overcooling, thus affecting the overall heat dissipation effect and chip performance. Utility Model Content

[0003] The purpose of this disclosure is to provide a chip heat dissipation system, a circuit board assembly, and an electronic module to solve the technical problems existing in the related art.

[0004] To achieve the above objectives, a first aspect of this disclosure provides a chip heat dissipation system, comprising: The chip body comprises a plurality of high-power devices and a plurality of low-power devices, wherein each of the high-power devices and each of the low-power devices are disposed on the chip body, each of the high-power devices forms a high-power density region on the chip body, and each of the low-power devices forms a low-power density region on the chip body. A cooling assembly for cooling the high power density region and the low power density region, wherein the cooling fluid of the cooling assembly can flow sequentially through the high power density region and the low power density region.

[0005] In some possible implementations, the cooling assembly includes a cooling fluid supply structure and a plurality of heat dissipation devices, each heat dissipation device having a first inlet connected to a cooling fluid outlet of the cooling fluid supply structure, each heat dissipation device exchanging heat with at least one high power density region and one low power density region, with the high power density region located upstream of the low power density region, so that the cooling fluid flows sequentially through the high power density region and the low power density region.

[0006] In some possible implementations, the plurality of heat dissipation devices include a plurality of high-power heat dissipation fins and a plurality of low-power heat dissipation fins, each of the high-power heat dissipation fins covering a corresponding high-power density region, each of the low-power heat dissipation fins covering a corresponding low-power density region, each of the high-power heat dissipation fins being connected between the cooling fluid supply structure and the low-power heat dissipation fins and being located upstream of the low-power heat dissipation fins.

[0007] In some possible implementations, the cooling assembly further includes a connecting pipe having a flow-diverting cavity and a plurality of second liquid inlets and a plurality of second liquid outlets respectively connected to the flow-diverting cavity, wherein the liquid outlet of each of the high-power heat dissipation fins is connected to a second liquid inlet, and the liquid inlet of each of the low-power heat dissipation fins is connected to a second liquid outlet.

[0008] In some possible implementations, the cooling assembly further includes a liquid collector having a liquid collection chamber and a third liquid inlet and a plurality of third liquid outlets respectively communicating with the liquid collection chamber. The third liquid inlet is connected to the cooling fluid outlet of the cooling fluid supply structure, and the third liquid outlet is connected to the first liquid inlet of the corresponding heat dissipation device.

[0009] In some possible implementations, the number of each of the first liquid inlets is equal to the number of the high-power devices.

[0010] In some possible implementations, the flow rate of the cooling fluid through the first inlet is within a preset threshold range, so that the cooling fluid flowing out of the first inlet can generate turbulence.

[0011] In some possible implementations, the high-power device includes a computing core; The low-power device includes an I / O interface.

[0012] A second aspect of this disclosure provides a circuit board assembly including a circuit board and a chip heat dissipation system as described above, the chip heat dissipation system being disposed on the circuit board.

[0013] A third aspect of this disclosure provides an electronic module including the chip heat dissipation system described above or the circuit board assembly described above.

[0014] Through the above technical solution, the heat generation of the chip varies at different locations during operation. The high-power density area where high-power devices are located generates more heat, while the low-power density area where low-power devices are located generates relatively less heat. This heat dissipation system places the high-power density area upstream of the low-power density area, so that the cooling fluid flows through the high-power density area first. Since the temperature of the cooling fluid is lower at this time, the temperature difference between it and the high-power density area is large. According to the principle of heat exchange, more heat can be carried away, effectively solving the problem of insufficient local heat dissipation in the high-power density area in related technologies, and ensuring that the key heat-generating parts of the chip can be adequately cooled.

[0015] The cooling fluid's temperature rises after flowing through the high power density region, and then it flows to the low power density region. At this point, there is still a certain temperature difference between the heated cooling fluid and the low power density region, which can still effectively dissipate heat from the region. At the same time, it avoids the energy waste caused by overcooling the low power density region with low-temperature cooling fluid, and realizes the rational use of cooling capacity. This keeps the chip temperature within a relatively stable range, reduces chip performance degradation and failures caused by excessive temperature, and improves the chip's operational stability and reliability.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a top view of a circuit board assembly provided in an exemplary embodiment of this disclosure, wherein the arrow points in the direction of the flow of cooling fluid; Figure 2 This is a perspective view of a chip heat dissipation system provided in an exemplary embodiment of this disclosure.

[0018] Explanation of reference numerals in the attached figures 1-Chip heat dissipation system; 10-Chip body; 20-High power density area; 30-Low power density area; 40-Cooling component; 50-Heat dissipation device; 51-High power heat dissipation fins; 510-First liquid inlet; 52-Low power heat dissipation fins; 60-Connecting pipe; 61-Diverter chamber; 62-Second liquid inlet; 63-Second liquid outlet; 70-Collector; 71-Collection chamber; 72-Third liquid inlet; 73-Third liquid outlet; 100-Circuit board assembly; 110-Circuit board. Detailed Implementation

[0019] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0020] In this disclosure, unless otherwise stated, directional terms such as "up," "down," "left," and "right" are used to indicate orientation or positional relationships only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or a specific orientation structure and operation, and therefore should not be construed as a limitation of this disclosure. The terms "inner" and "outer" refer to the inner and outer contours of the corresponding structures.

[0021] Additionally, it should be noted that the terms used, such as "first" and "second," are used to distinguish one element from another and do not indicate sequence or importance. Furthermore, in the description referring to the accompanying drawings, the same reference numerals in different drawings denote the same element.

[0022] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connect," "link," and "install" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0023] In related technologies, the heat generation of chips varies at different locations during operation. High-power devices generate more heat in high-power density areas, while low-power devices generate relatively less heat in low-power density areas. When using heat dissipation components in related technologies, insufficient heat dissipation occurs in some areas of the chip (such as high-power density areas), while other areas (such as low-power density areas) experience overcooling waste.

[0024] Based on this, refer to Figures 1 to 2 As shown, in order to achieve the above objectives, the first aspect of this disclosure provides a chip heat dissipation system 1, including a chip body 10, a plurality of high-power devices, a plurality of low-power devices, and a cooling assembly 40. Each high-power device and each low-power device are disposed on the chip body 10. Each high-power device forms a high-power density region 20 on the chip body 10, and each low-power device forms a low-power density region 30 on the chip body 10. The cooling assembly 40 is used to cool the high-power density region 20 and the low-power density region 30. The cooling fluid of the cooling assembly 40 can flow through the high-power density region 20 and the low-power density region 30 in sequence.

[0025] The cooling fluid of the cooling component 40 can flow sequentially through the high power density region 20 and the low power density region 30.

[0026] Through the above technical solution, the heat generation of the chip varies at different locations during operation. The high-power density region 20, where high-power devices are located, generates more heat, while the low-power density region 30, where low-power devices are located, generates relatively less heat. This heat dissipation system places the high-power density region 20 upstream of the low-power density region 30, so that the cooling fluid flows through the high-power density region 20 first. Since the temperature of the cooling fluid is lower at this time, the temperature difference between it and the high-power density region 20 is large. According to the principle of heat exchange, more heat can be carried away, effectively solving the problem of insufficient local heat dissipation in the high-power density region 20 in related technologies, and ensuring that the key heat-generating parts of the chip can be adequately cooled.

[0027] The cooling fluid's temperature rises after flowing through the high power density region 20, and then it flows to the low power density region 30. At this point, there is still a certain temperature difference between the heated cooling fluid and the low power density region 30, which can still effectively dissipate heat from this region. At the same time, it avoids the energy waste caused by overcooling the low power density region 30 with low-temperature cooling fluid, and realizes the rational utilization of cooling capacity. This keeps the chip temperature within a relatively stable range, reduces chip performance degradation and failures caused by excessive temperature, and improves the chip's operational stability and reliability.

[0028] Through the above technical solution, the heat generation of the chip varies at different locations during operation. The high-power density region 20, where high-power devices are located, generates more heat, while the low-power density region 30, where low-power devices are located, generates relatively less heat. This heat dissipation system places the high-power density region 20 upstream of the low-power density region 30, so that the cooling fluid flows through the high-power density region 20 first. Since the temperature of the cooling fluid is lower at this time, the temperature difference between it and the high-power density region 20 is large. According to the principle of heat exchange, more heat can be carried away, effectively solving the problem of insufficient local heat dissipation in the high-power density region 20 in related technologies, and ensuring that the key heat-generating parts of the chip can be adequately cooled.

[0029] The cooling fluid's temperature rises after flowing through the high power density region 20, and then it flows to the low power density region 30. At this point, there is still a certain temperature difference between the heated cooling fluid and the low power density region 30, which can still effectively dissipate heat from this region. At the same time, it avoids the energy waste caused by overcooling the low power density region 30 with low-temperature cooling fluid, and realizes the rational utilization of cooling capacity. This keeps the chip temperature within a relatively stable range, reduces chip performance degradation and failures caused by excessive temperature, and improves the chip's operational stability and reliability.

[0030] It should be noted here that, understandably, during actual chip operation, the heat generated by high-power devices should be higher than that of low-power devices. Specifically, for the high-power density region 20 formed by high-power devices, the power density of this high-power density region 20 is greater than 250 W / cm². 2 The power density in the low power density region 30 is less than 70 W / cm³. 2 .

[0031] In one exemplary embodiment provided in this disclosure, the power density of the high power density region 20 is 250 W / cm². 2 ~300W / cm 2 .

[0032] In this disclosure, there are no restrictions on the specific structure and cooling method of the cooling component 40, as long as it can sequentially cool the high-power device and the low-power device. For example, in an exemplary embodiment provided in this disclosure, the cooling component 40 may include a cooling fluid supply structure and a plurality of heat dissipation devices 50. The first liquid inlet 510 of each heat dissipation device 50 is connected to the cooling fluid outlet of the cooling fluid supply structure. Each heat dissipation device 50 exchanges heat with at least one high power density region 20 and one low power density region 30, and the high power density region 20 is located upstream of the low power density region 30, so that the cooling fluid flows sequentially through the high power density region 20 and the low power density region 30. In this way, the low-temperature cooling fluid flowing out from the cooling fluid supply structure enters each heat dissipation device 50 sequentially through the corresponding first liquid inlet 510. As the cooling fluid flows from upstream to downstream, it exchanges heat with the high power density region 20 and the low power density region 30 in sequence. That is, the high power devices with larger heat dissipation requirements and higher temperatures are cooled first, and the low power devices with relatively smaller heat dissipation requirements and lower temperatures are cooled first, thereby making reasonable use of the cooling capacity of the cooling fluid.

[0033] This disclosure does not limit the type of high-power device that forms the high-power density region 20 mentioned above. For example, in one embodiment provided in this disclosure, the high-power device (not shown) may include a computing core.

[0034] Alternatively, in other embodiments provided in this disclosure, the high-power device may also include a graphics processing unit, a memory controller, an integrated circuit, etc.

[0035] Similarly, this disclosure does not limit the type of low-power device (not shown) forming the low-power density region 30. For example, in an exemplary embodiment provided in this disclosure, the low-power density device may include an I / O interface.

[0036] In other embodiments provided in this disclosure, the low power density device may also include low-voltage, low-current MOSFETs, diodes, etc.

[0037] In this disclosure, there are no restrictions on the specific structure and heat dissipation method of the heat dissipation device 50. In one embodiment provided in this disclosure, the heat dissipation device 50 can be a heat dissipation fin.

[0038] Alternatively, in other embodiments provided in this disclosure, the heat dissipation device 50 may also be a microchannel heat sink, a graphene heat sink, a heat pipe heat sink, or other structures. In short, as long as heat exchange with the high power density region 20 and the low power density region 30 can be achieved, this disclosure does not impose any restrictions.

[0039] For embodiments where the heat dissipation device 50 can be heat dissipation fins, in one exemplary embodiment provided in this disclosure, such as... Figure 1 As shown, the multiple heat dissipation devices 50 may include multiple high-power heat dissipation fins 51 and multiple low-power heat dissipation fins 52. Each high-power heat dissipation fin 51 covers its corresponding high-power density region 20, and each low-power heat dissipation fin 52 covers its corresponding low-power density region 30. Each high-power heat dissipation fin 51 is connected between the cooling fluid supply structure and the low-power heat dissipation fin 52, and is located upstream of the low-power heat dissipation fin 52. In this way, after the cooling fluid flows out from the cooling fluid supply structure, it first enters the high-power heat dissipation fin 51 and exchanges heat with the high-power density region 20 covering the high-power heat dissipation fin 51, thereby carrying away the heat generated by the high-power device. The temperature of the cooling fluid then rises and enters the low-power heat dissipation fin 52, where it exchanges heat again with the low-power density region 30 covered by the low-power heat dissipation fin 52, thus achieving heat dissipation for the low-power heat dissipation device.

[0040] Furthermore, during the aforementioned process, the heat generated in the high power density region 20 is first absorbed by the high power heat dissipation fins 51. Since they are in direct contact with the cooling fluid, the heat is quickly carried away by the cooling fluid, preventing local overheating in the high power density region 20 and reducing the overall chip temperature. The high power heat dissipation fins 51 are located upstream of the low power heat dissipation fins 52. Although the temperature of the cooling fluid increases after absorbing the heat from the high power density region 20, it can still be used to assist the low power heat dissipation fins 52 in heat dissipation. Although the temperature of the cooling fluid is higher than the initial temperature, it can still play a certain role in heat dissipation relative to the heat generated in the low power density region 30, forming a synergistic effect of heat transfer and further improving the overall heat dissipation efficiency of the chip.

[0041] It should be noted here that the high-power heat dissipation fins 51 mentioned above all cover their corresponding high-power density regions 20, and the low-power heat dissipation fins 52 all cover their corresponding low-power density regions 30. This can be understood as the high-power heat dissipation fins 51 completely covering the high-power density region 20. In this case, if... Figure 1 As shown, the area of ​​the high-power heat dissipation fin 51 is greater than or equal to the area of ​​the high-power density region 20, or the high-power heat dissipation fin 51 can at least partially cover the high-power density region 20, thereby achieving the heat dissipation effect of the high-power device disposed in the high-power density region 20. Similarly, the same applies to the low-power heat dissipation fin 52, which will not be elaborated in this disclosure.

[0042] This disclosure does not limit the specific connection method between the high-power heat dissipation fins 51 and the low-power heat dissipation fins 52. For example, in an exemplary embodiment provided by this disclosure, the high-power heat dissipation fins 51 and the low-power heat dissipation fins 52 can be constructed as an integral part, that is, their internal flow channels are interconnected, thereby reducing the use of complex pipe connections and independent heat dissipation modules, making the structure of the cooling assembly 40 more compact.

[0043] Alternatively, in other embodiments provided in this disclosure, the high-power heat dissipation fins 51 and the low-power heat dissipation fins 52 can also be connected by a connection structure, for example, such as... Figure 1 , Figure 2 As shown, the cooling assembly 40 may further include a connecting pipe 60, which has a diversion cavity 61 and a plurality of second liquid inlets 62 and a plurality of second liquid outlets 63 respectively connected to the diversion cavity 61. The liquid outlet of each high-power heat dissipation fin 51 is connected to a second liquid inlet 62, and the liquid inlet of each low-power heat dissipation fin 52 is connected to a second liquid outlet 63. The outlets of multiple high-power heat dissipation fins 51 are connected to multiple second inlets 62 of the connecting pipe 60, which can collect the cooling fluid flowing out of the high-power heat dissipation fins 51 after heat exchange with the high-power density region 20 into the distribution chamber 61. On the one hand, since the positions of different high-power heat dissipation fins 51 and the corresponding high-power density region 20 of the chip may be different, the temperature and flow rate of the flowing cooling fluid may also be different. The distribution chamber 61 can perform preliminary mixing and equalization of these cooling fluids, ensuring that each low-power heat dissipation fin 52 can obtain a relatively uniform cooling fluid flow rate and temperature, avoiding poor heat dissipation effect of some low-power heat dissipation fins 52 due to uneven distribution of cooling fluid, thereby improving the heat dissipation uniformity of the entire cooling assembly 40 to the low-power density region 30 of the chip.

[0044] On the other hand, when the chip power increases or the heat dissipation requirements change, the number of high-power heat dissipation fins 51 and low-power heat dissipation fins 52 can be easily increased, and the system can be expanded by correspondingly increasing the second liquid inlet 62 and the second liquid outlet 63 of the connecting pipe 60, so as to better adapt to the continuous development and upgrading of chip technology.

[0045] In some possible implementations, the cooling assembly 40 may also include a collector 70, such as Figure 2 As shown, the liquid collector 70 has a liquid collecting chamber 71 and a third liquid inlet 72 and multiple third liquid outlets 73 respectively connected to the liquid collecting chamber 71. The third liquid inlet 72 is connected to the cooling fluid outlet of the cooling fluid supply structure, and the third liquid outlet 73 is connected to the first liquid inlet 510 of the corresponding heat dissipation device 50. On the one hand, the liquid collector 70, as an intermediate hub, can collect the cooling fluid in a concentrated manner, avoiding the problems of complex connection and difficult layout that may occur when the cooling fluid supply structure is directly connected to multiple heat dissipation devices 50. On the other hand, the liquid collecting chamber 71 can buffer and stabilize the cooling fluid. After the cooling fluid is fully mixed in the liquid collecting chamber 71, it is evenly distributed to the first liquid inlet 510 of each heat dissipation device 50 through the multiple third liquid outlets 73, ensuring that each heat dissipation device 50 can obtain a suitable and relatively uniform cooling fluid flow rate, avoiding poor heat dissipation effect of some heat dissipation devices 50 due to uneven flow distribution, thereby improving the heat dissipation uniformity and efficiency of the entire cooling assembly 40 for different areas of the chip.

[0046] Furthermore, the liquid collector 70 also plays a role in stabilizing the pressure, making the pressure of the cooling fluid entering each heat dissipation device 50 more stable.

[0047] In this disclosure, the inner diameter of the third liquid outlet 73 of the liquid collector 70 can be the same as the inner diameter of the first liquid inlet 510 of the high-power heat dissipation fins 51, such as... Figure 2 As shown, this allows the cooling fluid flowing from the third outlet 73 of the collector 70 to completely enter the high-power heat dissipation fins 51 through the first inlet 510 after the high-power heat dissipation fins 51 are connected to the collector 70.

[0048] In the embodiments provided in this disclosure, the number of each first liquid inlet 510 is equal to the number of the high-power devices. That is, each first liquid inlet 510 corresponds one-to-one with each high-power device, thereby ensuring that the cooling fluid flowing out from the cooling fluid supply structure can flow into the corresponding high-power device through the corresponding first liquid inlet 510, making the flow of cooling fluid more orderly and regular, and improving the stability of the heat exchange process for multiple high-power devices.

[0049] It should be noted that, for the aforementioned multiple first liquid inlets 510, the inner diameters of the multiple first liquid inlets 510 may be the same or different, or they may be partially the same and partially different. This disclosure does not impose any restrictions on this, and the specific settings can be made according to the actual heat dissipation scenario.

[0050] If the inner diameter is too large, the cooling fluid flow rate will be too slow, which may cause the cooling fluid to stay in the heat dissipation device 50 for too long, failing to remove heat in time and affecting the heat dissipation efficiency. If the inner diameter is too small, the cooling fluid flow rate will be too fast, increasing the flow resistance and potentially causing insufficient cooling fluid supply pressure, or even affecting the normal operation of the entire cooling system. Based on this, in an exemplary embodiment provided in this disclosure, the inner diameter of each first liquid inlet 510 can be 2mm to 3mm. Setting the inner diameter of the first liquid inlet 510 in the range of 2mm to 3mm ensures that the cooling fluid enters the heat dissipation device 50 at a suitable flow rate, allowing the cooling fluid flowing into the heat dissipation device 50 to generate turbulence, improving the heat exchange effect with the heat dissipation device 50. Furthermore, liquid inlets with the same inner diameter allow each heat dissipation device 50 to obtain a relatively balanced cooling fluid flow rate. When the liquid collector 70 distributes the cooling fluid to each heat dissipation device 50, it avoids poor heat dissipation performance of some heat dissipation devices 50 due to flow rate differences, thereby improving the heat dissipation uniformity of the entire cooling assembly 40.

[0051] An appropriate flow rate ensures sufficient flow of the cooling fluid within the system, enhancing turbulence and heat exchange, thereby improving cooling efficiency and maintaining the equipment at its optimal operating temperature. In one embodiment provided in this disclosure, the flow rate of the cooling fluid through the first inlet 510 is within a preset threshold range, enabling the cooling fluid exiting the first inlet 510 to generate turbulence. During turbulent flow, the fluid particles undergo irregular motion, making the fluid movement more intense and irregular, resulting in a reduction in temperature differences between different regions of the flow field, thus significantly improving the heat exchange efficiency between the fluid and the object being cooled.

[0052] In one exemplary embodiment provided in this disclosure, the flow velocity of the cooling fluid through the first inlet 510 is 2.5 m / s to 3.5 m / s, that is, the flow velocity of the cooling fluid through the first inlet 510 mentioned above is within a preset threshold of 2.5 m / s to 3.5 m / s. High-power devices generate a lot of heat, and the temperature rises rapidly in the high-power density region 20. Therefore, in this disclosure, the flow velocity of the cooling fluid is controlled at 2.5 m / s to 3.5 m / s, so that the cooling fluid can quickly reach the high-power density region 20 and remove a large amount of heat in time. In addition, controlling the flow velocity of the cooling fluid at 2.5 m / s to 3.5 m / s is also beneficial to improve the turbulence state of the cooling fluid and improve the heat exchange efficiency.

[0053] It should be noted that the cooling fluid mentioned above can be either coolant or refrigerant, and this disclosure does not impose any restrictions on it.

[0054] In one exemplary embodiment provided in this disclosure, under the premise that the flow rate and initial temperature of the cooling fluid are the same, the temperature values ​​of the B-die and C-die of the graphics processing unit (GPU) after using the chip cooling system 1 provided in this disclosure are significantly lower than the temperature values ​​of the B-die and C-die of the GPU after using the chip cooling system 1 in the related art. That is, the heat dissipation effect of the chip cooling system 1 provided in this disclosure is better than the heat dissipation effect of the chip cooling system provided in the related art. In particular, when the GPU is cooled by using the chip cooling system 1 provided in this disclosure, the temperature reduction of the B-die and C-die of the GPU is greater, and the maximum temperature of the GPU core, the maximum temperature of the GPU casing, the maximum junction temperature of the DDR, and the maximum junction temperature of the MOSFET are lower, significantly lower than the temperature of the related graphics processing unit (GPU) without using the chip cooling system 1.

[0055] like Figure 1 A second aspect of this disclosure provides a circuit board assembly 100, including a circuit board 110 and a chip heat dissipation system 1 as described above, the chip heat dissipation system 1 being disposed on and used on the circuit board 110. This electronic module circuit board assembly 100 has all the beneficial effects of the aforementioned chip heat dissipation system 1, which will not be elaborated upon herein.

[0056] In addition, MOSFETs and memory, such as Double Data Rate Synchronous Dynamic Random Access Memory (DDR memory), can also be installed on the circuit board 110.

[0057] When the improved chip heat dissipation system 1 is used to dissipate heat from the circuit board assembly 100, the memory and MOS transistors mounted on the circuit board 110 can also have lower temperatures. In other words, the chip heat dissipation system 1 can simultaneously improve the heat dissipation effect on the chip and related heat-generating devices on the circuit board 110.

[0058] This disclosure does not limit the specific type of the circuit board 110. For example, the circuit board 110 can be a universal baseboard, or it can be a high-power electronic device baseboard (such as a power amplifier or drive module in a server, communication base station, or industrial control equipment).

[0059] A third aspect of this disclosure provides an electronic module including the chip heat dissipation system 1 as described above or the circuit board assembly 100 as described above. This electronic module possesses all the beneficial effects of the chip heat dissipation system 1 and the circuit board assembly 100 described above, which will not be elaborated upon here.

[0060] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure. It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this disclosure will not further describe the various possible combinations.

[0061] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A chip heat dissipation system, characterized in that, include: The chip body comprises a plurality of high-power devices and a plurality of low-power devices, wherein each of the high-power devices and each of the low-power devices are disposed on the chip body, each of the high-power devices forms a high-power density region on the chip body, and each of the low-power devices forms a low-power density region on the chip body. The cooling assembly includes a cooling fluid supply structure and a plurality of heat dissipation devices. The first liquid inlet of each heat dissipation device is connected to the cooling fluid outlet of the cooling fluid supply structure. Each heat dissipation device exchanges heat with at least one high power density region and one low power density region, and the high power density region is located upstream of the low power density region, so that the cooling fluid flows through the high power density region and the low power density region in sequence.

2. The chip heat dissipation system according to claim 1, characterized in that, The plurality of heat dissipation devices include a plurality of high-power heat dissipation fins and a plurality of low-power heat dissipation fins. Each of the high-power heat dissipation fins covers the corresponding high-power density region, and each of the low-power heat dissipation fins covers the corresponding low-power density region. Each of the high-power heat dissipation fins is connected between the cooling fluid supply structure and the low-power heat dissipation fins and is located upstream of the low-power heat dissipation fins.

3. The chip heat dissipation system according to claim 2, characterized in that, The cooling assembly further includes a connecting pipe having a flow-diverting cavity and a plurality of second liquid inlets and a plurality of second liquid outlets respectively connected to the flow-diverting cavity. The liquid outlet of each high-power heat dissipation fin is connected to a second liquid inlet, and the liquid inlet of each low-power heat dissipation fin is connected to a second liquid outlet.

4. The chip heat dissipation system according to any one of claims 1-3, characterized in that, The cooling assembly further includes a liquid collector, which has a liquid collection chamber and a third liquid inlet and a plurality of third liquid outlets respectively connected to the liquid collection chamber. The third liquid inlet is connected to the cooling fluid outlet of the cooling fluid supply structure, and the third liquid outlet is connected to the first liquid inlet of the corresponding heat dissipation device.

5. The chip heat dissipation system according to any one of claims 1-3, characterized in that, The number of each of the first liquid inlets is equal to the number of the high-power devices.

6. The chip heat dissipation system according to any one of claims 1-3, characterized in that, The flow rate of the cooling fluid through the first inlet is within a preset threshold range, so that the cooling fluid flowing out of the first inlet can generate turbulence.

7. The chip heat dissipation system according to any one of claims 1-3, characterized in that, The high-power device includes a computing core; The low-power device includes an I / O interface.

8. A circuit board assembly, characterized in that, The invention includes a circuit board and a chip heat dissipation system according to any one of claims 1-7, wherein the chip heat dissipation system is disposed on the circuit board.

9. An electronic module, characterized in that, Includes the chip heat dissipation system according to any one of claims 1-7 or the circuit board assembly according to claim 8.

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