A low power consumption super-fast recovery rectifier diode

Abstract

The utility model discloses a kind of low-power consumption superfast recovery rectifier diodes, including diode and two leads, two the lead end portion is equipped with outer convex part, two the outer convex part is equipped with wiring hole, two the outer convex part outside is equipped with threaded wiring slot, two the outer convex part inner wall is equipped with screw rod with screw connection, the screw rod one end is in the wiring hole internal space;Through outer convex part and threaded wiring slot increase heat dissipation area, it is solved that the problem that the heat dissipation path is blocked, thermal resistance is high, heat cannot be promptly transferred, chip junction temperature rises and then makes power consumption rise due to lack of targeted heat dissipation structure;Through screw rod and wiring hole, the stable connection of line is realized, ensure diode stable work in high-frequency circuit, reduce additional loss caused by unstable connection and other factors, to improve the overall energy efficiency of circuit, delay device performance attenuation, prolong service life, guarantee its reliability and stability in high-power continuous work.

Description

Technical Field

[0001] This utility model relates to the field of diode technology, specifically a low-power ultrafast recovery rectifier diode. Background Technology

[0002] Low-power ultrafast recovery rectifier diodes, as key semiconductor devices in high-frequency circuits such as switching power supplies and inverters, possess the core advantage of achieving both "ultrafast reverse recovery speed" and "low on-state power consumption" on the basis of traditional rectifier diodes through structural optimization and material improvements. This effectively meets the requirements of high-frequency circuits for device response speed and energy efficiency, making them an important component in the field of power electronics. Currently, the industry's technical means to reduce the power consumption of such diodes mostly focus on material replacement to reduce power generation, but generally neglect the heat dissipation requirements during device operation. Existing low-power ultrafast recovery rectifier diodes typically lack a dedicated heat dissipation structure in their packaging and chip structure, relying solely on the package shell for passive heat dissipation, resulting in obstructed heat dissipation paths and high thermal resistance. Because diodes continue to generate heat under high-frequency operating conditions, after prolonged use, the heat cannot be transferred to the external environment in time, causing the junction temperature of the chip to rise continuously. The rise in junction temperature will significantly reduce the operating efficiency of the device, resulting in increased power consumption per unit operating current, forming a vicious cycle of "temperature rise - power consumption rise". This not only fails to further reduce power consumption and improve the overall energy efficiency of the circuit through effective cooling, but also accelerates the degradation of device performance, shortens its service life, and seriously affects its reliability and stability in high-power, long-term continuous high-frequency circuits. Therefore, this invention provides a low-power ultrafast recovery rectifier diode. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a low-power ultrafast recovery rectifier diode to solve the aforementioned problems.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution: a low-power ultrafast recovery rectifier diode, comprising a diode and two leads, each of the two leads having an external protrusion at its end, each of the two external protrusions having a wiring hole, each of the two external protrusions having a threaded wiring groove on its outer side, and each of the two external protrusions having a screw threadedly connected to its inner wall, with one end of the screw located inside the wiring hole.

[0005] Preferably, a plurality of heat dissipation fins are mounted on the outside of the diode, and the plurality of heat dissipation fins are evenly arranged.

[0006] Preferably, the inner wall of the wiring hole is provided with a groove, and the screw is positioned corresponding to the groove, so that the screw presses the wire into the groove.

[0007] Preferably, a rotating end is fixedly connected to the end of the screw, and a plurality of anti-slip grooves arranged in a circumferential array are provided on the outer side of the rotating end.

[0008] Preferably, each of the two rotating ends is equipped with a welding end plate, and the welding end plate has a through hole.

[0009] Beneficial effects Compared with the prior art, the present invention has the following advantages: (1) This utility model increases the heat dissipation area by using the protruding part and the threaded wiring groove, which solves the problem that the heat dissipation path is blocked and the thermal resistance is high due to the lack of a targeted heat dissipation structure, the heat cannot be transferred in time, the chip junction temperature rises and the power consumption increases.

[0010] (2) This utility model achieves a stable connection of the circuit through the screw and the wiring hole, ensuring that the diode works stably in the high-frequency circuit, reducing the additional losses caused by factors such as unstable connection, thereby improving the overall energy efficiency of the circuit, delaying the performance degradation of the device, extending its service life, and ensuring its reliability and stability in high-power, long-term continuous high-frequency circuits. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a three-dimensional enlarged structural diagram of the outward protrusion in this utility model; Figure 3 This is the utility model Figure 2 A magnified view of the structure at point A in the middle; Figure 4 This is a three-dimensional enlarged structural diagram of the screw in this utility model.

[0012] In the diagram: 1. Diode; 11. Lead wire; 12. Heat sink fin ring; 2. Outer protrusion; 21. Wiring hole; 22. Threaded wiring groove; 23. Groove; 3. Screw; 31. Rotating end; 311. Anti-slip groove; 32. Welding end plate; 33. Perforation. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Please see Figure 1-4A low-power ultra-fast recovery rectifier diode includes a diode 1 and two leads 11. Each of the two leads 11 has an external protrusion 2 installed at its end. Each of the two external protrusions 2 has a wiring hole 21. Each of the two external protrusions 2 has a threaded wiring groove 22 on its outer side. Each of the two external protrusions 2 has a screw 3 threadedly connected to its inner wall. One end of the screw 3 is located in the internal space of the wiring hole 21.

[0015] Specifically, during operation, the low-power ultra-fast recovery rectifier diode 1 operates in the high-frequency circuit, and the heat generated is transferred to the lead 11. The outer protrusion 2 at the end of the lead 11 has a large cross-sectional area, which can effectively expand the heat dissipation area and accelerate heat dissipation. The threaded wiring groove 22 on the outer side of the outer protrusion 2 further increases the heat dissipation area and improves the heat dissipation efficiency, allowing heat to be transferred to the external environment more quickly and preventing the chip junction temperature from continuously rising. When it is necessary to connect a circuit, the circuit is passed through the wiring hole 21 on the outer protrusion 2, and then the screw 3 is rotated. The screw 3 is connected to the inner wall of the outer protrusion 2 by threads, so that one end of the screw 3 is squeezed and fixed in the internal space of the wiring hole 21, which enhances the stability of the circuit connection. The circuit can also be wound around the outside of the protrusion 2 via the threaded connection groove 22 to further ensure connection reliability. This structural design, on the one hand, increases the heat dissipation area through the protrusion 2 and the threaded connection groove 22, solving the problem of blocked heat dissipation path and high thermal resistance caused by the lack of a targeted heat dissipation structure, which prevents heat from being transferred in time, leading to increased chip junction temperature and thus increased power consumption; on the other hand, it achieves a stable connection of the circuit with the help of the screw 3 and the connection hole 21, ensuring that the diode works stably in the high-frequency circuit, reducing additional losses caused by unstable connection and other factors, thereby improving the overall energy efficiency of the circuit, delaying the performance degradation of the device, extending its service life, and ensuring its reliability and stability in high-power, long-term continuous high-frequency circuits.

[0016] In one embodiment of this utility model, such as Figures 1-4 As shown, a number of heat dissipation fins 12 are mounted on the outside of diode 1, and the positions of the heat dissipation fins 12 are evenly arranged.

[0017] Specifically, during operation, diode 1 generates heat during the operation of the high-frequency circuit. This heat is transferred to several heat dissipation fins 12 that are evenly arranged on its outer side. The heat dissipation fins 12 increase the contact area between diode 1 and the outside air, thereby accelerating the convection and dissipation of heat. Originally, heat dissipation relied solely on the package shell for passive heat dissipation, which resulted in a blocked heat dissipation path and high thermal resistance. However, the presence of the heat dissipation fins 12 increases the effective heat dissipation area, allowing heat to be transferred from diode 1 to the surrounding environment more efficiently and quickly, thus preventing the chip junction temperature from continuously rising.

[0018] In one embodiment of this utility model, such as Figures 1-4As shown, a groove 23 is provided on the inner wall of the wiring hole 21, and the screw 3 is positioned in relation to the groove 23. The screw 3 presses the wire into the groove 23.

[0019] Specifically, during operation, after the wire passes through the wiring hole 21, the screw 3 is rotated. The screw 3 will squeeze the wire into the groove 23 corresponding to the inner wall of the wiring hole 21. The groove 23 can limit the wire, so that the wire is more stably fixed in a specific position when squeezed by the screw, avoiding slippage and enhancing the reliability of the wire connection.

[0020] In one embodiment of this utility model, such as Figures 1-4 As shown, a rotating end 31 is fixedly connected to the end of the screw 3, and a number of anti-slip grooves 311 arranged in a circular array are provided on the outer side of the rotating end 31.

[0021] Specifically, during operation, when it is necessary to fix the wire in the wiring hole 21, the operator rotates the end 31 to drive the screw 3 to rotate. Utilizing the threaded engagement between the screw 3 and the inner wall of the outer protrusion 2, the screw 3 is pushed into the wiring hole 21, thereby squeezing and fixing the wire in the groove 23. Several anti-slip grooves 311 on the outer side of the rotating end 31 are arranged in a circumferential array, increasing the friction between the hand or tool and the end, facilitating the application of torque, preventing slippage, and ensuring that the screw 3 can be quickly and stably tightened into place, achieving reliable clamping of the wire.

[0022] In one embodiment of this utility model, such as Figures 1-4 As shown, each of the two rotating ends 31 is equipped with a welding end plate 32, and the welding end plate 32 has a through hole 33.

[0023] Specifically, the welding end plate 32 provided at one end of the rotating end 31 provides two optional connection methods. First, the welding end plate 32 can be directly welded to the corresponding connection part of the equipment to form a tight electrical conduction path and mechanical fixing structure, ensuring stable current transmission and avoiding additional losses caused by poor contact. Second, if welding is not required or not suitable, the through hole 33 on the welding end plate 32 can be used to pass the bolt through the through hole 33 and tighten it to the threaded connection position of the equipment. The mechanical clamping force of the bolt realizes reliable fixing and electrical contact between the diode and the equipment.

[0024] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0025] Working principle: During operation, the heat generated by diode 1 chip is transferred to the outer protrusion 2 at the end through lead 11. The outer protrusion 2 has a large cross-sectional area and a threaded wiring groove 22 on the outside, which significantly expands the heat dissipation area and increases air convection, accelerating heat dissipation. At the same time, several heat dissipation fins 12 evenly arranged on the outside of diode 1 further increase the contact area with air, improve the overall heat dissipation efficiency, effectively reduce the chip junction temperature, and avoid the vicious cycle of "temperature increase - power consumption increase". When connecting the circuit, the circuit is passed through the wiring hole 21 of the outer protrusion 2. The screw 3 and the threaded engagement of the inner wall of the outer protrusion 2 are used to squeeze the circuit into the corresponding groove 23 on the inner wall of the wiring hole 21. The groove 23 limits the circuit, prevents slippage, and ensures a stable connection. After the circuit is fixed, it can also be moved along the threaded wiring groove. 22 is wrapped around the outside of the protrusion 2, further enhancing connection reliability and heat dissipation path. In addition, the welding end plate 32 installed at one end of each of the two rotating ends 31 provides two optional connection methods: directly welding the welding end plate 32 to the corresponding part of the equipment to form a low-resistance electrical and mechanical connection; or using the through hole 33 on the welding end plate 32 and bolts to achieve detachable and stable fixation. Both methods increase the contact area with the equipment, ensuring stable current transmission, reducing contact loss, and enhancing the conduction of heat to the equipment or heat sink. While maintaining the advantages of "ultra-fast reverse recovery speed" and "low conduction power consumption", it improves heat dissipation capacity and connection reliability, delays device performance degradation, extends service life, and ensures stable operation in high-power, long-term continuous high-frequency circuits.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A low-power ultrafast recovery rectifier diode, comprising a diode (1) and two leads (11), characterized in that, Both of the leads (11) are equipped with protrusions (2) at their ends. Both protrusions (2) are provided with wiring holes (21). Both protrusions (2) are provided with threaded wiring grooves (22) on their outer sides. Both protrusions (2) are threaded with screws (3) on their inner walls. One end of the screws (3) is located in the space inside the wiring holes (21).

2. The low-power ultrafast recovery rectifier diode according to claim 1, characterized in that, A plurality of heat dissipation fins (12) are mounted on the outside of the diode (1), and the plurality of heat dissipation fins (12) are evenly arranged.

3. The low-power ultrafast recovery rectifier diode according to claim 1, characterized in that, The inner wall of the wiring hole (21) is provided with a groove (23), and the screw (3) is positioned in relation to the groove (23). The screw (3) presses the wire into the groove (23).

4. A low-power ultrafast recovery rectifier diode according to claim 3, characterized in that, The screw (3) is fixedly connected to a rotating end (31), and the rotating end (31) has several anti-slip grooves (311) arranged in a circular array on its outer side.

5. A low-power ultrafast recovery rectifier diode according to claim 4, characterized in that, Each of the two rotating ends (31) is equipped with a welding end plate (32) at one end, and the welding end plate (32) has a through hole (33).

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