Circuit board damp heat test equipment

Abstract

The utility model discloses a kind of circuit board damp heat test equipment, comprising: conveying device, with conveying path, conveying path is equipped with damp heat section and the drying section located in the downstream of damp heat section;Damp heat box, cover is equipped in the outside of damp heat section, the box wall of damp heat box is equipped with the first inlet and the first outlet with conveying path adaptation;Drying box, cover is equipped in the outside of drying section, the box wall of drying box is equipped with the second inlet and the second outlet with conveying path adaptation;Heat pump device, including with the compressor of refrigerant outlet and refrigerant inlet, refrigerant outlet and refrigerant inlet are sequentially connected with condenser, throttling component, evaporator, condenser is equipped in damp heat box, evaporator is equipped in drying box.Heat pump device can be absorbed heat from drying box is transported to damp heat box, realize heat recycling, it is favorable to energy conservation;In addition, the position of taking and placing circuit board is respectively at the both ends of conveying path, can realize to multiple circuit board is continuously tested, it is favorable to improve test efficiency.

Description

Technical Field

[0001] This utility model relates to the field of testing technology, and in particular to a circuit board damp heat testing device. Background Technology

[0002] Before each batch of circuit boards leaves the factory, a portion of them are randomly selected for damp heat testing. This test assesses the circuit boards' tolerance to moisture in a high-temperature and high-humidity environment, detects problems such as mold, corrosion, or decreased insulation performance, and evaluates the reliability and stability of the circuit boards under humid conditions to prevent potential failures and ensure long-term reliability.

[0003] Currently, circuit boards are tested using a humidity and heat test chamber. Each test requires opening the chamber door to take the circuit boards in and out, which causes the humid and hot air to escape, resulting in significant heat loss. This requires a large amount of energy to reheat the circuit boards, which is not energy-efficient. Furthermore, continuous testing is not possible, which is not conducive to improving testing efficiency. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a circuit board damp heat testing device.

[0005] The circuit board damp heat testing device according to an embodiment of the present invention includes: A conveying device having a conveying path, the conveying path having a humid heat section and a drying section located downstream of the humid heat section; A heat and humidity chamber is installed on the outside of the heat and humidity section, and the chamber wall is provided with a first inlet and a first outlet adapted to the conveying path; A drying chamber is provided on the outside of the drying section, and the chamber wall of the drying chamber is provided with a second inlet and a second outlet adapted to the conveying path; A heat pump device includes a compressor having a refrigerant outlet and a refrigerant inlet, wherein a condenser, a throttling device, and an evaporator are sequentially connected between the refrigerant outlet and the refrigerant inlet, the condenser being located in the humidification chamber, and the evaporator being located in the drying chamber.

[0006] The circuit board damp heat testing equipment according to the embodiments of this utility model has at least the following technical effects: During use, the operator can place the circuit board to be tested in the feeding section of the conveying device. The conveying device sends the circuit board to be tested into the damp heat chamber, placing the circuit board in a damp heat environment for a period of time. Then, the conveying device transports the circuit board to be tested from the damp heat chamber to the drying chamber for drying and cooling. After drying, the circuit board is removed and tested using testing instruments to assess whether the harsh environment has caused permanent damage or performance drift to the circuit board. The heat pump device not only absorbs heat from the drying chamber, maintaining a low-temperature and dry environment to evaporate moisture from the circuit board surface and ensure the safety of subsequent testing, but also transfers the heat absorbed from the drying chamber to the damp heat chamber, realizing heat recovery and utilization, which is beneficial for energy saving. Furthermore, the positions for picking up and placing the circuit boards are located at opposite ends of the conveying path, enabling continuous testing of multiple circuit boards, which is beneficial for improving testing efficiency.

[0007] According to some embodiments of the present invention, the second inlet and the first outlet coincide.

[0008] According to some embodiments of the present invention, the drying chamber is provided with a cooling channel, the two ends of the cooling channel are respectively connected to the drying section, the evaporator is located in the cooling channel, and a second fan is provided in the cooling channel.

[0009] According to some embodiments of the present invention, the downstream end of the cooling channel is located at the downstream end of the drying section.

[0010] According to some embodiments of the present invention, the drying chamber is provided with an extension, which is located on the downstream side of the drying section; the cooling channel is provided with an air inlet, which is located on the upstream side of the second fan.

[0011] According to some embodiments of this utility model, the air inlet is provided with an air volume regulating valve.

[0012] According to some embodiments of the present invention, the humid heat box is provided with a heating channel, the two ends of the heating channel are respectively connected to the humid heat section, the condenser is provided in the heating channel, and a first fan is provided in the heating channel.

[0013] According to some embodiments of the present invention, the bottom of the evaporator is provided with a liquid collection tank, the heating channel is provided with a volatilization tank, and the liquid collection tank is connected to the volatilization tank.

[0014] According to some embodiments of the present invention, the conveying path is further provided with a test station located downstream of the drying section, and the test station is provided with a test device for testing the circuit board.

[0015] According to some embodiments of the present invention, the testing device includes a testing instrument, a testing fixture located above the testing station, and a driving mechanism for driving the testing fixture to rise and fall. The bottom of the testing fixture is provided with a plurality of probes, all of which are electrically connected to the testing instrument.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the main structure of the circuit board damp heat testing device according to an embodiment of this utility model; Figure 2 yes Figure 1 A partial sectional view; In the attached image: 100-Conveying device; 101-First inlet; 102-First outlet; 103-Second outlet; 200-Wet heat chamber; 201-Wet heat section; 210-Heating channel; 220-First fan; 300-Drying chamber; 301-Drying section; 310-Cooling channel; 311-Air inlet; 320-Second fan; 400-Extension section; 510-Drive mechanism; 520-Test fixture; 521-Spring probe; 600-Compressor; 610-Condenser; 620-Throttling component; 630-Evaporator; 640-Connecting pipe; 641-Volatile tank; 642-Collection tank. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0019] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, "several" means one or more, "multiple" means two or more, "greater than," "less than," "exceeding," etc., are understood to exclude the stated number, while "above," "below," "within," etc., are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0020] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0021] The following is for reference. Figure 1 and Figure 2 This invention describes a circuit board damp heat testing device according to an embodiment of the present invention.

[0022] The circuit board damp heat testing equipment of this utility model includes a conveying device 100, a damp heat chamber 200, a drying chamber 300, and a heat pump device.

[0023] The conveying device 100 has a conveying path located on the upper side of the conveying device 100. The heat chamber 200 and the drying chamber 300 are also located on the upper side of the conveying device 100. The conveying path extends laterally, and the conveying direction is from right to left. The conveying path has a heat section 201 and a drying section 301 located downstream of the heat section 201, that is, the drying section 301 is located to the left of the heat section 201. The conveying path also has a feeding section and a discharge section. The feeding section is located upstream of the heat section 201, and the discharge section is located downstream of the drying section 301, so that the operator can place the circuit board to be tested in the feeding section. The conveying device 100 can convey the circuit board to be tested sequentially through the heat section 201 and the drying section 301 to the discharge section. The operator can remove the tested circuit board from the discharge section. The conveying device 100 can be a conveyor belt.

[0024] The humidity chamber 200 is installed outside the humidity section 201. The humidity chamber 200 is rectangular in shape. The walls of the humidity chamber 200 are provided with a first inlet 101 and a first outlet 102 adapted to the conveying path. The first inlet 101 is located on the right wall of the humidity chamber 200, and the first outlet 102 is located on the left wall of the humidity chamber 200. The conveying path runs through the first inlet 101 and the first outlet 102, so that the circuit board can enter the humidity chamber 200 from the first inlet 101 and leave the humidity chamber 200 from the first outlet 102 during operation. Flexible curtains can be installed at both the first inlet 101 and the first outlet 102 to reduce heat loss.

[0025] The drying chamber 300 is covered outside the drying section 301. The drying chamber 300 is rectangular. The walls of the drying chamber 300 are provided with a second inlet and a second outlet 103 adapted to the conveying path. The second inlet is located on the right wall of the drying chamber 300, and the second outlet 103 is located on the left wall of the drying chamber 300. The conveying path runs through the second inlet and the second outlet 103, so that the circuit board can enter the drying chamber 300 from the second inlet along the conveying path during operation, and can also leave the drying chamber 300 from the second outlet 103.

[0026] The heat pump unit includes a compressor 600 with a refrigerant outlet and a refrigerant inlet. A condenser 610, a throttling device 620, and an evaporator 630 are connected sequentially between the refrigerant outlet and the refrigerant inlet. The throttling device 620 can be an expansion valve. The heat pump unit may also include components such as a liquid receiver, a gas-liquid separator, and an oil separator. The heat pump unit is a commercially available device, and its specific structure will not be described in detail here. The components of the heat pump unit can be connected by copper pipes. The condenser 610 is located in the humidification chamber 200, and the evaporator 630 is located in the drying chamber 300. The compressor 600 and other components of the heat pump unit, except for the condenser 610 and the evaporator 630, can be installed in a fixed position such as on the ground or a support frame, as long as it can be placed stably.

[0027] In use, the operator can place the circuit board to be tested in the feeding section of the conveyor 100. The conveyor 100 sends the circuit board to be tested into the humid heat chamber 200, exposing the circuit board to a humid heat environment for a period of time. Then, the conveyor 100 transports the circuit board to be tested from the humid heat chamber 200 to the drying chamber 300 for drying and cooling. After drying, the circuit board is taken out and tested with testing instruments to assess whether the harsh environment has caused permanent damage or performance drift to the circuit board. The heat pump device can not only absorb the heat in the drying chamber 300 to maintain a low-temperature and dry environment to evaporate the moisture on the surface of the circuit board and ensure the safety of subsequent testing, but also transfer the heat absorbed from the drying chamber 300 to the humid heat chamber 200, realizing heat recovery and utilization, which is conducive to energy saving. In addition, the positions for picking up and placing the circuit board are located at both ends of the conveying path, which can realize continuous testing of multiple circuit boards and improve testing efficiency.

[0028] In some embodiments of this utility model, the second inlet and the first outlet 102 coincide. The humid heat chamber 200 and the drying chamber 300 are attached together, and the left wall of the humid heat chamber 200 is the right wall of the drying chamber 300; in this way, the circuit board sent out from the humid heat chamber 200 directly enters the drying chamber 300, and the humid and hot air that escapes from the humid heat chamber 200 along with the circuit board also directly enters the drying chamber 300, preventing this part of the humid and hot air from dissipating into the external environment and causing heat loss.

[0029] In some embodiments of this utility model, the drying chamber 300 is provided with a cooling channel 310, the two ends of which are respectively connected to the drying section 301. The evaporator 630 is disposed in the cooling channel 310, and a second fan 320 is disposed in the cooling channel 310. The cooling channel 310 can be disposed at the top of the drying chamber 300 to avoid the conveying device 100. The cooling channel 310 is arranged horizontally, and the two ends of the cooling channel 310 are respectively located at the two ends of the drying section 301. The second fan 320 can be an axial flow fan. In this way, the air in the drying chamber 300 circulates through the evaporator 630, and the heat absorption effect of the evaporator 630 is better.

[0030] In some embodiments of this invention, the downstream end of the cooling channel 310 is located at the downstream end of the drying section 301. This results in the airflow direction within the cooling channel 310 being from right to left, and the airflow direction within the drying section 301 being from left to right. The humidity within the drying section 301 gradually decreases from right to left, which is beneficial for drying the circuit board.

[0031] In some embodiments of this utility model, the drying chamber 300 is provided with an extension 400, which is located downstream of the drying section 301; the chamber wall of the extension 400 may be made of a material with good thermal conductivity (such as stainless steel), and / or the chamber wall of the extension 400 is provided with vent holes, so that the extension 400 can exchange heat with the outer section, and the temperature inside the extension 400 gradually approaches room temperature from right to left; the cooling channel 310 is provided with an air inlet 311, which is located upstream of the second fan 320. As the circuit board moves to the left within the extension section 400, the ambient temperature of the circuit board gradually approaches room temperature, preventing condensation on the circuit board surface from causing errors in subsequent tests. Because an air inlet 311 is provided, and the air inlet 311 is under negative pressure, it will draw in external air. The left end of the drying section 301 is under positive pressure, so the air flow direction within the extension section 400 is from right to left. Thus, the air within the extension section 400 can remain dry while gradually approaching room temperature from right to left, which helps to prevent condensation on the circuit board surface.

[0032] In some embodiments of this invention, the air inlet 311 is equipped with an airflow regulating valve. This allows for the regulation of the airflow drawn into the air inlet 311, thereby adjusting the temperature and humidity within the drying section 301.

[0033] In some embodiments of this utility model, the humid heat chamber 200 is provided with a heating channel 210, the two ends of which are respectively connected to the humid heat section 201. A condenser 610 is disposed in the heating channel 210, and a first fan 220 is disposed in the heating channel 210. The heating channel 210 can be disposed at the top of the humid heat chamber 200 to avoid the conveying device 100. The heating channel 210 is arranged horizontally, and the two ends of the heating channel 210 are respectively located at the two ends of the humid heat section 201. The first fan 220 can be an axial flow fan. In this way, the air in the humid heat chamber 200 circulates through the condenser 610, and the heat release effect of the condenser 610 is better. The air flow direction in the heating channel 210 can be set from right to left. An electric heating component, such as a PTC heater, can be disposed in the heating channel 210 to supplement heat when the temperature in the humid heat chamber 200 is insufficient.

[0034] In some embodiments of this utility model, the bottom of the evaporator 630 is provided with a liquid collection tank 642, and the heating channel 210 is provided with an evaporation tank 641. The liquid collection tank 642 and the evaporation tank 641 are connected. In this way, the condensate generated on the surface of the evaporator 630 can be recycled and reused in the humidification chamber 200, and there is no need to clean the liquid collection tank 642 during use. The liquid collection tank 642 is located at the bottom of the cooling channel 310, and the evaporation tank 641 is located at the bottom of the heating channel 210. The height of the cooling channel 310 is set higher than that of the heating channel 210, so that the height of the liquid collection tank 642 is higher than that of the evaporation tank 641. A connecting pipe 640 connects the liquid collection tank 642 and the evaporation tank 641. There is no need to set up an additional water pump, and the water in the liquid collection tank 642 can also flow to the evaporation tank 641 spontaneously.

[0035] In some embodiments of this invention, the conveying path further includes a testing station located downstream of the drying section 301. The testing station is equipped with a testing device for testing the circuit board. The testing station is located downstream of the extension section 400; this facilitates testing the circuit board delivered from the drying chamber 300. The unloading section is located downstream of the testing station.

[0036] In some embodiments of this utility model, the testing device includes a testing instrument, a testing fixture 520 located above the testing station, and a drive mechanism 510 for driving the testing fixture 520 to rise and fall. The bottom of the testing fixture 520 is provided with multiple probes, all of which are electrically connected to the testing instrument. The drive mechanism 510 can be a linear motor, and the probes can be spring probes 521. The probes are electrically connected to the testing instrument via flexible wires. When the conveying device 100 transports the circuit board to the testing station, the conveying device 100 stops operating, and the drive mechanism 510 drives the testing fixture 520 to descend, causing the multiple probes to contact the multiple contacts on the circuit board one-to-one, thus performing electrical testing. After the test is completed, the drive mechanism 510 drives the testing fixture 520 to rise, and the conveying device 100 transports the circuit board to the unloading section, where the operator can remove the circuit board.

[0037] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A circuit board damp heat testing device, characterized in that, include: A conveying device having a conveying path, the conveying path having a humid heat section and a drying section located downstream of the humid heat section; A heat and humidity chamber is installed outside the heat and humidity section, and the chamber wall is provided with a first inlet and a first outlet adapted to the conveying path; A drying chamber is provided on the outside of the drying section, and the chamber wall of the drying chamber is provided with a second inlet and a second outlet adapted to the conveying path; A heat pump device includes a compressor having a refrigerant outlet and a refrigerant inlet, wherein a condenser, a throttling device, and an evaporator are sequentially connected between the refrigerant outlet and the refrigerant inlet, the condenser being located in the humidification chamber, and the evaporator being located in the drying chamber.

2. The circuit board damp heat testing equipment according to claim 1, characterized in that: The second inlet coincides with the first outlet.

3. The circuit board damp heat testing equipment according to claim 1, characterized in that: The drying chamber is equipped with a cooling channel, the two ends of which are connected to the drying section. The evaporator is located in the cooling channel, and a second fan is installed in the cooling channel.

4. The circuit board damp heat testing equipment according to claim 3, characterized in that: The downstream end of the cooling channel is located at the downstream end of the drying section.

5. The circuit board damp heat testing equipment according to claim 4, characterized in that: The drying chamber is provided with an extension section located downstream of the drying section; the cooling channel is provided with an air inlet located upstream of the second fan.

6. The circuit board damp heat testing equipment according to claim 5, characterized in that: The air inlet is equipped with an air volume regulating valve.

7. The circuit board damp heat testing equipment according to claim 1, characterized in that: The humid heat chamber is provided with a heating channel, the two ends of which are respectively connected to the humid heat section. The condenser is located in the heating channel, and a first fan is provided in the heating channel.

8. The circuit board damp heat testing equipment according to claim 7, characterized in that: The bottom of the evaporator is provided with a liquid collection tank, and the heating channel is provided with a volatilization tank. The liquid collection tank is connected to the volatilization tank.

9. The circuit board damp heat testing equipment according to claim 1, characterized in that: The conveying path also includes a testing station located downstream of the drying section, and the testing station is equipped with a testing device for testing the circuit board.

10. The circuit board damp heat testing equipment according to claim 9, characterized in that: The testing device includes a testing instrument, a testing fixture located above the testing station, and a driving mechanism for driving the testing fixture to rise and fall. The bottom of the testing fixture is provided with multiple probes, all of which are electrically connected to the testing instrument.

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