Storage cases and electronic devices

Abstract

This application belongs to the field of headphone technology and discloses a storage shell and an electronic device. The storage shell includes a housing and a conductive component. The inner wall of the housing is provided with a mounting groove, and the bottom wall of the mounting groove is provided with a mounting hole. The conductive component is integrally formed into the housing, and at least a portion of the conductive component is disposed in the mounting groove. The conductive component includes a first connecting portion, which is disposed in the mounting hole and connected to the wall of the mounting hole. The storage shell and electronic device provided by this application have high airtightness and high production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of headphone technology, and in particular to a storage shell and electronic device. Background Technology

[0002] Electronic devices typically include an earphone case and components such as earphone holders, batteries, and circuit boards housed within it. The bottom of the earphone case has mounting holes into which a grounding protection device is installed. This grounding protection device conducts static electricity within the earphone case, preventing electrostatic discharge from damaging internal components. The grounding protection device also has through holes for a charging connector to pass through, enabling the electronic device to be charged.

[0003] In related technologies, after the lower shell of the earphone case is processed, the grounding protection component is placed in a fixture, and then glue is applied to the grounding protection component using a dispensing machine. The fixture then aligns and assembles the grounding protection component with the lower shell, followed by curing. However, this method of connecting the grounding protection component to the lower shell of the earphone case involves dispensing, curing, and cleaning, resulting in low production efficiency for electronic devices. Furthermore, achieving airtightness between the grounding protection component and the lower shell through dispensing leads to low yield rates for airtightness. Utility Model Content

[0004] One objective of this application is to provide a storage shell to solve the technical problems of low airtightness and low production efficiency.

[0005] Another objective of this application is to provide an electronic device with high production efficiency.

[0006] Based on the above concept, the technical solution adopted in this application is:

[0007] Storage case, including:

[0008] The housing has an inner wall with a mounting groove and a mounting hole on the bottom wall of the mounting groove.

[0009] A conductive component is integrally formed on the housing, at least a portion of the conductive component is disposed in the mounting groove, the conductive component includes a first connecting portion disposed in the mounting hole, and the first connecting portion is connected to the hole wall of the mounting hole.

[0010] In one or more embodiments of this application, the conductive element is provided with a connection reinforcement structure, and the housing is provided with a reinforcement mating structure that mates with the connection reinforcement structure.

[0011] In one or more embodiments of this application, the first connecting portion is provided with the connection reinforcement structure, and the wall of the mounting hole is provided with the reinforcement mating structure.

[0012] In one or more embodiments of this application, the conductive element includes a second connecting portion, the second connecting portion being disposed in the mounting groove, and the first connecting portion being connected to one side of the second connecting portion;

[0013] The second connecting part is provided with the connection reinforcement structure, and the groove wall of the mounting groove is provided with the reinforcement fitting structure.

[0014] In one or more embodiments of this application, one of the connection enhancement structure and the enhancement mating structure is a groove and the other is a protrusion, with the protrusion placed in the groove.

[0015] In one or more embodiments of this application, one of the conductive element and the housing is provided with an anti-rotation groove, and the other is provided with an anti-rotation protrusion, wherein the anti-rotation protrusion is disposed in the anti-rotation groove.

[0016] In one or more embodiments of this application, the conductive element is provided with a plurality of positioning holes;

[0017] The plurality of positioning holes are asymmetrically arranged on the conductive element; and / or, at least some of the positioning holes are the same size.

[0018] In one or more embodiments of this application, the surface of the conductive element that contacts the housing is a first connecting surface, and the first connecting surface is provided with a knurled structure.

[0019] In one or more embodiments of this application, the housing further includes a connector, the connector including a support member, a circuit board and a plug terminal, the support member and the circuit board are both disposed inside the housing, the support member is connected to the conductive member, and a sealing member is provided between the support member and the conductive member; the conductive member is provided with a plug hole, the plug terminal is disposed in the plug hole and electrically connected to the circuit board.

[0020] In one or more embodiments of this application, one of the support member and the conductive member is provided with an annular groove, and the other is provided with an annular boss. At least a portion of the annular boss is located in the annular groove, and at least a portion of the sealing member is pressed between the annular boss and the groove wall of the annular groove.

[0021] In one or more embodiments of this application, the top surface of the annular boss is spaced apart from the bottom wall of the annular groove, and the distance between the top surface of the annular boss and the bottom wall of the annular groove is a, wherein 0.1mm≤a≤0.2mm;

[0022] And / or, the width of the annular groove is b, where 1mm ≤ b ≤ 1.5mm;

[0023] And / or, the surface of the support member with the annular boss is the first surface, the surface of the conductive member with the annular groove is the second surface, at least a portion of the sealing member is pressed between the first surface and the second surface, and the distance between the first surface and the second surface is c, wherein 0.1mm≤c≤0.2mm.

[0024] Electronic devices, including the storage case as described above.

[0025] The beneficial effects of this application are:

[0026] The storage shell and electronic device provided in this application have conductive components integrally molded into the shell, resulting in a strong and reliable connection between the shell and the conductive components. Furthermore, the connection between the shell and the conductive components can be achieved during the manufacturing process of the shell, eliminating the need for additional connection steps. This reduces assembly processes, improves production and assembly efficiency, lowers costs, shortens the production cycle, and increases the yield rate. The integrally molded structure avoids glue seams, forming a seamless seal, which enables the shell and the conductive components to have high airtightness, meeting high-level waterproof requirements. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this application and these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a storage shell provided in an embodiment of this application;

[0029] Figure 2 This is a top view of a storage shell provided in an embodiment of this application;

[0030] Figure 3 This application Figure 1 The diagram shows the structural structure of the housing.

[0031] Figure 4 This application Figure 1 A cross-sectional view of the storage shell shown;

[0032] Figure 5 This application Figure 1 Another cross-sectional view of the storage shell shown;

[0033] Figure 6 This application Figure 1 A first-view structural schematic diagram of the conductive components of the housing shown.

[0034] Figure 7 This application Figure 1 A second-view structural schematic diagram of the conductive components of the housing shown.

[0035] Figure 8 This application Figure 1 A third-view structural diagram of the conductive components of the housing shown.

[0036] Figure 9 This is a schematic diagram of another type of storage shell provided in the embodiments of this application;

[0037] Figure 10 This application Figure 9 An exploded view of the storage shell shown;

[0038] Figure 11 This application Figure 9 The first exploded view shows the support, sealing and conductive components of the housing.

[0039] Figure 12 This application Figure 9 The second exploded view shows the support, sealing, and conductive components of the housing.

[0040] Figure 13 This application Figure 9 The top view of the storage shell shown;

[0041] Figure 14 This application Figure 9 A partially enlarged cross-sectional view of the storage shell shown.

[0042] Explanation of reference numerals in the attached figures:

[0043] 1. Housing; 11. Mounting groove; 12. Mounting hole; 13. Reinforcing mating structure; 131. Protrusion; 14. Anti-rotation protrusion; 2. Conductive component; 20. Plug hole; 21. First connecting part; 22. Connection reinforcement structure; 221. Groove; 23. Second connecting part; 24. Anti-rotation groove; 25. Positioning hole; 26. First connecting surface; 27. Annular groove; 28. Second surface; 29. ​​Third connecting part; 3. Connector; 31. Support component; 311. Annular boss; 312. First surface; 313. Inclined surface; 32. Circuit board; 33. Plug terminal; 4. Seal. Detailed Implementation

[0044] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of this application will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not all of them.

[0045] It should be understood that the phrase "an embodiment" or "one embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0046] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0047] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. In the description of this embodiment, unless otherwise specified, "multiple" specifically refers to two or more.

[0049] In the description of this embodiment, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of description and simplification of operation. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0050] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or it can be located in between the component.

[0051] The technical solution of this application will be further described below with reference to the accompanying drawings and specific embodiments.

[0052] This embodiment provides a storage shell for electronic devices, which has high production efficiency and a high yield rate of airtightness at the connection.

[0053] For example, the storage shell can be at least a part of an earphone case, or it can be the shell of other electronic devices, which is not limited in this application. The accompanying drawings of this application show the storage shell as the bottom shell of an earphone case.

[0054] For example, such as Figures 1 to 13 As shown, the storage shell includes a shell 1 and a conductive component 2. The shell 1 and the conductive component 2 are a single, integrally molded structure. Specifically, the conductive component 2 is made of metal, while the shell 1 is made of a non-metallic material such as plastic. The conductive component 2 is integrally molded onto the shell 1, for example, by injection molding. This results in a strong connection between the shell 1 and the conductive component 2, and the connection between the shell 1 and the conductive component 2 can be achieved during the manufacturing process of the shell 1, eliminating the need for additional connection steps. This reduces assembly processes, improves assembly efficiency, and ensures high airtightness between the shell 1 and the conductive component 2.

[0055] In some embodiments, such as Figure 3 As shown, the inner wall of the housing 1 is provided with a mounting groove 11, which is used to install at least a portion of the conductive component 2. This increases the connection area between the conductive component 2 and the housing 1, thereby ensuring connection strength and sealing. The bottom wall of the mounting groove 11 is provided with a mounting hole 12, which is used to connect the conductive component 2.

[0056] It should be noted that the housing 1 in this embodiment can be part or all of the headphone case of the electronic device, and this embodiment does not limit this. For example, the housing 1 in this embodiment is the lower shell of the headphone case. The housing 1 is rotatably connected to the upper cover of the headphone case.

[0057] In some alternative embodiments, such as Figure 4 and Figure 5 As shown, the conductive component 2 is provided with a plug hole 20, and at least a portion of the connector 3 of the electronic device is located in the plug hole 20. For example, the plug terminal 33 of the connector 3 is located in the plug hole 20, and the charging cable is inserted into the plug hole 20 and electrically connected to the plug terminal 33 to charge the electronic device.

[0058] In this embodiment, at least a portion of the conductive element 2 is disposed in the mounting groove 11. On the one hand, the mounting groove 11 can limit the movement of the conductive element 2 relative to the housing 1, thereby reducing the risk of movement of the conductive element 2. On the other hand, it can increase the connection area between the housing 1 and the conductive element 2, thereby increasing the connection strength.

[0059] In some embodiments, such as Figure 4 and Figure 5 As shown, the conductive component 2 includes a first connecting portion 21, which is disposed within the mounting hole 12 and connected to the wall of the mounting hole 12. A insertion hole 20 is disposed within the first connecting portion 21. By providing the first connecting portion 21, the conductive component 2 can connect to the wall of the mounting hole 12, further increasing the connection area between the conductive component 2 and the housing 1. Furthermore, the mounting hole 12 can restrict the first connecting portion 21 in a direction perpendicular to the axis, thereby limiting the conductive component 2 and further reducing the risk of movement of the conductive component 2 relative to the housing 1.

[0060] The storage shell provided in this embodiment has the shell 1 integrally formed with the conductive component 2, which makes the connection between the shell 1 and the conductive component 2 stronger and more reliable. Moreover, the connection between the shell 1 and the conductive component 2 can be achieved during the manufacturing process of the shell 1, without the need for additional connection steps. This reduces assembly processes, improves production assembly efficiency, reduces costs, shortens the production cycle, and improves the yield rate. The integrally formed structure avoids glue seams and forms a seamless seal, which enables the shell 1 and the conductive component 2 to have high airtightness and meet high-level waterproof requirements.

[0061] In at least one possible implementation, such as Figure 5 and Figure 6 As shown, the conductive component 2 is provided with a connection reinforcement structure 22, such as Figure 3As shown, the housing 1 is provided with a reinforcing fit structure 13 that engages with the connecting reinforcement structure 22. The connecting reinforcement structure 22 and the reinforcing fit structure 13 cooperate with each other to further enhance the connection strength between the housing 1 and the conductive component 2. For example, the engaging fit structure 13 and the connecting reinforcement structure 22 can further increase the connection area between the conductive component 2 and the housing 1, which is equivalent to achieving interlocking between the conductive component 2 and the housing 1, thereby enhancing the connection strength between the conductive component 2 and the housing 1. This effectively resists impact, drops, and torsion, and significantly improves the durability of the housing.

[0062] In some embodiments, of the connecting reinforcement structure 22 and the reinforcing mating structure 13, one is a groove 221 and the other is a protrusion 131, wherein the protrusion 131 is placed in the groove 221. In this embodiment, the connecting reinforcement structure 22 is a groove 221 and the reinforcing mating structure 13 is a protrusion 131. Since the conductive component 2 is made of metal, the groove 221 can be formed on the conductive component 2 by means of stamping or the like, which facilitates the processing of the groove 221. Since the protrusion 131 is obtained by injection molding, it is also easy to process. Of course, it can be understood that the connecting reinforcement structure 22 can also be a protrusion 131 and the reinforcing mating structure 13 can be a groove 221, but this embodiment does not limit this.

[0063] In other embodiments, one of the connecting reinforcement structure 22 and the reinforcing mating structure 13 can be a through hole and the other can be a protrusion. The protrusion is inserted into the through hole, which can also achieve the purpose of improving the connection strength between the housing 1 and the conductive component 2. The specific choice can be made flexibly according to the requirements.

[0064] It should be noted that multiple connection reinforcement structures 22 and reinforcement mating structures 13 can be provided at intervals to improve the connection strength and reliability between the conductive component 2 and the housing 1, reduce the risk of weak connection areas, and ensure the overall connection strength.

[0065] In some alternative embodiments, the connection reinforcement structure 22 can be arranged in an array on the surface where the conductive element 2 is connected to the housing 1, and the reinforcement mating structure 13 can be arranged in an array on the surface where the housing 1 is connected to the conductive element 2.

[0066] In at least one possible implementation, such as Figure 7As shown, the first connecting portion 21 is provided with a connection reinforcement structure 22, and the wall of the mounting hole 12 is provided with a reinforcement fit structure 13. This improves the connection strength between the first connecting portion 21 and the wall of the mounting hole 12, reducing the risk of movement of the first connecting portion 21 relative to the wall of the mounting hole 12 during insertion and removal, thereby improving the connection strength and reliability between the conductive component 2 and the housing 1. Furthermore, the first connecting portion 21 and the wall of the mounting hole 12 can have a high degree of connection sealing, thus improving the airtightness between the conductive component 2 and the housing 1.

[0067] Optionally, such as Figure 7 As shown, the first connecting part 21 is provided with a plurality of connecting reinforcement structures 22, which are spaced apart.

[0068] In some alternative implementations, such as Figure 6 and Figure 7 As shown, the conductive element 2 includes a second connecting portion 23. At least a portion of the second connecting portion 23 is disposed in the mounting groove 11, and a first connecting portion 21 is connected to one side of the second connecting portion 23. The size of the second connecting portion 23 is larger than the size of the first connecting portion 21, thereby providing a larger connection area between the conductive element 2 and the housing 1.

[0069] For example, such as Figure 6 and Figure 7 As shown, the second connecting part 23 is provided with a connecting reinforcement structure 22, such as Figure 3 As shown, the mounting groove 11 has a reinforced mating structure 13 on its groove wall. This increases the connection area and connection strength between the second connecting part 23 and the groove wall of the mounting groove 11, reduces the risk of the second connecting part 23 moving relative to the housing 1, and thus improves the connection strength and reliability between the conductive part 2 and the housing 1.

[0070] Optionally, such as Figure 7 As shown, the second connecting part 23 is provided with a plurality of connecting reinforcement structures 22, which are spaced apart.

[0071] In some embodiments, such as Figure 4 or Figure 5 As shown, the conductive component 2 may also be provided with a third connecting portion 29, which is connected to the side of the second connecting portion 23 opposite to the first connecting portion 21. That is, the first connecting portion 21 and the third connecting portion 29 are connected to the opposite sides of the second connecting portion 23. The third connecting portion 29 can be used to connect with the connector 3. In this embodiment, the insertion hole 20 passes through the first connecting portion 21, the second connecting portion 23, and the third connecting portion 29.

[0072] In one or more embodiments, a groove structure or a protrusion structure may also be provided on the third connecting part 29 to improve the connection strength and reliability between the third connecting part 29 and the connector 3.

[0073] In some optional embodiments, the mounting groove 11 can be a stepped groove, and the second connecting part 23 that cooperates with the mounting groove 11 is a stepped structure. The stepped structure engages with the stepped groove, which further improves the limiting effect on the second connecting part 23 and ensures that the relative position of the conductive part 2 and the housing 1 remains unchanged.

[0074] In one or more embodiments of this application, such as Figure 6 As shown, the conductive component 2 is provided with an anti-rotation groove 24, such as Figure 3 As shown, the housing 1 is provided with an anti-rotation protrusion 14, which is disposed in the anti-rotation groove 24. This allows the conductive element 2 to be locked 360° circumferentially to resist torsional stress and shear force on the conductive element 2, ensuring that the relative position of the conductive element 2 and the housing 1 remains unchanged. By providing the anti-rotation groove 24 on the conductive element 2, the processing difficulty of the anti-rotation groove 24 can be reduced. By placing the anti-rotation protrusion 14 in the housing 1, it can be formed during injection molding, offering the advantage of convenient processing.

[0075] Of course, it is understandable that the conductive component 2 may also have an anti-rotation protrusion 14 and the housing 1 may have an anti-rotation groove 24. The specific design can be flexibly selected according to the requirements, and this embodiment does not limit it.

[0076] Optionally, multiple anti-rotation grooves 24 and anti-rotation protrusions 14 can be provided in a one-to-one correspondence, so that when one of the anti-rotation protrusions 14 breaks, the other anti-rotation protrusions 14 can still resist the torsional stress and shear force on the conductive component 2, thus having high reliability.

[0077] In at least one possible implementation, such as Figure 6 or Figure 7 As shown, an anti-rotation groove 24 is provided on the second connecting portion 23 of the conductive member 2, and the anti-rotation groove 24 can also be provided on the surface of the conductive member 2 where the first connecting portion 21 is located. To facilitate the formation of the anti-rotation protrusion 14, the anti-rotation groove 24 extends to the outer edge of the second connecting portion 23; that is, the anti-rotation groove 24 has a slot on the outer peripheral side of the second connecting portion 23, so that material can enter the anti-rotation groove 24 during injection molding, thereby forming the anti-rotation protrusion 14. Optionally, multiple anti-rotation grooves 24 can be provided on the periphery of the first connecting portion 21.

[0078] In one or more embodiments of this application, such as Figure 6As shown, the surface of the conductive component 2 that contacts the housing 1 is the first connecting surface 26, and the first connecting surface 26 is provided with a knurled structure. By providing the knurled structure, the roughness of the first connecting surface 26 can be increased, thereby improving the adhesion between the conductive component 2 and the housing 1, thus improving the connection strength between the conductive component 2 and the housing 1, and enhancing the durability of the storage shell.

[0079] Alternatively, the knurled structure can be obtained by knurling the first connecting surface 26.

[0080] It should be noted that by setting the conductive component 2 and the housing 1 with the connection reinforcement structure 22, the reinforcement mating structure 13, the anti-rotation groove 24, the anti-rotation protrusion 14, the knurling structure, etc., the conductive component 2 and the housing 1 can be guaranteed to have a stronger connection strength, reduce the risk of the conductive component 2 and the housing 1 separating, and improve the durability of the storage shell.

[0081] In at least one possible implementation, such as Figure 8 As shown, the conductive component 2 is provided with multiple positioning holes 25. The positioning holes 25 are used for positioning the conductive component 2 in the mold used for injection molding the housing 1. For example, the mold is provided with positioning pins, which are inserted into the positioning holes 25 to determine the position of the conductive component 2 in the mold, thereby ensuring the relative position of the conductive component 2 and the molded housing 1, and achieving precise positioning of the conductive component 2. By providing multiple positioning holes 25, the orientation of the conductive component 2 in the mold can be guaranteed, avoiding the situation of being placed backwards.

[0082] In some embodiments, multiple positioning holes 25 are asymmetrically arranged on the conductive element 2, that is, at least two positioning holes 25 are not symmetrically arranged, but staggered. In this way, it can be ensured that if the conductive element 2 is placed in reverse, the positioning post will not be able to be inserted, thus achieving foolproof and accurate positioning.

[0083] In some embodiments, at least two positioning holes 25 are not exactly the same size. At least some of the positioning holes 25 are the same size, and there may also be positioning holes 25 of different sizes. Thus, the positioning holes 25 vary in size, and the positioning posts also vary in size. Only when the positioning post is inserted into the corresponding size positioning hole 25 can the correct placement of the conductive component 2 be confirmed, thus achieving foolproof and precise positioning. It should be noted that the size of the positioning hole 25 in this embodiment refers to the cross-sectional area or the diameter of the positioning hole 25.

[0084] In one or more embodiments of this application, such as Figures 9 to 14 As shown, the housing also includes a connector 3. The connector 3 includes a support member 31, which is disposed within the housing 1. The support member 31 is made of a non-metallic material and is used to support other components within the connector 3. Figure 9 As shown, the support member 31 is connected to the conductive member 2, and, as Figure 10 As shown, a sealing member 4 is provided between the support member 31 and the conductive member 2. The sealing member 4 is used to seal the gap between the conductive member 2 and the support member 31, thereby preventing foreign objects entering through the insertion hole 20 of the conductive member 2 from entering the interior of the housing through the gap between the conductive member 2 and the support member 31. For example, the sealing member 4 can be a sealing ring.

[0085] In some alternative embodiments, the seal 4 can be obtained by filling the space between the support 31 and the conductive element 2 with hot melt adhesive. Since hot melt adhesive has good fluidity after melting, it can fully fill small and irregular spaces, expel air from the space, and thus adapt to more complex structural designs. In addition, hot melt adhesive has a low cost and does not require the design of complex silicone sleeves or other additional parts, reducing material and management costs.

[0086] In at least one implementation, such as Figure 9 As shown, connector 3 also includes circuit board 32 and plug terminals 33. Circuit board 32 is disposed inside housing 1. Conductive element 2 is connected to support member 31, plug terminals 33 are electrically connected to circuit board 32, and plug terminals 33 are disposed in plug holes 20 of conductive element 2.

[0087] In some embodiments, such as Figure 11 and Figure 12 As shown, of the support member 31 and the conductive member 2, one is provided with an annular groove 27, and the other is provided with an annular boss 311. At least a portion of the annular boss 311 is located within the annular groove 27, and at least a portion of the sealing member 4 is pressed between the annular boss 311 and the groove wall of the annular groove 27. By providing the annular groove 27, more hot melt adhesive can be contained during adhesive injection, thereby ensuring sufficient sealing members 4 between the support member 31 and the conductive member 2 to guarantee a sealing effect. The fact that at least a portion of the annular boss 311 is located within the annular groove 27 enables mutual positioning of the support member 31 and the conductive member 2, thereby ensuring the uniqueness of their relative positions and guaranteeing the installation accuracy of the support member 31 and the conductive member 2. Both the annular groove 27 and the annular boss 311 are annular, thus achieving circumferential sealing and ensuring a sealing effect.

[0088] For example, such as Figure 11 and Figure 12 As shown, the support member 31 has an annular boss 311, and the conductive member 2 has an annular groove 27. For example, the annular groove 27 is provided in the second connecting portion 23 of the conductive member 2, and is provided on the surface of the second connecting portion 23 facing the third connecting portion 29. One wall of the annular groove 27 is flush with the outer wall of the third connecting portion 29, so that the hot melt adhesive can be shielded and guided through the third connecting portion 29, so that the hot melt adhesive fills the annular groove 27.

[0089] In some alternative implementations, such as Figure 14 As shown, the top surface of the annular boss 311 is spaced apart from the bottom wall of the annular groove 27, and the distance between the top surface of the annular boss 311 and the bottom wall of the annular groove 27 is 'a', where 0.1mm ≤ a ≤ 0.2mm. When the value of 'a' meets the specified range, the thickness of the portion of the seal 4 located between the annular boss 311 and the bottom wall of the annular groove 27 meets the sealing requirements, thus achieving a good sealing effect. The value of 'a' cannot be too large, as this would result in a larger depth of the annular groove 27, which would affect the structural strength of the conductive element 2 and lead to a risk of breakage. The value of 'a' cannot be too small, as this would result in a smaller thickness of the portion of the seal 4 located between the annular boss 311 and the bottom wall of the annular groove 27, which would lead to a risk of breakage of the seal 4 and thus seal failure. For example, the value of 'a' can be any value or a range between any two values, such as 0.1mm, 0.12mm, 0.15mm, 0.17mm, 0.19mm, 0.2mm, etc., and this embodiment does not limit this value.

[0090] In at least one implementation, please continue to see Figure 4 The width of the annular groove 27 is b, where 1mm ≤ b ≤ 1.5mm. When the value of b meets the range, the width of the seal 4 can meet the requirements, and the contact area between the seal 4 and the conductive element 2 can be larger, thus achieving a better sealing effect. The value of b cannot be too large, as this indicates that the annular groove 27 is too wide. On the one hand, this increases the material used for the seal 4, thus increasing the cost; on the other hand, a wider annular groove 27 will reduce the structural strength of the conductive element 2. The value of b cannot be too small, as this indicates that the annular groove 27 is too narrow. On the one hand, this results in a smaller seal 4, a smaller connection area between the seal 4 and the conductive element 2 and the support 31, and a poor sealing effect; on the other hand, a narrow annular groove 27 will also affect the flow of the gel-like seal 4 during the glue injection process, thus failing to form a closed seal 4, leading to circumferential seal failure. For example, the value of b can be any value or a range between any two values, such as 1mm, 1.2mm, 1.3mm, 1.4mm, 1.45mm, 1.5mm, etc. This embodiment does not limit this value.

[0091] Optionally, please continue to see Figure 4 The support member 31 has an annular boss 311 on its first surface 312, and the conductive member 2 has an annular groove 27 on its second surface 28. The first surface 312 and the second surface 28 are arranged opposite to each other, so that at least a portion of the annular boss 311 can be located in the annular groove 27. At least a portion of the sealing member 4 is pressed between the first surface 312 and the second surface 28, that is, the sealing member 4 has a portion located outside the annular groove 27. In this way, the sealing area between the sealing member 4 and the conductive member 2 and the support member 31 can be further increased, thereby improving the sealing effect.

[0092] In some embodiments, such as Figure 14 As shown, the distance between the first surface 312 and the second surface 28 is c, where 0.1mm ≤ c ≤ 0.2mm. When the value of c meets the specified range, the thickness of the portion of the sealing element 4 located between the first surface 312 and the second surface 28 meets the sealing requirements, thus achieving a better sealing effect. The value of c cannot be too large, as this would result in an excessively large distance between the conductive element 2 and the support element 31, affecting the connection strength between the two. The value of c cannot be too small, as this would result in a thinner portion of the sealing element 4 located between the first surface 312 and the second surface 28, making it more prone to sealing failure. For example, the value of c can be any value or a range between any two values, such as 0.1mm, 0.12mm, 0.15mm, 0.17mm, 0.19mm, or 0.2mm. This embodiment does not limit this range.

[0093] In at least one possible implementation, such as Figure 12 and Figure 14 As shown, the support member 31 is provided with an inclined surface 313, which is inclined toward the connection between the second connecting part 23 and the third connecting part 29, so that an adhesive space can be formed between the inclined surface 313, the second connecting part 23 and the third connecting part 29. The adhesive space is used to accommodate the sealing member 4, so that the volume of the part of the sealing member 4 located between the inclined surface 313, the second connecting part 23 and the third connecting part 29 is larger, which further improves the sealing effect between the support member 31 and the conductive member 2 and reduces the risk of sealing failure.

[0094] The storage shell provided in this embodiment has extremely high connection strength and reliability. Through the cooperation of the groove 221, protrusion 131, anti-rotation groove 24, and anti-rotation protrusion 14, a physical bond is achieved through interlocking. The connection strength between the conductive component 2 and the shell 1 is far superior to that of adhesive bonding, effectively resisting impact, drops, and torsion, significantly improving product durability. Furthermore, the connection method between the shell 1 and the conductive component 2 provides excellent waterproof and dustproof performance. Because the one-piece molding structure completely eliminates adhesive seams, a seamless seal is formed, easily achieving high-level (such as IPX7) waterproof requirements. In addition, it improves the production efficiency of the storage shell, reduces costs, eliminates processes such as dispensing, curing, and cleaning, shortens the production cycle, increases automation, improves yield, and significantly reduces overall production costs. Moreover, the storage shell has a more aesthetically pleasing and consistent appearance, with no adhesive contamination, resulting in a clean and high-end product appearance. The boundary between the conductive component 2 and the shell 1 is clear and crisp, enhancing the overall quality. The connection method between the housing 1 and the conductive component 2 also has the advantage of high design flexibility. The mechanical interlock structure can be flexibly designed according to strength and appearance requirements, providing more possibilities for product design.

[0095] Furthermore, the sealing element 4 between the conductive component 2 and the support component 31 is formed by hot melt adhesive. This hot melt adhesive filling achieves both secondary chemical sealing and complete filling, providing double protection and a sealing effect far superior to other sealing methods. Additionally, it allows for high production efficiency of the housing, is easily automated, and utilizes inexpensive hot melt adhesive. Moreover, the hot melt adhesive has excellent fluidity after melting, enabling it to fully fill small and irregular spaces, expel air, and adapt to various complex structural designs, demonstrating high adaptability.

[0096] This embodiment also provides an electronic device, including the aforementioned storage shell. The electronic device provided in this embodiment has high assembly efficiency and good airtightness.

[0097] For example, the electronic device may be a wireless headset or other electronic product, and this embodiment is not limited thereto.

[0098] Obviously, the above embodiments of this application are merely examples for clear illustration and are not intended to limit the implementation of this application. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of the claims of this application.

Claims

1. A housing, characterized by, include: The housing has an inner wall with a mounting groove and a mounting hole on the bottom wall of the mounting groove. A conductive component is integrally formed on the housing, at least a portion of the conductive component is disposed in the mounting groove, the conductive component includes a first connecting portion disposed in the mounting hole, and the first connecting portion is connected to the hole wall of the mounting hole.

2. The housing case according to claim 1, wherein The conductive component is provided with a connection reinforcement structure, and the housing is provided with a reinforcement mating structure that mates with the connection reinforcement structure.

3. The housing case according to claim 2, characterized by The first connecting part is provided with the connection reinforcement structure, and the hole wall of the mounting hole is provided with the reinforcement fitting structure.

4. The housing case according to claim 2, wherein The conductive component includes a second connecting portion, which is disposed in the mounting groove, and the first connecting portion is connected to one side of the second connecting portion; The second connecting part is provided with the connection reinforcement structure, and the groove wall of the mounting groove is provided with the reinforcement fitting structure.

5. The receiving case according to any one of claims 2 to 4, characterized in that, Of the connection enhancement structure and the enhancement mating structure, one is a groove and the other is a protrusion, with the protrusion placed in the groove.

6. The receiving case according to any one of claims 1 to 4, characterized in that, Of the conductive component and the housing, one is provided with an anti-rotation groove, and the other is provided with an anti-rotation protrusion, wherein the anti-rotation protrusion is disposed in the anti-rotation groove.

7. The receiving case according to any one of claims 1 to 4, characterized in that, The conductive component is provided with multiple positioning holes; The plurality of positioning holes are asymmetrically arranged on the conductive element; and / or, at least some of the positioning holes are the same size.

8. The receiving case according to any one of claims 1 to 4, characterized in that, The surface of the conductive component that contacts the housing is the first connecting surface, and the first connecting surface is provided with a knurled structure.

9. The receiving case according to any one of claims 1 to 4, characterized in that, The storage shell also includes a connector, which includes a support member, a circuit board, and a plug-in terminal. The support member and the circuit board are both disposed inside the shell. The support member is connected to the conductive member, and a sealing member is provided between the support member and the conductive member. The conductive member is provided with a plug-in hole, and the plug-in terminal is disposed in the plug-in hole and electrically connected to the circuit board.

10. The housing case according to claim 9, wherein Of the support member and the conductive member, one is provided with an annular groove and the other is provided with an annular boss. At least a portion of the annular boss is located in the annular groove, and at least a portion of the sealing member is pressed between the annular boss and the groove wall of the annular groove.

11. An electronic device, characterized by Includes the storage shell as described in any one of claims 1-10.

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