A defoaming device for silicon wafer cutting fluid

Abstract

This utility model discloses a defoaming device for silicon wafer cutting fluid, belonging to the field of silicon wafer cutting technology. It includes a cutting chamber for cutting silicon wafers, with a spray system for spraying cutting fluid onto the top of the cutting chamber slidably connected. The cutting chamber also has a foam scraper floating above the surface of the cutting fluid, which moves back and forth along the long side of the cutting chamber. This silicon wafer cutting fluid defoaming device, by incorporating a movable foam scraper that floats on the cutting fluid, pushes the foam towards one end of the cutting chamber, thus suppressing foam overflow from the surface of the cutting fluid. A foam-collecting plate collects the foam within it; lifting the foam scraper removes the foam from the foam-collecting plate for easy cleaning. The entire defoaming process is efficient and fast, effectively removing foam and solving the technical problem of foam overflowing outside the equipment, causing a dirty working environment, and even leading to safety hazards such as short circuits and slippage.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cutting technology, specifically to a silicon wafer cutting fluid defoaming device. Background Technology

[0002] In the photovoltaic and semiconductor manufacturing industries, silicon wafers are typically processed using wire sawing, a process that relies on a cutting fluid containing silicon carbide or diamond abrasive to efficiently and precisely cut silicon ingots. However, during high-speed cutting, the intense friction between the cutting wire and the silicon ingot, along with the circulating flow of the cutting fluid, easily generates a large amount of foam on the surface of the fluid. If this foam is not removed promptly and effectively, it will not only reduce the cooling and lubrication performance of the cutting fluid, affecting cutting efficiency and the surface quality of the silicon wafers, but may also overflow onto the outside of the equipment, causing a dirty working environment and even posing safety hazards such as short circuits and slippage.

[0003] Currently, the most common method for controlling foam is to add defoamers. While adding chemical defoamers can suppress foam generation to some extent, it may introduce impurities, affecting the purity of the cutting fluid and the subsequent silicon wafer cleaning process, and the long-term cost is high.

[0004] Therefore, it is necessary to provide a defoaming device for silicon wafer cutting fluid to solve the above problems. Utility Model Content

[0005] Based on the aforementioned problems in the existing technology, the purpose of this utility model is to provide a silicon wafer cutting fluid defoaming device to solve the problems mentioned in the background technology.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a silicon wafer cutting fluid defoaming device, including a cutting chamber for cutting silicon wafers, a spraying system for spraying cutting fluid onto silicon wafers is slidably connected to the top of the cutting chamber, and a foam scraper floating above the surface of the cutting fluid is also provided in the cutting chamber, the foam scraper moving back and forth along the long side of the cutting chamber.

[0007] Furthermore, the scraper plate has a scraper, a float and a counterweight, the float is embedded on both sides of the scraper and the counterweight is installed at the bottom of the scraper.

[0008] Furthermore, the material of the counterweight is metal.

[0009] Furthermore, the device also includes a front pulley, a rear pulley, a front steel rope, and a rear steel rope. The front pulley and the rear pulley are both installed on the top of the cutting chamber, and the scraper is located between the front pulley and the rear pulley. The top of the scraper plate has a lifting lug, one end of the front steel rope passes around the front pulley and is fixedly connected to the lifting lug, and one end of the rear steel rope passes around the rear pulley and is fixedly connected to the lifting lug.

[0010] Furthermore, the bottom of the counterweight extends downwards with an arc-shaped foam-supporting plate, the opening of which faces upwards.

[0011] Furthermore, the bottom of the cutting chamber is connected to an outlet.

[0012] The beneficial effects of this utility model are as follows: This utility model provides a defoaming device for silicon wafer cutting fluid. The device is equipped with a movable foam scraper that floats on the cutting fluid, pushing the foam to one end of the cutting chamber to suppress the overflow of foam on the surface of the cutting fluid. By providing a foam-collecting plate, the foam can be collected in the foam-collecting plate. Lifting the foam scraper can lift the foam in the foam-collecting plate for cleaning. The entire defoaming process is efficient and fast, and the foam is removed in a timely and effective manner. This solves the technical problem of foam overflowing to the outside of the equipment, causing a dirty working environment, and even causing safety hazards such as short circuits and slippage.

[0013] In addition to the objectives, features, and advantages described above, this utility model has other objectives, features, and advantages. The present utility model will now be described in further detail with reference to the figures. Attached Figure Description

[0014] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments and descriptions of this utility model are used to explain this utility model and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall design of this utility model; Figure 2 This is a schematic diagram of the interior of the cutting chamber of this utility model; Figure 3 This is a schematic diagram of the bubble scraper of this utility model; Figure 4 This is a schematic diagram of the movement of the bubble scraper of this utility model; The following are the labeling elements in the figure: 1. Cutting chamber; 2. Discharge port; 3. Front pulley; 4. Rear pulley; 5. Spray system; 6. Scraper plate; 61. Lifting lug; 62. Scraper; 63. Float; 64. Counterweight; 65. Bubble support plate; 7. Front steel rope; 8. Rear steel rope; a. Cutting fluid; b. Foam. Detailed Implementation

[0015] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] like Figure 1-4 As shown, the present invention provides a technical solution: a silicon wafer cutting fluid defoaming device, including a cutting chamber 1 for cutting silicon wafers, a spraying system 5 for spraying cutting fluid a onto the silicon wafers slidably connected to the top of the cutting chamber 1, and a scraper 6 floating above the surface of the cutting fluid a in the cutting chamber 1, the scraper 6 moving back and forth along the long side of the cutting chamber 1.

[0018] The bubble scraper 6 has a scraper 62, a float 63, and a counterweight 64. The float 63 is embedded on both sides of the scraper 62, and the counterweight 64 is installed at the bottom of the scraper 62. The counterweight 64 is located at the bottom of the scraper 62 to prevent the bubble scraper 6 from tipping over.

[0019] The counterweight 64 is made of metal.

[0020] It also includes a front pulley 3, a rear pulley 4, a front steel rope 7 and a rear steel rope 8. The front pulley 3 and the rear pulley 4 are both installed on the top of the cutting chamber 1, and the scraper 6 is located between the front pulley 3 and the rear pulley 4. The top of the scraper plate 6 has a lifting lug 61. One end of the front steel rope 7 passes around the front pulley 3 and is fixedly connected to the lifting lug 61. One end of the rear steel rope 8 passes around the rear pulley 4 and is fixedly connected to the lifting lug 61.

[0021] The bottom of the counterweight 64 extends downwards to form an arc-shaped foam support plate 65, with the opening of the foam support plate 65 facing upwards.

[0022] The bottom of the cutting chamber 1 is connected to an outlet 2.

[0023] In one embodiment, the working principle of the defoaming device

[0024] Specifically, the equipment for cutting the silicon wafer is placed in the cutting chamber 1 to cut the silicon wafer. At this time, the spray system 5 sprays the cutting fluid a from the nozzle to spray the silicon wafer being cut. The cutting fluid a accumulates at the bottom of the pool in the cutting chamber 1, and the liquid level gradually rises, while a large amount of foam b is generated. At this time, the front steel cable 7 is pulled, the front pulley 3 rolls, and the scraper 62 moves forward in the cutting chamber 1. Affected by the float ball 63, the scraper 6 floats out in the cutting fluid a. At this time, part of the scraper 62 is in the cutting fluid a and part is above the surface of the cutting fluid a. The scraper 62 pushes the foam b on the cutting fluid a from the rear end to the front end of the cutting chamber 1. When the foam support plate 65 contacts the inner wall at the front end of the cutting chamber 1, lift the foam scraper plate 6 upwards. All the foam b will be inside the foam support plate 65. Pour out the foam b to remove the foam b in the cutting fluid a. When the foam scraper plate 6 is put into the cutting chamber 1, pull the rear steel rope 8 to make the foam scraper plate 6 return to the rear end of the cutting chamber 1.

[0025] In summary, this device, equipped with a movable foam scraper 6 that floats on the cutting fluid a, pushes the foam b towards one end of the cutting chamber 1, thus preventing the foam b from overflowing from the surface of the cutting fluid a. The foam-collecting plate 65 collects all the foam b within it, and lifting the foam scraper 6 allows the foam b within the foam-collecting plate 65 to be lifted and cleaned. The entire defoaming process is efficient and fast, effectively removing the foam b and solving the technical problem of foam b overflowing to the outside of the equipment, causing a dirty working environment, and even leading to safety hazards such as short circuits and slippage.

[0026] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A defoaming device for silicon wafer cutting fluid, characterized in that: The device includes a cutting chamber (1) for cutting silicon wafers, and a spraying system (5) for spraying cutting fluid (a) onto the top of the cutting chamber (1). The cutting chamber (1) also has a scraper (6) floating above the surface of the cutting fluid (a), and the scraper (6) moves back and forth along the long side of the cutting chamber (1).

2. The silicon wafer cutting fluid defoaming device according to claim 1, characterized in that: The scraper plate (6) has a scraper (62), a float (63) and a counterweight (64). The float (63) is embedded on both sides of the scraper (62), and the counterweight (64) is installed at the bottom of the scraper (62).

3. The silicon wafer cutting fluid defoaming device according to claim 2, characterized in that: The material of the counterweight (64) is metal.

4. The silicon wafer cutting fluid defoaming device according to claim 2, characterized in that: It also includes a front pulley (3), a rear pulley (4), a front steel rope (7) and a rear steel rope (8), the front pulley (3) and the rear pulley (4) are both installed on the top of the cutting chamber (1), and the scraper plate (6) is located between the front pulley (3) and the rear pulley (4); The top of the scraper plate (6) has a lifting lug (61), one end of the front steel rope (7) passes around the front pulley (3) and is fixedly connected to the lifting lug (61), and one end of the rear steel rope (8) passes around the rear pulley (4) and is fixedly connected to the lifting lug (61).

5. The silicon wafer cutting fluid defoaming device according to claim 4, characterized in that: The bottom of the counterweight (64) extends downwards with an arc-shaped foam support plate (65), and the opening of the foam support plate (65) faces upwards.

6. The silicon wafer cutting fluid defoaming device according to claim 1, characterized in that: The bottom of the cutting chamber (1) is connected to an outlet (2).

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