Automatic detection and sorting device for semiconductor chips

Abstract

This utility model discloses an automatic semiconductor chip inspection and sorting device, belonging to the field of semiconductor chip technology. It includes a worktable, an image acquisition component, a mounting base assembly, a sorting component, and a controller. The mounting base assembly includes a base and two storage bins, both of which are mounted on the base. The worktable is mounted on the base, exposing the two storage bins, and is used to hold multiple chips to be tested. The image acquisition component includes a light source and a camera. The light source illuminates the chips to be tested, and the camera is positioned above the worktable and communicatively connected to the controller. The controller determines the position of each chip to be tested based on the image captured by the camera and judges whether the chip is qualified, thereby classifying the chips. The sorting component picks up the chips to be tested according to their position and places them in the corresponding storage bins according to their category. This application achieves high sorting accuracy and efficiency through the above configuration, while reducing labor costs.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an automatic detection and sorting device for semiconductor chips. Background Technology

[0002] In the semiconductor chip manufacturing process, the detection of surface defects (such as scratches, damage, and pin deformation) is a crucial step in ensuring product quality. Currently, some chip inspection processes still rely on manual labor. Inspectors judge whether chips are qualified by visual inspection or with simple tools, and then manually separate qualified and unqualified chips. Manual inspection and sorting are slow, and human judgment is easily affected by factors such as fatigue and subjective experience, leading to poor consistency in inspection results. This may result in qualified chips being misjudged or unqualified chips being missed, affecting the stability of product quality.

[0003] In addition, although some existing automated testing equipment has testing functions, sorting after testing still requires additional independent equipment or manual assistance, which takes up a lot of space and increases the complexity of process connections. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide an automatic semiconductor chip detection and sorting device that can improve sorting accuracy and efficiency and reduce labor costs.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] An automatic semiconductor chip inspection and sorting device includes a worktable, an image acquisition component, a mounting base assembly, a sorting component, and a controller. The mounting base assembly includes a base and two storage bins, both of which are mounted on the base. One storage bin is used to hold qualified chips, and the other is used to hold unqualified chips. The worktable is mounted on the base and exposes the two storage bins. The worktable is used to hold multiple chips to be tested. The image acquisition component includes a light source and a camera. The light source is used to illuminate the chips to be tested, and the camera is mounted above the worktable and communicatively connected to the controller. The controller determines the position of each chip to be tested based on the image of the chips to be tested captured by the camera and judges whether each chip to be tested is qualified, thereby classifying the multiple chips to be tested. The sorting component picks up the chips to be tested based on their position and places them in the corresponding storage bins according to their category.

[0007] Furthermore, the controller is communicatively connected to the sorting component, and the controller drives the sorting component to rotate an angle to grasp the chip under test at different positions.

[0008] Furthermore, the sorting assembly includes a rotating rod, a mounting plate, a suction cup, and a vacuum pump. The rotating rod is rotatably mounted on the base, the mounting plate is disposed at the end of the rotating rod, the suction cup is mounted on the mounting plate, the vacuum pump is connected to the suction cup, and the controller controls the vacuum pump to evacuate air from the suction cup to pick up the chip under test.

[0009] Furthermore, there are multiple suction cups, which are evenly distributed on the mounting plate and are all connected to the vacuum pump. The controller controls the vacuum pump to evacuate air from one of the suction cups to pick up one of the chips under test.

[0010] Furthermore, the sorting component is disposed on the base and located below the image acquisition component.

[0011] Furthermore, the sorting assembly is positioned between the two storage bins.

[0012] Furthermore, the mounting bracket assembly also includes a mounting rod, which is vertically mounted on the base, and the image acquisition component is movably mounted on the mounting rod.

[0013] Furthermore, the image acquisition component also includes a height adjustment knob, through which the camera changes its height relative to the chip under test.

[0014] Compared to existing technologies, this utility model's automatic semiconductor chip testing and sorting device includes a worktable, an image acquisition component, a mounting base component, a sorting component, and a controller. The mounting base component includes a base and two storage bins, both of which are mounted on the base. One storage bin is used to hold qualified chips, and the other is used to hold unqualified chips. The worktable is mounted on the base and exposes the two storage bins. The worktable is used to hold multiple chips to be tested. The image acquisition component includes a light source and a camera. The light source is used to illuminate the chips to be tested, and the camera is mounted above the worktable and is communicatively connected to the controller. The controller determines the position of each chip to be tested based on the image captured by the camera and judges whether each chip to be tested is qualified, thereby classifying multiple chips to be tested. The sorting component picks up the chips to be tested based on their position and places them in the corresponding storage bins according to their category.

[0015] This application achieves higher sorting accuracy and efficiency while reducing labor costs. On the one hand, it ensures that the sorting components do not damage the chips being tested when picking them up, guaranteeing chip quality and meeting customer needs. On the other hand, it minimizes the range of motion of the device during use, making it convenient to operate while improving operator safety. The overall structure of this application is compact, occupies little space, and is easy to transport. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the automatic semiconductor chip detection and sorting device of this utility model;

[0017] Figure 2 for Figure 1 A partial structural diagram of an automated semiconductor chip inspection and sorting device;

[0018] Figure 3 for Figure 1 A schematic diagram of the sorting component of an automated semiconductor chip detection and sorting device.

[0019] In the diagram: 10. Mounting assembly; 11. Base; 111. Heat dissipation hole; 12. Storage bin; 13. Mounting rod; 14. Drawer; 20. Workbench; 30. Image acquisition assembly; 31. Light source; 32. Camera; 32. Camera clamp; 34. Clamping knob; 35. Light source bracket; 36. Height adjustment knob; 37. Light source adjuster; 40. Controller; 50. Sorting assembly; 51. Rotating rod; 52. Mounting plate; 53. Suction cup; 54. Vacuum pump; 60. Chip under test. Detailed Implementation

[0020] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Figures 1-3 The present invention relates to an automatic semiconductor chip detection and sorting device, comprising a mounting base assembly 10, a worktable 20, an image acquisition assembly 30, a controller 40, and a sorting assembly 50.

[0024] In this embodiment:

[0025] Mounting assembly 10 includes mounting base 11, two storage bins 12, mounting rod 13, and drawer 14.

[0026] The interior of the mounting base 11 is enclosed and houses a computer system, a machine vision control system, a PLC control system, and power supply safety-related components. The side of the mounting base 11 is provided with heat dissipation holes 111 to prevent damage caused by excessively high operating temperatures of the internal components.

[0027] Both storage bins 12 are mounted on the mounting base 11. One storage bin 12 is used to hold qualified chips 60, and the other storage bin 12 is used to hold unqualified chips 60. In this embodiment, the two storage bins 12 are symmetrically distributed on both sides of the chip 60 to be tested.

[0028] The mounting rod 13 is vertically mounted on the mounting base 11 and is used to mount the image acquisition component 30. In this embodiment, the length direction of the mounting rod 13 is perpendicular to the plane of the mounting base 11.

[0029] Drawer 14 is mounted on mounting base 11 and is used to store chip 60 under test. The front panel of drawer 14 faces the operator, making it convenient to take out.

[0030] The workbench 20 is set on the mounting base 11 and exposes two storage bins 12. The workbench 20 is used to place multiple chips 60 to be tested.

[0031] The image acquisition component 30 includes a light source 31, a camera 32, a camera clamp 33, a clamping knob 34, a light source bracket 35, and a height adjustment knob 36.

[0032] The camera 32 is positioned above the workbench 20 and is communicatively connected to the controller 40. It is used to take pictures of the chip under test 60 on the workbench 20 and transmit the acquired image of the chip under test 60 to the controller 40.

[0033] The light source bracket 35 is movably mounted on the mounting rod 13 and located below the camera 32.

[0034] The light source 31 is mounted on the light source bracket 35 to illuminate the chip under test 60. The light source 31 is signal-connected to the camera 32, and the light source 31 turns on when it receives an on signal from the camera 32. In this embodiment, the light source 31 is a bar light source, a coaxial light source, a ring light source, or a dome light source, and different models can be replaced according to actual needs.

[0035] A height adjustment knob 36 is mounted on the mounting rod 13. The camera 32 can change its height relative to the chip 60 being tested by adjusting the height adjustment knob 36. In this embodiment, the height adjustment knob 36 is a fine-tuning knob, used for fine-tuning to improve shooting accuracy.

[0036] The clamping knob 34 is located on one side of the camera clamp 33. The camera 32 is mounted on the camera clamp 33 via the clamping knob 34, ensuring the stability of the camera 32 during use and preventing it from falling off easily.

[0037] The light source regulator 37 is mounted on the mounting base 11 and is communicatively connected to the controller 40 to change the brightness of the light source 31. In this embodiment, the light source regulator 37 has two externally mounted channel knobs, which can control the brightness of the light source 31. Multiple light sources 31 can be added to meet the needs of different scenarios.

[0038] The controller 40 is located inside the mounting base 11. The controller 40 is communicatively connected to the sorting component 50. The controller 40 drives the sorting component 50 to rotate an angle to grab the chip 60 under test at different positions.

[0039] The controller 40 determines the position of each chip under test 60 based on the image of the chip under test 60 captured by the camera 32, and judges whether the chip under test 60 is qualified, thereby classifying the chips under test 60.

[0040] Determining the location of the chip under test 60 specifically includes the following steps:

[0041] S1. Determine the three-dimensional coordinates of each of the multiple positioning points on the target object in the object coordinate system;

[0042] S2. For each of the multiple positioning points, determine the multi-angle extension line image of the positioning point captured in the field of view of the camera 32; wherein, the multi-angle extension line image contains information about multiple straight lines extending from the positioning point with different extension angles.

[0043] S3. Determine the two-dimensional coordinates of the intersection of multiple straight lines with different extension angles in the multi-angle extension line image of each positioning point in the pixel coordinate system corresponding to the multi-angle extension line image, and use them as the two-dimensional coordinates of the positioning point in the pixel coordinate system.

[0044] S4. Obtain the intrinsic parameters of camera 32;

[0045] S5. Based on the camera's 32 intrinsic parameters, the 3D coordinates of each positioning point in the object coordinate system, and the 2D coordinates of each positioning point in the pixel coordinate system, calibrate the transformation parameters between the object coordinate system and the camera's 32 coordinate system.

[0046] The sorting component 50 picks up the chip 60 to be tested according to its position and places it in the corresponding storage bin 12 according to its category, which makes the sorting accuracy and sorting efficiency high and reduces labor costs.

[0047] The sorting component 50 is mounted on the mounting base 11 and located below the image acquisition component 30. The sorting component 50 includes a rotating rod 51, a mounting plate 52, a suction cup 53, and a vacuum pump 54.

[0048] The rotating rod 51 is rotatably mounted on the mounting base 11, the mounting plate 52 is located at the end of the rotating rod 51, the suction cup 53 is mounted on the mounting plate 52, the vacuum pump 54 is connected to the suction cup 53, and the controller 40 controls the vacuum pump 54 to evacuate the suction cup 53 to pick up the chip under test 60.

[0049] In this embodiment, there are multiple suction cups 53, which are evenly distributed on the mounting plate 52 and are all connected to the vacuum pump 54. The controller 40 controls the vacuum pump 54 to evacuate air from one suction cup 53 to pick up a chip 60 to be tested. This ensures that the sorting component 50 will not damage the chip 60 when picking it up, thus guaranteeing the quality of the chip 60 and meeting customer needs. Furthermore, the device has a small operating range, making it convenient to operate while improving operator safety.

[0050] When this application is used, the camera 32 first takes a picture of the chip 60 under test, and then transmits the image of the chip 60 under test to the controller 40. The controller 40 obtains the position information of each chip 60 under test and determines whether the chip 60 under test is qualified, thereby classifying the chip 60 under test. Then, the sorting component 50 is driven to grab the chip 60 under test.

[0051] This application achieves higher sorting accuracy and efficiency while reducing labor costs. On the one hand, this application ensures that the sorting component 50 will not damage the chip 60 when it picks up the chip to be tested, thus guaranteeing the quality of the chip 60 and meeting customer needs. On the other hand, this application makes the device have a small range of motion during use, which is convenient to operate and improves the personal safety of the operator. The overall structure of this application is compact, occupies a small area, and is easy to transport.

[0052] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An automatic semiconductor chip inspection and sorting device, comprising a worktable (20) and an image acquisition component (30), characterized in that: It also includes a mounting base assembly (10), a sorting assembly (50), and a controller (40). The mounting base assembly (10) includes a base (11) and two storage bins (12). Both storage bins (12) are disposed on the base (11). One storage bin (12) is used to place qualified chips, and the other storage bin (12) is used to place unqualified chips. A workbench (20) is disposed on the base (11) and exposes the two storage bins (12). The workbench (20) is used to place multiple chips (60) to be tested. The image acquisition assembly (30) includes a light source ( 31) Camera (32), the light source (31) is used to illuminate the chip under test (60), the camera (32) is set above the workbench (20) and is communicatively connected to the controller (40), the controller (40) determines the position of each chip under test (60) according to the image of the chip under test (60) captured by the camera (32), and judges whether each chip under test (60) is qualified, thereby classifying multiple chips under test (60), and the sorting component (50) places the chips under test (60) in the corresponding storage bin (12) according to the category of the chip under test (60).

2. The automatic semiconductor chip detection and sorting device according to claim 1, characterized in that: The controller (40) is communicatively connected to the sorting component (50), and the controller (40) drives the sorting component (50) to rotate an angle to grab the chip under test (60) at different positions.

3. The automatic semiconductor chip detection and sorting device according to claim 2, characterized in that: The sorting assembly (50) includes a rotating rod (51), a mounting plate (52), a suction cup (53), and a vacuum pump (54). The rotating rod (51) is rotatably mounted on the base (11). The mounting plate (52) is located at the end of the rotating rod (51). The suction cup (53) is mounted on the mounting plate (52). The vacuum pump (54) is connected to the suction cup (53). The controller (40) controls the vacuum pump (54) to evacuate the suction cup (53) to pick up the chip under test (60).

4. The automatic semiconductor chip detection and sorting device according to claim 3, characterized in that: There are multiple suction cups (53), which are evenly distributed on the mounting plate (52) and are all connected to the vacuum pump (54). The controller (40) controls the vacuum pump (54) to evacuate air from one of the suction cups (53) to pick up one of the test chips (60).

5. The automatic semiconductor chip detection and sorting device according to claim 1, characterized in that: The sorting component (50) is disposed on the base (11) and located below the image acquisition component (30).

6. The automatic semiconductor chip detection and sorting device according to claim 1, characterized in that: The sorting assembly (50) is disposed between the two storage bins (12).

7. The automatic semiconductor chip detection and sorting device according to claim 1, characterized in that: The mounting base assembly (10) further includes a mounting rod (13), which is vertically mounted on the base (11), and the image acquisition assembly (30) is movably mounted on the mounting rod (13).

8. The automatic semiconductor chip detection and sorting device according to claim 7, characterized in that: The image acquisition component (30) also includes a height adjustment knob (36), through which the camera (32) changes the height of the camera (32) relative to the chip under test (60).

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