A high-density pin connector visual CCD appearance inspection device

Abstract

This utility model belongs to the field of product testing technology and relates to a visual CCD appearance inspection device for high-density pin connectors. Its features include a base and a camera inspection mechanism, a conveying mechanism, a defective product buffer mechanism, and a loading mechanism mounted on the base. The device comprises a loading mechanism, a camera inspection mechanism, a conveying mechanism, a unloading mechanism, and a controller. Manual loading is performed. The loading mechanism moves the loading mechanism below the camera inspection mechanism. The camera captures images of the high-density pin connectors to be tested in the tray. The inspection software calculates the quantity, position, and color of the contact springs and solder balls in the connector based on the acquired images, determines the presence of foreign objects on the base, and finally determines whether the connector is qualified. The results are sent to the controller, which controls the conveying mechanism to automatically transport the defective products to the buffer loading position. This device, combined with the inspection method, achieves automated appearance inspection and has the advantages of strong connector product compatibility, high efficiency, high precision, and low cost.

Description

Technical Field

[0001] This utility model belongs to the field of product testing technology, and in particular relates to a visual CCD appearance inspection device for high-density pin connectors. Background Technology

[0002] Since most electronic components require soldering, it is necessary to inspect the quality of the soldered products. Usually, manual visual inspection of the connector is carried out using tools such as magnifying glasses, electronic magnifying glasses, and microscopes to determine whether there are any defects such as missing contacts, misaligned contacts, crushed contacts, warped contacts, bent contacts, deformed contacts, discolored contacts, and foreign objects, thereby preventing defective products from being shipped out.

[0003] Using magnification tools for manual visual inspection is limited by factors such as product structure and size, especially Figure 6 The large-size, thin-walled high-density pin connectors with more than 6000 pins shown are generally larger than 100mm*70mm. During the inspection process, the product needs to be moved continuously by the operator to achieve full field of view coverage. This results in the disadvantages of missed areas, visual fatigue, and long inspection time. Furthermore, the accuracy of the inspection results is easily affected by various factors such as human emotions and skills. Utility Model Content

[0004] This application proposes a high-density pin connector visual CCD appearance inspection device to address the above-mentioned technical problems. The specific technical solution is as follows: A high-density pin connector visual CCD appearance inspection device includes a base and a camera inspection mechanism, a conveying mechanism, a defective product buffer mechanism and a feeding mechanism mounted on the base; The camera detection mechanism includes a fixed frame, a Z-axis moving component, and a camera component. The fixed frame is fixed on the base, the Z-axis moving component is fixed on the fixed frame, and the camera component is installed on the moving end of the Z-axis moving component. The camera assembly includes a camera, a lens, a light source one, and a light source two arranged sequentially from top to bottom. The camera, lens, light source one, and light source two are all fixedly connected to the moving end of the Z-axis moving assembly one via a mounting plate.

[0005] Furthermore, the conveying mechanism includes a second fixed frame, a first dual-axis moving assembly, and a clamping assembly. The fixed frame is fixed on the base, the first dual-axis moving assembly is mounted on the second fixed frame, and the clamping assembly is connected to the moving end of the first dual-axis moving assembly.

[0006] Furthermore, the clamping assembly includes an electric cylinder and grippers fixed to two moving ends of the electric cylinder. The electric cylinder is fixed to the moving end of the dual-axis moving assembly. The grippers use four-point contact, and the four contact points of the grippers are coated with rubber.

[0007] Furthermore, the defective product buffer mechanism 4 includes a Y-axis moving component 1 and a carrier 1, wherein the carrier 1 is connected to the moving end of the Y-axis moving component 1 via a mounting plate.

[0008] Furthermore, a photoelectric switch is installed on the carrier.

[0009] Furthermore, the feeding mechanism includes a fixed frame four, a dual-axis moving component two, and a carrier two. The fixed frame four is fixed on the base, the dual-axis moving component two is mounted on the fixed frame four, and the carrier two is connected to the moving end of the dual-axis moving component two.

[0010] Furthermore, the base is provided with an operating table and a mouse and keyboard placement mechanism located under the operating table, and a barcode scanning mechanism is also fixed on the second fixing frame.

[0011] The beneficial effects of this utility model are as follows: This utility model comprises a feeding mechanism, a camera inspection mechanism, a conveying mechanism, an unloading mechanism, and a controller. Manual feeding is performed, and the feeding mechanism moves the loading mechanism to below the camera inspection mechanism. The camera captures images of the high-density pin connector products to be tested in the tray. The inspection software calculates the quantity, position, and color of the contact springs and solder balls in the connector based on the acquired images, determines the presence of foreign objects on the base, and finally determines whether it is qualified. The results are sent to the controller, which controls the conveying mechanism to automatically transport the defective products to the buffer loading position. This device, combined with the inspection method, achieves automated appearance inspection and has the advantages of strong connector product compatibility, high efficiency, high accuracy, and low cost. It avoids the problems of missed detections and unstable inspection results associated with manual inspection, as well as low inspection efficiency. Attached Figure Description

[0012] Figure 1 The diagram shown is a structural schematic of a high-density pin connector visual CCD appearance inspection device. Figure 2 The diagram shown is a structural schematic of the camera detection mechanism; Figure 3 The diagram shown is a structural schematic of the conveying mechanism; Figure 4 The diagram shown is a structural schematic of the defective product buffer mechanism; Figure 5 The diagram shown is a structural schematic of the feeding mechanism; Figure 6 The diagram shown is a schematic of the connector under test. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0014] like Figure 1 The diagram shows a structural schematic of a high-density pin connector visual CCD appearance inspection device. The device includes a base 1, a camera inspection mechanism 2, a conveying mechanism 3, a defective product buffer mechanism 4, a barcode scanning mechanism 5, a loading mechanism 6, a mouse and keyboard placement mechanism 7, and an operating table 8. The camera inspection mechanism 2, the conveying mechanism 3, the defective product buffer mechanism 4, the barcode scanning mechanism 5, the loading mechanism 6, the mouse and keyboard placement mechanism 7, and the operating table 8 are all mounted on the base 1. The conveying mechanism 3 moves back and forth between the loading mechanism 6 and the defective product buffer mechanism 4, transporting defective products that fail the inspection from the loading mechanism 6 to the defective product buffer mechanism 4.

[0015] Figure 2 The diagram shows the structure of the camera inspection mechanism 2. The camera inspection mechanism 2 is used to inspect the connectors to be inspected for defects. The camera inspection mechanism 2 includes a fixed frame, a Z-axis moving component 206 and a camera component. The camera component is mounted on the fixed frame through the Z-axis moving component 206. The fixed frame is fixed to the base 1, and the Z-axis moving component 206 can drive the camera component to move on the Z-axis.

[0016] The first fixing frame is composed of four mounting plates 216, 201, 203 and 205 fixedly connected. The first fixing frame is fixed to the base 1 through the mounting plate 216. The mounting plates 203 and 205 form a support structure on both sides of the mounting plate 201 as reinforcing plates, thereby improving the strength of the first fixing frame.

[0017] Z-axis moving assembly 206 includes a motor, a lead screw, and a moving block. The motor is fixedly connected to a fixed frame, and the motor shaft is coaxially connected to the lead screw. The moving block is threadedly connected to the lead screw, and the moving block is slidably connected to the mounting plate 201 via a slide rail. When the motor works and drives the lead screw to rotate, it can drive the moving block to move on the Z-axis.

[0018] The camera assembly includes mounting plate 3 210, mounting plate 4 207, camera 208, lens 209, mounting plate 5 211, mounting plate 6 202, mounting plate 7 212, mounting plate 8 213, light source 1 214, and light source 2 215. The camera 208, lens 209, light source 1 214, and light source 2 215 are arranged sequentially from top to bottom. Mounting plate 3 210 is fixed to a moving block to drive the camera assembly to move as a whole. Mounting plate 4 207 is fixed on mounting plate 3 210, and camera 208 is fixed on mounting plate 4 207. Mounting plate 6 202 and mounting plate 7 212 cooperate to clamp and fix lens 209 before fixing it to mounting plate 3 210. Light source 1 214 is fixed between mounting plate 7 212 and mounting plate 8 213, and light source 2 215 is fixed at the bottom of mounting plate 8 213. In this camera assembly, the optical axes of camera 208, lens 209, light source 1 214, and light source 2 are kept aligned.

[0019] Figure 3 The diagram shows the structure of the conveying mechanism 3, which includes a fixed frame, a dual-axis moving assembly, and a clamping assembly. The clamping assembly is connected to the dual-axis moving assembly, which is mounted on the fixed frame. The clamping assembly can move in the Z-axis and X-axis directions via the dual-axis moving assembly.

[0020] The second fixing frame is formed by four mounting plates 301, 302, 303 and 305 fixedly connected. The second fixing frame is fixed to the base 1 through the mounting plate 301. The mounting plates 302 and 305 form a support structure on both sides of the mounting plate 303 as reinforcing plates, which improves the strength of the second fixing frame.

[0021] The dual-axis moving assembly includes an X-axis moving assembly 308 and a Z-axis moving assembly 307. The X-axis moving assembly 308 is mounted on a mounting plate 303, and the Z-axis moving assembly 307 is mounted on the moving end of the X-axis moving assembly 308 via a mounting plate 306.

[0022] The clamping assembly includes an electric cylinder 311 and grippers 312. The electric cylinder 311 is fixedly connected to the moving end of the Z-axis moving assembly 307 via a fixed frame 3. The grippers 312 are mounted on the two moving ends of the electric cylinder 311. The electric cylinder 311 drives the two grippers 312 to move closer or further away to achieve product gripping and release. The grippers 312 adopt four-point contact, and the contact points are coated with rubber to ensure that the contact parts do not pinch or damage the product and that the gripping is stable.

[0023] The fixed frame three is formed by four mounting plates 304, 309 and 310 fixedly connected. The fixed frame three is fixed to the moving end of the Z-axis moving component two 307 through the mounting plate 304. The mounting plate 309 forms a support structure on both sides of the mounting plate 304 as a reinforcing plate, which improves the strength of the fixed frame three.

[0024] In addition, the scanning mechanism 5 is fixed on the second mounting bracket by the mounting bracket 501. The scanning mechanism 5 is a barcode scanner used to scan product codes to obtain product information.

[0025] Figure 4 The diagram shows the structure of the defective product buffer mechanism 4. The defective product buffer mechanism 4 includes a Y-axis moving component 401 and carriers 406, 407 and 408. The Y-axis moving component 401 is fixed to the base 1 by a mounting plate 409. The carriers 406, 407 and 408 are fixedly connected to the moving end of the Y-axis moving component 401 by a mounting plate 405. In addition, photoelectric switches 402, 403 and 404 are also provided on the carriers 406, 407 and 408 to detect whether there is a product in the corresponding defective product buffer position.

[0026] Figure 5The diagram shows the structure of the feeding mechanism 6. The feeding mechanism 6 includes a fixed frame 4, a dual-axis moving component 2, and a carrier 2 605. The fixed frame 4 includes mounting plates 609, 607, and 610. Mounting plate 609 is connected and fixed to base 1. Dual-axis moving component 2 includes Y-axis moving component 2 603 and X-axis moving component 2 601. Y-axis moving component 2 603 is fixed on mounting plate 609. X-axis moving component 2 601 is fixed to the moving end of Y-axis moving component 2 603 by mounting plate 606. At the same time, linear guide rails 608 are fixed on mounting plates 607 and 610 to cooperate with X-axis moving component 2 601 to maintain the stable movement of X-axis moving component 2 601. Carrier 2 605 is fixed on the moving end of X-axis moving component 2 601. Carrier 2 605 is a precision-machined part. It is designed to hold test products in the shape of the product. Its inner edges adopt a large R5 rounded corner design to increase the guidance for manual loading. The product marking position is hollowed out to avoid the product identification code.

[0027] The mouse and keyboard placement mechanism 7 is located on the operating table 8, and the mouse and keyboard placement mechanism 7 is mainly used to store the mouse and keyboard.

[0028] Based on the aforementioned automated measurement device for the appearance of high-density pin connectors using a visual CCD, a detection method is also provided, which includes the following steps: Place the product to be tested on carrier 2605; Return the camera inspection mechanism 2, defective product buffer mechanism 4, handling mechanism 3, and loading mechanism 6 to zero; Set the test parameters and test points of the product under test in the host computer, and write the vision program for the product under test at different shooting points; Perform automatic detection.

[0029] Set product test parameters: Different products have different feature dimensions and imaging parameters. To ensure compatibility during testing, it is necessary to input the length and width dimensions of the product features to calculate the number of image capture points. Before testing, the number of products in carrier 2 605, the length and width dimensions of the product features to be tested, and the imaging parameters need to be entered in the product maintenance interface of the host computer.

[0030] Set up product test points: Manually control the X-axis moving component 2 601 to move the carrier 2 605, and manually control the Y-axis moving component 2 603 and the Z-axis moving component 1 206 to move the camera 208, so that the feature area corresponding to the first shooting point of the first product on the carrier 2 605 is exactly located in the center of the field of view of the camera 208 and is in clear focus. In the upper computer debugging interface, save the shooting point P1 (X1,Y1,Z1), and so on, saving all shooting points P of the i-th product. i (X i ,Yi Z i ) and product images, where i=1······m.

[0031] Set up product handling points: Manually control the X-axis moving component 2 601 to move the carrier 2 605, and manually control the X-axis moving component 1 308 to make the center of the product on the carrier 2 605 exactly located at the center of the gripper 312, and the gripper 312 can correctly grip the product, and save the transport point L1 (X1,Y1,Z1).

[0032] Set the product unloading point: Manually control the Z-axis moving component 2 307 and the X-axis moving component 1 308, and manually control the Y-axis moving component 1 401 to align the center of the gripper 312 with the center of the defective buffer position. The product can be correctly placed on the carrier 1 406, and the unloading point P1 (X1,Y1,Z1) is saved.

[0033] Self-check: Before each test, the device needs to perform a self-check to determine whether the testing accuracy meets the design requirements and whether the material throwing function is normal. The specific process is as follows: Place the inspection item correctly in carrier 2 605, manually select the product verification program, press the start button, move carrier 2 605 and camera 208 according to the set photo points, the camera 208 takes pictures of the product parts in sequence, and calculates the abnormal position of the product. The program automatically compares the abnormal position with the actual value of the inspection item. If it is consistent with the actual value, it is judged as qualified and the conveying mechanism 3 does not move. Otherwise, it is unqualified, the throwing mechanism 3 moves and puts the product into the defective product buffer mechanism 4.

[0034] Automated testing: Testing can only proceed if the inspection is normal; otherwise, testing cannot be performed. The specific process is as follows: Place the test product correctly in carrier 2 605, select the product test program, press the start button, move carrier 2 605 and camera 208 according to the set shooting points, the camera 208 takes pictures of the product parts in sequence and calculates the abnormal positions of the product appearance, marks them, and judges them as qualified. If the product is qualified, the conveying mechanism 3 does not move; otherwise, it is unqualified, the throwing mechanism 3 moves and puts the product into the defective product buffer mechanism 4.

[0035] Based on the above description, the detection method includes the following steps: Step (1): Consult or calculate the dimensions of the test area of ​​the high-density pin connector: length * width = W * L; Step (2): Consult or calculate the detection range of the imaging system: length * width = C * K; Step (3): Calculate the ratio a of the length of the high-density pin connector measured area to the length of the imaging system, and the ratio b of the width of the high-density pin connector measured area to the width of the imaging system, and then determine the number of product inspection and imaging points as P=a*b. Step (4): Manually control the X-axis moving component 2 601 to move the carrier 2 605, and manually control the Y-axis moving component 2 603 and the Z-axis moving component 1 206 to move the camera 208, so that the feature area corresponding to the first shooting point of the first product on the carrier 2 605 is exactly located in the center of the field of view of the camera 208 and is in clear focus. In the upper computer debugging interface, save the shooting point P1(X1,Y1,Z1), and so on, save all shooting points P of the i-th product. i (X i ,Y i Z i ) and product images, where i=1······m; Step (5): Manually control the X-axis moving component 2 601 to move the carrier 2 605, and manually control the X-axis moving component 1 308 to make the center of the product on the carrier 2 605 exactly located at the center of the gripper 312, and the gripper 312 can correctly grip the product, and save the transport point L1 (X1,Y1,Z1). Step (6): Manually control the Z-axis moving component 307 and the X-axis moving component 308, and manually control the Y-axis moving component 401 to align the center of the gripper 312 with the center of the defective buffer position. The product can be correctly placed on the carrier 406 and the unloading point P1 (X1,Y1,Z1) is saved. Step (7), based on the different photo points P obtained in step (4) i Based on the product images below, write corresponding image processing algorithms to calculate the locations of appearance anomalies at different shooting points and mark them in the image; Step (8): Based on the different photo points P obtained in step (7) i The abnormal locations of the products are identified, and a complete list of abnormal locations is compiled, marked, and their distribution is statistically analyzed. This information is used to further analyze the location of the abnormalities and possible process causes, and to improve the product manufacturing process.

[0036] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A high-density pin connector visual CCD appearance inspection device, characterized in that, This includes a base and a camera inspection mechanism, a handling mechanism, a defective product buffer mechanism, and a feeding mechanism mounted on the base; The camera detection mechanism includes a fixed frame, a Z-axis moving component, and a camera component. The fixed frame is fixed on the base, the Z-axis moving component is fixed on the fixed frame, and the camera component is installed on the moving end of the Z-axis moving component. The camera assembly includes a camera, a lens, a light source one, and a light source two arranged sequentially from top to bottom. The camera, lens, light source one, and light source two are all fixedly connected to the moving end of the Z-axis moving assembly one via a mounting plate.

2. The high-density pin connector visual CCD appearance inspection device according to claim 1, characterized in that, The conveying mechanism includes a second fixed frame, a first dual-axis moving component, and a clamping component. The fixed frame is fixed on the base, the first dual-axis moving component is mounted on the second fixed frame, and the clamping component is connected to the moving end of the first dual-axis moving component.

3. The high-density pin connector visual CCD appearance inspection device according to claim 2, characterized in that, The clamping assembly includes an electric cylinder and grippers fixed to two moving ends of the electric cylinder. The electric cylinder is fixed to the moving end of the dual-axis moving assembly. The grippers use four-point contact, and the four contact points of the grippers are coated with rubber.

4. The high-density pin connector visual CCD appearance inspection device according to claim 1, characterized in that, The defective product buffer mechanism includes a Y-axis moving component and a carrier, wherein the carrier is connected to the moving end of the Y-axis moving component via a mounting plate.

5. The high-density pin connector visual CCD appearance inspection device according to claim 4, characterized in that, A photoelectric switch is installed on the vehicle.

6. The high-density pin connector visual CCD appearance inspection device according to claim 1, characterized in that, The feeding mechanism includes a fixed frame four, a dual-axis moving component two, and a carrier two. The fixed frame four is fixed on the base, the dual-axis moving component two is mounted on the fixed frame four, and the carrier two is connected to the moving end of the dual-axis moving component two.

7. The high-density pin connector visual CCD appearance inspection device according to claim 2, characterized in that, The base is equipped with an operating table and a mouse and keyboard placement mechanism located under the operating table. A barcode scanning mechanism is also fixed on the second fixing frame.

Images