A clamping and positioning device and wafer cleaning equipment

Abstract

This utility model belongs to the field of semiconductor equipment technology, and discloses a clamping and positioning device and a wafer cleaning device. The clamping and positioning device includes a frame, a rotating unit, and a driven unit. The driving unit includes a driving component disposed on the frame and a first positioning component drivenly connected to the output end of the driving component. The other end of the first positioning component is provided with a third positioning cone surface, which can be inserted into the first end so that the third positioning cone surface fits against the first positioning cone surface. The driven unit includes a second positioning component rotatably disposed on the frame. The second positioning component can move along the axial direction of the brush and is provided with a fourth positioning cone surface. The second positioning component can be inserted into the second end so that the fourth positioning cone surface fits against the second positioning cone surface. Using this clamping and positioning device to position the brush for cleaning wafers can effectively reduce brush vibration and ensure cleaning effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a clamping and positioning device and a wafer cleaning device. Background Technology

[0002] In the semiconductor wafer manufacturing process, wafers typically need to be ground to reduce their thickness to a target level, enabling them to meet packaging or performance requirements. This grinding process generates a large amount of debris and contaminants, necessitating cleaning of the ground wafers.

[0003] In existing technologies, when cleaning wafers after grinding and thinning, the wafer is typically fixed vertically and clamped between two brushes. The two brushes contact the front and rear sides of the wafer, respectively. Cleaning fluid is then sprayed onto the wafer while the brushes rotate around their own axis, thus cleaning the wafer. In this cleaning equipment, one end of the brush along the axial direction has a flat surface that abuts against the output end of a rotary drive mechanism. The other end also has a flat surface that abuts against a rotating shaft that can rotate around its own axis. When it is necessary to rotate the brush, simply activating the rotary drive mechanism will cause the brush to rotate. However, when the brush is positioned using the above method, there may be a certain deviation between the actual center position and the theoretical center position after the brush is positioned. This deviation causes the brush to vibrate when the rotary drive mechanism rotates the brush. The vibrating brush will cause the wafer to vibrate as well, which will cause the brush to separate from the wafer, making it impossible to clean the wafer thoroughly. It may even cause residual contaminants on the wafer surface, affecting the wafer's performance. Utility Model Content

[0004] The purpose of this invention is to provide a clamping and positioning device and a wafer cleaning equipment, which can fully position the brush, effectively reduce brush vibration, ensure the cleaning effect of the brush on the wafer, and avoid affecting the performance of the wafer.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, a clamping and positioning device is provided for clamping and positioning a brush, wherein a first end of the brush is provided with a first positioning conical surface, and a second end of the brush is provided with a second positioning conical surface; the clamping and positioning device includes:

[0007] Frame;

[0008] A drive unit, comprising a drive component and a first positioning component, wherein the drive component is disposed on the frame, one end of the first positioning component is drivenly connected to the output end of the drive component, and the other end of the first positioning component is provided with a third positioning cone surface, wherein the other end of the first positioning component can be inserted into the first end so that the third positioning cone surface fits against the first positioning cone surface.

[0009] The driven unit includes a second positioning component rotatably mounted on the frame, and the second positioning component is movable along the axial direction of the brush. The second positioning component is provided with a fourth positioning cone surface, and one end of the second positioning component facing the brush can be inserted into the second end so that the fourth positioning cone surface fits against the second positioning cone surface.

[0010] Optionally, the driven unit further includes a driven shaft rotatably disposed on the frame, and the second positioning component is reciprocally mounted on the driven shaft along the axial direction of the brush, so that the second positioning component switches between a clamping position and a retraction position. In the retraction position, the second positioning component is relatively far away from the drive unit, and in the clamping position, the second positioning component is relatively close to the drive unit.

[0011] Optionally, the clamping and positioning device further includes a mounting sleeve, a first spacer sleeve, and two first connecting bearings. The mounting sleeve is disposed on the frame, and the end of the driven shaft facing away from the drive unit is inserted into the inner cavity of the mounting sleeve. The first spacer sleeve and the two first connecting bearings are both sleeved on the driven shaft and embedded in the inner cavity of the mounting sleeve. The two first connecting bearings are respectively disposed on both sides of the first spacer sleeve.

[0012] Optionally, the second positioning component includes a clamping sleeve and a resetting member. The clamping sleeve is slidably fitted onto the driven rotating shaft along the brush axis. The end of the clamping sleeve facing the brush is provided with the fourth positioning cone surface. The clamping sleeve can be inserted into the second end. The resetting member is fitted onto the driven rotating shaft and located in the inner cavity of the clamping sleeve. An abutting sleeve is fixedly fitted onto the driven rotating shaft. The abutting sleeve is located on the side of the clamping sleeve away from the brush. One end of the resetting member is connected to the clamping sleeve, and the other end is connected to the abutting sleeve. At least a portion of the abutting sleeve is located in the inner cavity of the clamping sleeve.

[0013] Optionally, the clamping and positioning device further includes a limiting ring, a limiting groove is provided on the driven rotating shaft, the limiting groove extends circumferentially along the driven rotating shaft, the limiting ring is engaged in the limiting groove, and the limiting ring can limit the top sleeve along the axial direction of the driven rotating shaft.

[0014] Optionally, the first positioning component includes:

[0015] An active rotating shaft, one end of which is connected to the output end of the driving component, and the other end of which is provided with the third positioning cone surface and inserted into the first end;

[0016] A fixed sleeve is fitted onto the drive shaft, and the end of the fixed sleeve is fixedly connected to the frame.

[0017] The second spacer sleeve is sleeved on the active rotating shaft and embedded in the inner cavity of the fixed sleeve.

[0018] There are two second connecting bearings. Both second connecting bearings are sleeved on the drive shaft and are respectively located on both sides of the second spacer sleeve. Both second connecting bearings are embedded in the inner cavity of the fixed sleeve.

[0019] Optionally, the clamping and positioning device further includes a clamping sleeve, which is sleeved on the active rotating shaft. The inner wall of the clamping sleeve and the outer wall of the active rotating shaft form a clamping cavity, and the first end of the brush is inserted into the clamping cavity.

[0020] Optionally, the first positioning component further includes an adjusting washer, which is sleeved on the drive shaft and sandwiched between the second connecting bearing and the second spacer sleeve.

[0021] Optionally, the driving element includes a rotary motor.

[0022] In a second aspect, a wafer cleaning apparatus is provided, comprising a support assembly, a spraying assembly, two brushes, and two clamping and positioning devices as described above, wherein the two clamping and positioning devices respectively clamp and position the two brushes, the support assembly is configured to support a wafer, and the wafer is capable of being positioned between the two brushes, and the spraying assembly is capable of spraying cleaning fluid onto the surface of the wafer.

[0023] The beneficial effects of this utility model are:

[0024] This invention provides a clamping and positioning device and a wafer cleaning equipment. The clamping and positioning device is used to clamp and position a brush for cleaning wafers. The device includes a frame, a drive unit, and a driven unit. When clamping and fixing the brush, the second end of the brush is aligned with a second positioning component, and the second positioning component is inserted into the second end, so that the fourth positioning cone surface of the second positioning component and the second positioning cone surface are in contact. Then, the brush is moved axially, gradually moving it away from the drive unit, causing the brush to push the second positioning component away from the first positioning component until the other end of the brush is aligned with the first positioning component. Then, the brush is moved in the opposite direction, gradually moving it closer to the first positioning component, so that the first positioning component is inserted into the first end of the brush, and the third positioning cone surface is in contact with the first cone surface. This achieves clamping and positioning of the first and second ends of the brush. When cleaning the wafer, the drive unit is activated, which drives the brush to rotate through the first positioning component. Simultaneously, the brush drives the second positioning component to rotate, thus cleaning the wafer.

[0025] By inserting the first positioning component into the first end, the third positioning cone surface is made to fit against the first positioning cone surface. Simultaneously, the second positioning component is inserted into the second end, making the fourth positioning cone surface fit against the second positioning cone surface. The first and second positioning components not only provide axial clamping for the brush but also radial support and clamping, effectively positioning the brush and automatically correcting radial deviations. This ensures alignment between the brush and the axes of the first and second positioning components, providing guiding positioning. Furthermore, the fit between the third and first positioning cone surfaces, and between the fourth and second positioning cone surfaces, allows the first and second positioning components to guide the brush back to its original position when it vibrates radially. This effectively reduces brush vibration, preventing separation of the brush from the wafer and ensuring the cleaning effect on the wafer, thus avoiding any impact on wafer performance. Attached Figure Description

[0026] Figure 1 This is a cross-sectional view of the brush provided in this embodiment of the utility model;

[0027] Figure 2 This is a schematic diagram of the structure of the wafer cleaning equipment provided in this embodiment of the present invention;

[0028] Figure 3 This is a cross-sectional view of the wafer cleaning equipment provided in this embodiment of the present invention;

[0029] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0030] Figure 5 yes Figure 3 Enlarged view of point B in the middle.

[0031] In the picture:

[0032] 100. Clamping and positioning device; 200. Wafer cleaning equipment; 300. Wafer;

[0033] 1. Brush; 11. First positioning cone surface; 12. Second positioning cone surface;

[0034] 2. Frame;

[0035] 3. Drive unit; 31. Drive component; 32. First positioning assembly; 321. Fixed housing; 322. Drive shaft; 323. Second spacer sleeve; 324. Second connecting bearing; 33. Clamping housing;

[0036] 4. Driven unit; 41. Driven rotating shaft; 42. Mounting sleeve; 43. Second positioning assembly; 431. Tightening sleeve; 432. Reset component; 44. Abutting sleeve; 45. First spacer sleeve; 46. First connecting bearing;

[0037] 5. Limiting ring. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0039] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0042] Example 1

[0043] This embodiment provides a clamping and positioning device 100, configured to clamp and position a brush 1. For example... Figures 1 to 4 As shown, using the clamping and positioning device 100 to clamp and position the brush 1 for cleaning the wafer 300 can fully position the brush 1, effectively reduce the vibration of the brush 1, ensure the cleaning effect of the brush 1 on the wafer 300, and avoid affecting the performance of the wafer 300.

[0044] like Figure 1 As shown, the first end of the brush 1 is provided with a first positioning cone surface 11, and the second end of the brush 1 is provided with a second positioning cone surface 12. Figures 1 to 3 As shown, the clamping and positioning device 100 includes a frame 2, a rotating unit 3, and a driven unit 4. The driving unit 3 includes a driving component 31 and a first positioning assembly 32. The driving component 31 is mounted on the frame 2, and one end of the first positioning assembly 32 is drivenly connected to the output end of the driving component 31. The other end of the first positioning assembly 32 has a third positioning cone surface, and this other end can be inserted into the first end so that the third positioning cone surface fits against the first positioning cone surface 11. The driven unit 4 includes a second positioning assembly 43 rotatably mounted on the frame 2, and the second positioning assembly 43 can move along the axial direction of the brush 1. The second positioning assembly 43 has a fourth positioning cone surface, and the end of the second positioning assembly 43 facing the brush 1 can be inserted into the second end so that the fourth positioning cone surface fits against the second positioning cone surface 12.

[0045] When clamping and fixing brush 1, align the second end of brush 1 with the second positioning component 43, and insert the second positioning component 43 into the second end, so that the fourth positioning cone surface of the second positioning component 43 and the second positioning cone surface 12 are in contact with each other. Then, move brush 1 along the axial direction of brush 1, so that brush 1 gradually moves away from the drive unit 3, so that brush 1 pushes the second positioning component 43 to move away from the first positioning component 32, until the other end of brush 1 can be aligned with the first positioning component 32. Then, move brush 1 in the opposite direction, so that it gradually moves closer to the first positioning component 32, so that the first positioning component 32 is inserted into the first end of brush 1, so that the third positioning cone surface is in contact with the first positioning cone surface 11. Thus, the clamping and positioning of the first end and the second end of brush 1 is achieved. When cleaning wafer 300, start drive component 31, drive component 31 to drive brush 1 to rotate through the first positioning component 32, and at the same time brush 1 will drive the second positioning component 43 to rotate, thereby cleaning wafer 300.

[0046] By inserting the first positioning component 32 into the first end, the third positioning cone surface and the first positioning cone surface 11 are in contact with each other. At the same time, the second positioning component 43 is inserted into the second end, the fourth positioning cone surface and the second positioning cone surface 12 are in contact with each other. The first positioning component 32 and the second positioning component 43 can not only provide axial clamping for the brush 1, but also provide radial support and tightening for the brush 1. This can fully position the brush 1 and automatically correct the radial deviation of the brush 1, ensuring that the brush 1 is aligned with the axis of the first positioning component 32 and the second positioning component 43, thus providing a guiding and positioning function. Furthermore, the third positioning cone surface is in contact with the first positioning cone surface 11, and the fourth positioning cone surface is in contact with the second positioning cone surface 12. When the brush 1 vibrates radially, the first positioning component 32 and the second positioning component 43 can guide the brush 1 to reset, thereby effectively reducing the vibration of the brush 1 and preventing the brush 1 from separating from the wafer 300 due to the vibration of the brush 1, ensuring the cleaning effect of the brush 1 on the wafer 300, and avoiding affecting the performance of the wafer 300.

[0047] For example, the drive unit 31 includes a rotary motor.

[0048] Optionally, such as Figure 3 and Figure 4As shown, the driven unit 4 also includes a driven shaft 41 rotatably mounted on the frame 2. The second positioning component 43 is reciprocally mounted on the driven shaft 41 along the axial direction of the brush 1, allowing the second positioning component 43 to switch between a clamping position and a clearance position. In the clearance position, the second positioning component 43 is relatively far from the drive unit 3. In the clamping position, the second positioning component 43 is relatively close to the drive unit 3. When clamping and positioning brush 1, the second end of brush 1 needs to be inserted into the second positioning component 43, so that the fourth positioning cone surface and the second positioning cone surface 12 are in contact with each other. Then, brush 1 is moved along the axial direction of brush 1, moving brush 1 away from the drive unit 3, so that brush 1 pushes against the second positioning component 43. The second positioning component 43 will move along the driven rotating shaft 41 until it moves to the avoidance position. At this time, the first end of brush 1 is aligned with the first positioning component 32. Then, brush 1 is moved in the opposite direction, so that the first end of brush 1 is inserted into the first positioning component 32, and the third positioning cone surface and the first positioning cone surface 11 are in contact with each other, thereby achieving the clamping and positioning of brush 1. When the drive unit 31 drives brush 1 to rotate through the second positioning component 43, the second end of brush 1 will drive the driven rotating shaft 41 to rotate through the second positioning component 43, thereby achieving the cleaning of the surface of wafer 300.

[0049] Optionally, such as Figures 2 to 4 As shown, the clamping and positioning device 100 also includes a mounting sleeve 42, a first spacer sleeve 45, and two first connecting bearings 46. The mounting sleeve 42 is mounted on the frame 2, and the driven shaft 41, with one end facing away from the drive unit 3, is inserted into the inner cavity of the mounting sleeve 42. The first spacer sleeve 45 and the two first connecting bearings 46 are both sleeved on the driven shaft 41 and embedded in the inner cavity of the mounting sleeve 42, with the two first connecting bearings 46 located on opposite sides of the first spacer sleeve 45. When cleaning the wafer 300, the drive unit 31 drives the brush 1 to rotate around its own axis via the first positioning component 32, thereby driving the driven shaft 41 to rotate. During the rotation of the driven shaft 41, the mounting sleeve 42 provides radial and axial support for the driven shaft 41. The first spacer sleeve 45 and the two first connecting bearings 46 combine to form a double bearing rigid support system. The two first connecting bearings 46 can share the radial load of the driven shaft 41, reduce the bending deformation of the driven shaft 41, significantly improve the stability of the driven shaft 41 during rotation, effectively reduce the vibration of the brush 1, and the first spacer sleeve 45 can absorb some of the impact energy and protect the two first connecting bearings 46.

[0050] like Figures 2 to 4As shown, the second positioning assembly 43 includes a clamping sleeve 431 and a resetting member 432. The clamping sleeve 431 is slidably fitted onto the driven shaft 41 along the axial direction of the brush 1, and a fourth positioning cone surface is provided on the end of the clamping sleeve 431 facing the brush 1. The clamping sleeve 431 can be inserted into the second end, that is, the clamping sleeve 431 is inserted into the second end of the brush 1 so that the second positioning cone surface 12 of the second end fits against the fourth positioning cone surface of the clamping sleeve 431. The resetting member 432 is fitted onto the driven shaft 41 and located in the inner cavity of the clamping sleeve 431, and the driven shaft 41 is fixedly fitted with an abutment sleeve 44. The abutment sleeve 44 is located on the side of the clamping sleeve 431 away from the brush 1, one end of the resetting member 432 is connected to the clamping sleeve 431, and the other end is connected to the abutment sleeve 44, and at least part of the abutment sleeve 44 is located in the inner cavity of the clamping sleeve 431.

[0051] After the first end of the brush 1 is aligned with the clamping sleeve 431, the brush 1 is moved away from the first positioning component 32, so that the clamping sleeve 431 is inserted into the first end of the brush 1, thereby making the fourth positioning cone surface and the second positioning cone surface 12 fit together. Then, the brush 1 is moved further, and the brush 1 will push the clamping sleeve 431 to move, so that the brush 1 is fitted onto the driven rotating shaft 41. During this process, the clamping sleeve 431 will squeeze the reset member 432 until the brush 1 moves to the second end of the brush 1 and is aligned with the first positioning component 32. Then, the brush 1 is released, and the reset member 432 will push the brush 1 in the opposite direction through the clamping sleeve 431, so that the first positioning component 32 is inserted into the first end, and the third positioning cone surface and the first positioning cone surface 11 fit together, thereby making the first positioning component 32 and the clamping sleeve 431 provide a clamping and fixing effect on the brush 1 in the axial direction. By setting the reset member 432, the brush 1 can be pushed to achieve the insertion between it and the first positioning component 32. Moreover, during the cleaning of the wafer 300, if the brush 1 is displaced along the axial direction, the reset member 432 can also push the brush 1 to reset, ensuring the fixing effect of the brush 1.

[0052] For example, the reset member 432 includes a reset spring.

[0053] Optionally, such as Figures 2 to 4 As shown, the clamping and positioning device 100 also includes a limiting retaining ring 5. A limiting groove is provided on the driven rotating shaft 41, extending circumferentially along the driven rotating shaft 41. The limiting retaining ring 5 is engaged in the limiting groove, and can limit and tighten the sleeve 431 along the axial direction of the driven rotating shaft 41. When the tightening sleeve 431 pushes the brush 1 to move in a direction away from the driven rotating shaft 41, the limiting retaining ring 5 can provide a limiting effect for the tightening sleeve 431, preventing the tightening sleeve 431 from disengaging from the driven rotating shaft 41.

[0054] For example, the retaining ring 5 includes a rubber ring.

[0055] Optionally, such as Figure 2 , Figure 3 and Figure 5 As shown, the first positioning assembly 32 includes a drive shaft 322, a fixed housing 321, a second spacer sleeve 323, and two second connecting bearings 324. One end of the drive shaft 322 is connected to the output end of the drive member 31, and the other end is provided with a third positioning cone surface and inserted into the first end. The fixed housing 321 is sleeved on the drive shaft 322, and the end of the fixed housing 321 is fixedly connected to the frame 2. The second spacer sleeve 323 is sleeved on the drive shaft 322 and embedded in the inner cavity of the fixed housing 321. The two second connecting bearings 324 are both sleeved on the drive shaft 322 and are respectively located on both sides of the second spacer sleeve 323, and both second connecting bearings 324 are embedded in the inner cavity of the fixed housing 321.

[0056] When cleaning wafer 300, the drive unit 31 is activated, which drives the active shaft 322 inside the fixed housing 321 to rotate around its own axis, thereby driving the brush 1 to rotate. During the rotation of the active shaft 322, the fixed housing 321 provides radial and axial support for the active shaft 322. The second spacer 323 and the two second connecting bearings 324 combine to form a double bearing rigid support system. The two second connecting bearings 324 can share the radial load of the active shaft 322, reduce the bending deformation of the active shaft 322, significantly improve the stability of the active shaft 322 during rotation, effectively reduce the vibration of the brush 1, and the second spacer 323 can absorb some of the impact energy to protect the two second connecting bearings 324.

[0057] Optionally, such as Figure 2 , Figure 3 and Figure 5 As shown, the clamping and positioning device 100 also includes a clamping sleeve 33. The clamping sleeve 33 is sleeved on the active rotating shaft 322, and the inner wall of the clamping sleeve 33 and the outer wall of the active rotating shaft 322 form a clamping cavity. The first end of the brush 1 is inserted into the clamping cavity. By setting the clamping sleeve 33 and the active rotating shaft 322 to form a clamping cavity, when clamping and positioning the brush 1, the first end of the brush 1 is inserted into the clamping cavity, so that the clamping sleeve 33 is pressed against the outer wall of the first end. At this time, the clamping sleeve 33 can clamp and fix the first end of the brush 1, thereby further providing a fixing effect for the brush 1, which is beneficial to improving the stability of the brush 1 and reducing the vibration of the brush 1.

[0058] Optionally, the first positioning component 32 also includes an adjusting washer. The adjusting washer is fitted onto the drive shaft 322 and sandwiched between the second connecting bearing 324 and the second spacer sleeve 323. By providing the adjusting washer, the axial clearance between the second connecting bearing 324 and the second spacer sleeve 323 can be precisely adjusted, preventing the second connecting bearing 324 from becoming too tight, causing increased friction, or too loose, causing axial movement, thus avoiding affecting the operating performance of the first positioning component 32. Similarly, an adjusting washer can also be sandwiched between the first connecting bearing 46 and the first spacer sleeve 45.

[0059] Example 2

[0060] This embodiment provides a wafer cleaning device 200, such as... Figure 2 As shown, the device includes a support assembly, a spraying assembly, two brushes 1, and two clamping and positioning devices 100 as described above. The two clamping and positioning devices 100 respectively clamp and position the two brushes 1. The support assembly is configured to support the wafer 300, and the wafer 300 can be positioned between the two brushes 1. The spraying assembly can spray cleaning fluid onto the surface of the wafer 300.

[0061] When cleaning wafer 300, wafer 300 is vertically positioned on a support assembly, between two brushes 1. The front and rear surfaces of wafer 300 are in contact with the two brushes 1 respectively. Then, a spraying assembly sprays cleaning fluid onto the surface of wafer 300. Simultaneously, the drive unit 31 is activated, causing the brushes 1 to rotate, thereby cleaning wafer 300. By using the aforementioned positioning device to clamp the positioning brush roller, the brushes 1 can be properly positioned, effectively reducing brush vibration and ensuring the cleaning effect of the brushes on wafer 300, thus avoiding any impact on wafer 300's performance.

[0062] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A clamping and positioning device for clamping and positioning a brush (1), characterized in that, The first end of the brush (1) is provided with a first positioning cone surface (11), and the second end of the brush (1) is provided with a second positioning cone surface (12); the clamping and positioning device includes: Frame (2); The drive unit (3) includes a drive component (31) and a first positioning component (32). The drive component (31) is disposed on the frame (2). One end of the first positioning component (32) is driven to the output end of the drive component (31), and the other end of the first positioning component (32) is provided with a third positioning cone surface. The other end of the first positioning component (32) can be inserted into the first end so that the third positioning cone surface fits against the first positioning cone surface (11). The driven unit (4) includes a second positioning component (43) rotatably disposed on the frame (2), and the second positioning component (43) is movable along the axial direction of the brush (1). The second positioning component (43) is provided with a fourth positioning cone surface, and one end of the second positioning component (43) facing the brush (1) can be inserted into the second end so that the fourth positioning cone surface fits against the second positioning cone surface (12).

2. The chucking positioning device of claim 1, wherein, The driven unit (4) further includes a driven shaft (41) rotatably disposed on the frame (2). The second positioning component (43) is reciprocally mounted on the driven shaft (41) along the axial direction of the brush (1) so that the second positioning component (43) switches between a clamping position and a retraction position. In the retraction position, the second positioning component (43) is relatively far away from the drive unit (3), and in the clamping position, the second positioning component (43) is relatively close to the drive unit (3).

3. The chucking positioning device of claim 2, wherein, The clamping and positioning device further includes a mounting sleeve (42), a first spacer sleeve (45), and two first connecting bearings (46). The mounting sleeve (42) is disposed on the frame (2). The driven shaft (41) is inserted into the inner cavity of the mounting sleeve (42) at one end away from the drive unit (3). The first spacer sleeve (45) and the two first connecting bearings (46) are both sleeved on the driven shaft (41) and embedded in the inner cavity of the mounting sleeve (42). The two first connecting bearings (46) are disposed on both sides of the first spacer sleeve (45).

4. The chucking positioning device of claim 2, wherein, The second positioning component (43) includes a clamping sleeve (431) and a resetting member (432). The clamping sleeve (431) is slidably fitted onto the driven rotating shaft (41) along the axial direction of the brush (1). The end of the clamping sleeve (431) facing the brush (1) is provided with the fourth positioning cone surface. The clamping sleeve (431) can be inserted into the second end. The resetting member (432) is fitted onto the driven rotating shaft (41) and Located in the inner cavity of the tightening sleeve (431), the driven rotating shaft (41) is fixedly fitted with an abutment sleeve (44), the abutment sleeve (44) is located on the side of the tightening sleeve (431) away from the brush (1), one end of the reset member (432) is connected to the tightening sleeve (431), the other end is connected to the abutment sleeve (44), and at least part of the abutment sleeve (44) is located in the inner cavity of the tightening sleeve (431).

5. The chucking positioning device of claim 4, wherein, The clamping and positioning device further includes a limiting ring (5). A limiting groove is provided on the driven rotating shaft (41). The limiting groove extends circumferentially along the driven rotating shaft (41). The limiting ring (5) is engaged in the limiting groove. The limiting ring (5) can limit the top clamping sleeve (431) axially along the driven rotating shaft (41).

6. A chucking positioning device according to any one of claims 1-5, characterized in that, The first positioning component (32) includes: An active rotating shaft (322) is provided with a third positioning cone surface at one end, which is connected to the output end of the driving member (31) and inserted into the first end at the other end. A fixed sleeve (321) is fitted onto the active rotating shaft (322), and the end of the fixed sleeve (321) is fixedly connected to the frame (2); The second spacer sleeve (323) is sleeved on the active rotating shaft (322) and embedded in the inner cavity of the fixed sleeve (321); There are two second connecting bearings (324). Both second connecting bearings (324) are sleeved on the active rotating shaft (322) and respectively located on both sides of the second spacer sleeve (323). Both second connecting bearings (324) are embedded in the inner cavity of the fixed sleeve (321).

7. The clamping and positioning device according to claim 6, characterized in that, The clamping and positioning device further includes a clamping sleeve (33), which is sleeved on the active rotating shaft (322). The inner wall of the clamping sleeve (33) and the outer wall of the active rotating shaft (322) form a clamping cavity, and the first end of the brush (1) is inserted into the clamping cavity.

8. The clamping and positioning device according to claim 6, characterized in that, The first positioning component (32) further includes an adjusting washer, which is sleeved on the active rotating shaft (322) and sandwiched between the second connecting bearing (324) and the second spacer sleeve (323).

9. The clamping and positioning device according to any one of claims 1-5, characterized in that, The drive unit (31) includes a rotary motor.

10. A wafer cleaning device, characterized in that, The device includes a support assembly, a spraying assembly, two brushes (1) and two clamping and positioning devices as described in any one of claims 1-9, wherein the two clamping and positioning devices respectively clamp and position the two brushes (1), the support assembly is configured to support a wafer (300) and the wafer (300) is capable of being positioned between the two brushes (1), and the spraying assembly is capable of spraying cleaning fluid onto the surface of the wafer (300).

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