A negative pressure guiding chip removal device for PCB slotting cutter processing

Abstract

This utility model relates to the field of chip removal equipment in PCB processing, and more particularly to a negative pressure guiding chip removal device for PCB slot cutting. The device includes a collection trough, a sliding groove, and a hook. Multiple sliding grooves are evenly distributed on the outer wall of the collection trough. Two symmetrical springs are installed within each sliding groove. The lower end of the sliding groove is fixedly connected to one end of a spring, and the other end of the spring is fixedly connected to one side of the outer wall of a slider. The slider is located within the sliding groove, and a hook is fixedly connected to one side of the outer wall of the slider, with the head of the hook positioned above the collection trough. This device utilizes an elastic adaptable structure and deformable adjustment design, along with a collaborative mechanism of negative pressure guidance and arc-shaped inclined guide, to achieve flexible and precise docking between the collection trough and the equipment, efficient chip removal, centralized collection, and convenient maintenance. It solves the problems of existing devices lacking multi-scenario adaptability and integrated chip removal protection design.

Description

Technical Field

[0001] This utility model relates to the field of chip removal equipment for PCB processing, and in particular to a negative pressure guiding chip removal device for PCB slot cutting. Background Technology

[0002] During PCB manufacturing, the grooving process generates a large amount of fine debris. If this debris is not removed promptly, it easily adheres to the cutting tools, the PCB surface, and equipment gaps. This not only affects cutting accuracy and product yield but can also accelerate tool wear, cause equipment jamming, and increase maintenance costs. Existing chip removal devices mostly use fixed installation structures, resulting in poor adaptability and difficulty in meeting the needs of different specifications of processing equipment and diverse processing scenarios. Furthermore, chip removal methods often rely on natural falling or simple flow guidance, leading to low chip removal efficiency and incomplete chip collection. While some negative pressure chip removal devices can improve chip collection, they lack targeted guiding structures, making them prone to chip accumulation and blockage. Additionally, the lack of protective design for negative pressure components allows debris to enter core components such as the pump body, shortening the equipment's lifespan. Overall, it is difficult to balance adaptability, chip removal efficiency, and operational stability.

[0003] While existing technologies can achieve a certain chip removal effect during use, they have drawbacks: they lack adaptability to multiple scenarios and integrated chip removal protection design. In view of this, we propose a negative pressure guiding chip removal device for PCB slotting, which solves the above problems. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing a negative pressure guiding chip removal device for PCB slotting.

[0005] The technical solution of this utility model is as follows: A negative pressure guiding chip removal device for PCB slot cutting includes a collection groove, a slide groove, and a hook. The outer wall of the collection groove is evenly provided with multiple slide grooves. Two symmetrical springs are provided in the slide grooves. The lower end of the slide groove is fixedly connected to one end of the spring, and the other end of the spring is fixedly connected to one side of the outer wall of the slider. The slider is located in the slide groove, and a hook is fixedly connected to one side of the outer wall of the slider. The head of the hook is located above the collection groove, and the hook is used to hook onto the lower end of the processing equipment.

[0006] When using the negative pressure guiding chip removal device for PCB slotting in this solution, first fix the device to the external fixed equipment through the mounting holes of the mounting base. Adjust the angle of the collection tank by the deformation of the plastic frame, aligning the hook with the hanging structure at the lower end of the processing equipment. The spring drives the slider to self-adjust, ensuring that the collection tank is stably suspended and accurately aligned with the processing area. Start the pump body, which creates negative pressure in the collection tank through the through hole on the drawer. The chips generated during processing are sucked into the collection tank under the negative pressure and guided by the arc-shaped bevel to slide into the drawer. The ventilation port balances the air pressure in the drawer, ensuring smooth chip collection. The small-sized through hole design prevents chips from entering the pump body. During processing, periodically pull out the drawer by the handle, clean the internal chips, and then reset it. The entire process requires no complicated operation, achieves continuous and efficient chip removal, reduces equipment wear, and lowers maintenance difficulty.

[0007] Preferably, the lower outer wall of the collection tank is provided with an installation groove, and a pump body is fixedly connected to the surface of the installation groove, the pump body applying negative pressure to the bottom of the collection tank.

[0008] Preferably, the lower end of the collection trough is provided with a drawer, the outer wall of one side of the drawer is provided with a handle, and the inner wall of one side of the drawer is provided with a ventilation opening. The handle facilitates pushing and pulling the drawer.

[0009] Preferably, the drawer has a through hole on the other side of its outer wall, and one end of the pump body is connected to the through hole. The through hole is small in size to prevent debris from entering the pump body.

[0010] Preferably, one side of the outer wall of the collection tank is fixedly connected to one end of the plastic frame, and the other end of the plastic frame is fixedly connected to one side of the outer wall of the mounting seat. The mounting seat is evenly provided with multiple mounting holes, and the mounting seat is fixedly installed with external fixing equipment.

[0011] Preferably, the inner wall of the collection trough is provided with a beveled edge, which is an arc-shaped surface that guides the fragments so that they fall into the drawer.

[0012] Compared with existing technologies, the advantages of this utility model are:

[0013] I. This utility model, through the elastic adaptation structure of "spring-slider-hook" and the deformable and adjustable design of the plastic frame, achieves dual flexible docking between the collection tank and processing equipment and external fixed equipment. On the one hand, the hook adapts to the attachment position of the processing equipment by means of the spring's elasticity, ensuring suspension stability; on the other hand, the plastic frame can adjust the deformation angle according to the position requirements of the processing area, and with the multi-mounting hole design of the mounting base, the collection tank can accurately align with the chip generation point, solving the problem of fixed installation position and difficulty in adapting to different specifications of processing equipment in traditional chip removal devices, greatly improving the versatility and installation flexibility of the device.

[0014] II. Building upon the first beneficial effect, and based on the precise docking of the processing area, efficient chip removal and centralized chip collection are achieved through the synergistic effect of negative pressure guidance and curved bevel guide. The pump body creates a negative pressure environment in the collection tank through through-holes, actively guiding chips in; the curved bevel prevents chips from accumulating on the tank walls, ensuring that chips fall smoothly into the drawer along the guide surface; at the same time, the small size design of the through-holes effectively protects the pump body from chip wear, and the combination of the drawer and handle facilitates subsequent chip cleaning. The overall structure forms a complete chip removal process of "precise docking - efficient chip collection - safety protection - convenient cleaning," which not only improves the chip removal efficiency of PCB slotting but also reduces equipment maintenance costs and the difficulty of chip cleaning.

[0015] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0016] Figure 1 This is a first-person three-dimensional perspective schematic diagram of the present invention;

[0017] Figure 2 This is a two-dimensional perspective schematic diagram of the present invention.

[0018] Figure 3 This is a schematic diagram of the internal structure of the collection tank of this utility model;

[0019] Figure 4 This is a schematic diagram of the ventilation opening structure of this utility model;

[0020] Figure 5 This is a schematic diagram of the through-hole structure of this utility model.

[0021] Figure label:

[0022] 1. Hook; 2. Slide rail; 3. Slider; 4. Spring; 5. Collection trough; 6. Mounting hole; 7. Mounting base; 8. Plastic frame; 9. Pump body; 10. Mounting groove; 11. Bevel; 12. Drawer; 13. Handle; 14. Vent; 15. Through hole. Detailed Implementation

[0023] To make the above-mentioned objectives, features and advantages of this utility model more readily understood, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0027] Example 1

[0028] Please see Figures 1-5 As shown, this embodiment is a negative pressure guiding chip removal device for PCB slot cutting, including a collection groove 5, a slide 2, and a hook 1. The outer wall of the collection groove 5 is evenly provided with multiple slides 2. Two symmetrical springs 4 are provided in the slide 2. The lower end of the slide 2 is fixedly connected to one end of the spring 4, and the other end of the spring 4 is fixedly connected to one side of the outer wall of the slider 3. The slider 3 is located in the slide 2, and a hook 1 is fixedly connected to one side of the outer wall of the slider 3. The head of the hook 1 is located above the collection groove 5. In use, the elasticity of the spring 4 allows the hook 1 to adapt to the hanging position of the processing equipment, ensuring that the collection groove 5 is stably suspended below the processing equipment so as to initially collect the chips generated during processing.

[0029] Example 2

[0030] Please see Figures 1-5 As shown, this embodiment further includes, based on embodiment 1, an installation groove 10 is provided on the lower outer wall of the collection groove 5, and a pump body 9 is fixedly connected to the groove surface of the installation groove 10. When in use, after the pump body 9 is started, it generates negative pressure to draw the air in the collection groove 5 outward, so that a low-pressure environment is formed inside the collection groove 5, thereby guiding the debris generated by the PCB slotting process to gather in the collection groove 5 and improving the chip removal efficiency.

[0031] The lower end of the collection tank 5 is equipped with a drawer 12. A handle 13 is provided on the outer wall of one side of the drawer 12, and a vent 14 is provided on the inner wall of one side of the drawer 12. When in use, the handle 13 makes it easy for the operator to push and pull the drawer 12. When the amount of debris collected in the drawer 12 reaches a certain amount, the drawer 12 can be pulled out for cleaning through the handle 13. The negative pressure at the vent 14 helps the debris fall smoothly into the drawer 12.

[0032] The drawer 12 has a through hole 15 on the other side of its outer wall. One end of the pump body 9 is connected to the through hole 15. When in use, the pump body 9 creates a negative pressure inside the drawer 12 through the through hole 15. Since the through hole 15 is small, it can effectively block most of the debris from entering the pump body 9, reducing the wear and blockage of the pump body 9 by the debris and ensuring the stable operation of the pump body 9.

[0033] One side of the outer wall of the collection tank 5 is fixedly connected to one end of the plastic frame 8, and the other end of the plastic frame 8 is fixedly connected to one side of the outer wall of the mounting seat 7. The mounting seat 7 is evenly provided with multiple mounting holes 6. In use, the mounting seat 7 is fixedly connected to external fixed equipment (such as machine tool frame) through the mounting holes 6. The plastic frame 8 can deform to a certain extent according to the actual installation requirements, thereby adjusting the installation angle and position of the collection tank 5, ensuring that the collection tank 5 accurately connects to the processing area and improves the chip collection effect.

[0034] The inner wall of the collection tank 5 is provided with a beveled edge 11, which is an arc-shaped surface. During use, the beveled edge 11 of the arc-shaped surface can guide the debris falling into the collection tank 5, so that the debris slides down the arc-shaped surface into the drawer 12 under the dual action of gravity and negative pressure, avoiding the accumulation of debris on the inner wall of the collection tank 5 and ensuring that the debris discharge channel is unobstructed.

[0035] Instructions for Use: When using this device, first secure it to the external equipment via the mounting holes 6 of the mounting base 7. Adjust the angle of the collection tank 5 using the deformation of the plastic frame 8, aligning the hook 1 with the lower hanging structure of the processing equipment. The spring 4 drives the slider 3 to self-adjust, ensuring the collection tank 5 is stably suspended and precisely aligned with the processing area. Start the pump body 9, which creates negative pressure in the collection tank 5 through the through-hole 15 on the drawer 12. Processing debris is drawn into the collection tank 5 under this negative pressure and guided by the curved bevel 11 to slide into the drawer 12. The vent 14 balances the air pressure in the drawer 12, ensuring smooth debris collection. The small size of the through-hole 15 prevents debris from entering the pump body 9. During processing, periodically pull out the drawer 12 using the handle 13, clean out the internal debris, and then reset it. The entire process requires no complicated operation, achieving continuous and efficient chip removal while reducing equipment wear and simplifying maintenance.

[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A negative pressure guiding chip removal device for PCB slotting, comprising a collection groove (5), a slide (2), and a hook (1), characterized in that: The outer wall of the collection groove (5) is uniformly provided with multiple sliding grooves (2). Two symmetrical springs (4) are provided in the sliding groove (2). The lower end of the groove (2) is fixedly connected to one end of the spring (4). The other end of the spring (4) is fixedly connected to one side of the outer wall of the slider (3). The slider (3) is located in the sliding groove (2). A hook (1) is fixedly connected to one side of the outer wall of the slider (3). The head of the hook (1) is located above the collection groove (5).

2. The negative pressure guiding chip removal device for PCB slotting as described in claim 1, characterized in that: The lower outer wall of the collection tank (5) is provided with an installation groove (10), and the surface of the installation groove (10) is fixedly connected to the pump body (9).

3. The negative pressure guiding chip removal device for PCB slotting according to claim 2, characterized in that: The collection trough (5) is provided with a drawer (12) at the lower end. The drawer (12) has a handle (13) on one side of its outer wall and a vent (14) on one side of its inner wall.

4. The negative pressure guiding chip removal device for PCB slotting according to claim 3, characterized in that: The drawer (12) has a through hole (15) on the other side of its outer wall, and one end of the pump body (9) is connected to the through hole (15).

5. The negative pressure guiding chip removal device for PCB slotting as described in claim 1, characterized in that: The outer wall of one side of the collection tank (5) is fixedly connected to one end of the plastic frame (8), and the outer wall of the mounting seat (7) at the other end of the plastic frame (8) is fixedly connected to one side of the mounting seat (7). The mounting seat (7) is evenly provided with multiple mounting holes (6).

6. The negative pressure guiding chip removal device for PCB slotting according to claim 1, characterized in that: The inner wall of the collection trough (5) is provided with a bevel (11), and the bevel (11) is an arc-shaped surface.

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