Processing equipment

Abstract

This application relates to the field of workpiece processing technology, specifically providing a processing apparatus, including: a processing base; a support base disposed on the processing base, and having a processing position and a placement position for carrying multiple workpieces; a processing mechanism including a transfer component, a processing component, an adsorption component, and a cleaning component. The adsorption component is disposed on the transfer component and is used to adsorb workpieces located at the placement position to the processing position and vice versa, driven by the transfer component. The processing component is disposed on the transfer component and is used to process the workpieces located at the processing position, driven by the transfer component. The cleaning component is disposed on the adsorption component and is used to remove processing residues from the workpieces. The above-mentioned processing apparatus can complete the processing of multiple workpieces in a single loading, and by integrating the cleaning component and the adsorption component, the processing process of the processing apparatus can be simplified, thereby improving the processing efficiency of the workpieces.

Description

Technical Field

[0001] This application relates to the field of workpiece processing technology, specifically to a processing device. Background Technology

[0002] In the field of machining technology, before machining begins, workpieces are typically placed one by one into the machining station of the machining device. During machining, a cleaning mechanism located outside the machining device is used to clean the workpieces to remove machining residues, thereby improving machining accuracy. However, current loading and unloading methods are mostly single-piece loading, and the arrangement of the cleaning mechanism independent of the machining device makes the workpiece machining process cumbersome, resulting in low machining efficiency. Utility Model Content

[0003] In view of the above, it is necessary to provide a processing device to improve processing efficiency.

[0004] This application provides a processing apparatus, including: Machining base; A support base is provided on the processing base, and is provided with a processing position and a placement position for supporting multiple workpieces; The processing mechanism includes a transfer component, a processing component, an adsorption component, and a cleaning component. The adsorption component is disposed on the transfer component and is used to adsorb the workpiece located at the placement position to the processing position and adsorb the workpiece located at the processing position to the placement position under the action of the transfer component. The processing component is disposed on the transfer component and is used to process the workpiece located at the processing position under the action of the transfer component. The cleaning component is disposed on the adsorption component and is used to remove processing residues on the workpiece.

[0005] In operation, the aforementioned processing device first moves multiple workpieces to multiple placement positions on the support base to complete the loading of multiple workpieces. The adsorption component, driven by the transfer component, adsorbs the workpieces located at the placement positions and moves them to the processing position. Furthermore, after the workpieces at the processing position have been processed, the adsorption component adsorbs the processed workpieces and moves them back to the placement position. In addition, during the workpiece processing, a cleaning component mounted on the adsorption component removes processing residues from the workpieces. Therefore, the aforementioned processing device can process multiple workpieces with a single loading operation. By integrating the cleaning component and the adsorption component into a single structure, the processing process is simplified, thereby improving the workpiece processing efficiency.

[0006] In some embodiments, the support includes: The support platform is located on the processing base; A support member is provided on the bearing platform and has the processing position; A positioning element is provided on the bearing platform and located on one side of the support element, and the positioning element has multiple placement positions.

[0007] In some embodiments, the cleaning component includes: The fixing element is detachably connected to the adsorption assembly; The connecting pipe is inserted into the fixing member; The nozzle is connected to the connecting pipe and is coaxially arranged with the connecting pipe.

[0008] In some embodiments, the processing seat includes a processing platform and a processing drive component. The processing drive component is disposed on the processing platform and connected to the support seat, and is used to drive the support seat to move along a first direction. The transfer assembly includes a translation drive component and a lifting drive component. The translation drive component is connected to the lifting drive component and is used to drive the lifting drive component to move along a second direction. The lifting drive component is connected to the processing component and the adsorption assembly and is used to drive the processing component and the adsorption assembly to move along a third direction. The first direction, the second direction, and the third direction are all perpendicular to each other.

[0009] In some embodiments, the adsorption component includes: Mounting base, connected to the transfer assembly; cleaning assembly connected to the mounting base; An adsorption element, connected to the mounting base, is used to adsorb the workpiece; A guide component, connected to the mounting base, is used to position the workpiece.

[0010] In some embodiments, the adsorption element includes: Adsorbent, connected to the mounting base; A flexible body, connected to the adsorbent, is used to abut against the workpiece when the adsorbent adsorbs the workpiece.

[0011] In some embodiments, the mounting base includes: The mounting component connects to the transfer assembly and has a mounting slot; the cleaning assembly and the guide are respectively connected to the mounting component and are both located outside the mounting slot. Two connectors are detachably connected to the opposite side walls of the mounting groove, and the adsorption element is connected to the two connectors respectively and located between the two connectors.

[0012] In some embodiments, each of the connectors includes: An elastomer, one end of which is connected to the sidewall of the mounting groove; A connector is attached to the other end of the elastomer and connected to the adsorption element.

[0013] In some embodiments, the guide includes: The fixing body is connected to the adsorption element; A guide body, connected to the adsorption element and located at opposite ends of the adsorption element; The reset body has two ends that abut against the fixing body and the guide body, respectively.

[0014] In some embodiments, the processing apparatus further includes: A protective cover is provided on the machining base and has a protective cavity and a machining window connecting the inside and outside of the protective cavity. The support base and the machining mechanism are both housed in the protective cavity. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the processing apparatus according to an embodiment of this application.

[0016] Figure 2 for Figure 1 A partial structural schematic diagram of the processing device shown.

[0017] Figure 3 for Figure 2 The diagram shows the structure of the adsorption component and the cleaning component in the processing device.

[0018] Figure 4 for Figure 3 The diagram shows a breakdown of the adsorption component.

[0019] Key component symbols: Processing device 100, processing base 110, processing platform 111, processing drive component 112, support base 120, processing position 120a, placement position 120b, support platform 121, support component 122, positioning component 123, bracket 1231, positioning body 1232, processing mechanism 130, transfer assembly 131, translation drive component 1311, lifting drive component 1312, processing component 132, adsorption assembly 133, mounting base 1331. Mounting component 1331a, connector 1331b, mounting groove 1331c, elastomer 1331d, connector 1331e, adsorption component 1332, adsorption body 1332a, flexible body 1332b, guide component 1333, fixing body 1333a, guide body 1333b, reset body 1333c, cleaning assembly 134, fixing component 1341, connecting pipe 1342, nozzle 1343, protective cover 140, protective cavity 140a, processing window 140b. Detailed Implementation

[0020] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two elements or the interaction between two elements. In the description of this application, it should be noted that "multiple" means two or more, unless otherwise expressly and specifically limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0023] Please see Figure 1 and Figure 2 This application provides a processing apparatus 100, including a processing base 110, a support base 120 and a processing mechanism 130, for processing workpieces to improve the processing efficiency of workpieces.

[0024] For ease of description, in Figures 1 to 4 A three-dimensional coordinate system has been added. Specifically, the X-axis is the first direction, the Y-axis is the second direction, and the Z-axis is the third direction. The X-axis, Y-axis, and Z-axis are all perpendicular to each other.

[0025] Please see Figure 2 and Figure 3 The support seat 120 is located on the processing seat 110 and has a processing position 120a and multiple placement positions 120b. The processing position 120a can be used to place a fixture, and the multiple placement positions 120b are used to place multiple workpieces. The processing mechanism 130 includes a transfer assembly 131, a processing part 132, an adsorption assembly 133, and a cleaning assembly 134. The adsorption assembly 133 is located on the transfer assembly 131 and is used to adsorb the workpiece located at the placement position 120b to the processing position 120a and adsorb the workpiece located at the processing position 120a to the placement position 120b under the drive of the transfer assembly 131. The processing part 132 is located on the transfer assembly 131 and is used to process the workpiece located at the processing position 120a under the drive of the transfer assembly 131. The cleaning assembly 134 is located on the adsorption assembly 133 and is used to remove processing residues on the workpiece.

[0026] It should be noted that the fixture and workpiece are adapted to each other on the processing station 120a. Before processing the workpiece, the appropriate fixture can be selected based on the workpiece to be processed, and the fixture can be placed on the processing station 120a. Multiple workpieces can be placed on multiple placement stations 120b. Alternatively, other structures with the same function and structure as the fixture, such as grooves, can be directly set on the processing station 120a to complete the positioning of the workpiece.

[0027] In the aforementioned processing apparatus 100, multiple workpieces are first moved to multiple placement positions 120b of the support 120 to complete the loading of multiple workpieces. The adsorption component 133, driven by the transfer component 131, can adsorb the workpieces located at placement positions 120b to processing positions 120a. Furthermore, after the workpieces at processing positions 120a have been processed by the workpiece 132, the processed workpieces can be adsorbed back to placement positions 120b. In addition, during the workpiece processing, a cleaning component 134 mounted on the adsorption component 133 removes processing residues generated on the workpieces. Therefore, the aforementioned processing apparatus 100 can complete the processing of multiple workpieces with a single loading operation. Furthermore, by integrating the cleaning component 134 and the adsorption component 133 into a single structure, the processing process of the processing apparatus 100 can be simplified, thereby improving the workpiece processing efficiency.

[0028] Please see Figure 2 In some embodiments, the support 120 includes a support platform 121, a support member 122, and a positioning member 123. The support platform 121 is disposed on the processing base 110, the support member 122 is disposed on the support platform 121 and has a processing position 120a, and the positioning member 123 is disposed on the support platform 121 and located on one side of the support member 122, and the positioning member 123 has a plurality of placement positions 120b.

[0029] Therefore, the support 122 and the positioning 123 are set independently, which can avoid interference between the workpiece and the adsorption component 133 during the transfer process, and is beneficial to the efficiency of the adsorption component 133 in transferring the workpiece.

[0030] In some embodiments, the positioning member 123 includes a bracket 1231 and a positioning body 1232. The bracket 1231 is disposed on the support platform 121 and located on one side of the support member 122. The positioning body 1232 is connected to the side of the bracket 1231 away from the support platform 121 and has a plurality of placement positions 120b, each placement position 120b being used to support a workpiece.

[0031] For example, multiple placement positions 120b are spaced apart along the X-axis, and the bracket 1231 is generally U-shaped.

[0032] Therefore, the arrangement of the positioning element 123 can be optimized by using the bracket 1231 and the positioning body 1232, which is beneficial to the miniaturization of the bearing seat 120.

[0033] Please see Figure 2In some embodiments, the processing stand 110 includes a processing platform 111 and a processing drive 112. The processing drive 112 is disposed on the processing platform 111 and connected to the support stand 120, and is used to drive the support stand 120 to move along the X-axis. The transfer assembly 131 includes a translation drive 1311 and a lifting drive 1312. The translation drive 1311 is connected to the lifting drive 1312 and is used to drive the lifting drive 1312 to move along the Y-axis. The lifting drive 1312 is connected to the processing component 132 and the adsorption assembly 133 and is used to drive the processing component 132 and the adsorption assembly 133 to move along the Z-axis. Exemplarily, the processing drive 112, the translation drive 1311, and the lifting drive 1312 can all be servo motors.

[0034] Therefore, through the above configuration, the machining stand 110, in conjunction with the transfer assembly 131, enables the workpiece 132 to move relative to the workpiece in the X-axis, Y-axis, and Z-axis directions, thereby allowing the workpiece 132 to complete the machining of the workpiece. Please refer to... Figure 3 In some embodiments, the adsorption assembly 133 includes a mounting base 1331, an adsorption element 1332, and a guide element 1333. The mounting base 1331 is connected to the transfer assembly 131, the cleaning assembly 134 is connected to the mounting base 1331, the adsorption element 1332 is connected to the mounting base 1331 and is used to adsorb the workpiece, and the guide element 1333 is connected to the mounting base 1331 and is used to position the workpiece. Exemplarily, the adsorption element 1332 can be a gas structure, or it can be a magnetic structure when the workpiece is a metal part.

[0035] Therefore, the guide 1333 can guide the adsorption component 1332 to accurately adsorb the workpiece, and the adsorption component 1332 can simplify the structure of the adsorption assembly 133 and reduce the manufacturing difficulty of the adsorption assembly 133.

[0036] Please see Figure 4 In some embodiments, the adsorption member 1332 includes an adsorption body 1332a and a flexible body 1332b. The adsorption body 1332a is connected to the mounting base 1331, and the flexible body 1332b is connected to the adsorption body 1332a, used to abut against the workpiece when the adsorption body 1332a adsorbs the workpiece. Exemplarily, the flexible body 1332b is provided with a through hole, and the through hole of the flexible body 1332b is correspondingly arranged with the adsorption hole of the adsorption body 1332a in the Z-axis direction.

[0037] Therefore, the flexible body 1332b enables the adsorption element 1332 and the workpiece to flexibly contact each other, thus avoiding damage to the workpiece caused by the adsorption element 1332.

[0038] Please see Figure 3 and Figure 4In some embodiments, the mounting base 1331 includes a mounting member 1331a and two connecting members 1331b. The mounting member 1331a is connected to the transfer assembly 131 and has a mounting groove 1331c. The cleaning assembly 134 and the guide member 1333 are respectively connected to the mounting member 1331a and are both located outside the mounting groove 1331c. The two connecting members 1331b are respectively detachably connected to the opposite side walls of the mounting groove 1331c. The adsorption member 1332 is respectively connected to the two connecting members 1331b and is located between the two connecting members 1331b.

[0039] Therefore, through the above arrangement, the mounting component 1331 and the adsorption component 1332 can form an embedded structure, which helps to reduce the space occupied by the processing mechanism 130.

[0040] Please see Figure 4 In some embodiments, each connector 1331b includes an elastomer 1331d and a connector 1331e. One end of the elastomer 1331d is connected to the sidewall of the mounting groove 1331c, and the connector 1331e is connected to the other end of the elastomer 1331d and connected to the adsorption member 1332. Exemplarily, the elastomer 1331d can be a square flexible structure, and the elastic force direction of the elastomer 1331d is parallel to the Y-axis direction.

[0041] Therefore, the elastic body 1331d allows the adsorption member 1332 to have a certain floating range relative to the mounting base 1331 in the Y-axis direction, which is beneficial to improving the adsorption accuracy of the adsorption member 1332 on the workpiece.

[0042] Please see Figure 3 and Figure 4 In some embodiments, the guide 1333 includes a fixing body 1333a, a guide body 1333b, and a resetting body 1333c. The fixing body 1333a is connected to the adsorption member 1332, the guide body 1333b is connected to the adsorption member 1332 and located at opposite ends of the adsorption member 1332, and the two ends of the resetting body 1333c abut against the fixing body 1333a and the guide body 1333b, respectively. Exemplarily, the resetting body 1333c can be a spring.

[0043] Therefore, through the above settings, the adsorption element 1332 can float along the Z-axis direction, avoiding damage to the workpiece when the adsorption element 1332 adsorbs the workpiece.

[0044] Please see Figure 3 and Figure 4In some embodiments, the cleaning component 134 includes a fixing member 1341, a connecting pipe 1342, and a nozzle 1343. The fixing member 1341 is detachably connected to the mounting member 1331a of the adsorption component 133 by bolts. The connecting pipe 1342 is inserted into the fixing member 1341 to connect to an external air source or water source. The nozzle 1343 is connected to the connecting pipe 1342 and is coaxially arranged with the connecting pipe 1342. The external air source or water source can spray high-pressure gas or high-pressure water from the nozzle 1343 through the connecting pipe 1342 to remove processing residues generated on the workpiece, thereby achieving workpiece cleaning.

[0045] Therefore, the above-mentioned configuration facilitates the replacement of the cleaning component 134, making it suitable for various workpieces. In addition, the cleaning component 134 is easy to disassemble and assemble, which reduces the difficulty of disassembling and assembling the cleaning component 134 and the adsorption component 133.

[0046] Please see Figure 1 In some embodiments, the processing apparatus 100 further includes a protective cover 140. The protective cover 140 covers the processing base 110 and has a protective cavity 140a and a processing window 140b communicating with the inside and outside of the protective cavity 140a. The support base 120 and the processing mechanism 130 are both housed in the protective cavity 140a.

[0047] Therefore, the protective cover 140 can prevent external parts from colliding with the processing mechanism 130, thereby improving the safety of the processing device 100.

[0048] Before the aforementioned processing device 100 processes the workpiece, multiple workpieces are placed into multiple placement positions 120b of the support seat 120 through the processing window 140b. The operation process of the processing device 100 is roughly as follows: First, the processing drive 112 drives the carrier 120 to move along the X-axis direction, and the adsorption assembly 133 adsorbs the workpiece located at the placement position 120b to the processing position 120a under the drive of the transfer assembly 131. Then, the machining drive 112 drives the carrier 120 to move along the X-axis, and the machining part 132 moves along the Y-axis and Z-axis under the drive of the transfer assembly 131 to process the workpiece located at the machining position 120a. During this process, the cleaning assembly 134 removes the machining residue generated on the workpiece. Finally, the processing drive 112 drives the carrier 120 to move along the X-axis, and the adsorption assembly 133, driven by the transfer assembly 131, adsorbs the processed workpiece on the processing position 120a to the placement position 120b.

[0049] Repeat the above operation to process multiple workpieces. After processing is completed, remove the processed multiple workpieces through the processing window 140b and reposition the multiple workpieces to be processed to the support seat 120 so that the processing device 100 can continue to operate.

[0050] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A processing apparatus, characterized in that, include: Machining base; A support base is provided on the processing base, and is provided with a processing position and a placement position for supporting multiple workpieces; The processing mechanism includes a transfer component, a processing component, an adsorption component, and a cleaning component. The adsorption component is disposed on the transfer component and is used to adsorb the workpiece located at the placement position to the processing position and adsorb the workpiece located at the processing position to the placement position under the action of the transfer component. The processing component is disposed on the transfer component and is used to process the workpiece located at the processing position under the action of the transfer component. The cleaning component is disposed on the adsorption component and is used to remove processing residues on the workpiece.

2. The processing apparatus as described in claim 1, characterized in that, The support includes: The support platform is located on the processing base; A support member is provided on the bearing platform and has the processing position; A positioning element is disposed on the bearing platform and located on one side of the support element, and the positioning element has multiple placement positions.

3. The processing apparatus as described in claim 1, characterized in that, The cleaning components include: The fixing element is detachably connected to the adsorption assembly; The connecting pipe is inserted into the fixing member; The nozzle is connected to the connecting pipe and is coaxially arranged with the connecting pipe.

4. The processing apparatus as described in claim 1, characterized in that, The machining base includes a machining platform and a machining drive component. The machining drive component is disposed on the machining platform and connected to the support base, and is used to drive the support base to move along a first direction. The transfer assembly includes a translation drive and a lifting drive. The translation drive is connected to the lifting drive and is used to drive the lifting drive to move along a second direction. The lifting drive is connected to the processing part and the adsorption assembly and is used to drive the processing part and the adsorption assembly to move along a third direction. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.

5. The processing apparatus as described in claim 1, characterized in that, The adsorption component includes: Mounting base, connected to the transfer assembly; cleaning assembly connected to the mounting base; An adsorption element, connected to the mounting base, is used to adsorb the workpiece; A guide component, connected to the mounting base, is used to position the workpiece.

6. The processing apparatus as described in claim 5, characterized in that, The adsorption element includes: Adsorbent, connected to the mounting base; A flexible body, connected to the adsorbent, is used to abut against the workpiece when the adsorbent adsorbs the workpiece.

7. The processing apparatus as described in claim 5, characterized in that, The mounting base includes: The mounting component connects to the transfer assembly and has a mounting slot; the cleaning assembly and the guide are respectively connected to the mounting component and are both located outside the mounting slot. Two connectors are detachably connected to the opposite side walls of the mounting groove, and the adsorption element is connected to the two connectors respectively and located between the two connectors.

8. The processing apparatus as described in claim 7, characterized in that, Each of the connectors includes: An elastomer, one end of which is connected to the sidewall of the mounting groove; A connector is attached to the other end of the elastomer and connected to the adsorption element.

9. The processing apparatus as described in claim 5, characterized in that, The guide component includes: The fixing body is connected to the adsorption element; A guide body, connected to the adsorption element and located at opposite ends of the adsorption element; The reset body has two ends that abut against the fixing body and the guide body, respectively.

10. The processing apparatus as described in claim 1, characterized in that, The processing apparatus further includes: A protective cover is provided on the machining base and has a protective cavity and a machining window connecting the inside and outside of the protective cavity. The support base and the machining mechanism are both housed in the protective cavity.

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