Wafer carrier apparatus for chemical mechanical polishing

Abstract

This utility model relates to the field of semiconductor manufacturing technology and discloses a wafer carrier device for chemical mechanical polishing (CMP), comprising: a base; a rotating assembly including a drive motor arranged on the base and a rotating disk mounted on the output shaft of the drive motor; a locking assembly including a sliding groove arranged on the rotating disk and a limiting post slidably connected to the sliding groove; a lifting assembly including a sliding plate slidably connected to the base; an adsorption assembly including a rotating shaft rotatably connected to the sliding plate and a vacuum suction cup arranged on the rotating shaft; a liquid spraying assembly including a liquid storage tank arranged on one side of the base and a liquid supply pipe connected to the liquid storage tank; and a collection assembly including a housing arranged on the base and a collection bucket connected to the housing, ensuring precise and controllable wafer posture and polishing pad position during the polishing process, providing a stable foundation for CMP.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a wafer carrier device for chemical mechanical polishing. Background Technology

[0002] Chemical mechanical polishing (CMP) is a key process for achieving global planarization of wafers. As the core supporting devices in the CMP process, the performance of wafer carrier equipment and polishing equipment directly affects the wafer polishing accuracy, efficiency, and yield.

[0003] A search revealed existing technology (application number: CN213917712U), which describes "a chemical mechanical polishing device." This utility model includes a polishing disc with a polishing pad disposed on its top surface; a support head for receiving a wafer and loading the wafer onto the polishing pad; a temperature regulating unit disposed on the upper side of the polishing pad to regulate the temperature of an annular region concentric with the polishing pad; the support head rotates and moves horizontally along the radial direction of the polishing pad to control the contact time between the wafer edge and the annular region of the polishing pad, thereby adjusting the removal rate of the wafer edge.

[0004] However, while existing technologies can control the polishing rate of different areas of the wafer and achieve global planarization of the wafer, they still have some shortcomings: existing technologies lack convenient structures for replacing polishing pads, while this device limits the position through bumps and grooves, and finally locks it with limiting posts. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer carrier device for chemical mechanical polishing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wafer carrier device for chemical mechanical polishing, comprising: a base; a rotating assembly, including a drive motor arranged on the base, and a rotating disk mounted on the output shaft of the drive motor; a locking assembly, including a sliding groove arranged on the rotating disk, and a limiting post slidably connected to the sliding groove; a lifting assembly, including a sliding plate slidably connected to the base; an adsorption assembly, including a rotating shaft rotatably connected to the sliding plate, and a vacuum suction cup arranged on the rotating shaft; a liquid spraying assembly, including a liquid storage tank arranged on one side of the base, and a liquid supply pipe connected to the liquid storage tank; and a collection assembly, including a housing arranged on the base, and a collection bucket connected to the housing.

[0007] As a further description of the above technical solution:

[0008] The rotating assembly includes: a polishing pad slidably connected to the rotating disk; and protrusions arranged on both sides of the polishing pad, slidably connected to the groove, and cooperating with the limiting post.

[0009] As a further description of the above technical solution:

[0010] The locking assembly includes: a spring, one end of which is connected to the slide groove and the other end of which is connected to the limiting post.

[0011] As a further description of the above technical solution:

[0012] The lifting assembly includes: a cylinder, which is arranged on the base and whose output end is connected to a sliding plate; and a second spring, which is connected between the base and the sliding plate.

[0013] As a further description of the above technical solution:

[0014] The adsorption assembly includes: a second drive motor arranged on a sliding plate; and a gear set, wherein one set of bevel gears is mounted on a rotating shaft and another set of bevel gears is mounted on the output shaft of the second drive motor.

[0015] As a further description of the above technical solution:

[0016] The spraying assembly includes a water pump, which is arranged on the liquid supply pipe.

[0017] As a further description of the above technical solution:

[0018] The collection component includes a guide plate, which is disposed on the outer shell and rotatably connected to the rotating disk.

[0019] This utility model has the following beneficial effects:

[0020] The wafer is held in place by a vacuum suction cup, and driven by a motor and gear set, the wafer rotates and is lifted by a cylinder. At the same time, the position of the polishing pad is locked by a limit post and a spring, ensuring that the wafer posture and the position of the polishing pad are precisely controllable during the polishing process. The polishing pad can also be replaced to provide a stable foundation for chemical mechanical polishing.

[0021] The polishing liquid is precisely delivered through the supply pipe driven by a water pump to meet the requirements of polishing cooling and effect. The waste liquid is then efficiently collected by the guide plate and collection bucket to avoid pollution, thus achieving a high-efficiency, precise and clean polishing operation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the rotating component of this utility model;

[0024] Figure 3 This is a schematic diagram of the locking component of this utility model.

[0025] Legend:

[0026] 1. Base; 2. Drive motor one; 3. Rotating disk; 4. Polishing pad; 5. Protrusion; 6. Slide groove; 7. Limiting post; 8. Spring one; 9. Cylinder; 10. Sliding plate; 11. Spring two; 12. Drive motor two; 13. Gear set; 14. Rotating shaft; 15. Vacuum suction cup; 16. Liquid storage tank; 17. Liquid supply pipe; 18. Water pump; 19. Outer shell; 20. Guide plate; 21. Collection bucket. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Example 1

[0031] like Figures 1 to 3As shown, this embodiment provides a wafer carrier device for chemical mechanical polishing, comprising: a base 1; a rotating assembly including a drive motor 2 arranged on the base 1, and a rotating disk 3 mounted on the output shaft of the drive motor 2; a locking assembly including a sliding groove 6 arranged on the rotating disk 3, and a limiting post 7 slidably connected to the sliding groove 6; a lifting assembly including a sliding plate 10 slidably connected to the base 1; an adsorption assembly including a rotating shaft 14 rotatably connected to the sliding plate 10, and a vacuum suction cup 15 arranged on the rotating shaft 14; a liquid spraying assembly including a liquid storage tank 16 arranged on one side of the base 1, and a liquid supply pipe 17 connected to the liquid storage tank 16; and a collection assembly including a housing 19 arranged on the base 1, and a collection bucket 21 connected to the housing 19.

[0032] Understandable, Figure 1 The wafer carrier device is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, wafer carrier equipment can also include, compared to Figure 1 More or fewer parts.

[0033] Furthermore, in this embodiment, the components work together to achieve wafer support, rotation, locking, lifting, adsorption, liquid spraying, and waste liquid collection; providing stable wafer support and supporting operations for the chemical mechanical polishing process.

[0034] Specifically, the rotating assembly includes: a polishing pad 4, which is slidably connected to the rotating disk 3; and protrusions 5, which are arranged on both sides of the polishing pad 4 and slidably connected to the slide groove 6, and cooperate with the limiting post 7.

[0035] In this embodiment, the protrusion 5 slides along the groove 6, and the limiting post 7 limits the position of the protrusion 5; thus fixing the position of the polishing pad 4 and ensuring polishing accuracy.

[0036] Specifically, the locking component includes a spring 8, one end of which is connected to the slide groove 6 and the other end of which is connected to the limiting post 7.

[0037] As a preferred implementation, the elastic force of the spring 8 pushes the limiting post 7 to fit tightly with the protrusion 5; the effect is to enhance the locking force of the limiting post 7 on the protrusion 5 and prevent the polishing pad 4 from shifting during polishing.

[0038] Example 2

[0039] Specifically, the lifting assembly includes: a cylinder 9, which is arranged on the base 1 and whose output end is connected to the sliding plate 10; and a spring 11, which is connected between the base 1 and the sliding plate 10.

[0040] In this embodiment, cylinder 9 drives sliding plate 10 to rise and fall, and spring 2 11 assists in buffering and resetting; thus achieving smooth rising and falling of sliding plate 10 and the adsorption assembly above it, and adjusting the wafer height.

[0041] Specifically, the adsorption assembly includes: a second drive motor 12, arranged on the sliding plate 10; and a gear set 13, with one set of bevel gears mounted on the rotating shaft 14 and another set of bevel gears mounted on the output shaft of the second drive motor 12.

[0042] With this configuration, the drive motor 12 drives the rotating shaft 14 to rotate through the gear set 13, and the vacuum suction cup 15 generates negative pressure to adsorb the wafer; thus realizing the adsorption, fixation and rotation adjustment of the wafer to meet the polishing angle requirements.

[0043] Example 3

[0044] Specifically, the spraying assembly includes a water pump 18, which is arranged on the liquid supply pipe 17.

[0045] The water pump 18 provides power to transport the polishing liquid in the storage tank 16 to the polishing area through the supply pipe 17; it continuously supplies polishing liquid to the polishing process, reduces the polishing temperature and improves the polishing effect.

[0046] Specifically, the collection component includes a guide plate 20, which is disposed on the housing 19 and rotatably connected to the rotating disk 3.

[0047] In actual use, the user places the wafer on the vacuum suction cup 15, where the top of the rotating shaft 14 is rotatably connected to the vacuum suction pipe of the external vacuum suction equipment. The rotating shaft 14 suctions the vacuum suction cup 15 to achieve wafer adsorption. Then, the second drive motor 12 is started to drive the gear set 13 to rotate, and the gear set 13 drives the rotating shaft 14 to rotate. At this time, the water pump 18 is started. The liquid storage tank 16 is equipped with two sets, one set for storing polishing liquid and the other set for water. By opening the valve storing polishing liquid, it is sprayed onto the polishing pad 4 through the liquid supply pipe 17. The cylinder 9 is started to drive the wafer to descend, and the first drive motor 2 is started to drive the polishing pad 4 to rotate to achieve polishing. The liquid flowing down the polishing pad 4 is collected into the collection bucket 21 under the action of the inclined guide plate 20. After polishing, the valve can be switched to spray water for easy cleaning by the user. When the polishing pad 4 needs to be replaced, the limit post 7 is pulled upward to release the lock on the protrusion 5, and the polishing pad 4 can be rotated to replace it. The device is also equipped with a trimmer (not shown in the figure) for real-time trimming of the surface of the polishing pad 4.

[0048] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer carrier apparatus for chemical mechanical polishing, comprising: include: Base (1); The rotating assembly includes a drive motor (2) arranged on the base (1) and a rotating disk (3) mounted on the output shaft of the drive motor (2); The locking assembly includes a groove (6) arranged on the rotating disk (3) and a limiting post (7) slidably connected to the groove (6); The lifting assembly includes a sliding plate (10) that is slidably connected to the base (1); The adsorption assembly includes a rotating shaft (14) rotatably connected to a sliding plate (10), and a vacuum suction cup (15) arranged on the rotating shaft (14); The spraying assembly includes a liquid storage tank (16) arranged on one side of the base (1) and a liquid supply pipe (17) connected to the liquid storage tank (16); The collection assembly includes a housing (19) arranged on a base (1) and a collection bucket (21) connected to the housing (19).

2. A wafer carrier apparatus for use in chemical mechanical polishing as defined in claim 1, wherein, The rotating assembly includes: Polishing pad (4) is slidably connected to rotating disk (3); The protrusions (5) are arranged on both sides of the polishing pad (4) and are slidably connected to the groove (6) and cooperate with the limiting post (7).

3. A wafer carrier apparatus for use in chemical mechanical polishing as defined in claim 2, wherein The locking component includes: Spring 1 (8) is connected at one end to the slide groove (6) and at the other end to the limiting post (7).

4. A wafer carrier apparatus for use in chemical mechanical polishing as defined in claim 3, wherein The lifting assembly includes: A cylinder (9) is arranged on a base (1) and its output end is connected to a sliding plate (10); Spring 2 (11) is connected between the base (1) and the sliding plate (10).

5. A wafer carrier device for chemical mechanical polishing according to claim 4, characterized in that, The adsorption component includes: Drive motor 2 (12) is arranged on sliding plate (10); The gear set (13) has one set of bevel gears mounted on the rotating shaft (14) and another set of bevel gears mounted on the output shaft of the second drive motor (12).

6. A wafer carrier apparatus for use in chemical mechanical polishing as defined in claim 5, wherein, The liquid spraying assembly includes: A water pump (18) is installed on the liquid supply pipe (17).

7. A wafer carrier apparatus for use in chemical mechanical polishing as defined in claim 6, wherein, The collection component includes: A guide plate (20) is mounted on the outer casing (19) and is rotatably connected to the rotating disk (3).

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