A dressing and polishing device

Abstract

This application provides a dressing tool and polishing equipment for correcting annular polishing pads. The dressing tool includes a grinding section, which is constructed such that, along the radial direction of the polishing pad, the grinding section has a first end corresponding to the inner ring portion of the polishing pad and a second end corresponding to the outer ring portion of the polishing pad. The circumferential dimension of the first end along the polishing pad is greater than that of the second end along the polishing pad. By specifically setting the dimensions of the grinding section of the dressing tool, the circumferential dimension of the grinding section along the polishing pad is negatively correlated with the radius of the corresponding position on the polishing pad. The grinding capacity of the first end of the grinding section is greater than that of the second end, thereby balancing the difference in grinding amount caused by the difference in the dimensions of the inner and outer rings of the polishing pad. This ensures that the removal amount between the inner and outer rings of the polishing pad tends to be consistent during the actual grinding process, ultimately guaranteeing a uniform overall thickness of the polishing pad after grinding.

Description

Technical Field

[0001] This application relates generally to the field of polishing equipment technology, and more specifically to a dressing tool and polishing equipment. Background Technology

[0002] In silicon wafer manufacturing, double-side polishing (DSP) technology is typically used to achieve a highly flat silicon wafer surface. During the polishing process, as processing continues, the condition of the polishing pads (PADs) deteriorates due to physical wear and chemical reactions. This is primarily manifested in a continuous decrease in processing speed, thus affecting output, and a deterioration in flatness, which in turn affects product quality. Therefore, existing processes require the use of a pad dressing tool to correct the PAD surface after a period of PAD processing, ensuring the PADs are in good condition and guaranteeing the polishing quality of the silicon wafer.

[0003] Existing dressing tools typically include multiple annular dressing structures arranged around the axis of the polishing pad. When the annular dressing tool corrects the annular polishing pad, it involves both the dressing tool's revolution around the polishing pad's axis and its own rotation. However, due to the dimensional differences between the inner and outer rings of the annular polishing pad, the amount of material removed by the dressing tool varies between the inner and outer rings during correction. This results in uneven polishing pad thickness after correction. Over time, the thickness difference between the inner, middle, and outer rings of the polishing pad will increase significantly, severely impacting processing speed and wafer flatness, and significantly shortening the polishing pad's lifespan.

[0004] Therefore, improvements are needed to at least partially address the aforementioned problems. Utility Model Content

[0005] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] To at least partially solve the above problems, this application provides a dressing tool for correcting annular polishing pads. The dressing tool includes a grinding section, which is configured such that, along the radial direction of the polishing pad, the grinding section has a first end corresponding to the inner ring portion of the polishing pad and a second end corresponding to the outer ring portion of the polishing pad. The first end has a larger circumferential dimension along the polishing pad than the second end has a larger circumferential dimension along the polishing pad. During the process of the dressing tool correcting the polishing pad, at least one of the dressing part and the polishing pad is configured to pivot about the axis of the polishing pad, and there is a speed difference between the dressing tool and the polishing pad.

[0007] Optionally, during the process of the dressing tool correcting the polishing pad, one of the dressing part and the polishing pad pivots about the axis of the polishing pad, while the other remains stationary; or Both the grinding section and the polishing pad pivot about the axis of the polishing pad. When the rotation directions of the grinding section and the polishing pad are the same, there is a speed difference between the two.

[0008] Optionally, the grinding section has a first contour, a second contour, a third contour, and a fourth contour connected end to end in sequence. The first contour corresponds to the inner ring position of the polishing pad, and the third contour corresponds to the outer ring position of the polishing pad. The second contour and the fourth contour are both smooth lines.

[0009] Optionally, the first contour, the second contour, the third contour and the fourth contour form a trapezoidal or fan-shaped grinding section; When the grinding section is trapezoidal, R1 / R2=L2 / L1, where R1 is the radius of the inner ring of the polishing pad, R2 is the radius of the outer ring of the polishing pad, L1 is the length dimension of the first contour, and L2 is the length dimension of the third contour.

[0010] Optionally, the grinding section is configured to satisfy the following conditions: 30cm≥L1≥10cm and / or 15cm≥L2≥5cm.

[0011] Optionally, the plurality of said grinding portions are distributed at circumferential intervals along the polishing pad; and / or Along the radial direction of the polishing pad, the size of the grinding portion is greater than or equal to the size between the inner and outer rings of the polishing pad.

[0012] Optionally, the dressing tool includes a dressing body, and at least one side of the dressing body is provided with a grinding section.

[0013] Optionally, the dressing tool further includes a support assembly to which the dressing body is connected.

[0014] Optionally, the support assembly includes an inner pin ring and an outer pin ring arranged coaxially; The dressing body is disposed between the inner pin ring and the outer pin ring, and the dressing body is detachably connected to the inner pin ring and / or the outer pin ring.

[0015] This application also provides a polishing apparatus, which includes the dressing device described above.

[0016] According to the dressing device provided in this application, by specifically setting the dimensions of the dressing section of the dressing device, the circumferential dimension of the dressing section along the polishing pad is negatively correlated with the radius of the corresponding position on the polishing pad. Specifically, along the radial direction of the polishing pad, the dressing section has a first end corresponding to the inner ring portion of the polishing pad and a second end corresponding to the outer ring portion of the polishing pad, and the circumferential dimension of the first end along the polishing pad is greater than the circumferential dimension of the second end along the polishing pad. Thus, during the process of the dressing device correcting the polishing pad, the dressing capacity of the first end of the dressing section on the polishing pad is greater than that of the second end, thereby balancing the difference in dressing amount caused by the difference in the dimensions of the inner and outer rings of the annular polishing pad, making the actual removal amount (rate) between the inner and outer rings of the polishing pad tend to be consistent, and ultimately ensuring that the overall thickness of the polishing pad is uniform after dressing. This solves the problem in related technologies where the thickness difference between the inner, middle, and outer parts of the polishing pad will become increasingly larger, which has a significant impact on the processing rate and the flatness of the silicon wafer, and seriously shortens the service life of the polishing pad. Attached Figure Description

[0017] The following drawings, illustrating embodiments of this application, are incorporated herein by reference and are used to understand this application. The drawings illustrate embodiments of this application and their descriptions, serving to explain the principles of this application. In the drawings, Figure 1 A schematic diagram of an existing ring-shaped dressing device; Figure 2 This is a schematic diagram illustrating the concave center of the polishing pad after correction in related technologies; Figure 3 This is a schematic diagram illustrating the case where the thickness of the inner ring of the polishing pad is greater than the thickness of the outer ring in the related technology. Figure 4 This is a schematic diagram of the structure of a repair device according to an exemplary embodiment of this application; Figure 5 This is a schematic diagram of the structure of the grinding section according to an exemplary embodiment of this application; Figure 6 This is a schematic diagram of the connection structure between the support component and the grinding part in an exemplary embodiment of this application; only a partial structure of the fan-shaped area of ​​the inner and outer annular pin rings is shown in the figure.

[0018] Explanation of reference numerals in the attached figures: 10 / 110, Polishing pad; 20 / 120, Grinding section; 121, First end; 122, Second end; 123, Diamond coating; 130. Main body of the repair disc; 131. Clip tooth one; 140. Support component; 141. Domestic sales ring; 142. Export sales ring. Detailed Implementation

[0019] In the following description, numerous specific details are set forth to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that embodiments of this application may be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid confusion with embodiments of this application.

[0020] To fully understand the embodiments of this application, a detailed structure will be presented in the following description. Obviously, the implementation of the embodiments of this application is not limited to the specific details familiar to those skilled in the art.

[0021] It should be understood that the terminology used herein is intended only to describe particular embodiments and is not intended to limit the scope of this application. The singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. When the terms “comprising” and / or “including” are used in this specification, they indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0022] The ordinal numbers such as "first" and "second" used in this application are merely identifiers and have no other meaning, such as a specific order. Furthermore, for example, the term "first component" does not imply the existence of a "second component," and the term "second component" does not imply the existence of a "first component." It should be noted that the terms "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and similar expressions used in this application are for illustrative purposes only and are not intended to be limiting.

[0023] The specific embodiments of this application will be described in more detail below with reference to the accompanying drawings, which illustrate representative embodiments of this application and are not intended to limit this application.

[0024] like Figure 1As shown, the dressing tool in the related technology typically includes multiple annular dressing sections 20 arranged around the axis of the polishing pad 10. When the dressing tool corrects the annular polishing pad 10, it includes the revolution of the dressing tool around the axis of the polishing pad 10 and the rotation of the annular dressing tool itself. However, due to the dimensional difference between the inner and outer rings of the annular polishing pad 10, when the dressing tool corrects the polishing pad 10, there is a difference in the amount of removal (rate) of the inner and outer rings of the polishing pad 10. This results in uneven thickness of the polishing pad 10 after correction. As time accumulates, the thickness difference between the inner, middle, and outer rings of the polishing pad 10 will become larger and larger, which will greatly affect the processing speed and the flatness of the silicon wafer, and seriously shorten the service life of the polishing pad 10.

[0025] Specifically, such as Figure 1 As shown, V is the linear velocity of the relative revolution motion between the polishing pad 10 and the dressing tool. 内 V 中 V 外 These represent the linear velocities of the inner ring, the middle (the midpoint between the inner and outer rings), and the outer ring of the polishing pad 10, respectively. When V... 内 =V 外 At this time (when the annular polishing pad 10 is stationary), the amount of material removed by the annular dressing tool from the inner ring of the annular polishing pad 10 is greater than the amount removed from the outer ring of the polishing pad 10. Over time, the polishing pad 10 will exhibit a state where the center is concave and the inner and outer rings are convex (e.g., ...). Figure 2 As shown); when V 内 <V 中 <V 外 At this time, the annular polishing pad 10 rotates. Because the linear velocity of the outer ring of the polishing pad 10 is greater than that of its inner ring, over time, the amount removed by the annular dressing tool from the inner ring of the annular polishing pad 10 is less than the amount removed from the outer ring. Ultimately, the polishing pad 10 will exhibit a situation where the inner ring is thicker and the outer ring is thinner (e.g., ...). Figure 3 (As shown).

[0026] Therefore, in order to at least partially solve the above problems, this application proposes a dressing tool for correcting annular polishing pads. The dressing tool includes a grinding section, which is configured such that, along the radial direction of the polishing pad, the grinding section has a first end corresponding to the inner ring portion of the polishing pad and a second end corresponding to the outer ring portion of the polishing pad. The first end has a circumferential dimension greater than that of the second end along the circumferential direction of the polishing pad. During the process of the dressing tool correcting the polishing pad, at least one of the dressing part and the polishing pad is configured to pivot about the axis of the polishing pad, and there is a speed difference between the dressing tool and the polishing pad.

[0027] According to the dressing device of this application, by specifically setting the dimensions of the dressing section of the dressing device, the circumferential dimension of the dressing section along the polishing pad is negatively correlated with the radius of the corresponding position on the polishing pad. Specifically, along the radial direction of the polishing pad, the dressing section has a first end corresponding to the inner ring portion of the polishing pad and a second end corresponding to the outer ring portion of the polishing pad, and the circumferential dimension of the first end along the polishing pad is greater than the circumferential dimension of the second end along the polishing pad. Thus, during the process of the dressing device correcting the polishing pad, the dressing capacity of the first end of the dressing section is greater than that of the second end, thereby balancing the difference in dressing amount caused by the difference in the dimensions of the inner and outer rings of the annular polishing pad. This makes the removal amount between the inner and outer rings of the polishing pad tend to be consistent during the actual dressing process, ultimately ensuring that the overall thickness of the polishing pad is uniform after dressing. This solves the problem in related technologies where the thickness difference between the inner, middle, and outer parts of the polishing pad will become increasingly larger, which greatly affects the processing rate and the flatness of the silicon wafer, and seriously shortens the service life of the polishing pad.

[0028] Example 1 like Figure 4 and Figure 5 As shown, this application embodiment provides a dressing tool for correcting annular polishing pads 110. The dressing tool includes a grinding section 120, which is configured such that, along the radial direction of the polishing pad 110, the grinding section 120 has a first end 121 corresponding to the inner ring portion of the polishing pad 110 and a second end 122 corresponding to the outer ring portion of the polishing pad 110. The circumferential dimension of the first end 121 along the polishing pad 110 is greater than the circumferential dimension of the second end 122 along the polishing pad 110. During the correction of the polishing pad 110 by the dressing tool, at least one of the grinding section 120 and the polishing pad 110 is configured to pivot about the axis of the polishing pad 110, and there is a speed difference between the dressing tool and the polishing pad 110.

[0029] When the annular polishing pad 110 is corrected by the dressing device of this embodiment, the dimension of the first end 121 of the dressing part 120 along the circumference of the polishing pad 110 is greater than the dimension of the second end 122 along the circumference of the polishing pad 110. This makes the removal (dressing) capacity of the dressing part 120 on the inner ring of the polishing pad 110 greater than the removal capacity of the dressing part 120 on the outer ring of the polishing pad 110. This balances the difference in removal amount caused by the size difference between the inner and outer rings of the polishing pad 110, and ultimately ensures that the corrected polishing pad 110 has a uniform thickness and a flat surface.

[0030] It should be noted that during the process of the dressing tool correcting the polishing pad 110, the specific movement of the dressing tool and the polishing pad 110 can be set according to actual needs and is not limited thereto, as long as there is a relative revolution around the axis of the polishing pad 110 between the dressing part 120 and the polishing pad 110 to achieve the dressing action on the annular polishing pad 110. For example, one of the dressing part 120 and the polishing pad 110 may pivot around the axis of the polishing pad 110, while the other remains stationary. Alternatively, both the dressing part 120 and the polishing pad 110 may pivot around the axis of the polishing pad 110. In this case, the rotation directions of the dressing part 120 and the polishing pad 110 can be the same or opposite. When the rotation directions of the dressing part 120 and the polishing pad 110 are the same, there needs to be a speed difference between them.

[0031] It is worth mentioning that due to manufacturing or assembly errors of the equipment, the polishing pad 110 in a stationary state is not an ideal plane. During the grinding process when either the polishing pad 110 or the dressing tool is stationary, the accumulation of errors can easily lead to surface defects on the polishing pad 110. In particular, when the polishing pad 110 is stationary, defects in the polishing pad 110 after grinding can easily occur due to errors in the equipment itself. Therefore, the preferred grinding state is that both the dressing tool and the polishing pad 110 are rotating around the axis of the polishing pad 110, and a speed difference is set between the two. This can distribute the errors in the equipment itself, which is beneficial to improving the uniformity of the thickness of the polishing pad 110 after correction.

[0032] In this embodiment, along the radial direction of the polishing pad 110, the size of the grinding portion 120 is greater than or equal to the size between the inner and outer rings of the polishing pad 110. As a preferred example, the size of the grinding portion 120 is slightly larger than the size between the inner and outer rings of the polishing pad 110; that is, when the grinding portion 120 is projected onto the plane where the polishing pad 110 is located, the first end 121 of the grinding portion 120 is located inside the inner ring of the polishing pad 110, and the second end 122 of the grinding portion 120 is located outside the edge of the outer ring of the polishing pad 110. In this way, when the grinding tool revolves around the axis of the polishing pad 110, the correction process between the inner and outer rings of the polishing pad 110 can be completed in one go.

[0033] like Figure 4 As shown, multiple grinding sections 120 are distributed at intervals along the circumference of the polishing pad 110. Thus, by simultaneously applying the grinding sections 120 to the polishing pad 110, the correction efficiency is effectively improved. The specific number of grinding sections 120 can be set as needed and is not specifically limited. For example, the number of grinding sections 120 can be set to two, three, four, five, etc., evenly distributed along the circumference of the polishing pad 110.

[0034] like Figure 4 and Figure 5 As shown, the specific shape of the grinding section 120 can be set according to actual needs. Preferably, the grinding section 120 extends from the first end 121 to the second end 122, and its dimensions change linearly along the circumference of the polishing pad 110. This avoids abrupt changes in thickness when correcting the polishing pad 110. For example, the grinding section 120 has a first contour, a second contour, a third contour, and a fourth contour connected end-to-end. The first contour corresponds to the inner ring position of the polishing pad 110 (corresponding to the first end 121 of the grinding section 120), and the third contour corresponds to the outer ring position of the polishing pad 110. The second contour and the fourth contour are located on the side of the grinding section 120. As a preferred example, the second contour and the fourth contour are both smooth lines, such as smooth curves or straight lines. Setting the second contour and the fourth contour as smooth lines can ensure that when the polishing pad 110 is corrected by the dressing tool, the step-like abrupt change in the thickness of the polishing pad 110 after correction is avoided due to the step-like abrupt change in the circumferential dimension of the dressing tool along the polishing pad 110.

[0035] For example, the first contour, the second contour, the third contour and the fourth contour form a trapezoidal or fan-shaped grinding part 120; that is, the grinding part 120 can be set as a fan-shaped or trapezoidal structure. It is understood that the grinding part 120 is not limited to the above shape, and can be adjusted according to actual needs in actual use.

[0036] When the grinding section 120 is trapezoidal, R1 / R2 = L2 / L1, where R1 is the radius of the inner ring of the polishing pad 110, R2 is the radius of the outer ring of the polishing pad 110, L1 is the length of the first contour, and L2 is the length of the third contour. By setting the circumferential dimension of the grinding section 120 along the polishing pad 110 to be inversely proportional to the radius of the polishing pad 110 at the corresponding position, the difference in removal amount caused by the difference in linear velocity between the inner and outer rings of the polishing pad 110 is compensated, ensuring the uniformity of the thickness of the corrected polishing pad 110.

[0037] The specific dimensions of the grinding section 120 can be set according to the size specifications of the polishing pad 110, and are not specifically limited here. It is understood that the size of the grinding tool should not be set too large; otherwise, the excessive weight of the grinding tool would be inconvenient for operators to disassemble and assemble. Therefore, by way of example, the grinding section 120 is configured to satisfy the following conditions: 30cm ≥ L1 ≥ 10cm and / or 15cm ≥ L2 ≥ 5cm.

[0038] like Figure 5As shown, in this embodiment, the grinding section 120 can be entirely composed of diamond. As another example, the dressing device includes a dressing body 130, with the grinding section 120 disposed on at least one side of the dressing body 130. The grinding section 120 is composed of a diamond coating 123 disposed on the dressing body 130. This allows for the use of the dressing body 130 as a base structure, and the diamond coating 123 disposed on the dressing body 130 as the grinding section 120, thereby reducing the amount of diamond used and lowering equipment costs. As one example, the diamond coating 123 can be composed of diamonds uniformly disposed within the area enclosed by the first, second, third, and fourth contours; as another example, the diamond coating 123 can also be composed of multiple independent coating strips, as long as the dimension (area of ​​diamonds that can be used to correct the polishing pad 110) of the grinding section 120 from the first end 121 to the second end 122 along the axial direction of the polishing pad 110 is negatively correlated with the radius of the corresponding position on the polishing pad 110.

[0039] It is worth mentioning that the grinding part 120 can be disposed on one side of the dressing body 130. For example, the grinding part 120 can be disposed on the bottom surface of the dressing body 130, so that the correction process of one polishing pad 110 can be performed at one time. As a preferred example, the top surface and bottom surface of the dressing body 130 are respectively provided with corresponding grinding parts 120, so that the top polishing pad 110 and the bottom polishing pad 110 can be corrected separately or simultaneously. That is, the grinding part 120 located on the top surface of the dressing body 130 can be used to correct the top polishing pad 110 located above, and the grinding part 120 located on the bottom surface of the dressing body 130 can be used to correct the bottom polishing pad 110 located below.

[0040] like Figure 6 As shown, in this embodiment, the dressing tool further includes a support assembly 140, and the dressing body 130 is connected to the support assembly 140. The support assembly 140 can be a rod-shaped structure, a plate-shaped structure, or a ring-shaped structure, etc. For example, the support assembly 140 includes an inner pin ring 141 and an outer pin ring 142 coaxially arranged; the dressing body 130 is disposed between the inner pin ring 141 and the outer pin ring 142, and the dressing body 130 is detachably connected to the inner pin ring 141 and / or the outer pin ring 142. Since existing ring-shaped dressing tools include an inner pin ring 141 and an outer pin ring 142, modifications can be made to the existing dressing tool by installing the grinding section 120 of the dressing tool in this application between the inner pin ring 141 and the outer pin ring 142. This effectively reduces the degree of modification to existing equipment, lowers the difficulty of modification, and saves costs.

[0041] The specific connection method between the repair body 130 and the inner pin ring 141 and / or the outer pin ring 142 can be selected as needed and is not limited thereto. For example... Figure 6 As shown, for example, both ends of the dressing disc body 130 can be provided with multiple locking teeth 131, with a locking groove 1 formed between two adjacent locking teeth. The outer ring of the inner pin ring 141 and / or the inner ring of the outer pin ring 142 are provided with multiple locking teeth 2, with a locking groove 2 formed between two adjacent locking teeth 2 that matches the locking teeth 131. In this way, the dressing disc body 130 can be installed between the inner pin ring 141 and the outer pin ring 142 through the locking tooth and locking groove structure. Furthermore, the dressing disc body 130 can also be locked by locking components (such as screws or pins) to ensure the stability of the dressing disc body 130.

[0042] Example 2 This embodiment provides a polishing device (not shown in the figure), which includes a dressing device as described above. The polishing device includes an annular polishing pad 110 for double-sided polishing of silicon wafers. The dressing device is used to correct the polishing pad 110 when necessary, ensuring the surface quality of the polishing pad 110 and thus ensuring the polishing quality of the silicon wafer. When correcting the polishing pad 110 with the dressing device, the polishing pad 110 should be kept as horizontal as possible, which is more conducive to ensuring the uniformity of the polishing pad 110 after correction.

[0043] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for descriptive purposes only and is not intended to limit the scope of this application. Terms such as “setup” appearing herein can refer to either a component being directly attached to another component or a component being attached to another component via an intermediary. A feature described in one embodiment herein may be applied, alone or in combination with other features, to another embodiment, unless that feature is not applicable in that other embodiment or is otherwise stated.

[0044] This application has been described through the above embodiments; however, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this application to the described embodiments. Those skilled in the art will understand that many more variations and modifications can be made based on the teachings of this application, and all such variations and modifications fall within the scope of protection claimed in this application.

Claims

1. A dressing tool for correcting annular polishing pads, characterized in that, The dressing device includes a dressing section, which is configured such that, along the radial direction of the polishing pad, the dressing section has a first end corresponding to the inner ring portion of the polishing pad and a second end corresponding to the outer ring portion of the polishing pad, wherein the circumferential dimension of the first end along the polishing pad is greater than the circumferential dimension of the second end along the polishing pad. During the process of the dressing tool correcting the polishing pad, at least one of the dressing part and the polishing pad is configured to pivot about the axis of the polishing pad, and there is a speed difference between the dressing tool and the polishing pad.

2. The dressing device according to claim 1, characterized in that, During the process of the dressing device correcting the polishing pad, one of the dressing part and the polishing pad pivots about the axis of the polishing pad, while the other remains stationary; or Both the grinding section and the polishing pad pivot about the axis of the polishing pad. When the rotation directions of the grinding section and the polishing pad are the same, there is a speed difference between the two.

3. The dressing device according to claim 1, characterized in that, The grinding section has a first contour, a second contour, a third contour, and a fourth contour connected end to end in sequence. The first contour corresponds to the inner ring position of the polishing pad, and the third contour corresponds to the outer ring position of the polishing pad. The second contour and the fourth contour are both smooth lines.

4. The dressing device according to claim 3, characterized in that, The first contour, the second contour, the third contour, and the fourth contour form a trapezoidal or fan-shaped grinding section; When the grinding section is trapezoidal, R1 / R2=L2 / L1, where R1 is the radius of the inner ring of the polishing pad, R2 is the radius of the outer ring of the polishing pad, L1 is the length dimension of the first contour, and L2 is the length dimension of the third contour.

5. The dressing device according to claim 4, characterized in that, The grinding section is configured to meet the following conditions: 30cm ≥ L1 ≥ 10cm and / or 15cm ≥ L2 ≥ 5cm.

6. The dressing device according to claim 1, characterized in that, The plurality of said grinding portions are distributed at circumferential intervals along the polishing pad; and / or Along the radial direction of the polishing pad, the size of the grinding portion is greater than or equal to the size between the inner and outer rings of the polishing pad.

7. The dressing device according to any one of claims 1 to 6, characterized in that, The dressing tool includes a dressing body, and at least one side of the dressing body is provided with a grinding section.

8. The dressing device according to claim 7, characterized in that, The dressing tool also includes a support assembly, to which the dressing body is connected.

9. The dressing device according to claim 8, characterized in that, The support assembly includes an inner pin ring and an outer pin ring arranged coaxially. The dressing body is disposed between the inner pin ring and the outer pin ring, and the dressing body is detachably connected to the inner pin ring and / or the outer pin ring.

10. A polishing device, characterized in that, The polishing equipment includes a dressing device as described in any one of claims 1 to 9.

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