Wire cutting machine frame and wire cutting machine

Abstract

This application provides a wire cutting machine frame and a wire cutting machine, belonging to the field of crystal ingot processing technology, and solves the problem of low silicon wafer cutting quality in existing wire cutting machines. The wire cutting machine frame of this application includes a frame body, a temperature detection component, and a temperature control component. The frame body has at least two mounting holes, and a heat exchange section is provided around the outer periphery of the mounting holes. The temperature detection component is disposed on and acts on the heat exchange section to detect its temperature. The temperature control component is connected to and acts on the heat exchange section, and is communicatively connected to the temperature detection component. This application, by setting a temperature detection component to detect the temperature of the heat exchange section and a temperature control component to adjust the temperature of the heat exchange section, can instantly adjust and maintain a constant temperature in the area near the mounting holes by detecting the temperature of the heat exchange section and feeding back this temperature information to the temperature control component. This prevents thermal deformation, ensures the cutting spindle position remains unchanged, and improves the stability of silicon wafer cutting.

Description

Technical Field

[0001] This application belongs to the field of crystal rod processing technology, and specifically relates to a wire cutting machine frame and a wire cutting machine. Background Technology

[0002] Currently, semiconductor slicing machines commonly use slurry-assisted cutting. This involves spraying a slurry containing diamond abrasive onto a cutting wire mesh, which then adheres to the mesh. The silicon ingot is fed downwards and pressed against the wire mesh, and the mesh's back-and-forth movement cuts the silicon ingot into wafers. The heat generated during silicon ingot cutting is transferred to the cutting chamber frame via the slurry, air, or spindle, causing thermal deformation of the frame. This, in turn, alters the arrangement of the cutting wire mesh, ultimately affecting the quality of the silicon wafer cutting.

[0003] Existing technologies mostly focus on optimizing the control of slurry temperature. For example, a first temperature sensor is used to detect the temperature of the slurry flowing out of the slicing machine body, and then adjustments are made based on the slurry temperature. However, this method has a lag in real-time temperature control during the cutting process, which is not conducive to reducing the impact of cutting heat. In addition, during the cutting process, the slurry also exchanges heat with other components such as the frame. The dissipation of this heat is also an important factor affecting the instability of cutting quality.

[0004] Based on the above, the technical problem to be solved by this application is: how to improve the quality of silicon wafer cutting. Utility Model Content

[0005] The purpose of this application is to address the aforementioned problems in the prior art by proposing a wire cutting machine frame and a wire cutting machine, which solves the problem of low silicon wafer cutting quality in the prior art. By controlling the frame temperature, thermal deformation of the frame is prevented, thereby improving the silicon wafer cutting quality.

[0006] The objective of this application can be achieved through the following technical solution: a wire cutting machine frame, comprising: a frame body, wherein the frame body has at least two mounting holes for mounting cutting spindles, and a heat exchange section is provided around the mounting holes; a temperature detection component, wherein the temperature detection component is disposed on the heat exchange section and acts on the heat exchange section to detect the temperature of the heat exchange section; and a temperature regulating component, wherein the temperature regulating component is connected to the heat exchange section to act on the heat exchange section, and the temperature regulating component is communicatively connected to the temperature detection component. It is understood that two or more mounting holes are respectively used to mount cutting spindles, and the cutting spindles generally have multiple wire grooves arranged along their length. During operation, wire mesh can be arranged around the multiple cutting spindles. The wire mesh is used to cut silicon rods, and the cutting generates a large amount of heat, which is gradually transferred from the cutting spindles to the mounting holes on the frame body and the heat exchange section around the mounting holes. The temperature detection component is used to detect the temperature of the heat exchange section, and the temperature adjustment component is used to adjust the temperature of the heat exchange section. By detecting the temperature of the heat exchange section and feeding back the temperature information to the temperature adjustment component, the temperature can be adjusted in real time to maintain a constant temperature in the mounting hole accessory area, avoid heat deformation, and thus ensure that the position of the cutting spindle remains unchanged, thereby improving the stability of silicon wafer cutting.

[0007] In the aforementioned wire cutting machine frame, the heat exchange section includes multiple heat exchange blocks, each with a hollowed-out heat exchange cavity. The temperature control assembly includes multiple temperature control pipes for conveying temperature control fluid. These pipes are connected to multiple heat exchange cavities to individually regulate the temperature of each heat exchange block. It is understood that by dividing the heat exchange section into multiple heat exchange blocks, each corresponding to a different temperature control pipe, individual temperature control is achieved, improving efficiency and flexibility. It should be noted that to maintain a stable temperature in the heat exchange cavities, the temperature of the temperature control fluid can be relatively increased or decreased, facilitating control of the overall temperature uniformity of the heat exchange section.

[0008] In the aforementioned wire cutting machine frame, the heat exchange block has an inlet and an outlet. The temperature control pipeline is connected to both the inlet and the outlet. Multiple guide columns are provided within the heat exchange chamber, distributed between the inlet and the outlet to form a flow channel for removing heat from the heat exchange chamber. It is understood that the temperature control pipeline typically carries coolant, which enters the heat exchange chamber through the inlet. This coolant is guided by the multiple guide columns within the heat exchange chamber. For example, the multiple guide columns can be spaced apart to form a flow channel, preferably curved, such as an S-shape or a serpentine shape. After entering the flow channel, the fluid can flow rapidly within the heat exchange chamber, thereby removing heat from the heat exchange chamber, and finally flows out through the outlet to the next section of the temperature control pipeline.

[0009] In the aforementioned wire cutting machine frame, the temperature detection assembly includes multiple first temperature sensors, each acting on a different heat exchange block to detect its temperature. Proportional valves are installed on each of the multiple temperature control pipelines, and these proportional valves are used to control and regulate flow rates. For example, the proportional valves are communicatively connected to the first temperature sensors to provide feedback on the flow rate regulation, thereby adjusting the temperature of the heat exchange blocks. Furthermore, the first temperature sensors can be positioned on the outer surface of the heat exchange blocks for temperature monitoring, or they can be positioned inside the heat exchange chamber; the latter placement allows for more precise monitoring.

[0010] The wire cutting machine frame described above also includes a shape detection component. This component is located outside the heat exchange section and acts on its outer surface to detect the deformation of the heat exchange section. The shape detection component is communicatively connected to the temperature control component. It is understood that by using the shape detection component to detect the deformation of the heat exchange section, the deformation information is sent back to the temperature control component, which then adjusts the temperature of the heat exchange section to control the deformed portion to restore its initial shape.

[0011] In the aforementioned wire cutting machine frame, the topography detection component includes: multiple distance sensors facing the outer surface of the heat exchange section to acquire the deformation of the outer surface of the heat exchange section; and / or a CCD camera facing the outer surface of the heat exchange section to acquire the deformation of the outer surface of the heat exchange section. It is understood that by setting distance sensors, the distance change of a portion of the outer surface of the heat exchange section can be detected, thereby calculating the deformation; or, by setting a CCD camera, the deformation of the outer surface of the heat exchange section can be directly detected from another perspective.

[0012] In the aforementioned wire cutting machine frame, a heater is installed on the temperature control pipeline. The heater acts on the temperature control pipeline to adjust the temperature of the temperature control liquid, and the heater is communicatively connected to the temperature detection component. It is understood that by installing a heater on the temperature control pipeline, the heater can heat the temperature control liquid within the pipeline, thereby increasing the temperature control methods and improving temperature controllability.

[0013] In the aforementioned wire cutting machine frame, an air extraction port is provided on the temperature control pipeline, which is used to connect an air extraction device. It is understood that by providing the air extraction port, air is extracted before the liquid enters the temperature control pipeline, thereby providing a pressure differential to facilitate rapid flow of the temperature control liquid, and it can also be used to test the sealing performance of the temperature control pipeline.

[0014] Another object of this application is to provide a wire cutting machine, including the wire cutting machine frame as described above, and a cutting spindle that is disposed through the mounting hole. It is understood that the number of cutting spindles and the number of mounting holes are generally the same, both being two or more, thereby facilitating the winding of wire to form a wire mesh suitable for cutting silicon rods.

[0015] The aforementioned wire cutting machine also includes a slurry pipe, which is mounted on the machine frame and located above the mounting hole. A second temperature sensor is installed inside the slurry pipe. It is understood that by installing the slurry pipe above the mounting hole, slurry is sprayed from the pipe onto the cutting spindle. The slurry can adhere to the wire mesh near the cutting spindle, thereby improving the cutting performance of the wire mesh.

[0016] Compared with the prior art, this application has the following beneficial effects:

[0017] This application sets up a temperature detection component to detect the temperature of the heat exchange section and a temperature adjustment component to adjust the temperature of the heat exchange section. By detecting the temperature of the heat exchange section and feeding back the temperature information to the temperature adjustment component, the temperature can be adjusted in real time to maintain a constant temperature in the mounting hole accessory area, avoid thermal deformation, and thus ensure that the position of the cutting spindle remains unchanged, thereby improving the stability of silicon wafer cutting. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the frame of the wire cutting machine of this application;

[0019] Figure 2 This is a cross-sectional structural diagram of the wire cutting machine frame of this application;

[0020] Figure 3 yes Figure 2 Partial structural diagram;

[0021] Figure 4 This is a simplified schematic diagram of the temperature control pipeline of this application;

[0022] In the diagram, 100 is the frame body; 110 is the mounting hole; 120 is the heat exchange section; 121 is the heat exchange block; 1211 is the liquid inlet; 1212 is the liquid outlet; 1213 is the flow guide column; Q is the heat exchange chamber; S is the flow channel; 200 is the temperature detection component; 210 is the first temperature sensor; 300 is the temperature control component; 310 is the temperature control pipeline; 311 is the proportional valve; 312 is the air extraction port; 320 is the heater; 400 is the morphology detection component; 410 is the distance sensor; 420 is the CCD camera; and 500 is the mortar pipe. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0029] Please refer to the attached diagram in the instruction manual. Figure 1 and Figure 2 The wire cutting machine frame of this application includes a frame body 100, a temperature detection component 200, and a temperature control component 300. The frame body 100 is provided with at least two mounting holes 110 for mounting the cutting spindle. A heat exchange part 120 is provided on the outer periphery of the mounting hole 110. The temperature detection component 200 is disposed on the heat exchange part 120 and acts on the heat exchange part 120 to detect the temperature of the heat exchange part 120. The temperature control component 300 is connected to the heat exchange part 120 to act on the heat exchange part 120, and the temperature control component 300 is communicatively connected to the temperature detection component 200. Understandably, two or more mounting holes 110 are used to mount the cutting spindles. The cutting spindles typically have multiple grooves along their length. During operation, wire mesh can be wound around the multiple cutting spindles. The wire mesh is used to cut the silicon rod. Cutting generates a large amount of heat, which is gradually transferred from the cutting spindles to the mounting holes 110 on the frame body 100 and the heat exchange section 120 around the mounting holes 110. The temperature detection component 200 is used to detect the temperature of the heat exchange section 120, and the temperature adjustment component 300 is used to adjust the temperature of the heat exchange section 120. By detecting the temperature of the heat exchange section 120 and feeding back this temperature information to the temperature adjustment component 300, the temperature can be adjusted in real time to maintain a constant temperature in the area surrounding the mounting holes 110, preventing thermal deformation and ensuring the cutting spindle position remains unchanged, thus improving the stability of silicon wafer cutting.

[0030] See Figure 1 In some embodiments, the wire cutting machine frame of this application further includes a shape detection component 400. The shape detection component 400 is disposed outside the heat exchange section 120 and acts on the outer surface of the heat exchange section 120 to detect the deformation of the heat exchange section 120. The shape detection component 400 is communicatively connected to the temperature control component 300. It can be understood that by setting the shape detection component 400 to detect the deformation of the heat exchange section 120, the deformation information is sent back to the temperature control component 300, which then adjusts the temperature of the heat exchange section 120 to control the deformed part to restore its initial shape.

[0031] Continue to refer to Figure 1In some embodiments, the shape detection component 400 includes a distance sensor 410 and / or a CCD camera 420. Multiple distance sensors 410 are positioned facing the outer surface of the heat exchange section 120 to acquire the deformation of the outer surface of the heat exchange section 120. The CCD camera 420 is also positioned facing the outer surface of the heat exchange section 120 to acquire the deformation of the outer surface of the heat exchange section 120. It is understood that by setting the distance sensor 410, the distance change of a portion of the outer surface of the heat exchange section 120 can be detected, thereby calculating the deformation; alternatively, the CCD camera 420 can be used to directly detect the deformation of the outer surface of the heat exchange section 120 from another perspective.

[0032] See Figure 1 and Figure 2 In some embodiments, the heat exchange section 120 includes a plurality of heat exchange blocks 121, and heat exchange cavities Q are formed inside the heat exchange blocks 121. See [link to relevant documentation]. Figure 4 The temperature control assembly 300 includes multiple temperature control pipes 310 for conveying temperature control fluid. These pipes are connected to multiple heat exchange chambers Q to individually regulate the temperature of the heat exchange blocks 121. It is understood that by dividing the heat exchange section 120 into multiple heat exchange blocks 121, with each block corresponding to a different temperature control pipe 310, temperature control is achieved separately, improving efficiency and flexibility. It should be noted that to maintain a stable temperature in the heat exchange chambers Q, the temperature of the temperature control fluid can be relatively increased or decreased, facilitating control of the overall temperature uniformity of the heat exchange section 120.

[0033] See Figure 3 In some embodiments, the heat exchange block 121 has a liquid inlet 1211 and a liquid outlet 1212. The temperature control pipe 310 is connected to the liquid inlet 1211 and the liquid outlet 1212 respectively. The heat exchange cavity Q is provided with a plurality of flow guide columns 1213. The plurality of flow guide columns 1213 are distributed between the liquid inlet 1211 and the liquid outlet 1212 to form a flow channel S, which is used to remove the heat of the heat exchange cavity Q. It is understood that the temperature control pipe 310 is generally filled with coolant. The coolant enters the heat exchange chamber Q through the inlet 1211, which facilitates the flow of the multiple guide columns 1213 in the heat exchange chamber Q. For example, the multiple guide columns 1213 can be distributed at intervals to form flow channels S. The shape of the flow channel S is preferably curved, such as S-shaped or serpentine. After the fluid enters the flow channel S, it can flow rapidly in the heat exchange chamber Q, thereby carrying away the heat of the heat exchange chamber Q. Finally, it flows out from the outlet 1212 to the next section of the temperature control pipe 310.

[0034] See Figure 4In some embodiments, the temperature detection assembly 200 includes multiple first temperature sensors 210, each acting on a different heat exchange block 121 to detect its temperature. Multiple temperature control pipes 310 are each equipped with a proportional valve 311, which controls and regulates the flow rate. For example, the proportional valve 311 is communicatively connected to the first temperature sensors 210 to provide feedback on the flow rate regulation, thereby adjusting the temperature of the heat exchange block 121 through flow rate changes. Furthermore, the first temperature sensors 210 can be positioned on the outer surface of the heat exchange block 121 for temperature monitoring, or they can be positioned inside the heat exchange cavity Q; the latter positioning allows for more precise monitoring.

[0035] See Figure 4 In some embodiments, a heater 320 is provided on the temperature control pipeline 310. The heater 320 acts on the temperature control pipeline 310 to adjust the temperature of the temperature control liquid, and the heater 320 is communicatively connected to the temperature detection component 200. It is understood that by providing a heater 320 on the temperature control pipeline 310, the heater 320 can heat the temperature control liquid in the temperature control pipeline 310, thereby increasing the temperature control methods and improving temperature controllability.

[0036] Continue to refer to Figure 4 In some embodiments, the temperature control pipeline 310 is provided with an air extraction port 312, which is used to connect an air extraction device. It can be understood that by setting the air extraction port 312, air is extracted before liquid enters the temperature control pipeline 310, thereby providing a pressure difference to facilitate the rapid flow of the temperature control liquid, and it can also be used to test the sealing performance of the temperature control pipeline 310.

[0037] The wire cutting machine of this application includes the frame of the wire cutting machine of this application, and also includes a cutting spindle (not shown in the figure), which is disposed through the mounting hole 110. It is understood that the number of cutting spindles and the number of mounting holes 110 are generally consistent, both being two or more, so as to facilitate the winding of wire to form a wire mesh that can be cut into silicon rods.

[0038] In some embodiments, the wire cutting machine of this application further includes a slurry pipe 500, which is disposed on the frame body 100 and located above the mounting hole 110. A second temperature sensor (not shown) is provided inside the slurry pipe 500. It is understood that by providing the slurry pipe 500 above the mounting hole 110, the slurry pipe 500 sprays slurry liquid onto the cutting spindle, and the slurry liquid can adhere to the wire mesh near the cutting spindle, thereby improving the cutting performance of the wire mesh.

[0039] Beneficial effects:

[0040] This application sets up a temperature detection component 200 to detect the temperature of the heat exchange section 120 and a temperature adjustment component 300 to adjust the temperature of the heat exchange section 120. By detecting the temperature of the heat exchange section 120 and feeding back the temperature information to the temperature adjustment component 300, the temperature can be adjusted in real time to maintain a constant temperature in the area near the mounting hole 110, avoid thermal deformation, and thus ensure that the position of the cutting spindle remains unchanged, thereby improving the stability of silicon wafer cutting.

[0041] The specific embodiments described herein are merely illustrative examples of the spirit of this application. Those skilled in the art to which this application pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this application or exceeding the scope defined by the appended claims.

Claims

1. A wire cutting machine frame, characterized in that, include: A frame body (100) is provided with at least two mounting holes (110), the mounting holes (110) are used to mount the cutting spindle, and a heat exchange part (120) is provided on the outer periphery of the mounting holes (110); A temperature detection component (200) is disposed on the heat exchange section (120) and acts on the heat exchange section (120) to detect the temperature of the heat exchange section (120); as well as A temperature control component (300) is connected to the heat exchange section (120) to act on the heat exchange section (120), and the temperature control component (300) is communicatively connected to the temperature detection component (200).

2. The wire cutting machine frame of claim 1, wherein, The heat exchange section (120) includes a plurality of heat exchange blocks (121), and the heat exchange blocks (121) are hollowed out to form heat exchange cavities (Q); The temperature control assembly (300) includes multiple temperature control pipes (310), which are used to transport temperature control liquid. The multiple temperature control pipes (310) are respectively connected to multiple heat exchange chambers (Q) to regulate the temperature of the heat exchange block (121).

3. The wire cutting machine frame of claim 2, wherein, The heat exchange block (121) has a liquid inlet (1211) and a liquid outlet (1212). The temperature regulating pipe (310) is connected to the liquid inlet (1211) and the liquid outlet (1212) respectively. The heat exchange cavity (Q) is provided with a plurality of flow guide columns (1213). The plurality of flow guide columns (1213) are distributed between the liquid inlet (1211) and the liquid outlet (1212) to form a flow channel (S) for carrying away the heat of the heat exchange cavity (Q).

4. The wire cutting machine frame of claim 2, wherein, The temperature detection component (200) includes a plurality of first temperature sensors (210), which act on different heat exchange blocks (121) to detect the temperature respectively. A proportional valve (311) is provided on each of the plurality of temperature regulating pipelines (310), and the proportional valve (311) is used to control and regulate the flow rate.

5. The wire cutting machine frame according to claim 1, characterized in that, It also includes a morphology detection component (400), which is disposed outside the heat exchange section (120) and acts on the outer surface of the heat exchange section (120) to detect the deformation of the heat exchange section (120). The morphology detection component (400) is communicatively connected to the temperature control component (300).

6. The wire cutting machine frame according to claim 5, characterized in that, The morphology detection component (400) includes: Distance sensors (410), wherein there are multiple distance sensors (410) facing the outer surface of the heat exchange section (120), for acquiring the deformation of the outer surface of the heat exchange section (120); and / or, A CCD camera (420) is positioned facing the outer surface of the heat exchange section (120) to obtain the deformation of the outer surface of the heat exchange section (120).

7. The wire cutting machine frame according to claim 2, characterized in that, A heater (320) is provided on the temperature regulating pipeline (310). The heater (320) acts on the temperature regulating pipeline (310) to adjust the temperature of the temperature regulating liquid, and the heater (320) is communicatively connected to the temperature detection component (200).

8. The wire cutting machine frame according to claim 2, characterized in that, The temperature regulating pipeline (310) is provided with an air extraction port (312), which is used to connect an air extraction device.

9. A wire cutting machine, characterized in that, The frame of the wire cutting machine as described in any one of claims 1-8 is further comprising a cutting spindle, the cutting spindle being disposed through the mounting hole (110).

10. The wire cutting machine according to claim 9, characterized in that, It also includes a mortar pipe (500), which is disposed on the frame body (100) and located above the mounting hole (110), and a second temperature sensor is provided inside the mortar pipe (500).

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