An automatic flexible film application device

Abstract

This utility model belongs to the field of optical film technology and discloses an automatic flexible film application device, including a conveyor line extending along the Y direction; a fixture transfer line extending along the Y direction; the conveyor line and the fixture transfer line being spaced apart along the X direction; and the fixture transfer line having a loading station, a film application station, a unloading station, and a PCB visual positioning station sequentially arranged along the Y direction, with the X and Y directions perpendicular to each other; a support frame positioned above the conveyor line and the fixture transfer line along the X direction; a first transport mechanism and a third transport mechanism respectively positioned on both sides of the support frame along the Y direction; and a second transport mechanism positioned on the side of the fixture transfer line away from the conveyor line. This utility model, through the cooperation of the conveyor line and fixture transfer line, allows the PCB visual positioning station to position the PCB, the first transport mechanism to load the PCB, and the third transport mechanism to unload the film-applied PCB, improving the layout rationality of flexible film application and saving equipment space.

Description

Technical Field

[0001] This utility model belongs to the field of optical film technology, specifically a flexible film automatic application device. Background Technology

[0002] Backlight films, as a key component of backlight modules, mainly include brightness enhancement films, diffusion films, reflective films, and light-shielding films. These films play a vital role in backlight modules. Currently, backlight film technology is widely used in various display devices, including liquid crystal displays and organic light-emitting diode displays.

[0003] However, with the continuous advancement of display technology, especially the rise of new display technologies, higher requirements have been placed on the precision, flatness, and bonding quality of backlight films. Traditional manual film application methods can no longer meet the stringent requirements of modern display devices for film bonding precision. Therefore, many automatic film application machines have emerged in the existing technology. However, the current production line layout of film application machines is unreasonable, resulting in long transportation paths and large machine space occupation. Utility Model Content

[0004] To address the issue of unreasonable production line layout in film applicators mentioned in the background section, this invention provides an automatic flexible film applicator.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic flexible film application device, comprising: The conveyor line extends along the Y direction. The fixture transfer line extends along the Y direction, and the conveyor line and fixture transfer line are spaced apart along the X direction. The fixture transfer line is arranged with loading station, film application station, unloading station and PCB vision positioning station in sequence along the Y direction. The X direction and Y direction are perpendicular to each other. The support frame is set above the conveyor line (1) and the fixture transfer line along the X direction; The first transport mechanism (5) and the third transport mechanism (9) are respectively arranged on both sides of the support frame along the Y direction; The second handling mechanism (8) is located on the side of the fixture transfer line away from the conveyor line.

[0006] As an optional technical solution, a first camera group is set up at the film application station; a second camera group is set up at the PCB vision positioning station.

[0007] As an optional technical solution, a scanner and an antistatic component are sequentially arranged along the Y direction on the conveyor line, with the antistatic component positioned between the scanner and the first conveying mechanism.

[0008] As an optional technical solution, a PCB cleaning component is also installed on the conveyor line, which is located between the antistatic component and the first handling mechanism.

[0009] As an optional technical solution, the lower end of the PCB cleaning component is equipped with multiple soft brushes.

[0010] As an optional technical solution, the fixture transfer line includes a fixture transfer mechanism, which includes a first driving member and a fixture support platform that is driven by the first driving member to move along the Y direction; the fixture support platform is provided with multiple positioning columns.

[0011] As an optional technical solution, both the first and third conveying mechanisms include a fixture gripper assembly.

[0012] As an optional technical solution, a bottom film removal mechanism is provided below the transfer path of the second handling mechanism.

[0013] As an optional technical solution, the flexible film automatic application equipment also includes a flexible film feeding unit and a transfer positioning platform. The transfer positioning platform is located on the side of the second handling mechanism away from the fixture transfer line, and the flexible film feeding unit and the transfer positioning platform are spaced apart along the Y direction.

[0014] As an optional technical solution, the flexible membrane feeding unit includes a flexible membrane feeding bin located on one side of the transfer positioning platform along the Y direction and an adsorption and conveying module set above the flexible membrane feeding bin.

[0015] This utility model has at least the following beneficial effects: This invention achieves automated film application through the cooperation of two production lines: a conveyor line and a fixture transfer line. The film application station and PCB vision positioning station on the fixture transfer line enable pre-application photographic positioning of the film and PCB board, as well as film application. The system utilizes the conveyor line, a support frame positioned above both the conveyor line and the fixture transfer line along the X-direction, and a first and third transport mechanism respectively positioned on both sides of the support frame along the Y-direction. The first transport mechanism loads the PCB board, and the third transport mechanism unloads the film-applied PCB board. Therefore, this structural layout achieves efficient PCB board loading and unloading after film application. The entire flexible film application mechanism has a reasonable layout and occupies minimal space. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top view of the structure of this utility model; Figure 3 This is a schematic diagram showing the structural fit relationship at the jig transfer mechanism of this utility model; Detailed Implementation

[0017] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0018] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0021] like Figures 1 to 3 As shown, this utility model provides an automatic flexible film bonding device, including a conveyor line 1 extending along the Y direction, which conveys a fixture 11 carrying a PCB board along the Y direction. A fixture transfer line extends along the Y direction, while the conveyor line and fixture transfer line are spaced apart along the X direction. The fixture transfer line sequentially includes a loading station, a film application station 10, a unloading station, and a PCB visual positioning station 20 along the Y direction, with the X direction perpendicular to the Y direction. The fixture transfer line includes a fixture transfer mechanism 2, which carries a fixture 11 that reciprocates along the Y direction between the loading station, film application station 10, unloading station, and PCB visual positioning station 20. A support frame is positioned above the conveyor line 1 and the fixture transfer line along the X direction. A first handling mechanism 5 and a third handling mechanism 9 are respectively positioned on both sides of the support frame along the Y direction. A second handling mechanism 8 is positioned on the side of the fixture transfer line away from the conveyor line. The first transport mechanism 5 transports the fixture 11 from the conveyor line 1 to the loading station and places it on the fixture transfer mechanism 2. The third transport mechanism 9 moves the fixture 11 from the fixture transfer mechanism 2 back to the conveyor line 1 at the unloading station. The second transport mechanism 8 picks up the flexible film, transports it to the film application station 10, and applies it to the PCB board.

[0022] The above scheme involves placing the PCB board to be laminated on the surface of conveyor line 1, which then transports the PCB board. The first transport mechanism 5 moves the PCB board to the fixture transfer mechanism 2, which then transfers the PCB board to the PCB vision positioning station 20. During this process, the second transport mechanism 8 picks up the flexible film and moves it above the lamination station 10. The fixture transfer mechanism 2 moves the PCB board below the lamination station 10 and rolls the flexible film onto the PCB board. After lamination, the fixture transfer mechanism 2 carries the PCB board to the unloading station, below the third transport mechanism 9. The third transport mechanism 9 removes the PCB board from the fixture transfer mechanism 2 and transfers it to conveyor line 1, which then transports the PCB board out, completing the unloading process. The cooperation of the conveyor line and the fixture transfer line achieves automated lamination. The lamination station and the PCB vision positioning station on the fixture transfer line enable pre-lamination film and PCB board positioning and lamination photography. The flexible film application mechanism is rationally laid out and occupies little space, consisting of a conveyor line, a support frame set above the conveyor line and fixture transfer line along the X direction, and a first and a third transport mechanism set on both sides of the support frame along the Y direction. The first transport mechanism transports the PCB board for loading, and the third transport mechanism transports the PCB board after film application for unloading.

[0023] like Figure 1 , Figure 2 As shown, a first CCD camera group 3 is installed at the film application station 10; a second CCD camera group 4 is installed at the PCB vision positioning station 20.

[0024] Using the above scheme: the second CCD camera group 4 at the PCB visual positioning station 20 performs visual positioning of the PCB board; the first CCD camera group 3 performs positional visual positioning of the flexible film, thereby achieving precise adhesion of the film to the PCB board.

[0025] like Figure 1 , Figure 2 As shown, a scanner 12 and an anti-static component 13 are sequentially arranged along the Y direction on the conveyor line 1, with the anti-static component 13 positioned between the scanner 12 and the first conveying mechanism 5. A PCB cleaning component 14 is also arranged on the conveyor line 1, positioned between the anti-static component 13 and the first conveying mechanism 5. Multiple soft brushes are provided at the lower end of the PCB cleaning component 14.

[0026] The above scheme involves placing the PCB board to be coated on conveyor line 1, scanning the PCB board with scanner 12, and then conveying it to the static discharge component 13 to remove static electricity from the PCB board, preventing component burnout, performance degradation, or failure caused by electrostatic discharge. The board is then continuously conveyed to the PCB cleaning component 14 to clean the PCB board, removing surface oil, impurities, and uneven materials. This ensures that the coating material is evenly covered on the circuit board, improving film adhesion and reducing air bubbles, cracks, and peeling. This improves the accuracy, flatness, and bonding quality of the backlight coating. The soft brush design of the PCB cleaning component 14 allows for cleaning of hard-to-reach areas, gently removing tiny dust particles, solder residue, and other minor contaminants, preventing damage to components during cleaning. After passing through scanning, static discharge component 13, and PCB cleaning component 14, the first transport mechanism 5 moves the PCB board to the fixture transfer mechanism 2.

[0027] like Figure 1 , Figure 2 As shown, the fixture transfer line includes a fixture transfer mechanism 2, which includes a first driving member 21 and a fixture support platform 22 that is driven by the first driving member 21 to move along the Y direction; the fixture support platform 22 is provided with a plurality of positioning posts 23 for positioning the periphery of the fixture 11; the fixture transfer mechanism 2 is provided on the fixture transfer line.

[0028] Both the first transport mechanism 5 and the third transport mechanism 9 include fixture gripper assemblies.

[0029] Using the above scheme: the first conveying mechanism 5 moves the PCB board to the fixture transfer mechanism 2, the fixture support platform 22 supports the PCB board, and the positioning column 23 positions the PCB board. The second driving component 51 and the fixture gripper assembly on the second driving component 51 can ensure that the protective film can be accurately and firmly clamped. The multi-angle combination ensures that the protective film is torn off without damaging the conductive film, thereby improving the accuracy, flatness and bonding quality of the backlight film.

[0030] like Figures 1 to 3 As shown, a bottom film tearing mechanism 87 for tearing off the bottom isolation film of the flexible film is provided below the transfer path of the second transport mechanism 8. The bottom film tearing mechanism 87 can adopt the film tearing mechanism disclosed in the prior art, and its structure will not be described in detail in this embodiment.

[0031] The above scheme is adopted: a bottom film removal mechanism 87 for removing the bottom isolation film of the flexible film is provided below the transfer path of the second transport mechanism 8. The bottom isolation film of the flexible film is removed by the bottom film removal mechanism 87 before the film is applied.

[0032] like Figures 1 to 2 As shown, the flexible film automatic application equipment also includes a flexible film feeding unit 6 and a transfer positioning platform 7. The transfer positioning platform 7 is located on the side of the second conveying mechanism 8 away from the fixture transfer line. The flexible film feeding unit 6 and the transfer positioning platform 7 are spaced apart along the Y direction. The flexible film feeding unit 6 includes a flexible film feeding bin 61 located on the Y-direction side of the transfer positioning platform 7 and an adsorption conveying module 62 disposed above the flexible film feeding bin 61.

[0033] Using the above scheme: the adsorption and handling module 62 picks up a flexible film from the flexible film supply bin 61, and then transports it to the surface of the transfer positioning platform 7 for the first positioning. The material is separated by shaking combined with the air knife around the flexible film supply unit 6. The second handling mechanism 8 picks up the flexible film from the transfer positioning platform through the adsorption component. The bottom film removal mechanism 87 removes the bottom isolation bottom film of the flexible film and moves it above the film application station. The first CCD camera group 3 performs secondary positioning of the flexible film. The fixture transfer mechanism 2 moves the PCB board below the film application station and rolls the flexible film onto the PCB board.

[0034] The film application process is as follows: The PCB board to be filmed is placed on the surface of conveyor line 1. Conveyor line 1 transports the PCB board, and scanner 12 scans the PCB board. Conveyor line 1 continues to transport the PCB board to the anti-static component 13 and PCB cleaning component 14 for anti-static and cleaning. The first transport mechanism 5 transports the fixture 11 from conveyor line 1 to the loading station and places it on the fixture transfer mechanism 2. Then, the fixture transfer mechanism 2 transfers the PCB board from the loading station to the PCB vision positioning station 20. The second CCD camera group 4 at the PCB vision positioning station 20 performs visual positioning of the PCB board. During the above steps, the adsorption transport module 62 picks up a flexible film from the flexible film supply bin 61 and then transports it to the surface of the transfer positioning platform 7. The first physical positioning is performed. The adsorption and handling module 62 can separate the flexible film by shaking in combination with the air knife around the flexible film feeding unit 6. The second handling mechanism 8 picks up the flexible film from the transfer positioning platform 7 through the adsorption component and moves it above the film application station 10. The first CCD camera group 3 performs secondary visual positioning of the flexible film on the adsorption component. The fixture transfer mechanism 2 moves the PCB board below the film application station 10. The second handling mechanism 8 rolls and pastes the flexible film onto the PCB board. After the film application is completed, the fixture transfer mechanism 2 carries the PCB board and moves it to the unloading station, that is, below the third handling mechanism 9. The third handling mechanism 9 takes the PCB board out from the fixture transfer mechanism 2 and transports it to the conveyor line 1. The PCB board is then transported out through the conveyor line 1 to achieve unloading.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic flexible film application device, characterized in that, include: The conveyor line extends along the Y direction. The fixture transfer line extends along the Y direction, the conveyor line and the fixture transfer line are spaced apart along the X direction, and the fixture transfer line is sequentially provided with a loading station, a film application station, a unloading station and a PCB vision positioning station along the Y direction, wherein the X direction and the Y direction are perpendicular to each other; A support frame is disposed above the conveyor line and the fixture transfer line along the X direction; The first and third transport mechanisms are respectively located on both sides of the support frame along the Y direction; The second handling mechanism is located on the side of the fixture transfer line away from the conveyor line.

2. The automatic flexible film bonding equipment as described in claim 1, characterized in that, A first camera group is installed at the film application station; a second camera group is installed at the PCB vision positioning station.

3. The automatic flexible film bonding equipment as described in claim 1, characterized in that, A scanner and an antistatic assembly are sequentially arranged along the Y direction on the conveyor line, with the antistatic assembly positioned between the scanner and the first conveying mechanism.

4. The automatic flexible film application equipment as described in claim 3, characterized in that, The conveyor line is also equipped with a PCB cleaning component, which is located between the antistatic component and the first handling mechanism.

5. The automatic flexible film application equipment as described in claim 4, characterized in that, The lower end of the PCB cleaning assembly is equipped with multiple soft brushes.

6. The automatic flexible film bonding equipment as described in claim 1, characterized in that, The fixture transfer line includes a fixture transfer mechanism, which includes a first driving member and a fixture support platform that is driven by the first driving member to move along the Y direction; the fixture support platform is provided with a plurality of positioning columns.

7. The automatic flexible film bonding equipment as described in claim 1, characterized in that, Both the first transport mechanism and the third transport mechanism include a jig gripper assembly.

8. The automatic flexible film bonding equipment as described in claim 1, characterized in that, A bottom film removal mechanism is provided below the transfer path of the second transport mechanism.

9. The automatic flexible film application equipment as described in claim 1, characterized in that, The flexible film automatic application equipment also includes a flexible film feeding unit and a transfer positioning platform. The transfer positioning platform is located on the side of the second transport mechanism away from the fixture transfer line. The flexible film feeding unit and the transfer positioning platform are spaced apart along the Y direction.

10. The automatic flexible film application equipment as described in claim 9, characterized in that, The flexible membrane feeding unit includes a flexible membrane feeding bin located on one side of the transfer positioning platform along the Y direction and an adsorption and conveying module disposed above the flexible membrane feeding bin.

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