Ceramic ring components and semiconductor processing equipment

Abstract

This utility model discloses a ceramic ring assembly and a semiconductor processing device. The ceramic ring assembly includes: a ceramic ring covering the outer periphery of a heating plate; a movable ceramic sheet embedded in the ceramic ring, with its lower surface in contact with the heating plate; and a lifting mechanism located below the ceramic ring for supporting and lifting the ceramic ring.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment manufacturing, and in particular to ceramic ring assemblies. Background Technology

[0002] In some processes of plasma-enhanced atomic layer deposition (PEALD) equipment, the edge film thickness is too thick due to the oxide film. Ceramic rings are needed to block the plasma at the edge, thereby making the film thickness more uniform.

[0003] The height of the ceramic ring determines the window of process performance. Therefore, ceramic rings are generally used as optimization parts for process testing by changing their height. However, ceramic rings with fixed height require opening and closing the cavity to replace the part during testing. If there is an adjustable height ceramic ring, it can not only save manpower, but also avoid the cost of optimization parts and the impact of different optimization part tolerances on process performance. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model provides a ceramic ring assembly and a semiconductor processing device.

[0005] The ceramic ring assembly provided by this utility model includes, but is not limited to, a ceramic ring, movable ceramic plates, and a lifting mechanism.

[0006] The ceramic ring covers the outer periphery of the heating plate.

[0007] The movable ceramic sheet is embedded in the ceramic ring, and its lower surface is in contact with the heating plate.

[0008] The lifting mechanism is located below the ceramic ring and is used to support and lift the ceramic ring.

[0009] In one embodiment, the ceramic ring has a horizontal portion and a vertical portion.

[0010] The horizontal section is located above the horizontal edge of the heating plate.

[0011] The vertical portion is attached to the outer wall of the heating plate.

[0012] In one embodiment, the ceramic sheet is embedded in the horizontal portion of the ceramic ring.

[0013] In one embodiment, when the ceramic ring is not lifted by the lifting mechanism, the horizontal portion of the ceramic ring is in contact with the horizontal surface of the heating plate, and the ceramic sheet is not exposed to the outside; when the ceramic ring is lifted by the lifting mechanism, the horizontal portion of the ceramic ring leaves the horizontal surface of the heating plate, and the lower surface of the ceramic sheet is still in contact with the horizontal surface of the heating plate, at which time part or all of the ceramic sheet is exposed to the outside of the ceramic ring.

[0014] In one embodiment, the height difference between the highest point of the ceramic ring and the horizontal plane of the heating plate is continuously adjustable.

[0015] In one embodiment, when the lifting mechanism drives the ceramic ring to rise, the height difference between the highest point of the ceramic ring and the horizontal plane of the heating plate is the sum of the height of the horizontal portion of the ceramic ring and the height of the ceramic sheet protruding outside the ceramic ring.

[0016] In one embodiment, the lifting mechanism includes a ceramic column base, a corrugated tube, and a top screw.

[0017] The ceramic column base is located below the ceramic ring and is used to support the ceramic ring.

[0018] The corrugated pipe is connected to the lower part of the ceramic column base.

[0019] The set screw is connected to the lower part of the bellows.

[0020] The set screw is driven by an external power source to move up and down, which in turn drives the bellows, the ceramic column base, and the ceramic ring to move up and down.

[0021] In one embodiment, the upper part of the ceramic column base is provided with a groove for embedding the lower part of the vertical portion of the ceramic ring.

[0022] In one embodiment, the ceramic plate is not fixed to the ceramic ring, and the ceramic plate is not fixed to the heating plate.

[0023] This invention also provides a semiconductor processing device, including a processing chamber, wherein the processing chamber includes a ceramic ring assembly and a heating plate as described above.

[0024] The ceramic ring assembly is movable upward relative to the heating plate, and the height difference between the highest point of the ceramic ring assembly and the horizontal plane of the heating plate can be continuously adjusted.

[0025] The ceramic ring assembly and semiconductor processing equipment provided by this invention enable continuous variation in the height of the ceramic ring. This not only eliminates the need for processing ceramic rings of varying heights but also avoids the drawback of not being able to continuously vary the height when a specific requirement is met. Furthermore, the ceramic ring assembly and semiconductor processing equipment of this invention have a simple structure, which significantly reduces the time, labor, and consumable costs associated with the switching chamber while improving film thickness uniformity. Attached Figure Description

[0026] The above-described utility model and the following detailed embodiments will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed utility model. In the drawings, the same reference numerals represent the same or similar elements.

[0027] Figure 1 This illustrates a prior art semiconductor processing device;

[0028] Figure 2 A schematic diagram of a semiconductor processing apparatus according to an embodiment of the present invention is shown;

[0029] Figure 3 A top view of a ceramic ring assembly according to an embodiment of the present invention is shown;

[0030] Figure 4 A schematic diagram of a ceramic ring assembly according to an embodiment of the present invention is shown;

[0031] Figure 5 A schematic diagram of a ceramic ring assembly according to an embodiment of the present invention is shown.

[0032] Explanation of reference numerals in the attached figures

[0033] 100 chambers

[0034] 101 Heating Plate

[0035] 102 Plasma

[0036] 200 chambers

[0037] 201 Heating Plate

[0038] 203 Ceramic Ring

[0039] 204 Lifting Mechanism

[0040] 301 ceramic sheet

[0041] 302 Ceramic Column Base

[0042] 303 Corrugated Pipe

[0043] 304 set screw Detailed Implementation

[0044] The detailed features and advantages of this utility model are described below in specific embodiments. The content is sufficient for any person skilled in the art to understand the technical content of this utility model and implement it accordingly. Furthermore, based on the specification, claims, and drawings disclosed herein, those skilled in the art can easily understand the related objectives and advantages of this utility model. Although the description of this utility model is presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived from the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. In addition, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description.

[0045] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0046] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation; therefore, they should not be construed as limiting the scope of this invention.

[0047] It is understood that while terms such as "first," "second," and "third" may be used herein to describe various components, channels, assemblies, regions, layers, and / or parts, these components, channels, assemblies, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, assemblies, regions, layers, and / or parts. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0049] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0050] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0051] Plasma deposition is used to deposit materials onto a substrate to form thin films. In plasma deposition, the plasma distribution, uniformity, and density are critical, affecting film formation. This is because these factors cause differences in film thickness between the center and edges of the substrate. Proper plasma distribution, uniformity, and density result in films with uniform thickness.

[0052] Figure 1 A schematic diagram of a prior art semiconductor processing apparatus is shown, particularly a processing apparatus using plasma processing. This processing apparatus includes a chamber 100 for housing devices and components used for various processes. A heating plate 101 for supporting a wafer is also provided within the chamber 100. When the wafer within the chamber is subjected to plasma 102 processing, the plasma distribution at the wafer edges is not uniform, resulting in thicker thin films appearing at the edges.

[0053] Figure 2 A schematic diagram of a semiconductor processing apparatus according to an embodiment of the present invention is shown. Figure 2As shown, the processing apparatus includes a chamber 200 to house various processing devices and components. A heating plate 201 for supporting the wafer is also disposed within the chamber 200. A ceramic ring 203 covers the outer periphery of the heating plate 201. A lifting mechanism 204 is connected below the ceramic ring 203. The lifting mechanism 204 drives the ceramic ring 203 to move up and down, allowing the height difference between the highest point of the ceramic ring 203 and the horizontal plane of the heating plate 201 to be continuously adjustable.

[0054] For ease of description, the term "ceramic ring height" will be used below to represent the height difference between the highest point of the ceramic ring and the horizontal plane of the heating plate.

[0055] Figure 3 A top view of a ceramic ring assembly according to an embodiment of the present invention is shown. Figure 3 As shown, the lifting mechanism 204 of this utility model is distributed below the ceramic ring 203 and is used to support and lift the ceramic ring 203.

[0056] In one embodiment, there are three lifting mechanisms 204 arranged in an equilateral triangle.

[0057] Figure 4 A schematic diagram of a ceramic ring assembly according to an embodiment of the present invention is shown. The ceramic ring assembly includes a ceramic ring 203, a ceramic sheet 301, and a lifting mechanism 204.

[0058] The lifting mechanism 204 includes a ceramic column base 302, a corrugated pipe 303, and a set screw 304.

[0059] The ceramic column base 302 is used to support the ceramic ring 203.

[0060] In one embodiment, the upper part of the ceramic column base 302 is provided with a groove for the lower part of the ceramic ring 203 to be inserted.

[0061] A corrugated pipe 303 is connected below the ceramic column base 302.

[0062] The upper end of the bellows 303 is connected to the ceramic column base 302, and the lower end is connected to the set screw 304.

[0063] The set screw 304 is driven by an external power source to move up and down, which in turn drives the bellows, ceramic column base and ceramic ring to move up and down.

[0064] The bellows 304 is used to isolate the atmosphere from the vacuum inside the cavity, so that the vertical movement of the ceramic column base and ceramic ring inside the cavity can be controlled from outside the cavity.

[0065] The ceramic ring 203 has a horizontal portion and a vertical portion. The horizontal portion is located above the horizontal edge of the heating plate 201, and the vertical portion adheres to the outer wall of the heating plate 201. A ceramic plate 301 is embedded in the horizontal portion of the ceramic ring 203, and its lower surface contacts the heating plate 201. The ceramic plate 301 is not fixedly connected to either the ceramic ring 203 or the heating plate 201. When the ceramic ring 203 is pushed up by the lifting mechanism 202, the movable ceramic plate 301, due to gravity, does not rise with the lifting mechanism 202, but moves downward and falls onto the horizontal surface of the heating plate 201, contacting the heating plate 201.

[0066] like Figure 4 As shown, when the ceramic ring assembly is in its original position (not raised), the height of the ceramic ring is h1. At this time, the ceramic part within the dashed box is in complete contact with the heating plate 201, the horizontal part of the ceramic ring 203 is in contact with the horizontal surface of the heating plate 201, and the ceramic sheet 301 is completely embedded in the ceramic ring 203 and is not exposed. At this time, the height difference between the highest point of the ceramic ring and the horizontal surface of the heating plate is the height of the horizontal part h1.

[0067] Figure 5 A schematic diagram of a ceramic ring assembly according to an embodiment of the present invention is shown. Figure 5 As shown, the height of the ceramic ring after the ceramic ring assembly is raised is h2.

[0068] After determining the required upward movement distance of the ceramic ring 203, the set screw 305 moves it upward by that distance, pushing the ceramic ring 203 higher. However, the movable ceramic plate 301 will move downward due to gravity, effectively increasing the height of the ceramic ring 203 by the upward movement distance (i.e., the height of the exposed ceramic plate 301), thus achieving height adjustment of the ceramic ring. In other words, when the ceramic ring 203 is lifted by the lifting mechanism 204, the horizontal part of the ceramic ring 203 leaves the horizontal plane of the heating plate 201. Since the ceramic plate 301 is not fixedly connected to the ceramic ring 203, under the action of gravity, the lower surface of the ceramic plate 301 remains in contact with the horizontal plane of the heating plate 201, meaning that part or all of the ceramic plate 301 will be exposed outside the ceramic ring 203. At this time, the height difference between the highest point of the ceramic ring 203 and the horizontal plane of the heating plate 201 is the sum of the height of the horizontal part of the ceramic ring 203 and the height of the part of the ceramic plate 301 exposed outside the ceramic ring 203, i.e., ... Figure 5 The height h2 is shown.

[0069] In one embodiment, the maximum height the ceramic ring can rise is equal to the height of the ceramic plate 301. At this point, the height difference between the highest point of the ceramic ring 203 and the horizontal plane of the heating plate 201 is the sum of the height of the horizontal portion of the ceramic ring 203 and the total height of the ceramic plate 301. In practical applications, the height of the ceramic plate can be designed according to requirements.

[0070] This invention also provides a semiconductor processing apparatus, including a processing chamber containing a ceramic ring assembly and a heating plate as described above. The ceramic ring assembly is movable upward relative to the heating plate, and the height difference between the highest point of the ceramic ring assembly and the horizontal plane of the heating plate can be continuously adjusted.

[0071] The ceramic ring assembly and semiconductor processing equipment provided by this invention enable continuous variation in the height of the ceramic ring. This not only eliminates the need for processing ceramic rings of varying heights but also avoids the drawback of not being able to continuously vary the height when a specific requirement is met. Furthermore, the ceramic ring assembly and semiconductor processing equipment of this invention have a simple structure, which significantly reduces the time, labor, and consumable costs associated with the switching chamber while improving film thickness uniformity.

[0072] The terminology and expressions used above are for descriptive purposes only, and this utility model should not be limited to these terms and expressions. The use of these terms and expressions does not mean excluding any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various possible modifications should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

[0073] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the utility model, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims.

[0074] Similarly, it should be noted that although the present invention has been described with reference to the specific embodiments described above, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, any changes or modifications to the above embodiments within the scope of the essential spirit of the present invention will fall within the scope of the claims of this application.

Claims

1. A ceramic ring assembly, characterized by, include: A ceramic ring surrounds the outer periphery of the heating plate; The movable ceramic sheet is embedded in the ceramic ring, and its lower surface is in contact with the heating plate; A lifting mechanism, located below the ceramic ring, is used to support and lift the ceramic ring.

2. The ceramic ring assembly of claim 1, wherein, The ceramic ring has the following characteristics: A horizontal portion, said horizontal portion being located above the horizontal edge of the heating plate; and The vertical portion is attached to the outer wall of the heating plate.

3. The ceramic ring assembly of claim 2, wherein, The ceramic sheet is embedded in the horizontal portion of the ceramic ring.

4. The ceramic ring assembly of claim 2, wherein, When the ceramic ring is not lifted by the lifting mechanism, the horizontal part of the ceramic ring is in contact with the horizontal surface of the heating plate, and the ceramic sheet is not exposed to the outside; when the ceramic ring is lifted by the lifting mechanism, the horizontal part of the ceramic ring leaves the horizontal surface of the heating plate, and the lower surface of the ceramic sheet is still in contact with the horizontal surface of the heating plate. At this time, part or all of the ceramic sheet is exposed to the outside of the ceramic ring.

5. The ceramic ring assembly of claim 1, wherein, The height difference between the highest point of the ceramic ring and the horizontal plane of the heating plate is continuously adjustable.

6. The ceramic ring assembly of claim 5, wherein, When the lifting mechanism drives the ceramic ring to rise, the height difference between the highest point of the ceramic ring and the horizontal plane of the heating plate is the sum of the height of the horizontal part of the ceramic ring and the height of the ceramic sheet protruding outside the ceramic ring.

7. The ceramic ring assembly of claim 1, wherein, The lifting mechanism includes: A ceramic column base, located below the ceramic ring, is used to support the ceramic ring; A bellows, connected to the lower part of the ceramic column base; and A set screw connects to the lower part of the bellows; The set screw is driven by an external power source to move up and down, which in turn drives the bellows, the ceramic column base, and the ceramic ring to move up and down.

8. The ceramic ring assembly of claim 7, wherein, The upper part of the ceramic column base is provided with a groove for embedding into the lower part of the vertical part of the ceramic ring.

9. The ceramic ring assembly of claim 1, wherein, The ceramic sheet is not fixed to the ceramic ring, and the ceramic sheet is not fixed to the heating plate.

10. A semiconductor processing apparatus, characterized by comprising: Includes a processing chamber, the processing chamber comprising: The ceramic ring assembly as described in any one of claims 1 to 9; Heating plate; The ceramic ring assembly is movable upward relative to the heating plate, and the height difference between the highest point of the ceramic ring assembly and the horizontal plane of the heating plate can be continuously adjusted.

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