A selective electroplating structure for a smart card carrier tape

Abstract

This application belongs to the field of microelectronic packaging technology, and specifically relates to a selective electroplating structure for smart card carrier tape. It includes: positioning edges on both sides of a molding compound unit array, with positioning holes on the positioning edges; the molding compound unit array includes multiple molding compound units arranged in an array, with longitudinal connecting edges on both sides of each molding compound unit and transverse connecting edges on both sides of each molding compound unit; two longitudinally adjacent molding compound units share a longitudinal connecting edge, and positioning holes are provided between the transverse connecting edges of two transversely adjacent molding compound units; the front of each molding compound unit is a molding cover, and the back of each molding compound unit is a metal surface; a first functional area is provided on the molding cover, with a substrate area at the center of the first functional area; a second functional area corresponding to the first functional area is provided on the metal surface; the area of ​​the first functional area excluding the substrate area and the second functional area are electroplating areas.

Description

Technical Field

[0001] This application belongs to the field of microelectronic packaging technology, and specifically relates to a selective electroplating structure for smart card carrier tape. Background Technology

[0002] Contactless carrier tape (die stage) is a key auxiliary material in smart card module packaging. In the packaging and manufacturing of smart card modules (such as machine-readable travel document modules), the carrier tape serves as a precise, stable, and efficient carrier, with its core function being to support and protect the chip. The carrier tape is used throughout the entire packaging process, including key steps such as chip mounting, wire bonding, molding, and electrical performance testing (including open / short circuit and functional testing). It is a core component ensuring the quality and production efficiency of smart card modules.

[0003] Currently, carrier tapes are generally manufactured using a full-plating process, which mainly faces problems such as high cost, long production cycle, serious waste of plating materials, and significant environmental pressure.

[0004] Therefore, there is an urgent need for a technical solution to overcome or mitigate at least one of the aforementioned defects in the existing technology. Utility Model Content

[0005] The purpose of this application is to provide a selective electroplating structure for smart card carriers to solve at least one problem existing in the prior art.

[0006] The technical solution of this application is:

[0007] A selective electroplating structure for a smart card carrier tape, comprising:

[0008] A molding compound unit array, wherein positioning edges are provided on both sides of the longitudinal direction of the molding compound unit array, and positioning holes are provided on the positioning edges;

[0009] The molding compound unit array includes multiple molding compound units arranged in an array. Each molding compound unit has a longitudinal connecting edge on both sides and a transverse connecting edge on both sides. Two molding compound units that are adjacent in the longitudinal direction share the longitudinal connecting edge, and a positioning hole is provided between the transverse connecting edges of two molding compound units that are adjacent in the transverse direction.

[0010] The molding compound unit has a front and a back side arranged opposite to each other. The front side of the molding compound unit is a molding cover, and the back side of the molding compound unit is a metal surface. A first functional area is provided on the molding cover, and a substrate stage area is provided at the center of the first functional area. A second functional area corresponding to the first functional area is provided on the metal surface. The area of ​​the first functional area other than the substrate stage area and the second functional area are electroplating areas.

[0011] In at least one embodiment of this application, a plurality of rectangular positioning holes are provided on the positioning edge.

[0012] In at least one embodiment of this application, a rectangular circular composite positioning hole and a rectangular positioning hole are provided between the lateral connecting edges of two laterally adjacent molding bodies.

[0013] In at least one embodiment of this application, a rectangular circular composite positioning hole and a trapezoidal positioning hole are provided between the lateral connecting edges of two laterally adjacent molding bodies.

[0014] In at least one embodiment of this application, the dimensions of the first functional area and the second functional area are 5mm × 8mm.

[0015] In at least one embodiment of this application, the size of the stage area is 3.4 mm × 3.7 mm.

[0016] In at least one embodiment of this application, the chip is disposed in the wafer stage area by hot pressing or adhesive bonding, and antenna soldering holes are provided around the wafer stage area.

[0017] The utility model has at least the following beneficial technical effects:

[0018] The selective electroplating structure of the smart card carrier in this application can save precious metal materials, reduce the consumption of chemicals, lower costs, and has environmental advantages. It is also conducive to improving production efficiency and flexibility, and to accurately controlling the position and thickness of the plating layer, thereby effectively improving the overall performance of the smart card. Attached Figure Description

[0019] Figure 1 This is a front view of a selective electroplating structure for a smart card carrier tape according to one embodiment of this application;

[0020] Figure 2 This is a reverse schematic diagram of a selective electroplating structure for a smart card carrier tape according to one embodiment of this application;

[0021] Figure 3 This is a front view of a molding compound unit according to one embodiment of this application;

[0022] Figure 4 This is a reverse side schematic diagram of a molding compound unit according to one embodiment of this application.

[0023] in:

[0024] 1-Encapsulation unit; 2-First functional area; 3-Stage area; 4-Second functional area. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this application.

[0027] The following is in conjunction with the appendix Figures 1 to 4 This application will be described in further detail.

[0028] This application provides a selective electroplating structure for a smart card carrier, comprising: an array of encapsulation units 1 arranged in an array.

[0029] Specifically, such as Figure 1-2 As shown, positioning edges are provided on both sides of the longitudinal direction of the molding compound unit array, and multiple positioning holes are provided at equal intervals on the positioning edges. In the preferred embodiment of this application, multiple rectangular positioning holes are provided on the positioning edges. By using the two positioning edges as the overall positioning reference of the molding compound unit array, an important reference is provided for the transmission and positioning of the carrier tape in the continuous production process, laying a solid foundation for achieving large-scale, high-precision, and stable production.

[0030] The molding compound unit array includes multiple molding compound units 1 arranged in an array. In this embodiment, a 3-row × 2-column molding compound unit array structure is given. It is understood that this specific number of rows and columns is only an example. In smart card manufacturing, the specific number of rows and columns in the molding compound unit array is a highly flexible design parameter. The array layout can be customized based on factors such as substrate material size, production efficiency, and material utilization rate, thereby meeting diverse production needs and cost control objectives.

[0031] The molding compound unit 1 has longitudinal connecting edges on both sides and transverse connecting edges on both sides. Two adjacent molding compound units 1 share the longitudinal connecting edges. This integrated design not only optimizes material utilization but also ensures the structural integrity and dimensional stability of the array in the longitudinal direction. A positioning hole is provided between the transverse connecting edges of two adjacent molding compound units 1. By setting the positioning hole, a high-precision local positioning reference is formed, ensuring that the smart card can achieve fast and accurate positioning in a series of high-precision manufacturing processes.

[0032] In one embodiment of this application, a positioning layout in which rectangular-circular composite positioning holes and rectangular positioning holes cooperate between the lateral connecting edges of two horizontally adjacent molding compound units 1. In another embodiment of this application, a positioning layout in which rectangular-circular composite positioning holes and trapezoidal positioning holes cooperate between the lateral connecting edges of two horizontally adjacent molding compound units 1. Preferably, in this embodiment, in a row of molding compound units 1 on the outer longitudinal side of the molding compound unit array, rectangular-circular composite positioning holes and trapezoidal positioning holes are provided between the lateral connecting edges of two horizontally adjacent molding compound units 1, and rectangular-circular composite positioning holes and rectangular positioning holes are provided between the lateral connecting edges of other horizontally adjacent molding compound units 1.

[0033] The selective electroplating structure for the smart card carrier in this application provides both an overall positioning structure and a local positioning structure. On the one hand, the overall positioning edge of the molding compound unit array provides a macroscopic reference alignment for the entire smart card; on the other hand, the composite positioning hole and the positioning hole with a specific geometric shape set between two adjacent molding compound units 1 achieve more precise local positioning control. This multi-level, multi-form positioning design can provide a precise, consistent, and reliable positioning reference in multiple key processes of smart card manufacturing, effectively ensuring that various functional elements on the smart card body (such as antennas, chip modules, etc.) can be accurately printed, laminated, and installed in the preset positions of the smart card body, significantly improving product yield and process stability, and providing a reliable technical guarantee for the large-scale, high-precision manufacturing of high-end smart cards.

[0034] like Figure 3-4As shown, the molding compound unit 1 adopts a double-sided composite structure, with a front and a back side arranged opposite each other. The front side of the molding compound unit 1 is a molding cover, and the back side is a metal surface. A first functional area 2 is provided on the molding cover, and a die-mounting area 3 is provided at the center of the first functional area 2. This area is used to mount chips. A second functional area 4 corresponding to the first functional area 2 is provided on the metal surface. To achieve precise electrical connections, the areas of the first functional area 2 excluding the die-mounting area 3 and the second functional area 4 are set as electroplating areas. Functional circuits are formed through selective electroplating, thereby integrating highly reliable microcircuit modules on each molding compound unit 1. Figure 1-4 In the diagram, the areas without background color are electroplated areas, while the other areas with background color are non-electroplated areas.

[0035] In a preferred embodiment of this application, the dimensions of the first functional area 2 and the second functional area 4 are precisely set to 5mm × 8mm, providing optimized space for circuit and antenna layout. The dimensions of the die-carrying platform area 3, located at the center of the first functional area 2, are 3.4mm × 3.7mm. This size is set to match the mainstream chip size, laying the foundation for high-density integration. The die-carrying platform area 3 is equipped with chips by hot pressing or adhesive bonding, ensuring the mechanical strength and long-term reliability of the connection. Antenna soldering holes are provided around the die-carrying platform area 3. The precise arrangement of antenna soldering holes creates conditions for accurate interconnection between the chip and the peripheral antenna circuit, thus forming a highly integrated and highly reliable smart card module packaging core structure.

[0036] The selective electroplating structure for the smart card carrier in this application employs selective electroplating, significantly reducing the consumption of precious metal materials (such as gold, silver, platinum, palladium, nickel, etc.) and electroplating solutions. Electroplating is performed only in the first functional area 2 (excluding the substrate area 3) and the second functional area 4, avoiding the waste of expensive plating materials in non-plating areas. This effectively saves on the cost of precious metal materials and chemicals, significantly reducing waste volume, waste liquid and residue, and the total amount of chemicals used and potential environmental impact, thus offering environmental advantages. By setting corresponding first functional areas 2 and second functional areas 4 on the plastic cover and metal surface respectively, the electroplating area and non-electroplated area are precisely defined, eliminating time-consuming and labor-intensive complex masking steps and improving production efficiency and flexibility. Through clear area definition and corresponding electroplating processes, the location of the plating layer can be precisely positioned and controlled, avoiding the need to deal with complex deep holes, narrow slits, and tank edges, which are difficult to cover or require extensive masking under traditional electroplating methods. This facilitates precise control of the plating position and thickness. By using localized functional plating, coatings meeting specific performance requirements (such as localized wear-resistant coatings, localized conductive coatings, localized anti-corrosion coatings, localized weldability coatings, etc.) can be applied to designated locations without altering the overall material or substrate properties of the workpiece, effectively improving the overall performance of the smart card. Using the carrier stage area 3 as a non-electroplated area ensures optimal adhesion and welding quality between the chip and the substrate during installation, avoiding issues like poor soldering or stress caused by electroplating, thus guaranteeing the long-term reliability of the final product. Using the second functional area 4 of the metal surface as the entire electroplated area not only provides stable electrical connections and heat dissipation paths but also preserves the mechanical strength of the metal substrate, making the entire carrier tape less prone to deformation during manufacturing and adaptable to the demanding requirements of subsequent printing, lamination, and die-cutting processes.

[0037] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A selective electroplating structure for a smart card carrier, characterized in that, include: A molding compound unit array, wherein positioning edges are provided on both sides of the longitudinal direction of the molding compound unit array, and positioning holes are provided on the positioning edges; The encapsulation unit array includes multiple encapsulation units (1) arranged in an array. Each encapsulation unit (1) has a longitudinal connecting edge on both sides and a transverse connecting edge on both sides. Two adjacent encapsulation units (1) share the longitudinal connecting edge, and a positioning hole is provided between the transverse connecting edges of two adjacent encapsulation units (1). The molding unit (1) has a front and a back side arranged opposite to each other. The front side of the molding unit (1) is a molding cover, and the back side of the molding unit (1) is a metal surface. A first functional area (2) is provided on the molding cover, and a substrate stage area (3) is provided at the center of the first functional area (2). A second functional area (4) corresponding to the first functional area (2) is provided on the metal surface. The area of ​​the first functional area (2) other than the substrate stage area (3) and the second functional area (4) are electroplating areas.

2. The selective electroplating structure for smart card carrier tape according to claim 1, characterized in that, The positioning edge is provided with multiple rectangular positioning holes.

3. The selective electroplating structure for smart card carrier tape according to claim 1, characterized in that, A rectangular circular composite positioning hole and a rectangular positioning hole are provided between the transverse connecting edges of two transversely adjacent molding bodies (1).

4. The selective electroplating structure for smart card carrier tape according to claim 1, characterized in that, A rectangular circular composite positioning hole and a trapezoidal positioning hole are provided between the transverse connecting edges of two transversely adjacent encapsulation units (1).

5. The selective electroplating structure for smart card carrier tape according to claim 1, characterized in that, The dimensions of the first functional area (2) and the second functional area (4) are 5mm × 8mm.

6. The selective electroplating structure for smart card carrier tape according to claim 1, characterized in that, The dimensions of the stage area (3) are 3.4mm × 3.7mm.

7. The selective electroplating structure for smart card carrier tape according to claim 1, characterized in that, The chip is mounted on the wafer stage area (3) by hot pressing or adhesive bonding, and antenna welding holes are provided around the wafer stage area (3).

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