Fixture structure, electroplating equipment and continuous electroplating production line

Abstract

This utility model relates to the field of electroplating equipment technology, and discloses a clamping structure, an electroplating device, and a continuous electroplating production line, including: a fixed frame; a guide clamping member installed on the fixed frame, located in the arc-shaped transition section of the conveyor belt; several electroplating clamps evenly arranged on the conveyor belt, the electroplating clamps moving with the conveyor belt, the electroplating clamps being suitable for clamping the substrate, the electroplating clamps having a clamping state suitable for disengaging from the guide clamping member and an open clamping state suitable for sliding connection with the guide clamping member; a buffer mechanism fixedly installed on the fixed frame, located at the upper end of the guide clamping member, with a gap between the buffer mechanism and the guide clamping member, and the gap gradually decreasing along the movement direction of the electroplating clamp. This utility model, through the cooperation of the guide clamping member and the buffer mechanism, enables the electroplating clamps to gradually close, avoiding the instantaneous hard clamping of traditional clamps that squeezes or scratches the substrate, thus reducing the risk of damage to the substrate from the contact method.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, specifically to a clamping structure, an electroplating device, and a continuous electroplating production line. Background Technology

[0002] Currently, in vertical electroplating production lines for materials such as PCB boards, the substrate is transported to the electroplating tank by a feeding system. The conveying device installed in the electroplating tank drives the substrate to move forward continuously in the horizontal direction. After the substrate is electroplated, it is output to the receiving system through the outlet of the electroplating device.

[0003] In the prior art, the opening method of electroplating fixtures is usually to install pressure rollers on the electroplating fixtures. When the pressure rollers pass through the guide opening component, physical opening is achieved. However, after the electroplating fixtures are separated from the guide opening component, they are quickly closed by magnetic force and gravity, which can easily lead to damage to the film surface. Utility Model Content

[0004] In view of this, the present invention provides a clamping structure, an electroplating device, and a continuous electroplating production line to solve the problem of film surface damage caused by rapid closure of electroplating clamps.

[0005] In a first aspect, this utility model provides a clamp structure, comprising: Fixture; A guide clamp is mounted on the fixed frame and located in the arc-shaped transition section of the conveyor belt; A plurality of electroplating fixtures are evenly arranged on the conveyor belt. The electroplating fixtures move with the conveyor belt. The electroplating fixtures are adapted to clamp the substrate. The electroplating fixtures have a clamping state adapted to disengage from the guide clamping member and an open clamping state adapted to slide and connect with the guide clamping member. A buffer mechanism is fixedly mounted on the fixed frame and located at the upper end of the guide clamp. There is a gap between the buffer mechanism and the guide clamp, and the gap gradually decreases along the movement direction of the electroplating fixture.

[0006] Beneficial effects: By guiding the clamping components and the buffer mechanism to cooperate, the electroplating fixture closes gradually, avoiding the squeezing or scratching of the substrate by the instantaneous hard clamping of traditional fixtures, thus reducing the risk of damage to the substrate from the contact method. Moreover, there is no sudden impact force when the electroplating fixture closes, and the friction and collision between the clamping part of the electroplating fixture and the substrate, as well as between the fixture components themselves, are greatly reduced, reducing the mechanical wear of the electroplating fixture itself and naturally extending the service life of the electroplating fixture.

[0007] In one optional embodiment, the guide clamp is arc-shaped and includes a top-in section, a connecting section, and a top-out section connected in sequence. The connecting section is adapted to connect the top-in section and the top-out section, and the buffer mechanism is located at the upper end of the top-out section. The electroplating fixture slides in from the top entry section, passes through the connecting section, and slides out from the top exit section before disengaging.

[0008] In one alternative embodiment, the insertion section is inclined downwards along the front end direction from one end near the connecting section, and the ejection section is inclined downwards along the rear end direction from one end near the connecting section.

[0009] In one alternative embodiment, the buffer mechanism includes a first bracket, which is fixedly mounted on the fixed frame; The second bracket is fixedly installed on the first bracket; A buffer block is fixedly installed on the second bracket and is located at the upper end of the ejector section.

[0010] In one alternative embodiment, the lower end face of the buffer block is a buffer ramp, and the ejector section extends from the side of the buffer ramp away from the connecting section.

[0011] In one optional embodiment, the electroplating fixture includes: A fixing member is fixedly installed on the conveyor belt, and a first clamping part is provided below the fixing member; Hinged unit; The movable component is rotatably connected to the fixed component via the hinge unit. The upper part of the movable component is provided with a driving part adapted to slide and connect with the guide clamping component. The bottom of the movable component is provided with a second clamping part. The driving part drives the movable component to slide in the vertical direction to achieve the clamping state and the clamping state.

[0012] In one alternative embodiment, the drive unit includes a roller and a connecting rod, one end of the connecting rod being fixedly connected to the upper part of the movable member, the roller being disposed at the other end of the connecting rod, and the roller being adapted to slide against the upper surface of the guide clamp.

[0013] In one optional embodiment, the driving part disengages from the guide clamp, and the first clamping part and the second clamping part are pressed against each other to achieve a clamping state; The driving part slides and abuts against the upper surface of the guide clamping member, and the first clamping part and the second clamping part disengage from each other to achieve the open clamping state.

[0014] Secondly, this utility model also provides an electroplating apparatus, comprising: The fixture includes a fixed frame, a conveyor belt, and the aforementioned clamping structure, which is adapted to hold the conveyed substrate.

[0015] Thirdly, this utility model also provides a continuous electroplating production line, comprising: A feeding system for continuous output of substrates; An electroplating apparatus for electroplating the substrate; A collecting device for collecting the electroplated substrate into rolls. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an electroplating apparatus according to an embodiment of the present utility model; Figure 2 for Figure 1 Enlarged diagram of A in the middle; Figure 3 This is a schematic diagram of a clamp structure according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of the structure of a clamping structure according to an embodiment of the present invention, in which the guide clamping member and the buffer mechanism are installed on the fixed frame; Figure 5 This is a schematic diagram of the buffer mechanism in a clamp structure according to an embodiment of the present utility model; Figure 6 This is a schematic diagram of the electroplating fixture in a fixture structure according to an embodiment of the present utility model.

[0018] Explanation of reference numerals in the attached figures: 100. Fixed frame; 200. Guide clamp; 210. Insertion section; 220. Connecting section; 230. Ejection section; 300. Electroplating fixture; 310. Fixed component; 320. Moving component; 330. Hinge unit; 340. First clamping part; 350. Second clamping part; 360. Drive part; 400. Buffer mechanism; 410. First bracket; 411. First connecting hole; 420. Second bracket; 430. Buffer block; 431. Buffer ramp; 432. Second connecting hole; 500. Conveyor belt. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] According to embodiments of the present invention, on the one hand, such as Figures 1 to 4 As shown, a clamping structure is provided, including: a fixed frame 100; a guide clamping member 200, which is mounted on the fixed frame 100 and located in the arc-shaped transition section of the conveyor belt 500; a plurality of electroplating clamps 300, which are evenly arranged on the conveyor belt 500 and move with the conveyor belt 500. The electroplating clamps 300 are suitable for clamping substrates and have a clamping state suitable for disengaging from the guide clamping member 200 and an open clamping state suitable for sliding connection with the guide clamping member 200; and a buffer mechanism 400, which is fixedly mounted on the fixed frame 100 and located at the upper end of the guide clamping member 200. There is a gap between the buffer mechanism 400 and the guide clamping member 200, and the gap gradually decreases along the movement direction of the electroplating clamps 300.

[0022] In this embodiment, the fixed frame 100 serves as a supporting base, used to fix the guide clamp 200 and the buffer mechanism 400, ensuring that the positions of the guide clamp 200 and the buffer mechanism 400 are relatively stable, providing a reference for subsequent mating. The guide clamp 200 is fixedly installed on the fixed frame 100 and positioned in the arc-shaped transition section of the conveyor belt 500 to control the opening and closing of the electroplating fixture 300. The electroplating fixtures 300 are evenly distributed on the conveyor belt 500 and move with the conveyor belt 500. The electroplating fixtures 300 are used to clamp the substrate; when the electroplating fixture 300 slides and connects with the guide clamp 200, the electroplating fixture 300 is in an open clamping state; when the electroplating fixture 300 disengages from the guide clamp 200, the electroplating fixture 300 switches to a clamping state to clamp the substrate. The buffer mechanism 400 is fixedly installed on the fixed frame 100 and installed on the upper end of the guide clamp 200, so that there is a gap between the buffer mechanism 400 and the guide clamp 200, and the gap gradually decreases along the movement direction of the electroplating fixture 300, so that the electroplating fixture 300 can move through the gap and the movement speed of the electroplating fixture 300 can be slowed down.

[0023] During the operation of the electroplating apparatus, the electroplating fixture 300 moves with the conveyor belt 500. When the electroplating fixture 300 reaches the arc-shaped transition section of the conveyor belt 500, it slides into contact with the guide clamping member 200 on the fixed frame 100. At this time, the electroplating fixture 300 is in an open clamping state, waiting for the substrate to enter. As the conveyor belt 500 continues to move, the open electroplating fixture 300 gradually approaches the buffer mechanism 400. Since the gap between the buffer mechanism 400 and the guide clamping member 200 gradually decreases along the movement direction of the electroplating fixture 300, the buffer mechanism 400 slowly applies resistance to the electroplating fixture 300 to limit its closing speed. When the electroplating fixture 300 disengages from the guide clamp 200, the electroplating fixture 300, which was originally held open by the guiding force, begins to close naturally. However, under the resistance of the buffer mechanism 400, the electroplating fixture 300 can only close slowly and gradually, eventually gently contacting and clamping the substrate.

[0024] By guiding the clamping components and the buffer mechanism 400 to cooperate, the electroplating fixture 300 gradually closes, avoiding the squeezing or scratching of the substrate caused by the instantaneous hard clamping of traditional fixtures, thus reducing the risk of damage to the substrate from the contact method. Moreover, there is no sudden impact force when the electroplating fixture 300 closes, and the friction and collision between the clamping part of the electroplating fixture 300 and the substrate, as well as the fixture's own components, are greatly reduced, reducing the mechanical wear of the electroplating fixture 300 itself and naturally extending the service life of the electroplating fixture 300.

[0025] In one embodiment, the guide clamp 200 is arc-shaped and includes an infeed section 210, a connecting section 220 and an ejection section 230 connected in sequence. The connecting section 220 is adapted to connect the infeed section 210 and the ejection section 230. The buffer mechanism 400 is located at the upper end of the ejection section 230. The electroplating fixture 300 slides in from the infeed section 210, passes through the connecting section 220, slides out from the ejection section 230 and disengages.

[0026] In this embodiment, the guide clamp 200 is an arc-shaped plate, comprising an integrally formed insert section 210, a connecting section 220, and an ejector section 230. The electroplating fixture 300 remains clamped when disengaged from the guide clamp 200. When the electroplating fixture 300 slides into the insert section 210, it tends to open, achieving full opening at the connecting section 220. When the electroplating fixture 300 slides out along the ejector section 230, it tends to clamp, achieving full clamping upon disengagement from the ejector section 230. A buffer mechanism 400 is further disposed at the upper end of the ejector section 230, creating a gap between the ejector section 230 and the buffer mechanism 400, which gradually decreases along the direction of movement of the electroplating fixture 300. As the electroplating fixture 300 slides out from the ejector section 230, the buffer mechanism 400 limits the moving speed of the electroplating fixture 300, thereby limiting its closing speed and allowing it to close slowly to flexibly hold the substrate. The cooperation between the guide clamping component and the buffer mechanism 400 achieves both clamping and opening of the electroplating fixture 300, while ensuring the fixture flexibly holds the substrate, reducing the risk of damage.

[0027] In one embodiment, the insertion section 210 is inclined downward along the front end direction from one end near the connecting section 220, and the ejection section 230 is inclined downward along the rear end direction from one end near the connecting section 220.

[0028] In this embodiment, the top-entry section 210 is inclined downward along the front end direction from one end near the connecting section 220, and the top-exit section 230 is inclined downward along the rear end direction from one end near the connecting section 220. This allows the electroplating fixture 300 to gradually slide upward along the top-entry section 210, then translate in the connecting section 220, and then gradually slide downward along the top-exit section 230. This improves the stability of the electroplating fixture 300 and avoids abrupt changes in the state of the electroplating fixture 300 due to excessive height difference, which could affect the integrity of the film surface.

[0029] like Figure 5As shown, in one embodiment, the buffer mechanism 400 includes a first bracket 410, which is fixedly mounted on the fixed frame 100; a second bracket 420, on which the first bracket 410 is fixedly mounted; and a buffer block 430, which is fixedly mounted on the second bracket 420 and is located at the upper end of the ejector section 230.

[0030] In this embodiment, the first bracket 410 is directly fixed to the fixing frame 100, and the first bracket 410 is provided with a first connecting hole 411; wherein, two first connecting holes 411 are provided and are U-shaped. The first bracket 410 is fixedly installed on the fixing frame 100 by passing a connector through the first connecting hole 411, and the height of the first bracket 410 can also be adjusted by providing U-shaped connecting holes to suit different working scenarios. The second bracket 420 is welded to the first bracket 410 and is used to install the buffer block 430. The buffer block 430 is provided with a through second connecting hole 432, and the second bracket 420 is provided with a third connecting hole corresponding to the second connecting hole 432. The buffer block 430 is fixedly installed on the second bracket 420 by passing a connector through the second connecting hole 432 and the third connecting hole in sequence, and the buffer block 430 is located at the upper end of the ejector section 230, which facilitates limiting the moving speed of the electroplating fixture 300 and allows the electroplating fixture 300 to flexibly clamp the substrate. The second connecting hole 432 and the third connecting hole can both be screw holes, and the buffer block 430 can be fixed on the second bracket 420 by using screws.

[0031] In one embodiment, the lower end face of the buffer block 430 is a buffer ramp 431, and the side of the buffer ramp 431 away from the connecting section 220 extends out to the ejector section 230.

[0032] In this embodiment, the lower end face of the buffer block 430 is configured as a buffer ramp 431. When the electroplating fixture 300 moves with the conveyor belt 500, the ejector section 230 of the electroplating fixture 300 will first contact the edge of the buffer ramp 431 near the connecting section 220, so that the buffering resistance of the electroplating fixture 300 gradually increases from zero, avoiding a sudden drop in the closing speed of the electroplating fixture 300 due to sudden force. By reasonably setting the tilt angle of the buffer ramp 431, the resistance experienced by the electroplating fixture 300 can be controlled, thereby adjusting the clamping speed of the electroplating fixture 300; the tilt angle of the buffer ramp 431 can be flexibly adjusted according to the tolerance of different substrates. Furthermore, the ejector section 230 extends from the side of the buffer ramp 431 away from the connecting section 220, so that after the electroplating fixture 300 disengages from the guide clamp 200, it can better transition to the closed state, so as to gently contact and clamp the substrate and avoid damage to the substrate.

[0033] like Figure 6As shown, in one embodiment, the electroplating fixture 300 includes: a fixing member 310, which is fixedly mounted on the conveyor belt 500, and a first clamping part 340 is provided below the fixing member 310; a hinge unit 330; and a movable member 320, which is rotatably connected to the fixing member 310 through the hinge unit 330. The upper part of the movable member 320 is provided with a driving part 360 suitable for sliding connection with the guide clamping member 200, and the bottom of the movable member 320 is provided with a second clamping part 350. The driving part 360 drives the movable member 320 to slide in the vertical direction to achieve a clamping state and an open clamping state.

[0034] In this embodiment, the fixed member 310 is mounted on the conveyor belt 500 and slides along with it. The movable member 320 is connected to the fixed member 310 via a hinge unit 330. The movable member 320 is equipped with a driving part 360, which is slidably connected to the guide clamping member 200, thereby driving the movable member 320 to move upward in the vertical direction to achieve the open clamping state. When the driving part 360 disengages from the guide clamping member 200, the movable member slides downward in the vertical direction to achieve the clamping state. Through the cooperation of the electroplating fixture 300, the guide clamping member 200, and the buffer mechanism 400, during the process of the electroplating fixture 300 disengaging from the guide clamping member 200, the buffer mechanism 400 reduces the moving speed of the electroplating fixture 300, thereby causing the electroplating fixture 300 to close slowly to flexibly clamp the substrate, reducing the risk of damage to the substrate and ensuring the electroplating quality.

[0035] It is understood that there are two hinge units 330. The hinge unit 330 is connected to the fixing member 310 through a return spring. In the initial state, the first clamping part 340 and the second clamping part 350 are in a clamping state. When the driving part 360 slides and connects with the guide opening clamp 200, the return spring is stretched, so that the first clamping part 340 and the second clamping part 350 are in an open clamping state. As the driving part 360 and the guide opening clamp 200 disengage from each other, the first clamping part 340 and the second clamping part return to the clamping state under the elastic action of the return spring.

[0036] Furthermore, the drive unit 360 includes a roller and a connecting rod. One end of the connecting rod is fixedly connected to the upper part of the movable member 320, and the roller is located at the other end of the connecting rod. The roller is adapted to slide and abut against the upper surface of the guide clamping member 200. The roller rolls on the guide clamping member 200. Since the insertion section 210 has an upward trend, the rolling of the roller causes the connecting rod to rise at a slope, which in turn causes the movable member 320 to slide in the vertical direction, thereby realizing the clamping state.

[0037] Furthermore, the drive unit 360 disengages from the guide clamp 200, and the first clamping unit 340 and the second clamping unit 350 are pressed against each other to achieve a clamping state; the drive unit 360 slides and abuts against the upper surface of the guide clamp 200, and the first clamping unit 340 and the second clamping unit 350 disengage from each other to achieve an open clamping state.

[0038] Furthermore, the first clamping portion 340 and the second clamping portion 350 are made of flexible material. When the hinge unit 330 is connected to the fixing member 310 via the return spring, the first clamping portion 340 and the second clamping portion 350 can be made of flexible material, specifically, they can be made of rubber or silicone, thereby causing damage to the surface of the substrate.

[0039] In other possible implementations, the first clamping part 340 and the second clamping part 350 can be made of magnetic components. In the clamping state, the first clamping part 340 and the second clamping part 350 are magnetically connected. When the driving part 360 is connected to the guide opening clamp 200, the first clamping part 340 and the second clamping part 350 separate to achieve the opening state. When the driving part 360 is disengaged from the guide opening clamp 200, the first clamping part 340 and the second clamping part 350 re-adhere and adhere under the action of magnetic force to achieve the clamping state.

[0040] Secondly, this utility model also proposes an electroplating apparatus, including a fixing frame 100, a conveyor belt 500 and the aforementioned clamping structure, the clamping structure being suitable for clamping and conveying a substrate.

[0041] Thirdly, this utility model also provides a continuous electroplating production line, including: a feeding system, an electroplating device, and a receiving device; the feeding system is used to continuously output substrates; the electroplating device is used to electroplat the substrates; and the receiving device is used to collect the electroplated substrates into rolls.

[0042] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0043] The specific embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A clamp structure characterized by, include: Fixture (100); A guide clamp (200) is mounted on the fixed frame (100) and located in the arc transition section of the conveyor belt (500); A plurality of electroplating fixtures (300) are evenly arranged on the conveyor belt (500). The electroplating fixtures (300) move with the conveyor belt (500). The electroplating fixtures (300) are adapted to clamp the substrate. The electroplating fixtures (300) have a clamping state adapted to disengage from the guide clamping member (200) and an open clamping state adapted to slide and connect with the guide clamping member (200). A buffer mechanism (400) is fixedly mounted on the fixed frame (100) and located at the upper end of the guide clamp (200). There is a gap between the buffer mechanism (400) and the guide clamp (200), and the gap gradually decreases along the movement direction of the electroplating fixture (300).

2. The clamp structure according to claim 1, characterized by The guide clamp (200) is arc-shaped and includes a top-in section (210), a connecting section (220) and a top-out section (230) connected in sequence. The connecting section (220) is adapted to connect the top-in section (210) and the top-out section (230). The buffer mechanism (400) is located at the upper end of the top-out section (230). The electroplating fixture (300) slides in from the top entry section (210), passes through the connecting section (220), and slides out from the top exit section (230) before disengaging.

3. The clamp structure according to claim 2, characterized by The top-entry section (210) is inclined downward along the front end direction from one end near the connecting section (220), and the top-out section (230) is inclined downward along the rear end direction from one end near the connecting section (220).

4. The clamp structure according to claim 2, wherein The buffer mechanism (400) includes a first bracket (410), which is fixedly mounted on the fixed frame (100); The second bracket (420) is fixedly installed on the first bracket (410); A buffer block (430) is fixedly installed on the second bracket (420) and is located at the upper end of the ejector section (230).

5. The clamp structure according to claim 4, characterized in that, The lower end face of the buffer block (430) is a buffer ramp (431), and the top section (230) extends from the side of the buffer ramp (431) away from the connecting section (220).

6. The clamp structure according to claim 1, characterized in that, The electroplating fixture (300) includes: A fastener (310) is fixedly installed on the conveyor belt (500), and a first clamping part (340) is provided below the fastener (310). Hinged unit (330); The movable part (320) is rotatably connected to the fixed part (310) through the hinge unit (330). The upper part of the movable part (320) is provided with a drive part (360) suitable for sliding connection with the guide clamping part (200). The bottom of the movable part (320) is provided with a second clamping part (350). The drive part (360) drives the movable part (320) to slide in the vertical direction to realize the clamping state and the clamping state.

7. The clamp structure according to claim 6, characterized in that, The drive unit (360) includes a roller and a connecting rod. One end of the connecting rod is fixedly connected to the upper part of the movable member (320). The roller is located at the other end of the connecting rod and is adapted to slide against the upper surface of the guide clamp (200).

8. The clamp structure according to claim 7, characterized in that, The driving part (360) disengages from the guide clamp (200), and the first clamping part (340) and the second clamping part (350) are pressed against each other to achieve a clamping state; The driving part (360) slides and abuts against the upper surface of the guide clamping member (200), and the first clamping part (340) and the second clamping part (350) disengage from each other to achieve the open clamping state.

9. An electroplating apparatus, characterized in that, include: The fixture (100), the conveyor belt (500), and the clamping structure according to any one of claims 1 to 8, the clamping structure being adapted to clamp the conveying substrate.

10. A continuous electroplating production line, comprising: A feeding system for continuous output of substrates; An electroplating apparatus for electroplating the substrate; A collecting device for collecting the electroplated substrate into a roll; The electroplating apparatus is characterized in that it is the electroplating apparatus according to claim 9.

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