A sealed structure of a wafer etching apparatus

Abstract

This utility model belongs to the field of wafer etching technology, specifically relating to a sealing structure for a wafer etching apparatus, comprising: a main cavity with a motor housing cavity in its center; a motor housing cavity containing a motor, the motor's output shaft facing upwards and connected to a wafer support stage; a protective cover mounted on the main cavity, located above the motor housing cavity; the top plate of the protective cover is penetrated by the bottom of the wafer support stage; a sealing element located above the motor, its sidewall situated between the sidewall of the protective cover and the outer wall of the motor housing cavity; the top plate of the sealing element is penetrated by the motor's output shaft, and multiple sealing grooves are formed on both the inner and outer sides of its sidewall; sealing rings are placed within the sealing grooves; a lifting cup mounted on the main cavity, located outside the protective cover; the lifting cup has an opening at its top, and its inner wall has an inclined overlapping surface; the top of the overlapping surface contacts the top of the sidewall of the protective cover. This utility model prevents the leakage of chemicals used in the wafer etching process from corroding the motor, and has good market application prospects.

Description

Technical Field

[0001] This utility model belongs to the field of wafer etching technology, and specifically relates to a sealing structure for wafer etching equipment. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. Wafer etching is a key process in semiconductor manufacturing, selectively removing material from the wafer surface using physical or chemical methods to form nanoscale circuit patterns. Wafer etching includes two main technical routes: wet etching and dry etching. Their core purpose is to transfer two-dimensional patterns from photoresist to the wafer (such as silicon, metal, or dielectric layers) to form 3D structures such as transistors and interconnects.

[0003] In wafer etching, chemical solutions (such as acids, alkalis, organic solvents, or plasma etching gases) can cause multi-dimensional damage upon contact with the motor, requiring targeted protection. Patent application CN2024207803734 discloses a sealing structure for wafer etching equipment, applicable to the motor protective cover and lifting CPU of the equipment. The outer periphery of the motor protective cover has a sealing ring mounting groove, in which a sealing ring is embedded. A sealing ring pressing edge extends from the top opening of the lifting CPU towards the inner side of the motor protective cover. This invention forms a stepped sealing structure by connecting the motor protective cover and the lowered lifting CPU, preventing the chemical solutions used in the later stages of the etching process from flowing into the gap between the lifting CPU and the motor protective cover, and also preventing liquid accumulation between them, effectively improving chemical recovery. However, repeated compression of the sealing ring by the pressing edge at the top of the lifting CPU may cause deformation and loosening of the sealing ring, significantly reducing its sealing effect. If a leakage channel forms, it may lead to motor corrosion.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a sealing structure for a wafer etching equipment to solve the problem that repeated compression of the sealing ring by the crimping edge at the top of the lifting CPU may lead to leakage of the chemical solution and corrosion of the motor.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A sealing structure for a wafer etching apparatus includes: The main cavity has a motor housing cavity in its middle; a motor is installed in the motor housing cavity, and the output shaft of the motor is arranged upward and connected to a support platform; A protective cover is installed on the main cavity and located above the motor housing cavity; the top plate of the protective cover is penetrated by the bottom of the support platform. A sealing element is located above the motor, with its sidewall situated between the sidewall of the protective cover and the outer wall of the motor housing cavity. The top plate of the sealing element is penetrated by the output shaft of the motor, and multiple sealing grooves are provided on both the inner and outer sides of its sidewall. A sealing ring is placed within the sealing groove. The lifting cup is installed on the main cavity and located outside the protective cover; the top of the lifting cup is open and its inner wall is provided with an inclined overlapping surface; the top of the overlapping surface contacts the top of the side wall of the protective cover.

[0007] Preferably, the inner and outer walls of the seal are each provided with two sealing grooves.

[0008] Preferably, the outer wall of the top of the lifting cup is sloped; the height of the middle part of the top plate of the protective cover is higher than the top of its side wall.

[0009] Preferably, the top of the side wall of the protective cover is provided with a slot, and a rubber pad is provided in the slot; the outer side of the rubber pad is provided as an inclined surface that mates with the overlapping surface.

[0010] Preferably, a limiting ring is provided inside the side wall of the protective cover, and the bottom of the limiting ring abuts against the top of the sealing element.

[0011] Preferably, the main cavity is provided with a flow guiding cavity one and a flow guiding cavity two; the bottom of the flow guiding cavity two is provided with a flow guiding plate, and the bottoms of the flow guiding cavity one and the flow guiding cavity two are connected through a flow guiding hole.

[0012] Preferably, the outer bottom of the lifting cup is located inside the first flow guide cavity, and the inner bottom of the cup is located inside the second flow guide cavity; the side wall of the protective cover is located above the second flow guide cavity.

[0013] Compared with the prior art, the present invention has the following beneficial effects: (1) The sealing structure of the wafer etching equipment of this utility model is provided by setting a sealing element between the protective cover and the motor housing cavity. The sealing element is equipped with sealing rings on both the inner and outer sides of the side wall. The sealing effect is good and can prevent the chemical solution used in the wafer etching process from flowing into the motor housing cavity, thus avoiding corrosion damage to the motor.

[0014] (2) The sealing structure of the wafer etching equipment of this utility model is provided by setting up a flow guide cavity 1 and a flow guide cavity 2 that are interconnected, so that the flowing liquid is temporarily gathered in the flow guide cavity, which is convenient for subsequent recycling and processing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Explanation of key figure labels: 1. Main cavity; 2. Motor housing cavity; 3. Motor; 4. Plate support platform; 5. Protective cover; 6. Seal; 7. Sealing groove; 8. Sealing ring; 9. Lifting cup; 10. Limiting ring; 11. Slot; 12. Rubber pad; 13. Guide plate; 14. Guide hole. Detailed Implementation

[0016] The technical solution of this utility model patent will be clearly and completely described below. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0017] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0018] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0019] See attached document Figure 1 A sealing structure for a wafer etching apparatus includes a main cavity 1, a protective cover 5, a sealing element 6, and a lifting cup 9 located on the main cavity 1. The main cavity 1 has a motor housing cavity 2 in the middle; the motor 3 is installed inside the motor housing cavity 2, and its output shaft is set upward and connected to a support platform 4; a protective cover 5 is installed above the motor housing cavity 2, and the bottom of the support platform 4 penetrates the middle of the top plate of the protective cover 5; the lifting cup 9 is installed on the outside of the protective cover 5, and its top opening and inner wall have an inclined overlapping surface; the top of the overlapping surface contacts the top of the side wall of the protective cover 5.

[0020] A sealing element 6 is provided above the motor 3. The top plate of the sealing element 6 is penetrated by the output shaft of the motor 3. Two sealing grooves 7 are provided on the inner and outer sides of its side wall. The side wall of the sealing element 6 is located between the side wall of the protective cover 5 and the outer wall of the motor housing cavity 2. A sealing ring 8 is placed in the sealing groove 7, which can play a sealing role and prevent the liquid medicine from flowing into the motor housing cavity 2.

[0021] In this embodiment, the main cavity 1 is provided with a first guide cavity and a second guide cavity; the outer bottom of the lifting cup 9 is located in the first guide cavity, and the inner bottom of the lifting cup 9 is located in the second guide cavity; the side wall of the protective cover 5 is located above the second guide cavity. The middle part of the top plate of the protective cover 5 is higher than the top of its side wall, which facilitates the flow of the etching solution along the top plate of the protective cover 5 to both sides; the outer top wall of the lifting cup 9 is set as a slope, which can further guide the solution along the outer wall of the lifting cup 9 into the first guide cavity.

[0022] The top of the side wall of the protective cover 5 is also provided with a slot 11, and a rubber pad 12 is provided in the slot 11. The outer side of the rubber pad 12 is set as an inclined surface to cooperate with the overlapping surface. Due to the softness of the rubber pad 12, it can play a buffering role during the descent of the lifting cup 9, so as to avoid damage to the contact part between the lifting cup 9 and the protective cover 5. A limiting ring 10 is provided in the side wall of the protective cover 5. The bottom of the limiting ring 10 abuts against the top of the sealing member 6 to determine the installation height of the protective cover 5 and to prevent the rubber pad 12 from failing to contact the overlapping surface.

[0023] Additionally, when the top of the lifting cup 9 is pressed tightly against the rubber pad 12, it provides a certain degree of sealing, reducing the total amount of liquid medicine flowing into the second guide cavity. The bottom of the second guide cavity is equipped with a guide plate 13, and the bottoms of the first and second guide cavities are connected through a guide hole 14. The liquid medicine flowing into the second guide cavity can flow down along the guide plate 13 and eventually enter the first guide cavity through the guide hole 14. The liquid medicine collects in the first guide cavity, facilitating subsequent recycling.

[0024] It should be noted that when the rubber pad 12 is deformed or damaged due to long-term use, the sealing rings 8 on the inner and outer sides of the sealing element 6 can ensure that the liquid medicine does not flow into the motor housing cavity 2, effectively protecting the motor 3 from the corrosion of the liquid medicine.

[0025] The sealing structure of the wafer etching equipment of this utility model can effectively prevent the motor 1 from being damaged by chemical corrosion by setting multiple layers of sealing rings 8 on the inner and outer sides of the side wall of the sealing element 6. While providing a good sealing effect, it can also recover the chemical liquid through the guide cavity, which is very practical and has good market application prospects.

[0026] The foregoing description of specific exemplary embodiments of the present invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the present invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the present invention, as well as various different choices and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A sealing structure for a wafer etching apparatus, characterized in that, include: The main cavity has a motor housing cavity in its middle; a motor is installed in the motor housing cavity, and the output shaft of the motor is arranged upward and connected to a support platform; A protective cover is installed on the main cavity and located above the motor housing cavity; the top plate of the protective cover is penetrated by the bottom of the support platform. A sealing element is located above the motor, with its sidewall situated between the sidewall of the protective cover and the outer wall of the motor housing cavity. The top plate of the sealing element is penetrated by the output shaft of the motor, and multiple sealing grooves are provided on both the inner and outer sides of its sidewall. A sealing ring is placed within the sealing groove. The lifting cup is installed on the main cavity and located outside the protective cover; the top of the lifting cup is open and its inner wall is provided with an inclined overlapping surface; the top of the overlapping surface contacts the top of the side wall of the protective cover.

2. The sealing structure of the wafer etching equipment according to claim 1, characterized in that, The sealing element has two sealing grooves on its inner and outer walls.

3. The sealing structure of the wafer etching equipment according to claim 1, characterized in that, The outer wall of the top of the lifting cup is set as a slope; the height of the middle part of the top plate of the protective cover is higher than the top of its side wall.

4. The sealing structure of the wafer etching equipment according to claim 1, characterized in that, The top of the side wall of the protective cover is provided with a slot, and a rubber pad is provided in the slot; the outer side of the rubber pad is set as an inclined surface that mates with the overlapping surface.

5. The sealing structure of the wafer etching equipment according to claim 1, characterized in that, A limiting ring is provided inside the side wall of the protective cover, and the bottom of the limiting ring abuts against the top of the sealing element.

6. The sealing structure of the wafer etching equipment according to claim 1, characterized in that, The main cavity is provided with a flow guide cavity one and a flow guide cavity two; the bottom of the flow guide cavity two is provided with a flow guide plate, and the bottoms of the flow guide cavity one and the flow guide cavity two are connected through a flow guide hole.

7. The sealing structure of the wafer etching equipment according to claim 6, characterized in that, The outer bottom of the lifting cup is located inside the first flow guide cavity, and the inner bottom of the cup is located inside the second flow guide cavity; the side wall of the protective cover is located above the second flow guide cavity.

Images