A multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas

Abstract

This utility model provides a multi-channel diversion device for efficient recovery of semiconductor exhaust gas, comprising: a support frame on which a plurality of exhaust gas conveying pipes are equally spaced; an inlet pipe for connecting to the exhaust port of semiconductor process equipment; and a diversion section fixed on the support frame, wherein the inlet of the diversion section is connected to the inlet pipe, and the inlet ends of the plurality of exhaust gas conveying pipes are all connected to the plurality of exhaust ports of the diversion section, for selectively connecting the inlet pipe to one of the exhaust gas conveying pipes. This multi-channel diversion device for efficient recovery of semiconductor exhaust gas, through the diversion section, can classify and output exhaust gas of different components for processing, avoiding mixed pollution of exhaust gas. Furthermore, the constant temperature section ensures the temperature within the plurality of exhaust gas conveying pipes, effectively preventing condensation and blockage of exhaust gas in the pipes and ensuring the stability of exhaust gas treatment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor exhaust gas recovery technology, and more specifically, to a multi-channel diversion device for efficient recovery of semiconductor exhaust gas. Background Technology

[0002] In semiconductor manufacturing processes, a large amount of special gases, such as silane, phosphine, and arsine, are used for chemical vapor deposition and etching processes. These processes generate process exhaust gases that are toxic, corrosive, flammable, or harmful to the environment. Therefore, these exhaust gases must be safely and efficiently treated by an exhaust gas treatment system before they can be released.

[0003] Traditional exhaust gas treatment solutions typically employ a "single process equipment corresponding to a single exhaust gas treatment device" model, or use simple multi-channel valves for diversion. During use, exhaust gases with different properties, such as acidic, alkaline, and organic solvents, may be mixed and transported, or cannot be accurately directed to the most suitable treatment unit, resulting in low treatment efficiency. In some cases, the mixing of incompatible exhaust gases may even create safety hazards. Furthermore, during exhaust gas transport, since the temperature in the transport pipe is generally lower than that of the semiconductor processing equipment, some exhaust gases may condense, crystallize, or react during the transport process due to the temperature drop, thereby clogging and corroding the transport pipe and affecting the stability of exhaust gas transport. Utility Model Content

[0004] The purpose of this invention is to provide a multi-channel diversion device for efficient recovery of semiconductor exhaust gas, in order to solve the above-mentioned problems.

[0005] To achieve the above objectives, this utility model provides a multi-channel diversion device for efficient recovery of semiconductor exhaust gas, comprising: a support frame, on which a plurality of exhaust gas conveying pipes are arranged at equal intervals; The intake pipe is used to connect to the exhaust port of semiconductor process equipment. The diversion section is fixed on the support frame, and the air inlet of the diversion section is connected to the air inlet pipe. The air inlet ends of the plurality of exhaust gas delivery pipes are all connected to the plurality of exhaust ports of the diversion section, for selectively connecting the air inlet pipe to one of the exhaust gas delivery pipes. A temperature control unit is installed on the support frame and the plurality of exhaust gas conveying pipes to collect low-grade waste heat generated during the semiconductor manufacturing process and maintain the temperature inside the plurality of exhaust gas conveying pipes. A connecting part, which is mounted on the support frame, is used to restrict the movement of several of the exhaust gas delivery pipes on the support frame.

[0006] Furthermore, the diversion section includes a diversion shell fixed on the support frame, a closed sleeve rotatably installed inside the diversion shell, a drive motor fixed at one end of the diversion shell, a number of vents arranged in a ring array on the closed sleeve, and a number of vents arranged at different positions along the axial direction of the closed sleeve. The output end of the drive motor is fixedly connected to the enclosed sleeve; The intake pipe is fixed to the splitter shell and communicates with the sealing sleeve through a rotary joint; Each of the aforementioned exhaust gas delivery pipes is connected to the diversion shell, and each of the aforementioned air inlets corresponds one-to-one with the aforementioned exhaust gas delivery pipes.

[0007] Furthermore, the diversion section also includes several sealing rings fixed in several of the air vents, several pressure-contacting elements equally spaced in the diversion shell, and several contact rings corresponding to the several sealing rings respectively; The pressing element includes pressing rings arranged in a ring array and fixed on the inner wall of the diversion shell, which are adapted to the sealing ring. When the sealing sleeve rotates to a specific position, the sealing ring on one of the vents forms a sliding seal with a corresponding pressure ring, and connects the vent to the corresponding exhaust gas delivery pipe.

[0008] Furthermore, the constant temperature unit includes several heating covers that are respectively fixedly sleeved on the outside of several exhaust gas delivery pipes and form heating cavities between them and the outer walls of several exhaust gas delivery pipes; heat insulation sleeves that are respectively fixed on the outer walls of several heating covers; several gas supply pipes that are respectively connected to the lower side of one end of several heating covers; several exhaust pipes that are respectively connected to the upper side of the other end of several heating covers; an upper gas collection pipe that is connected to several exhaust pipes; and several first temperature sensors that are equally spaced on the upper gas collection pipe and respectively inserted into several exhaust pipes.

[0009] Furthermore, the constant temperature unit includes a fan disposed on one side of the support frame, an air supply pipe connected at one end to the air inlet of the fan and at the other end to the exhaust end of an external waste heat collection device, a lower air collection pipe connected to the exhaust end of the fan, an assembly frame fixed in the support frame, several heating boxes fixed at equal intervals in the assembly frame and respectively connected to several air supply pipes, and several second temperature sensors respectively installed in several heating boxes; The bottom of each of the heating boxes is connected to the lower gas collection pipe.

[0010] Furthermore, each of the aforementioned exhaust gas delivery pipes is equipped with a check valve, and the exhaust ends of the aforementioned exhaust gas delivery pipes are respectively connected to different exhaust gas treatment devices.

[0011] Furthermore, the connecting part includes several mounting seats fixed to the upper surface of the support frame and adapted to several exhaust gas conveying pipes, mounting grooves respectively opened on several mounting seats and adapted to the outer wall of the insulation sleeve, several U-shaped fixing bolts respectively fitted on the outer wall of several insulation sleeves and respectively threaded to several mounting seats.

[0012] Compared with the prior art, the embodiments of this utility model have the following beneficial effects: This multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas can quickly and accurately switch exhaust gases from different process stages or with different compositions to dedicated and most suitable processing channels through a set diversion section. This allows different exhaust gases to be transported to different recovery and processing equipment through several exhaust gas conveying pipes according to their composition, value and processing method, avoiding mixed pollution of exhaust gases, improving the processing efficiency of single exhaust gas processing equipment, ensuring the effective recovery and processing of different exhaust gases, realizing refined management of exhaust gas recovery and effectively improving recovery efficiency. This multi-channel diversion device for efficient recovery of semiconductor exhaust gas can actively collect waste heat generated in the semiconductor manufacturing process through a constant temperature section. It uses the waste heat to insulate several exhaust gas delivery pipes. With the cooperation of several heating boxes, it can precisely control and maintain the insulation temperature of several exhaust gas delivery pipes, preventing exhaust gas condensation, crystallization and pipe blockage caused by temperature drop, ensuring production continuity, and effectively reducing energy consumption, with significant energy-saving effect. Attached Figure Description

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] Figure 1 A perspective view of the present invention is shown; Figure 2 This invention provides a partially cross-sectional perspective view. Figure 1 ; Figure 3 This invention provides a partially cross-sectional perspective view. Figure 2 ; Figure 4 A partial side view of the present invention is shown; Figure 5 A partially disassembled perspective view of this utility model is shown; Figure 6 A partial perspective view of the present invention is shown; Figure 7 This invention provides a partially cross-sectional perspective view. Figure 3 .

[0015] In the picture 1. Support frame; 2. Exhaust gas delivery pipe; 3. Inlet pipe; 4. Diverter section; 5. Constant temperature section; 6. Connecting part; 7. Diverter shell; 8. Sealing sleeve; 9. Drive motor; 10. Vent; 11. Sealing ring; 12. Contact element; 13. Contact ring; 14. Heating cover; 15. Insulation sleeve; 16. Gas supply pipe; 17. Exhaust pipe; 18. Upper gas collection pipe; 19. First temperature sensor; 20. Fan; 21. Gas delivery pipe; 22. Lower gas collection pipe; 23. Assembly frame; 24. Heating box; 25. Second temperature sensor; 26. Check valve; 27. Assembly base; 28. Mounting slot; 29. ​​U-shaped fixing bolt. Detailed Implementation

[0016] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0017] like Figure 1-7 As shown, a multi-channel diversion device for efficient recovery of semiconductor exhaust gas includes: a support frame 1, on which a plurality of exhaust gas conveying pipes 2 are arranged at equal intervals; Inlet pipe 3 is used to connect to the exhaust port of semiconductor process equipment; The diversion section 4 is fixed on the support frame 1, and the air inlet of the diversion section 4 is connected to the air inlet pipe 3. The air inlet ends of several exhaust gas delivery pipes 2 are connected to several exhaust ports of the diversion section 4, for selectively connecting the air inlet pipe 3 to one of the exhaust gas delivery pipes 2. The temperature control unit 5 is installed on the support frame 1 and the plurality of exhaust gas conveying pipes 2, and is used to collect low-grade waste heat generated during the semiconductor manufacturing process and maintain the temperature inside the plurality of exhaust gas conveying pipes 2. Connecting part 6, which is mounted on the support frame 1, is used to restrict the movement of the plurality of exhaust gas delivery pipes 2 on the support frame 1; In operation, exhaust gas generated by semiconductor process equipment enters the diversion section 4 through the inlet pipe 3. At this time, the drive motor 9, according to a preset program, rotates the internal sealing sleeve 8, aligning its specific vent 10 with the inlet of the corresponding exhaust gas delivery pipe 2. At the aligned position, the sealing ring 11 and the pressure ring 13 form a tight seal, ensuring that exhaust gas can only enter the selected exhaust gas delivery pipe 2, while other exhaust gas delivery pipes 2 are completely sealed. Thus, by switching and opening several vents 10, the system achieves the effect of accurately and on-demand delivering exhaust gas of different properties to different processing equipment through different exhaust gas delivery pipes 2, avoiding mixed pollution of exhaust gas and improving the treatment efficiency of single exhaust gas. The equipment improves processing efficiency, ensuring effective recovery and treatment of different exhaust gases. This achieves refined management of exhaust gas recovery, effectively improving recovery efficiency. Furthermore, while transporting exhaust gases, the constant temperature unit 5 operates. The fan 20 draws waste heat from the semiconductor processing equipment into several heating boxes 24 through the gas delivery pipe 21. Under the secondary heating effect of the heaters in the heating boxes 24, the exhaust gases are then fed into several heating covers 14, continuously keeping the exhaust gas delivery pipes 2 warm. The heaters can effectively regulate the temperature, ensuring that no condensation or crystallization occurs during the transport of different exhaust gases, thus ensuring stable exhaust gas recovery and treatment.

[0018] Optionally, the diversion section 4 includes a diversion shell 7 fixed on the support frame 1, a sealing sleeve 8 rotatably installed inside the diversion shell 7, a drive motor 9 fixed at one end of the diversion shell 7, a plurality of vents 10 arranged in a ring array on the sealing sleeve 8 and provided at different positions along the axial direction of the sealing sleeve 8. The output end of the drive motor 9 is fixedly connected to the enclosed sleeve 8; The intake pipe 3 is fixed to the splitter shell 7 and is connected to the sealing sleeve 8 through a rotary joint; Each of the exhaust gas delivery pipes 2 is connected to the diversion shell 7, and each of the ventilation ports 10 corresponds to one of the exhaust gas delivery pipes 2. In use, the drive motor 9 drives the closed sleeve 8 to rotate inside the diverter housing 7. The closed sleeve 8 is a hollow cylinder, and its internal cavity is always connected to the intake pipe 3 through a rotary joint, thus ensuring that the exhaust gas source continuously enters the interior of the closed sleeve 8. On the wall of the closed sleeve 8, there are multiple vents 10. These vents 10 are not on the same circumference, but are distributed at different positions along the axis of the closed sleeve 8. Therefore, when the closed sleeve 8 rotates to a certain angle, one of the vents 10 on its wall will be aligned with the connection port of one of the exhaust gas delivery pipes 2 on the diverter housing 7. At this time, the exhaust gas enters the closed sleeve 8 from the intake pipe 3. The gas can only flow out through the aligned vent 10 and enter the corresponding exhaust gas delivery pipe 2. When a channel needs to be switched, the sealing sleeve 8 is controlled to rotate, and the previously aligned vent 10 will leave its docking position until the next designated vent 10 rotates to the position aligned with the inlet of the corresponding exhaust gas delivery pipe 2. Once the switch is complete, a new channel is established, which facilitates quick changes to the exhaust gas delivery channel during use. This allows different exhaust gases to be sent to different, specialized exhaust gas treatment equipment through different exhaust gas delivery channels, effectively avoiding the mixing of different exhaust gases and realizing the classification and graded treatment of exhaust gases, thereby greatly improving the recovery efficiency and treatment effect.

[0019] Optionally, the diversion section 4 further includes a plurality of sealing rings 11 respectively fixed in a plurality of vents 10, and a plurality of pressing members 12 equally spaced in the diversion shell 7 and corresponding to the plurality of sealing rings 11 respectively. The pressure member 12 includes a pressure ring 13 that is fixed in a ring array on the inner wall of the diversion shell 7 and is adapted to the sealing ring 11. When the closed sleeve 8 is rotated to a specific position, the sealing ring 11 on one of the vents 10 forms a sliding seal with a corresponding pressure ring 13, and the vent 10 is connected to the corresponding exhaust gas delivery pipe 2. Several sealing rings 11 are respectively installed at several vents 10, and can rotate together with the sealing sleeve 8. The contact ring 13 is fixed on the inner wall of the diversion shell 7. When the sealing sleeve 8 rotates and controls one of the vents 10 to align with the corresponding exhaust gas delivery pipe 2, the sealing ring 11 on that vent 10 will come into contact with the corresponding contact ring 13 on the inner wall of the diversion shell 7. At the moment of contact, due to the rigid support of the contact ring 13 and the elasticity of the sealing ring 11 itself, the sealing ring 11 will be compressed, thereby achieving effective sealing. The sealing rings on the other vents 10 will also be compressed. The ring 11 will also contact the other pressure rings 13 on the inner wall of the diversion shell 7, effectively sealing the gaps between the inner walls of the diversion shell 7 at the edges of several vents 10, preventing exhaust gas from leaking into the other exhaust gas delivery pipes 2, ensuring that the airflow can only pass through the currently aligned vents 10 and exhaust gas delivery pipes 2, and ensuring that during the adjustment process, the sealing rings 11 will only experience compression wear when they contact the pressure rings 13 after rotating with the sealing sleeve 8 at a certain angle, effectively reducing the contact wear between the sealing rings 11 and the sealing sleeve 8, and significantly reducing long-term maintenance costs and downtime.

[0020] Optionally, the constant temperature unit 5 includes a plurality of heating covers 14 that are respectively fixedly sleeved on the outside of a plurality of exhaust gas conveying pipes 2 and form heating cavities between them and the outer walls of the plurality of exhaust gas conveying pipes 2; heat insulation sleeves 15 that are respectively fixed on the outer walls of the plurality of heating covers 14; a plurality of gas supply pipes 16 that are respectively connected to the lower side of one end of the plurality of heating covers 14; a plurality of exhaust pipes 17 that are respectively connected to the upper side of the other end of the plurality of heating covers 14; an upper gas collection pipe 18 that is connected to the plurality of exhaust pipes 17; and a plurality of first temperature sensors 19 that are equally spaced on the upper gas collection pipe 18 and respectively inserted into the plurality of exhaust pipes 17. The exhaust gas delivery pipe 2 serves as the inner pipe, and is covered by a heating cover 14, forming a heating cavity between the heating cover 14 and the exhaust gas delivery pipe 2. During use, hot gas from the waste heat equipment enters the heating cavity from the gas supply pipe 16 and flows out from the upper exhaust pipe 17, moving evenly within the heating cover 14 and naturally and smoothly filling the entire cavity. This effectively heats the exhaust gas delivery pipe 2, preventing condensable gases in the exhaust gas from condensing into liquids or solids due to temperature drops, thus avoiding pipe blockage, corrosion, and particulate matter generation. It also ensures that the exhaust gas delivery pipe 2 is heated evenly, avoiding localized overheating or underheating. Furthermore, the insulation cover 15 effectively reduces heat loss, improves thermal efficiency, and reduces energy consumption. Simultaneously, the upper gas collecting pipe 18 is equipped with first temperature sensors 19 corresponding to several exhaust gas delivery pipes 2, which can effectively monitor the temperature of the gas flowing out of each independent heating cavity. This allows for precise adjustment based on the required temperature of the exhaust gas in each exhaust gas delivery pipe 2, and timely detection of abnormal temperatures, facilitating maintenance.

[0021] Optionally, the constant temperature unit 5 includes a fan 20 disposed on one side of the support frame 1, an air supply pipe 21 with one end connected to the air inlet of the fan 20 and the other end connected to the exhaust end of an external waste heat collection device, a lower air collection pipe 22 connected to the exhaust end of the fan 20, an assembly frame 23 fixed in the support frame 1, a plurality of heating boxes 24 fixed at equal intervals in the assembly frame 23 and respectively connected to a plurality of air supply pipes 16, and a plurality of second temperature sensors 25 respectively installed in a plurality of heating boxes 24. The bottom of each of the heating boxes 24 is connected to the lower gas collection pipe 22; In semiconductor manufacturing processes, certain equipment, such as oxidation furnaces and diffusion furnaces, generates waste heat at relatively low temperatures during operation. During use, a fan 20 can directly extract this waste heat gas through a gas delivery pipe 21. The gas is then exchanged with a heat exchanger in an external preheating and collection device to extract the hot air. After being pressurized by the fan 20, the hot air is sent into the lower gas collection pipe 22 and evenly distributed into several heating chambers 24. At this time, the second temperature sensor 25 inside each heating chamber 24 can monitor the temperature of the hot air about to enter the heating cavity of the corresponding exhaust gas delivery pipe 2 in real time. When the temperature of the hot air provided by the external waste heat collection device is sufficient to maintain... When the required temperature is reached in the exhaust gas delivery pipe 2, the heaters in several heating boxes 24 do not start. However, when the residual heat is insufficient or different exhaust gases require different insulation temperatures, the heaters in several heating boxes 24 can precisely supplement the heating of the hot air passing through them, raising it to the set target temperature. This maintains the temperature of several exhaust gas pipes within an extremely precise range, avoiding the risk of exhaust gas condensation, crystallization, blockage, or even equipment shutdown due to excessively low pipe temperatures. Furthermore, the hot air passing through the heating boxes 24 is heated based on residual heat, effectively reducing cold source consumption.

[0022] Optionally, a check valve 26 is installed on each of the exhaust gas delivery pipes 2, and the exhaust ends of the exhaust gas delivery pipes 2 are respectively connected to different exhaust gas treatment devices. When the diversion section 4 introduces the exhaust gas into one of the specific exhaust gas delivery pipes 2, the pressure inside the pipe increases, and the airflow pushes the valve disc of the check valve 26 to open, allowing the exhaust gas to pass smoothly and flow to the processing equipment connected to the exhaust gas delivery pipe 2. When the pipe is no longer in use, under the action of spring force, gravity, or downstream reverse air pressure, the valve disc of the check valve 26 quickly closes, preventing the exhaust gas delivery pipe 2 from being blocked, thereby effectively preventing exhaust gas backflow and preventing gas or flame backflow into the processing equipment, ensuring the safety of the device. Since several exhaust gas delivery pipes 2 are connected to different processing equipment, different exhaust gases generated during semiconductor production can be input into different processing equipment through different exhaust gas delivery pipes 2 for processing, avoiding mixing between different exhaust gases and affecting the exhaust gas treatment effect, ensuring the high efficiency and reliability of exhaust gas recovery and treatment.

[0023] Optionally, the connecting part 6 includes a plurality of mounting seats 27 fixed to the upper surface of the support frame 1 and adapted to the plurality of exhaust gas conveying pipes 2, mounting grooves 28 respectively opened on the plurality of mounting seats 27 and adapted to the outer wall of the insulation sleeve 15, and a plurality of U-shaped fixing bolts 29 respectively fitted onto the outer wall of the plurality of insulation sleeves 15 and threadedly connected to the plurality of mounting seats 27; During assembly, the exhaust gas delivery pipe 2, which is wrapped with an insulation sleeve 15, is placed in the mounting slots 28 of several mounting bases 27. At this time, several U-shaped fixing bolts 29 are used to fasten the exhaust gas delivery pipe 2 from above and lock it with the threaded holes on both sides of the mounting base 27, thereby firmly fixing the exhaust gas delivery pipe 2 and preventing the pipe from shifting or vibrating under thermal expansion and contraction or airflow impact. This ensures the long-term stability of the equipment. When needed, it is only necessary to loosen the U-shaped fixing bolts 29 on the corresponding exhaust gas delivery pipe 2 to lift out the section of exhaust gas delivery pipe 2 for maintenance, which is convenient to use.

[0024] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas, characterized in that, include: The support frame (1) is provided with several exhaust gas delivery pipes (2) at equal intervals. Inlet pipe (3) is used to connect to the exhaust port of semiconductor process equipment; The diversion section (4) is fixed on the support frame (1), and the air inlet of the diversion section (4) is connected to the air inlet pipe (3). The air inlet ends of several exhaust gas delivery pipes (2) are connected to several exhaust ports of the diversion section (4) for selectively connecting the air inlet pipe (3) to one of the exhaust gas delivery pipes (2). The temperature control unit (5) is installed on the support frame (1) and a plurality of exhaust gas conveying pipes (2) to collect low-grade waste heat generated during the semiconductor manufacturing process and maintain the temperature inside the plurality of exhaust gas conveying pipes (2). A connecting part (6) is mounted on the support frame (1) to restrict the movement of a plurality of exhaust gas delivery pipes (2) on the support frame (1).

2. The multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas as described in claim 1, characterized in that, The diversion section (4) includes a diversion shell (7) fixed on the support frame (1), a closed sleeve (8) rotatably installed inside the diversion shell (7), a drive motor (9) fixed at one end of the diversion shell (7), a ring array of openings on the closed sleeve (8), and several vents (10) set at different positions along the axis of the closed sleeve (8). The output end of the drive motor (9) is fixedly connected to the closed sleeve (8); The intake pipe (3) is fixed to the splitter shell (7) and is connected to the sealing sleeve (8) through a rotary joint; Several of the exhaust gas delivery pipes (2) are connected to the diversion shell (7), and several of the air inlets (10) correspond one-to-one with several of the exhaust gas delivery pipes (2).

3. The multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas as described in claim 2, characterized in that, The diversion section (4) also includes several sealing rings (11) fixed in several of the air vents (10), and several pressure members (12) equally spaced in the diversion shell (7) and corresponding to several of the sealing rings (11). The pressure member (12) includes a pressure ring (13) fixed in a ring array on the inner wall of the diversion shell (7) and adapted to the sealing ring (11). When the closed sleeve (8) is rotated to a specific position, the sealing ring (11) on one of the vents (10) forms a sliding seal with a corresponding pressure ring (13), and the vent (10) is connected to the corresponding exhaust gas delivery pipe (2).

4. The multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas as described in claim 3, characterized in that, The constant temperature unit (5) includes several heating covers (14) that are fixedly sleeved on the outside of several exhaust gas delivery pipes (2) and form heating cavities between them and the outer walls of several exhaust gas delivery pipes (2); heat insulation sleeves (15) that are fixed on the outer walls of several heating covers (14); several gas supply pipes (16) that are connected to the lower side of one end of several heating covers (14); several exhaust pipes (17) that are connected to the upper side of the other end of several heating covers (14); an upper gas collection pipe (18) that is connected to several exhaust pipes (17); and several first temperature sensors (19) that are installed at equal intervals on the upper gas collection pipe (18) and inserted into several exhaust pipes (17).

5. The multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas as described in claim 4, characterized in that, The constant temperature unit (5) includes a fan (20) disposed on one side of the support frame (1), an air supply pipe (21) with one end connected to the air inlet of the fan (20) and the other end connected to the exhaust end of an external waste heat collection device, a lower air collection pipe (22) connected to the exhaust end of the fan (20), an assembly frame (23) fixed in the support frame (1), several heating boxes (24) fixed at equal intervals in the assembly frame (23) and connected to several air supply pipes (16) respectively, and several second temperature sensors (25) respectively installed in several heating boxes (24). The bottom of several of the heating boxes (24) is connected to the lower gas collection pipe (22).

6. The multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas as described in claim 5, characterized in that, Each of the aforementioned exhaust gas delivery pipes (2) is equipped with a check valve (26), and the exhaust ends of the aforementioned exhaust gas delivery pipes (2) are respectively connected to different exhaust gas treatment devices.

7. The multi-channel diversion device for high-efficiency recovery of semiconductor exhaust gas as described in claim 4, characterized in that, The connecting part (6) includes a plurality of mounting seats (27) fixed on the upper surface of the support frame (1) and adapted to the plurality of exhaust gas conveying pipes (2), mounting grooves (28) respectively opened on the plurality of mounting seats (27) and adapted to the outer wall of the insulation sleeve (15), and a plurality of U-shaped fixing bolts (29) respectively fitted on the outer wall of the plurality of insulation sleeves (15) and threadedly connected to the plurality of mounting seats (27).

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