An LED module structure

By introducing positioning, stable assembly, and efficient heat dissipation mechanisms into the LED module structure, the problems of inconvenient installation and low heat dissipation efficiency are solved, achieving fast and stable installation and efficient heat dissipation, thus extending the service life of the LED module.

CN224944694UActive Publication Date: 2026-11-06XIAMEN XINRUIQI TECH CO LTD
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Patent Information

Application Number
CN202522683978.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-18
Publication Date
2026-11-06
Estimated Expiration
2035-12-18

AI Technical Summary

Technical Problem

Existing LED module structures are not quick or convenient to install, the installation effect is not stable enough, and the heat dissipation efficiency is low, which affects the service life.

Method used

It employs a positioning and installation mechanism, a stable assembly mechanism, and a high-efficiency heat dissipation mechanism, including components such as positioning posts, fastening screws, anti-loosening sleeves, and heat dissipation fins, to achieve rapid and stable installation and efficient heat dissipation of PCB circuit boards.

Benefits of technology

It enables rapid and stable installation of LED module structures, avoids loosening, improves heat dissipation efficiency, and extends service life.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224944694U_ABST
Patent Text Reader

Abstract

This utility model relates to the field of LED module structure technology, specifically an LED module structure, including a module frame. A stable assembly mechanism is provided on the surface of the PCB circuit board and the inner wall of the module frame. An efficient heat dissipation mechanism is provided on the surface of the module frame. A positioning and mounting mechanism is provided on the inner wall of the PCB circuit board and the surface of the positioning posts. This utility model not only makes the assembly of the LED module structure between the module frame and the PCB circuit board faster and more convenient, and makes the LED module structure easier to operate during use, but also ensures the firmness of the assembled module frame and PCB circuit board, preventing loosening. Furthermore, it improves the heat dissipation efficiency of the LED module structure during use, preventing overheating from affecting the lifespan of the LED module structure.
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Description

Technical Field

[0001] This utility model relates to the field of LED module structure technology, specifically to an LED module structure. Background Technology

[0002] With the development of LED technology, LED modules have been increasingly used in the lighting field. LED modules used for lighting typically include a bottom and a cover plate. The cavity formed by the two contains a circuit board, and the circuit board has lighting components. The lighting components include multiple LED particles, and the LED particles are coated with a fluorescent adhesive made of phosphor and glue. However, the existing LED module structure has some shortcomings in use. In order to meet the needs of the market, an LED module structure is needed.

[0003] Existing LED module structures cannot be positioned and installed, making assembly between the module frame and PCB circuit board slow and inconvenient, thus hindering operation. Furthermore, the installation stability of existing LED module structures is insufficient, making it difficult to guarantee the secure connection between the module frame and PCB circuit board, leading to potential loosening. In addition, the heat dissipation efficiency of existing LED module structures is inadequate, making them prone to overheating and shortening their lifespan. Utility Model Content

[0004] The purpose of this utility model is to provide an LED module structure to solve the problems mentioned in the background art, such as the inability to position and install LED module structures, insufficient installation stability, and low heat dissipation efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an LED module structure, including a module frame, a frame installed on the inner wall of the module frame, the bottom end of the frame extending to the outer side of the module frame, multiple sets of grooves arrayed on the surface of the frame, multiple sets of positioning posts arrayed on the surface of the frame, multiple sets of mounting posts arrayed on the surface of the grooves on the inner wall of the module frame, a PCB circuit board disposed on the surface of the module frame, a stable assembly mechanism disposed on the surface of the PCB circuit board and the inner wall of the module frame, a high-efficiency heat dissipation mechanism disposed on the surface of the module frame, and a positioning and mounting mechanism disposed on the inner wall of the PCB circuit board and the surface of the positioning posts.

[0006] Preferably, the PCB circuit board has multiple sets of LED beads for lighting mounted on its surface array, with the bottom ends of the LED beads extending into the interior of the groove.

[0007] Preferably, the positioning and installation mechanism includes a positioning rod, an elastic clip, an arc-shaped slot, a positioning groove, a positioning slot and a positioning clip. The surface of the mounting column is provided with a positioning groove. Multiple sets of positioning rods are arrayed on the surface of the bottom position of the PCB circuit board. The bottom end of the positioning rod extends into the interior of the positioning groove. Two sets of elastic clips are symmetrically installed on the surface of the positioning rod.

[0008] Preferably, the inner wall of the positioning post is provided with an arc-shaped groove for engaging with the elastic clip, the arc-shaped groove engaging with the surface of the elastic clip, the top of the positioning post is provided with a positioning groove, and the surface of the PCB circuit board is provided with a positioning clip for engaging with the positioning groove.

[0009] Preferably, the stabilizing assembly mechanism includes a fastening screw, an anti-loosening screw sleeve, an assembly screw hole, and a fixing seat. Four sets of fixing seats are symmetrically installed on the inner wall of the module frame. The surface of the fixing seat is provided with an assembly screw hole, and the surface of the PCB circuit board is provided with an anti-loosening screw sleeve.

[0010] Preferably, the surface of the anti-loosening sleeve is threaded with a fastening screw, the bottom end of which passes through the anti-loosening sleeve and the PCB circuit board in sequence and is threadedly fastened to the inner wall of the assembly screw hole, and the anti-loosening sleeve and the fastening screw cooperate with each other.

[0011] Preferably, the high-efficiency heat dissipation mechanism consists of heat dissipation fins, mounting bolts, mounting screw holes, and heat dissipation through holes. The surface array of the module frame has multiple sets of heat dissipation through holes, which are connected to the interior of the module frame. The surface array of the module frame is provided with multiple sets of heat dissipation fins.

[0012] Preferably, the surface of the heat dissipation fins is symmetrically provided with four sets of mounting screw holes, and the surface of the heat dissipation fins is threaded with mounting bolts. One end of the mounting bolt passes through the mounting screw hole and is fastened to the surface of the module frame by threads.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the LED module structure not only makes the assembly of the LED module frame and PCB circuit board quicker and more convenient, but also makes the LED module structure easier to operate during use, and ensures the firmness of the assembly between the module frame and PCB circuit board, making it less likely for the module frame and PCB circuit board to loosen, but also makes the heat dissipation efficiency of the LED module structure higher during use, and will not affect the service life of the LED module structure due to overheating;

[0014] 1. By setting up a positioning and installation mechanism, the positioning slot on the surface of the positioning column automatically engages with the inside of the positioning clip. Under the engaging action of the positioning slot and the positioning clip, the PCB circuit board is positioned and installed. After the PCB circuit board is positioned and installed in place, the positioning rod at the bottom of the PCB circuit board automatically engages with the inside of the positioning groove on the surface of the positioning column. At this time, the elastic clip on the surface of the positioning rod automatically engages with the inside of the arc-shaped clip. Under the engaging action of the elastic clip and the arc-shaped clip, the stability of the positioning rod when installed inside the positioning groove is improved. This realizes the function of positioning and installing the PCB circuit board in the LED module structure, making it faster and more convenient to assemble the LED module structure between the module frame and the PCB circuit board, and making the LED module structure easier to operate during use.

[0015] 2. With a robust assembly mechanism, users tighten the fastening screws, and the PCB circuit board is installed on the surface of the module frame through the threaded engagement between the fastening screws and the assembly screw holes on the surface of the fixing base. The anti-loosening sleeve prevents the fastening screws from accidentally coming loose. The cooperation between the fastening screws and the anti-loosening sleeve ensures the PCB circuit board is firmly installed on the surface of the module frame, making the PCB circuit board more stable. This facilitates user operation when assembling and disassembling the PCB circuit board, achieving the function of stable installation of the LED module structure. This ensures the firmness of the assembly between the module frame and the PCB circuit board during use, making it less likely for the module frame and the PCB circuit board to come loose.

[0016] 3. With an efficient heat dissipation mechanism, users place the heat dissipation fins on the surface of the module frame, place the mounting bolts on the surface of the mounting screw holes, and then tighten the mounting bolts. Under the action of the mounting bolts, the heat dissipation fins are installed on the surface of the module frame. The heat generated by the PCB circuit board and LED beads during operation is dissipated through the heat dissipation holes on the inner wall of the module frame, and the heat is conducted to the surface of the heat dissipation fins. The heat dissipation fins efficiently dissipate the heat generated by the PCB circuit board and LED beads during operation, avoiding overheating of the PCB circuit board and LED beads. This achieves the function of efficient heat dissipation of the LED module structure, thereby making the heat dissipation efficiency of the LED module structure higher during use and preventing overheating from affecting the service life of the LED module structure. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 3 This is a schematic diagram of the main appearance structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the front cross-sectional structure of this utility model;

[0021] Figure 5 For the present utility model Figure 4 Enlarged structural diagram of the positioning and installation mechanism;

[0022] Figure 6 For the present utility model Figure 4 Enlarged schematic diagram of the middle section;

[0023] Figure 7 For the present utility model Figure 4 Enlarged structural diagram of a medium-to-high efficiency heat dissipation mechanism.

[0024] In the diagram: 1. Module frame; 10. PCB circuit board; 11. Frame; 12. Positioning post; 13. Slot; 14. LED bead; 15. Mounting post; 2. Positioning and mounting mechanism; 21. Positioning rod; 22. Elastic clip; 23. Arc-shaped slot; 24. Positioning slot; 25. Positioning slot; 26. Positioning clip; 3. Stable assembly mechanism; 31. Fastening screw; 32. Anti-loosening screw sleeve; 33. Assembly screw hole; 34. Fixing base; 4. High-efficiency heat dissipation mechanism; 41. Heat dissipation fins; 42. Mounting bolt; 43. Mounting screw hole; 44. Heat dissipation through hole. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance. At the same time, in the description of the present utility model, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0026] The structure of the LED module provided by this utility model is as follows: Figures 1 to 4As shown, the module includes a module frame 1, with a frame 11 installed on the inner wall of the module frame 1. The bottom end of the frame 11 extends to the outer side of the module frame 1. Multiple slots 13 are arrayed on the surface of the frame 11. Multiple positioning posts 12 are arrayed on the surface of the frame 11. Multiple mounting posts 15 are arrayed on the surface of the slots 13 on the inner wall of the module frame 1. A PCB circuit board 10 is provided on the surface of the module frame 1. Multiple LED beads 14 for lighting are arrayed on the surface of the PCB circuit board 10. The bottom end of the LED beads 14 extends into the interior of the slots 13.

[0027] Furthermore, such as Figure 4 and Figure 6 As shown, a stabilizing assembly mechanism 3 is provided on the surface of the PCB circuit board 10 and the inner wall of the module frame 1. The stabilizing assembly mechanism 3 includes a fastening screw 31, an anti-loosening sleeve 32, an assembly screw hole 33, and a fixing seat 34. Four sets of fixing seats 34 are symmetrically installed on the inner wall of the module frame 1. The surface of the fixing seat 34 is provided with an assembly screw hole 33. An anti-loosening sleeve 32 is installed on the surface of the PCB circuit board 10. The fastening screw 31 is threadedly connected to the surface of the anti-loosening sleeve 32. The bottom end of the fastening screw 31 passes through the anti-loosening sleeve 32 and the PCB circuit board 10 in sequence and is threadedly fastened to the inner wall of the assembly screw hole 33. The anti-loosening sleeve 32 and the fastening screw 31 cooperate with each other.

[0028] During implementation, after the PCB circuit board 10 is positioned on the surface of the module frame 1, the user tightens the fastening screw 31. With the threaded engagement between the fastening screw 31 and the assembly screw hole 33 on the surface of the fixing seat 34, the PCB circuit board 10 is installed on the surface of the module frame 1. The anti-loosening sleeve 32 can prevent the fastening screw 31 from accidentally loosening. The cooperation between the fastening screw 31 and the anti-loosening sleeve 32 can ensure the firmness of the PCB circuit board 10 when installed on the surface of the module frame 1, making the PCB circuit board 10 more stable when installed on the surface of the module frame 1. This makes it easier for the user to operate when installing and removing the PCB circuit board 10, thus achieving the function of stable installation of the LED module structure.

[0029] Furthermore, such as Figures 4 to 6 As shown, the surface of the module frame 1 is provided with a high-efficiency heat dissipation mechanism 4. The high-efficiency heat dissipation mechanism 4 consists of heat dissipation fins 41, mounting bolts 42, mounting screw holes 43 and heat dissipation through holes 44. Multiple sets of heat dissipation through holes 44 are arrayed on the surface of the module frame 1. The heat dissipation through holes 44 are connected to the interior of the module frame 1. Multiple sets of heat dissipation fins 41 are arrayed on the surface of the module frame 1. Four sets of mounting screw holes 43 are symmetrically opened on the surface of the heat dissipation fins 41. Mounting bolts 42 are threadedly connected to the surface of the heat dissipation fins 41. One end of the mounting bolt 42 passes through the mounting screw hole 43 and is threadedly fastened to the surface of the module frame 1.

[0030] During implementation, the user places the heat dissipation fins 41 on the surface of the module frame 1, places the mounting bolts 42 on the surface of the mounting screw holes 43, and then tightens the mounting bolts 42. Under the action of the mounting bolts 42, the heat dissipation fins 41 are installed on the surface of the module frame 1. The heat generated by the PCB circuit board 10 and the LED beads 14 during operation is dissipated through the heat dissipation holes 44 on the inner wall of the module frame 1. The heat is conducted to the surface of the heat dissipation fins 41, and the heat generated by the PCB circuit board 10 and the LED beads 14 during operation is efficiently dissipated through the heat dissipation fins 41, so as to avoid the phenomenon of excessive temperature of the PCB circuit board 10 and the LED beads 14 during operation, thereby realizing the function of efficient heat dissipation of the LED module structure.

[0031] Furthermore, such as Figure 2 and Figure 4 As shown, the inner wall of the PCB circuit board 10 and the surface of the positioning post 12 are provided with a positioning mounting mechanism 2. The positioning mounting mechanism 2 includes a positioning rod 21, an elastic clip 22, an arc-shaped clip 23, a positioning groove 24, a positioning clip 25, and a positioning clip 26. The surface of the mounting post 15 is provided with a positioning groove 24. Multiple sets of positioning rods 21 are arrayed on the surface of the bottom position of the PCB circuit board 10. The bottom end of the positioning rod 21 extends into the interior of the positioning groove 24. Two sets of elastic clips 22 are symmetrically installed on the surface of the positioning rod 21. The inner wall of the positioning post 12 is provided with an arc-shaped clip 23 for engaging with the elastic clip 22. The arc-shaped clip 23 engages with the surface of the elastic clip 22. The surface of the positioning post 12 is provided with a positioning clip 25. The surface of the PCB circuit board 10 is provided with a positioning clip 26 for engaging with the positioning clip 25.

[0032] During implementation, when the PCB circuit board 10 is placed on the surface of the module frame 1, the positioning slot 25 on the surface of the positioning post 12 automatically engages with the inside of the positioning clip 26. Under the engaging action of the positioning slot 25 and the positioning clip 26, the PCB circuit board 10 is positioned and installed. After the PCB circuit board 10 is positioned and installed in place, the positioning rod 21 at the bottom of the PCB circuit board 10 automatically engages with the inside of the positioning groove 24 on the surface of the positioning post 12. At this time, the elastic clip 22 on the surface of the positioning rod 21 automatically engages with the inside of the arc-shaped clip 23. Under the engaging action of the elastic clip 22 and the arc-shaped clip 23, the stability of the positioning rod 21 when installed inside the positioning groove 24 can be improved, so as to realize the function of positioning and installing the PCB circuit board 10 by the LED module structure.

[0033] Working principle: In use, first place the module frame 1 in the designated position, then place the PCB circuit board 10 on the surface of the module frame 1. The LED beads 14 on the surface of the PCB circuit board 10 move to the surface of the slot 13, and the PCB circuit board 10 controls the LED beads 14 to emit light for illumination. When the PCB circuit board 10 is placed on the surface of the module frame 1, the positioning slot 25 on the surface of the positioning post 12 automatically engages with the inside of the positioning clip 26. Under the engaging action of the positioning slot 25 and the positioning clip 26, the PCB circuit board 10 is positioned and installed. After the PCB circuit board 10 is positioned and installed in place... The positioning rod 21 at the bottom of the PCB circuit board 10 automatically engages with the positioning groove 24 on the surface of the positioning post 12. At this time, the elastic clip 22 on the surface of the positioning rod 21 automatically engages with the arc-shaped groove 23. The engagement of the elastic clip 22 and the arc-shaped groove 23 can improve the stability of the positioning rod 21 when it is installed in the positioning groove 24, so as to realize the function of positioning and installing the PCB circuit board 10 by the LED module structure. This makes it faster and more convenient to assemble the LED module structure between the module frame 1 and the PCB circuit board 10, and makes the LED module structure easier to operate during use.

[0034] Subsequently, after the PCB circuit board 10 is positioned on the surface of the module frame 1, the user tightens the fastening screw 31. With the threaded engagement of the fastening screw 31 and the assembly screw hole 33 on the surface of the fixing seat 34, the PCB circuit board 10 is installed on the surface of the module frame 1. The anti-loosening sleeve 32 can prevent the fastening screw 31 from accidentally coming loose. The cooperation between the fastening screw 31 and the anti-loosening sleeve 32 can ensure the firmness of the PCB circuit board 10 when it is installed on the surface of the module frame 1, making the PCB circuit board 10 more stable when installed on the surface of the module frame 1. This makes it easier for the user to operate when installing and removing the PCB circuit board 10, so as to achieve the function of stable installation of the LED module structure. This ensures the firmness of the assembly between the module frame 1 and the PCB circuit board 10 when the LED module structure is used, making it less likely for the module frame 1 and the PCB circuit board 10 to come loose.

[0035] Subsequently, the user places the heat dissipation fins 41 on the surface of the module frame 1, places the mounting bolts 42 on the surface of the mounting screw holes 43, and then tightens the mounting bolts 42. Under the action of the mounting bolts 42, the heat dissipation fins 41 are installed on the surface of the module frame 1. The heat generated by the PCB circuit board 10 and the LED beads 14 during operation is dissipated through the heat dissipation holes 44 on the inner wall of the module frame 1. The heat is conducted to the surface of the heat dissipation fins 41, which efficiently dissipates the heat generated by the PCB circuit board 10 and the LED beads 14 during operation, avoiding the phenomenon of overheating of the PCB circuit board 10 and the LED beads 14 during operation. This achieves the function of efficient heat dissipation of the LED module structure, thereby making the heat dissipation efficiency of the LED module structure higher during use and preventing the lifespan of the LED module structure from being affected by overheating. Finally, the use of the LED module structure is completed.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An LED module structure comprising a module frame body (1), characterized in that: The inner wall of the module frame (1) is fitted with a frame (11), the bottom of which extends to the outer side of the module frame (1). The surface of the frame (11) is arrayed with multiple sets of grooves (13). The surface of the frame (11) is arrayed with multiple sets of positioning posts (12). The surface of the grooves (13) on the inner wall of the module frame (1) is arrayed with multiple sets of mounting posts (15). The surface of the module frame (1) is provided with a PCB circuit board (10). The surface of the PCB circuit board (10) and the inner wall of the module frame (1) are provided with a stable assembly mechanism (3). The surface of the module frame (1) is provided with a high-efficiency heat dissipation mechanism (4). The inner wall of the PCB circuit board (10) and the surface of the positioning posts (12) are provided with a positioning installation mechanism (2).

2. The LED module structure of claim 1, wherein: The PCB circuit board (10) has multiple sets of LED beads (14) for lighting mounted on its surface array, with the bottom end of the LED beads (14) extending into the interior of the groove (13).

3. The LED module structure according to claim 1, characterized in that: The positioning and mounting mechanism (2) includes a positioning rod (21), an elastic clip (22), an arc-shaped slot (23), a positioning groove (24), a positioning slot (25), and a positioning clip (26). The mounting post (15) has a positioning groove (24) on its surface. Multiple sets of positioning rods (21) are arrayed on the surface of the bottom of the PCB circuit board (10). The bottom end of the positioning rod (21) extends into the interior of the positioning groove (24). Two sets of elastic clips (22) are symmetrically installed on the surface of the positioning rod (21).

4. The LED module structure of claim 1, wherein: The inner wall of the positioning post (12) is provided with an arc-shaped slot (23) for engaging with the elastic clip (22). The arc-shaped slot (23) engages with the surface of the elastic clip (22). A positioning slot (25) is installed on the surface at the top of the positioning post (12). A positioning clip (26) is provided on the surface of the PCB circuit board (10) for engaging with the positioning slot (25).

5. The LED module structure according to claim 1, characterized in that: The stabilizing assembly mechanism (3) includes a fastening screw (31), an anti-loosening screw sleeve (32), an assembly screw hole (33), and a fixing seat (34). Four sets of fixing seats (34) are symmetrically installed on the inner wall of the module frame (1). The surface of the fixing seat (34) is provided with an assembly screw hole (33), and the surface of the PCB circuit board (10) is provided with an anti-loosening screw sleeve (32).

6. The LED module structure according to claim 5, characterized in that: The surface of the anti-loosening sleeve (32) is threaded with a fastening screw (31). The bottom end of the fastening screw (31) passes through the anti-loosening sleeve (32) and the PCB circuit board (10) in sequence and is threadedly fastened to the inner wall of the assembly screw hole (33). The anti-loosening sleeve (32) and the fastening screw (31) cooperate with each other.

7. The LED module structure according to claim 1, characterized in that: The high-efficiency heat dissipation mechanism (4) is composed of heat dissipation fins (41), mounting bolts (42), mounting screw holes (43) and heat dissipation through holes (44). Multiple sets of heat dissipation through holes (44) are arranged on the surface of the module frame (1). The heat dissipation through holes (44) are connected to the interior of the module frame (1). Multiple sets of heat dissipation fins (41) are arranged on the surface of the module frame (1).

8. The LED module structure of claim 7, wherein: The surface of the heat dissipation fins (41) is symmetrically provided with four sets of mounting screw holes (43), and the surface of the heat dissipation fins (41) is threaded with mounting bolts (42). One end of the mounting bolts (42) passes through the mounting screw holes (43) and is threadedly fastened to the surface of the module frame (1).