A lighting device for the edge-break module of a silicon wafer sorting machine

Abstract

This application relates to the field of light source heat dissipation technology, and discloses a lighting device for a silicon wafer sorting machine edge-breaking module. It includes a housing, a light strip, a flow guiding unit, and a heat dissipation unit. The housing is generally arranged in a strip-shaped hollow frustum configuration, with the cross-sectional area of ​​the bottom being smaller than that of the top. A light-transmitting hole is provided at the bottom of the housing along its length. The light strip is rectangular and positioned on the bottom of the inner wall of the housing near the light-transmitting hole. Multiple flow guiding units are located on the light strip away from the light-transmitting hole and are arranged along the length of the light strip, forming a top heat dissipation channel between the flow guiding units and the light strip. Multiple heat dissipation units are provided, each positioned between two adjacent flow guiding units. This application facilitates heat dissipation of the light source.

Description

Technical Field

[0001] This application relates to the field of light source heat dissipation technology, and in particular to a lighting device for a silicon wafer sorting machine edge-breaking module. Background Technology

[0002] Fully automated silicon wafer sorting machines are indispensable high-precision, high-efficiency final inspection equipment in the fields of solar photovoltaic and semiconductor wafer manufacturing. In this sorting machine, the edge chipping detection module is a crucial unit for ensuring the mechanical integrity of silicon wafers and the yield of subsequent processes.

[0003] Edge chipping detection modules are typically built on machine vision principles. Their operating mode uses a strip light source at a specific angle to illuminate the edge contour of the silicon wafer at a low-angle grazing motion. When light is projected onto a complete, smooth, chamfered surface, regular specular reflection occurs, forming a continuous, uniform, bright band in the camera's field of view. However, if edge chipping defects exist in the illuminated area, the original optical interface morphology is disrupted, and the incident light undergoes disordered diffuse scattering. This abrupt change in the optical signal is represented in the acquired image as a local dark area or abnormal bright spot, which is then identified and located by the higher-level image processing algorithm.

[0004] As the semiconductor and photovoltaic industries move towards larger sizes and higher power, the diameter of silicon wafers continues to increase. Against this backdrop, traditional edge chipping detection modules, due to the limited length of their strip light sources, struggle to maintain uniform illumination intensity across the entire edge area of ​​large-sized silicon wafers.

[0005] At the edges far from the center of the light source, the light intensity decreases significantly, forming dark areas. On the one hand, the system may misjudge the image shadows caused by insufficient lighting as edge chipping defects, resulting in false positives and increasing unnecessary re-inspection costs. On the other hand, small-scale edge chipping defects that actually exist in the dark areas may be ignored by the system due to the low signal-to-noise ratio, causing false negatives and creating potential quality problems for subsequent processes.

[0006] To address the uneven illumination caused by insufficient light source coverage, those skilled in the art typically opt for lengthening the light source. However, increasing the length of the light source directly leads to increased operating power, resulting in more significant heat accumulation. Excessively high operating temperatures will drastically shorten the lifespan of the light source, causing light intensity attenuation, wavelength drift, and even direct device failure, ultimately reducing the reliability and stability of the detection system. Utility Model Content

[0007] To facilitate heat dissipation from the light source, this application provides a lighting device for the edge-breaking module of a silicon wafer sorting machine.

[0008] The lighting device for the chipped edge module of a silicon wafer sorting machine provided in this application adopts the following technical solution: A lighting device for a chipped edge module of a silicon wafer sorting machine includes a housing, a light strip, a heat guiding unit, and a heat dissipation unit, wherein: The outer shell is generally arranged in the form of a hollow frustum in the shape of a strip. The cross-sectional area of ​​the bottom of the outer shell is smaller than that of the top of the outer shell. The bottom of the outer shell has a light-transmitting hole along its own length. The light strip is arranged in a rectangular shape and is located at the bottom of the inner wall of the housing near the light-transmitting hole. The flow guiding unit is located on the light strip away from the light-transmitting hole, and multiple units are provided along the length of the light strip. A top heat dissipation channel is formed between the flow guiding unit and the light strip. The heat dissipation unit is provided in multiple ways, and each heat dissipation unit is located between two adjacent flow guiding units.

[0009] Optionally, positioning units are provided on the inner sidewalls of the outer casing that are close to each other along the length direction of the outer casing; A positioning channel is formed between the two positioning units; The light strip, the flow guiding unit, and the heat dissipation unit are all located inside the positioning channel.

[0010] Optionally, the positioning unit includes multiple positioning plates, which are distributed along the length of the outer casing. A lateral heat dissipation channel is formed between two adjacent positioning plates.

[0011] Optionally, the flow guiding unit includes a reference block and a flow guiding ring, wherein: The flow guide ring is sleeved on the outside of the reference block, and multiple flow guide rings are provided along the axial direction of the flow guide ring, with a top heat dissipation channel formed between two adjacent flow guide rings; The axial direction of the flow guide ring is perpendicular to the length direction of the outer shell; The outer wall of the flow guide ring is in contact with the top of the light strip.

[0012] Optionally, a placement notch is provided at the top of the sidewalls of two adjacent flow guiding units; The outer wall of the heat dissipation unit is provided with a support block, which is located at the placement notch.

[0013] Optionally, there is a certain gap between the heat dissipation unit and the top of the light strip.

[0014] Optionally, the inner top of the housing may be removably fitted with a sealing plate; The sealing plate presses against the flow guiding unit and the heat dissipation unit.

[0015] Optionally, the cover plate has an opening for cables to pass through.

[0016] In summary, this application includes at least one of the following beneficial technical effects: 1. The heat dissipation unit simultaneously draws hot air from the top and side channels and exhausts it to the outside, achieving continuous forced cooling of the LED strip. Meanwhile, the airflow guide ring is in direct contact with the LED strip, transferring heat to the ring and increasing the heat dissipation area. 2. The sealing plate eliminates gaps between components by pressing all flow guiding and heat dissipation units downwards, preventing displacement or loosening in a vibrating environment and ensuring the long-term stability and consistency of the lighting optical path; 3. The positioning channel formed by the positioning unit simplifies the installation process of the light strip, the flow guiding unit and the heat dissipation unit, avoids the tedious process of adjusting each one individually, and ensures the consistency of the product and the assembly accuracy. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0018] Figure 2 This is a schematic diagram illustrating the relative positions of the airflow guiding unit and the heat dissipation unit in an embodiment of this application.

[0019] Figure 3 This is a schematic diagram illustrating the relative positions of the positioning plate and the outer shell in an embodiment of this application.

[0020] Figure 4 This is a schematic diagram illustrating the structure of the flow guiding unit in the embodiments of this application.

[0021] Explanation of reference numerals in the attached figures: 1. Outer shell; 11. Light-transmitting hole; 12. Positioning channel; 13. Positioning plate; 14. Side heat dissipation channel; 2. Light strip; 3. Flow guiding unit; 31. Reference block; 32. Flow guiding ring; 33. Top heat dissipation channel; 34. Placement notch; 4. Heat dissipation unit; 41. Support block; 5. Sealing plate; 51. Opening. Detailed Implementation

[0022] The following is in conjunction with the appendix Figures 1-4 This application will be described in further detail.

[0023] This application discloses a lighting device for the edge-break module of a silicon wafer sorting machine.

[0024] A lighting device for a silicon wafer sorting machine edge-breaking module mainly consists of a housing 1, a light strip 2, a flow guiding unit 3, and a heat dissipation unit 4. The housing 1 is designed as a strip-shaped hollow frustum, with a geometric feature of being wider at the top and narrower at the bottom, and the bottom cross-sectional area is smaller than the top. A light-transmitting hole 11 is provided along the length of the bottom of the housing 1. The light strip 2 is a rectangular strip structure, installed inside the housing 1 and adjacent to the bottom light-transmitting hole 11. On the side of the light strip 2 facing away from the light-transmitting hole 11, multiple flow guiding units 3 are arranged in an array along its length, together defining a continuous top heat dissipation channel 33. Furthermore, multiple heat dissipation units 4 are respectively disposed between two adjacent flow guiding units 3.

[0025] The frustum-shaped outer shell 1, wider at the top and narrower at the bottom, ensures structural strength while providing space for internal airflow. Light emitted from the lamp strip 2 is projected through a narrow, elongated light-transmitting hole 11 at the bottom, creating low-angle sweeping illumination. During operation, the lamp strip 2 is powered on and emits light, which is then evenly distributed across the edge of the silicon wafer through the light-transmitting hole 11. The generated heat is guided by air convection into the top heat dissipation channel 33 formed by the lamp strip 2 and the airflow guiding unit 3. Simultaneously, the heat dissipation unit 4, installed between the airflow guiding units 3, activates, actively and rapidly expelling the hot air accumulated in the channel, achieving continuous and efficient cooling of the lamp strip 2.

[0026] A pair of positioning units are symmetrically arranged on the inner walls of both sides along the length of the outer casing 1. These two positioning units cooperate with each other to form a positioning channel 12 that runs through the entire length of the outer casing 1. The light strip 2, the flow guiding unit 3, and the heat dissipation unit 4 are all installed and fixed in the internal space of this positioning channel 12.

[0027] Positioning channel 12 simplifies the assembly process, avoiding the tedious process of individually adjusting multiple components and ensuring product consistency. The positioning unit consists of multiple positioning plates 13, which are arranged in an array along the length of the outer casing 1. The two adjacent positioning plates 13 are not closely arranged, but are separated by a specific gap, which together form a lateral heat dissipation channel 14 that communicates with the top heat dissipation channel 33.

[0028] The function of the heat dissipation unit 4 is to generate directional airflow, actively extract the hot airflow accumulated in the top heat dissipation channel 33 and the side heat dissipation channel 14, and finally discharge it to the outside of the lighting device.

[0029] When in operation, the heat dissipation unit 4 is activated, generating a suction force to draw hot air from the top heat dissipation channel 33 and the side heat dissipation channel 14, and then the collected hot air is discharged outside the equipment casing 1.

[0030] The flow guiding unit 3 includes a reference block 31 and a flow guiding ring 32. The flow guiding ring 32 is sleeved on the outside of the reference block 31 and has multiple rings along the axial direction. A top heat dissipation channel 33 is formed between two adjacent flow guiding rings 32. The axial direction of the flow guiding ring 32 is perpendicular to the length direction of the outer shell 1. The outer ring wall of the flow guiding ring 32 is in contact with the top of the light strip 2.

[0031] The airflow guiding unit 3 consists of a reference block 31 and airflow guiding rings 32. Multiple airflow guiding rings 32 are fitted around the outside of the housing 1 along its axial direction. The gap between two adjacent airflow guiding rings 32 forms a top heat dissipation channel 33. The axial direction of the airflow guiding rings 32 is perpendicular to the length direction of the housing 1. Simultaneously, the outer wall of the airflow guiding rings 32 maintains contact with the top of the lower light strip 2.

[0032] When the axis of the air guide ring 32 is perpendicular to the length of the outer casing 1, the direction of the top heat dissipation channel 33 is exactly consistent with the length direction of the outer casing 1, thereby effectively guiding the airflow along the longitudinal direction of the lamp strip 2. The direct contact between the air guide ring 32 and the lamp strip 2 serves two purposes: positioning and support, and direct conduction of the heat generated by the lamp strip 2 to the air guide ring 32, thus increasing the heat dissipation area.

[0033] At the top of the sidewalls of two adjacent flow guiding units 3, there are placement notches 34. Correspondingly, a support block 41 is provided on the outer sidewall of the heat dissipation unit 4, which is precisely positioned at the placement notches 34. In addition, a sealing plate 5 is detachably installed at the top of the inner sidewall of the outer casing 1. When closed, this sealing plate 5 can simultaneously press all the flow guiding units 3 and the heat dissipation unit 4 from top to bottom.

[0034] During assembly, the heat dissipation unit 4 is first inserted into the placement notch 34 of the flow guiding unit 3 via the support block 41. Then, the sealing plate 5 is closed and locked onto the top of the inner shell 1. The lower surface of the sealing plate 5 simultaneously presses against the upper surfaces of all the flow guiding units 3 and the heat dissipation unit 4, using downward pressure to eliminate gaps between components, preventing them from shifting or loosening in a vibration environment, and ensuring long-term operational stability.

[0035] The fit between the notch 34 and the support block 41 simplifies the assembly process, facilitates the alignment of the heat dissipation unit 4 and the heat dissipation air duct formed by the air guiding unit 3, and improves the assembly accuracy and efficiency.

[0036] On the cover plate 5, there are one or more openings 51 for cables to pass through. During equipment assembly and wiring, all cables that need to be introduced into or led out of the outer casing 1 are planned and bundled together and laid out through this opening 51 on the cover plate 5.

[0037] This prevents cables from running haphazardly inside the equipment, resulting in neat and standardized internal wiring and reducing the risk of malfunctions caused by cables coming into contact with high-temperature surfaces.

[0038] The heat dissipation unit 4 is specifically a fan. The fan is installed directly above the light strip 2, and there is a certain gap between its bottom and the top of the light strip 2.

[0039] When in operation, the fan starts, and its rotating blades create a low-pressure zone on the air inlet side. This low-pressure zone draws in air that has been heated by the LED strip 2, which converges from the top heat dissipation channel 33 and the side heat dissipation channel 14. The drawn-in hot airflow quickly passes through the gap between the fan and the LED strip 2, enters the fan's pressurization zone, and is finally forced out by the fan to complete the cooling process.

[0040] The implementation principle of the lighting device for the edge-breaking module of a silicon wafer sorting machine in this application embodiment is as follows: When the light strip 2 is powered on, it emits light. The light shines evenly on the edge of the silicon wafer through the narrow light-transmitting hole 11 at the bottom of the outer shell 1, forming a low-angle sweeping illumination. The heat generated by the light strip 2 is guided by air convection into the top heat dissipation channel 33 formed by the light strip 2 and the flow guiding unit 3, and the side heat dissipation channel 14 formed by the gap of the positioning plate 13. After the heat dissipation unit 4 is activated, it generates directional airflow and simultaneously draws hot air from the top heat dissipation channel 33 and the side heat dissipation channel 14, and discharges it to the outside of the lighting device, thereby achieving continuous and efficient cooling of the light strip 2. During this process, the direct contact between the flow guiding ring 32 and the light strip 2 conducts heat to the flow guiding ring 32, increasing the heat dissipation area. The sealing plate 5 ensures that the component remains stable during long-term operation by pressing the flow guiding unit 3 and the heat dissipation unit 4 together.

[0041] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A lighting device for a chipped edge module of a silicon wafer sorting machine, characterized in that: Includes a housing, LED strip, airflow guiding unit, and heat dissipation unit, wherein: The outer shell is generally arranged in the form of a hollow frustum in the shape of a strip. The cross-sectional area of ​​the bottom of the outer shell is smaller than that of the top of the outer shell. The bottom of the outer shell has a light-transmitting hole along its own length. The light strip is arranged in a rectangular shape and is located at the bottom of the inner wall of the housing near the light-transmitting hole. The flow guiding unit is located on the light strip away from the light-transmitting hole, and multiple units are provided along the length of the light strip. A top heat dissipation channel is formed between the flow guiding unit and the light strip. The heat dissipation unit is provided in multiple ways, and each heat dissipation unit is located between two adjacent flow guiding units.

2. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 1, characterized in that: Positioning units are provided on the inner sidewalls of the outer shell that are close to each other along the length direction of the outer shell; A positioning channel is formed between the two positioning units; The light strip, the flow guiding unit, and the heat dissipation unit are all located inside the positioning channel.

3. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 2, characterized in that: The positioning unit includes multiple positioning plates, which are distributed along the length of the outer shell. A lateral heat dissipation channel is formed between two adjacent positioning plates.

4. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 1, characterized in that: The flow guiding unit includes a reference block and a flow guiding ring, wherein: The flow guide ring is sleeved on the outside of the reference block, and multiple flow guide rings are provided along the axial direction of the flow guide ring, with a top heat dissipation channel formed between two adjacent flow guide rings; The axial direction of the flow guide ring is perpendicular to the length direction of the outer shell; The outer wall of the flow guide ring is in contact with the top of the light strip.

5. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 1, characterized in that: Each of the two adjacent flow guiding units has a placement notch at the top of its sidewall; The outer wall of the heat dissipation unit is provided with a support block, which is located at the placement notch.

6. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 5, characterized in that: There is a certain gap between the heat dissipation unit and the top of the light strip.

7. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 5, characterized in that: The inner top of the outer casing is removably fitted with a sealing plate; The sealing plate presses against the flow guiding unit and the heat dissipation unit.

8. The lighting device for the edge-damping module of a silicon wafer sorting machine according to claim 7, characterized in that: The cover plate has openings for cables to pass through.

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