Ice making equipment and refrigeration equipment

Abstract

This disclosure provides an ice-making apparatus and a refrigeration device. The ice-making apparatus includes an ice-making component and a refrigeration component. The ice-making component has an ice-making cavity and an air inlet communicating with the ice-making cavity; the refrigeration component includes a thermoelectric cooler, which has a cold end and a hot end opposite each other in its thickness direction. The hot end of the thermoelectric cooler is disposed near the air outlet of the cold air duct of the refrigeration device, and the cold end of the thermoelectric cooler faces the ice-making cavity. Cold air in the cold air duct blows towards the hot end of the thermoelectric cooler, so that the cold end of the thermoelectric cooler delivers cooling energy to the ice-making cavity. The ice-making apparatus of this disclosure can further cool and lower the temperature of the cold air by the thermoelectric cooler, reducing the temperature of the cold air entering the ice-making component and improving ice-making efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of refrigeration equipment technology, specifically to an ice-making apparatus and a refrigeration device. Background Technology

[0002] In related technologies, the ice-making device in refrigeration equipment includes an ice-making component, an ice storage box, and a water tank. The water tank is used to supply water to the ice-making component, which freezes the water into ice blocks using cold air from the refrigeration equipment. The ice storage box is used to store the ice blocks that fall off the ice-making component.

[0003] However, the ice-making devices in related technologies have limited heat exchange efficiency between water and cold air, resulting in low ice-making efficiency. Utility Model Content

[0004] This disclosure aims to at least partially address one of the technical problems in the related art. To this end, embodiments of this disclosure propose an ice-making apparatus with high ice-making efficiency.

[0005] Embodiments of this disclosure provide a refrigeration device.

[0006] The ice-making apparatus of this disclosure includes: An ice-making assembly, the ice-making assembly having an ice-making chamber and an air inlet communicating with the ice-making chamber; A refrigeration assembly includes a thermoelectric cooler having a cold end and a hot end opposite each other in its thickness direction. The hot end of the thermoelectric cooler is positioned near the air outlet of the cold air duct of the refrigeration device, while the cold end of the thermoelectric cooler faces the ice-making cavity. Cold air in the cold air duct is blown toward the hot end of the thermoelectric cooler so that the cold end of the thermoelectric cooler delivers cooling energy to the ice-making cavity.

[0007] In the ice-making apparatus of this embodiment, the cold air blown out by the cold air duct can cool the hot end of the thermoelectric cooler, increase the heat dissipation rate of the hot end, improve the cooling effect of the thermoelectric cooler, and further reduce the temperature of the cold end. Since the cold air can enter the ice-making chamber through the air inlet after passing through the cold end of the thermoelectric cooler, the cold air after secondary cooling can further cool the ice-making chamber, effectively improving the ice-making efficiency and enhancing the user experience.

[0008] In some embodiments, the hot end of the semiconductor cooling chip is disposed opposite to the air outlet; and / or The cold end of the semiconductor cooling chip is positioned opposite to the air inlet.

[0009] In the ice-making apparatus of this embodiment, the hot end of the thermoelectric cooler can receive direct cold air blowing from the air outlet, and the heat dissipation speed of the hot end of the thermoelectric cooler is faster, which can increase the cooling capacity provided by the cold end of the thermoelectric cooler. At the same time, the cold end of the thermoelectric cooler can directly cool and lower the cold air flowing into the air inlet, so that more cooling capacity of the cold end of the thermoelectric cooler flows into the ice-making chamber, avoiding the loss of cooling capacity of the cold end of the thermoelectric cooler, improving the cooling effect of the thermoelectric cooler, and improving the ice-making efficiency.

[0010] In some embodiments, the cooling assembly further includes: A cold-end heat exchange component, wherein the cold-end heat exchange component is disposed at the cold end of the semiconductor cooling chip; and / or, A hot-end heat exchange component is disposed at the hot end of the semiconductor cooling chip.

[0011] The ice-making apparatus of this disclosure improves the heat exchange efficiency and speed between the hot end of the thermoelectric cooler and the surrounding cold air by arranging a hot-end heat exchange component, further reducing the temperature of the hot end and making the cold end temperature even lower, resulting in better cooling effect. Similarly, arranging a cold-end heat exchange component improves the heat exchange efficiency between the cold end of the thermoelectric cooler and the surrounding cold air, enabling the acquisition of cold air with lower temperature and better uniformity, thus improving ice-making efficiency.

[0012] In some embodiments, at least one of the end of the cold-end heat exchange component facing the hot-end heat exchange component and the end of the hot-end heat exchange component facing the cold-end heat exchange component has a protrusion, and the semiconductor cooling chip is attached to the protrusion.

[0013] The ice-making apparatus of this disclosure can clamp and fix the semiconductor refrigeration chip, and the semiconductor refrigeration chip can be positioned with the protrusion to facilitate assembly, improve the stability of the connection between the semiconductor refrigeration chip and the heat exchange component, and ensure the heat exchange efficiency between the hot and cold ends of the semiconductor refrigeration chip and the surrounding cold air.

[0014] In some embodiments, the free end face of the protrusion has a recess, and at least a portion of the semiconductor cooling chip is embedded in the recess.

[0015] The ice-making apparatus of this disclosure can limit the position of the thermoelectric cooler to prevent the thermoelectric cooler from moving relative to the hot-end heat exchange component and / or the cold-end heat exchange component, ensuring that the relative position of the thermoelectric cooler with the hot-end heat exchange component and the cold-end heat exchange component is determined, thereby improving the stability and performance of the assembly structure.

[0016] In some embodiments, the ice-making apparatus further includes a connector that connects the cold-end heat exchange component and the hot-end heat exchange component. The connector is spaced apart from the thermoelectric cooler in a first direction, which is orthogonal to the thickness direction of the thermoelectric cooler.

[0017] In the ice-making apparatus of this disclosure, after the connector connects the cold end heat exchange component and the hot end heat exchange component, the semiconductor cooling chip is clamped by the cold end heat exchange component and the hot end heat exchange component, thereby realizing the assembly of the cooling components and avoiding the impact on the overall performance after the connector comes into contact with the semiconductor cooling chip.

[0018] In some embodiments, at least one of the cold-end heat exchange component and the hot-end heat exchange component includes a substrate extending along a first direction and a plurality of heat exchange fins disposed on the substrate and spaced apart in the first direction.

[0019] The ice-making apparatus of this disclosure can facilitate heat exchange between the cold air and the heat exchange fins, thereby improving heat exchange efficiency.

[0020] In some embodiments, the ice-making device further includes an air guide member connected to the ice-making assembly and having an air guide channel. The air guide channel has an inlet and an outlet. The inlet is opposite to the cold-end heat exchange component, and the outlet is opposite to and communicates with the air inlet.

[0021] The ice-making apparatus of this disclosure can make the cold air in the corresponding area flow in a directional and stable manner, so that the cold air after being further cooled by the cold end of the semiconductor refrigeration chip can flow into the ice-making cavity in more way, thereby improving the utilization rate of cold energy and the efficiency of ice making.

[0022] In some embodiments, the air guide includes an air guide body and an extension, the air guide channel is disposed on the air guide body, the extension extends from one end of the air guide body toward the air inlet toward the air inlet, and the top surface of the extension is in contact with the bottom wall surface of the air guide channel.

[0023] The ice-making apparatus of this disclosure can reduce the leakage of cold air from the gap between the air guide and the air inlet, and increase the amount of cold air that has been cooled by the semiconductor refrigeration chip entering the ice-making chamber.

[0024] In some embodiments, the air guide further includes a plurality of baffles extending toward the air inlet, the baffles being disposed on the top surface of the extension, and the plurality of baffles being arranged at intervals; and / or, The bottom wall of the air guide channel is arranged to slope downwards in the direction of the air inlet.

[0025] In the ice-making apparatus of this embodiment, the baffles can evenly distribute the cold air in the upper part of the extension, making the cold air flow between adjacent baffles more stable. This optimizes the flow field on the top surface of the extension, making the flow field of the cold air flowing over the top surface of the extension more stable and uniform, reducing air resistance, and improving the guiding performance of the guide members. The downwardly inclined bottom wall allows the cold air to be stably and efficiently guided to the air inlet through the air guide channel, satisfying the requirements for assembly with the ice-making components and air guiding performance.

[0026] In some embodiments, at least one of the cold-end heat exchange component and the hot-end heat exchange component is connected to the air guide. This embodiment ensures effective alignment of the air guide channels of the cold-end heat exchange component and the air guide, allowing the cooled air from the cold-end heat exchange component to enter the air guide channel more smoothly. It also allows for the reasonable determination of the connection positions between the air guide and the refrigeration assembly, improving the overall performance after assembly.

[0027] In some embodiments, a fixing bracket is further included, which is connected to at least one of the cold-end heat exchange component and the hot-end heat exchange component, and the fixing bracket is connected to the air guide component. The ice-making apparatus of this disclosure allows for easier alignment and assembly between the air guide component and the refrigeration components, resulting in better overall structural stability.

[0028] In some embodiments, the ice-making assembly includes a bracket and an ice grid. The bracket defines the top wall of the ice-making cavity, and the ice grid is disposed within the ice-making cavity. The air guide is connected to the bracket. In the ice-making device of this disclosure embodiment, there is a gap between the top wall of the bracket and the upper part of the ice grid. An air inlet corresponds to the gap. Cold air flows into the ice-making cavity through the air inlet and is then blown towards the space between the ice grid and the top wall, thereby causing the water in the ice grid to freeze and form ice cubes, resulting in a better ice-making effect.

[0029] In some embodiments, a fan is further included, the fan being disposed between the inlet and the cold-end heat exchange component. The ice-making apparatus of this disclosure can increase the airflow velocity at the cold end of the thermoelectric cooler, causing the cold air to flow directionally into the inlet of the air guide after passing through the cold-end heat exchange component, thereby increasing the airflow into the ice-making chamber and improving the ice-making effect and efficiency.

[0030] In some embodiments, there are multiple thermoelectric coolers arranged at intervals. The ice-making apparatus of this disclosure can further improve the cooling effect of the cold air and ensure the uniformity of the temperature of the cold air flowing into the air inlet.

[0031] In some embodiments, the ice-making apparatus further includes: The housing contains both the ice-making component and the refrigeration component. A water tank, which is located inside the housing and is used to supply water to the ice-making cavity.

[0032] The ice-making apparatus of this embodiment has a water tank, an ice-making component, and a refrigeration component housed within a housing, thereby achieving overall integration, resulting in better overall structural stability and facilitating overall assembly and disassembly.

[0033] The refrigeration equipment of this disclosure includes an ice-making apparatus according to any of the above embodiments.

[0034] The refrigeration device of this embodiment can further cool the cold air flowing into the ice-making chamber, so that the temperature of the cold air entering the ice-making chamber is lower than the temperature of the cold air in the freezer chamber, thereby improving the ice-making efficiency. Attached Figure Description

[0035] Figure 1 This is a perspective view of an ice-making apparatus according to an embodiment of the present disclosure.

[0036] Figure 2 This is a perspective view of an ice-making apparatus according to an embodiment of the present disclosure.

[0037] Figure 3 This is a schematic diagram showing the relative positions of the ice-making device and the cold air channel according to an embodiment of this disclosure.

[0038] Figure 4 This is a cross-sectional schematic diagram showing the relative positions of the ice-making device and the cold air channel according to an embodiment of this disclosure.

[0039] Figure 5 This is a three-dimensional schematic diagram of the connection between the cooling component and the air guide in an embodiment of this disclosure.

[0040] Figure 6 This is a side view of the connection between the cooling component and the air guide in an embodiment of this disclosure.

[0041] Figure 7 This is a schematic diagram showing the connection between the cooling component and the fan in an embodiment of this disclosure.

[0042] Figure 8 This is a schematic diagram of a refrigeration device according to an embodiment of the present disclosure.

[0043] Figure 9 yes Figure 8 A schematic diagram of the AA direction.

[0044] Figure 10 This is a cross-sectional view of a refrigeration device according to an embodiment of the present disclosure.

[0045] Figure label: 100. Ice-making equipment; 200. Refrigeration equipment; 1. Ice-making assembly; 11. Ice-making cavity; 12. Air inlet; 13. Hanging rack; 14. Ice tray; 2. Refrigeration assembly; 21. Semiconductor refrigeration chip; 22. Cold end heat exchange component; 23. Hot end heat exchange component; 24. Protrusion; 25. Substrate; 26. Heat exchange fins; 27. Connector; 3. Air guide component; 31. Air guide channel; 32. Air guide body; 33. Extension section; 34. Baffle; 4. Fixed bracket; 5. Fan; 6. Shell; 7. Water tank; 8. Body; 81. Freezer compartment; 811. Freezer cavity; 82. Cold air duct; 821. Air outlet; 83. Door. Detailed Implementation

[0046] Embodiments of this disclosure are described in detail below, with examples of these embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this disclosure, and should not be construed as limiting it.

[0047] See Figures 1 to 10 The ice-making apparatus 100 of this embodiment includes an ice-making component 1 and a refrigeration component 2. Both the ice-making component 1 and the refrigeration component 2 can be placed within the freezing chamber 811 of the refrigeration device 200. The refrigeration device 200 can be a refrigerator, freezer, or similar device.

[0048] See Figures 1 to 4 The ice-making assembly 1 has an ice-making chamber 11 and an air inlet 12 communicating with the ice-making chamber 11. When cold air from the freezing chamber 811 of the refrigeration equipment 200 enters the ice-making chamber 11 of the ice-making assembly 1, it can freeze the water in the ice-making chamber 11 and form ice blocks, thereby realizing ice making.

[0049] The cooling component 2 in this embodiment includes a thermoelectric cooler 21. The thermoelectric cooler 21 has a cold end and a hot end opposite each other in its thickness direction. It is understood that during operation, the thermoelectric cooler 21 can absorb heat at its cold end and transfer the heat to the hot end, allowing heat to be transferred between the cold and hot ends of the thermoelectric cooler 21. This reduces the temperature of the cold end, thus cooling the air near the cold end. In this embodiment, the thickness direction of the thermoelectric cooler 21 is the vertical direction as shown in the figure. The hot end of the thermoelectric cooler 21 is the upper end shown in the figure, and the cold end is the lower end shown in the figure.

[0050] The hot end of the thermoelectric cooler 21 is positioned near the air outlet 821 of the cold air duct 82 of the refrigeration device 200, while the cold end of the thermoelectric cooler 21 faces the ice-making cavity 11. Cold air from the cold air duct blows towards the hot end of the thermoelectric cooler 21, allowing the cold end of the thermoelectric cooler 21 to deliver cooling energy to the ice-making cavity 11. In this embodiment, the cold air blown out of the cold air duct 82 can cool the hot end, increasing the heat dissipation rate and improving the cooling effect of the thermoelectric cooler 21, further reducing the temperature of the cold end. This allows the cold end of the thermoelectric cooler 21 to provide more cooling energy, and the cold end of the thermoelectric cooler 21 provides secondary cooling to the cold air entering the ice-making cavity 11, ensuring that the temperature of the cold air entering the ice-making cavity 11 is lower than the temperature of the cold air in the freezing cavity 811 of the refrigeration device 200, thereby effectively improving ice-making efficiency and enhancing the user experience.

[0051] In some embodiments, the hot end of the thermoelectric cooler 21 is positioned opposite to the air outlet 821, and the cold end of the thermoelectric cooler 21 is positioned opposite to the air inlet 12. In this embodiment, the cold air blown out of the air outlet of the cold air duct 82 of the refrigeration device 200 can directly blow onto the hot end of the thermoelectric cooler 21, increasing the heat dissipation rate of the hot end of the thermoelectric cooler 21 and increasing the cooling capacity provided by the cold end of the thermoelectric cooler 21. At the same time, the cold end of the thermoelectric cooler 21 can directly further cool and lower the temperature of the cold air flowing into the air inlet 12, allowing more cooling capacity from the cold end of the thermoelectric cooler 21 to flow into the ice-making chamber 11, preventing the loss of cooling capacity from the cold end of the thermoelectric cooler 21, improving the cooling effect of the thermoelectric cooler 21, and increasing the ice-making efficiency.

[0052] See Figures 5 to 7 In some embodiments, the cooling assembly 2 further includes a cold-end heat exchange component 22 and / or a hot-end heat exchange component 23. The cold-end heat exchange component 22 is disposed at the cold end of the thermoelectric cooler 21, and the hot-end heat exchange component 23 is disposed at the hot end of the thermoelectric cooler 21. In other words, the cold-end heat exchange component 22 may be arranged only at the cold end, or the hot-end heat exchange component 23 may be arranged only at the hot end, or the hot-end heat exchange component 23 may be arranged at the hot end and the cold-end heat exchange component 22 may be arranged at the cold end.

[0053] By arranging the hot-end heat exchange component 23, the heat exchange efficiency and speed between the hot end of the thermoelectric cooler 21 and the surrounding cold air can be improved, further reducing the temperature of the hot end and making the temperature of the cold end even lower, resulting in better cooling effect. By arranging the cold-end heat exchange component 22, the heat exchange efficiency between the cold end of the thermoelectric cooler 21 and the surrounding cold air can be improved, enabling better acquisition of cold air at a lower temperature and improving ice-making efficiency.

[0054] Furthermore, at least one of the ends of the cold-end heat exchange component 22 facing the hot-end heat exchange component 23 and the ends of the hot-end heat exchange component 23 facing the cold-end heat exchange component 22 has a protrusion 24, and the semiconductor cooling chip 21 is attached to the protrusion 24. The protrusion 24 and the corresponding heat exchange component can be an integral structure, both made of materials with good thermal conductivity, to ensure that the heat at the hot end of the semiconductor cooling chip 21 can be dissipated through the hot-end heat exchange component 23, and to ensure that the cold energy at the cold end of the semiconductor cooling chip 21 can be transferred to the nearby cold air through the cold-end heat exchange component 22.

[0055] The protrusion 24 can fit against the thermoelectric cooler 21, thereby clamping and fixing the thermoelectric cooler 21. The thermoelectric cooler 21 can be positioned with the protrusion, thereby facilitating assembly.

[0056] Preferably, in this embodiment, the cold end heat exchange component 22 has a protrusion 24 at one end facing the hot end heat exchange component 23, and the hot end heat exchange component 23 also has a protrusion 24 at one end facing the cold end heat exchange component 22. The semiconductor cooling chip 21 is disposed between the two protrusions 24. It can be understood that one of the protrusions 24 is located on the first side of the thickness direction of the semiconductor cooling chip 21, and the other protrusion 24 is located on the second side of the thickness direction of the semiconductor cooling chip 21.

[0057] See Figure 6 Furthermore, the free end face of the protrusion 24 has a recess, and at least a portion of the thermoelectric cooler 21 is embedded in the recess. In this embodiment, the "free end face" of the protrusion 24 refers to the end face of the protrusion 24 adjacent to the thermoelectric cooler 21. The recess can be a groove located on the free end face. By providing a recess on the free end face, the thermoelectric cooler 21 can be embedded in the recess, thereby limiting the position of the thermoelectric cooler 21 and preventing it from moving relative to the hot end heat exchange component 23 and / or the cold end heat exchange component 22. This ensures that the relative position of the thermoelectric cooler 21 with the hot end heat exchange component 23 and the cold end heat exchange component 22 is determined, improving the stability and performance of the assembly structure.

[0058] If the semiconductor cooling chip 21 can be a rectangular block, then the recess can be a groove with a rectangular cross-section.

[0059] See Figure 6 and Figure 7 In some embodiments, the cooling assembly 2 further includes a connector 27, which connects the cold-end heat exchange component 22 and the hot-end heat exchange component 23. The connector 27 is spaced apart from the thermoelectric cooler 21 in a first direction, which is orthogonal to the thickness direction of the thermoelectric cooler 21. In this embodiment, the thickness direction of the thermoelectric cooler 21 is the vertical direction shown in the figure, and the first direction is the horizontal direction shown in the figure.

[0060] Understandably, the connector 27 and the thermoelectric cooler 21 do not contact each other. After connecting the cold-end heat exchange component 22 and the hot-end heat exchange component 23, the connector 27 clamps the thermoelectric cooler 21 through the cold-end heat exchange component 22 and the hot-end heat exchange component 23, thereby realizing the assembly of the cooling assembly 2. At the same time, it also avoids the connector 27 contacting the thermoelectric cooler 21 and affecting the overall performance.

[0061] Furthermore, at least one of the cold-end heat exchange component 22 and the hot-end heat exchange component 23 includes a base 25 extending along a first direction and a plurality of heat exchange fins 26 arranged at intervals in the first direction on the base 25.

[0062] Both the heat exchange fins 26 and the substrate 25 can be flat. The substrate 25 is generally parallel to the semiconductor cooling chip 21, and the heat exchange fins 26 are generally perpendicular to the substrate 25. The heat exchange fins 26 are spaced apart to facilitate heat exchange between the cold air and the heat exchange fins 26, thereby improving heat exchange efficiency. In this embodiment, the protrusion 24 can be provided on the side of the substrate 25 away from the heat exchange fins 26. The protrusion 24, the substrate 25, and the heat exchange fins 26 are integrally formed, resulting in good structural stability.

[0063] During connection, the connector 27 can penetrate the base 25 of both the cold-end heat exchange component 22 and the hot-end heat exchange component 23. Simultaneously, there are clearance portions at both the heat exchange fins 26 of the cooling heat exchange component and the hot-end heat exchange component 23 to facilitate the installation of the connector 27. These clearance portions can be formed by cutting a portion of the heat exchange fin 26 corresponding to the connector 27, or they can be formed directly during manufacturing. The clearance portions can be columnar spaces extending along the thickness direction of the thermoelectric cooler 21. The connector 27 is a screw / bolt + nut. During installation, the cold-end heat exchange component 22, the thermoelectric cooler 21, and the hot-end heat exchange component 23 are first aligned and pre-assembled together. Then, the bases 25 of the cold-end heat exchange component 22 and the hot-end heat exchange component 23 are connected using bolts and nuts.

[0064] Of course, the cold-end heat exchange component 22 and the hot-end heat exchange component 23 can also be positioned and connected by snap-fit ​​or plug-in methods. For example, the connector 27 includes a first snap-fit ​​and a second snap-fit. The first snap-fit ​​is fixed to the base 25 of the cold-end heat exchange component 22, and the second snap-fit ​​is fixed to the base 25 of the hot-end heat exchange component 23. When the cold-end heat exchange component 22, the semiconductor cooling chip 21 and the hot-end heat exchange component 23 are aligned, the first snap-fit ​​and the second snap-fit ​​engage to realize the assembly of the cooling assembly 2.

[0065] See Figures 1 to 6In some embodiments, the ice-making device 100 further includes an air guide 3, which is connected to the ice-making assembly 1 and has an air guide channel 31. The air guide channel 31 has an inlet and an outlet. The inlet is opposite to the cold-end heat exchange component 22, and the outlet is opposite to and connected to the air inlet 12. The air guide 3 can be connected to the ice-making assembly 1, thereby guiding cold air into the ice-making chamber 11.

[0066] Specifically, after the cold air at the cold end of the semiconductor cooling chip 21 is further cooled, it is guided to the air inlet 12 through the air guide channel 31 of the air guide 3. This can promote the directional and stable flow of cold air in the corresponding area, so that more cold air after being further cooled by the cold end of the semiconductor cooling chip 21 can flow into the ice-making chamber 11, thereby improving the utilization rate of cold energy and the efficiency of ice making.

[0067] See Figure 5 Furthermore, the air guide 3 includes an air guide body 32 and an extension 33. The air guide channel 31 is disposed on the air guide body 32, and the extension 33 extends from one end of the air guide body 32 toward the air inlet 12 toward the air inlet 12. The top surface of the extension 33 is in contact with the bottom wall surface of the air guide channel 31. The extension 33 can be a plate integrally formed with the air guide body 32. The extension 33 can guide the cold air flowing from the air guide channel 31 to the air inlet 12 into the air inlet 12, reduce the leakage of cold air from the gap between the air guide 3 and the air inlet 12, and increase the amount of cold air cooled by the semiconductor refrigeration chip 21 entering the ice-making chamber 11.

[0068] The air guide 3 also includes multiple baffles 34 extending toward the air inlet 12. The baffles 34 are located on the top surface of the extension 33 and are arranged at intervals. This allows for uniform flow of the cold air in the upper part of the extension 33, making the flow of cold air between adjacent baffles 34 more stable and the flow of cold air on both sides of the baffles 34 more independent. This optimizes the flow field on the top surface of the extension 33, making the flow field of the cold air flowing over the top surface of the extension 33 more stable and uniform, reducing air resistance, and improving the air guiding performance of the guide.

[0069] Furthermore, the bottom wall of the air guide channel 31 is arranged to slope downwards towards the air inlet 12. After the air guide component 3 and the ice-making component 1 are assembled, the downward slope of the bottom wall of the air guide channel 31 enables effective communication between the air guide channel 31 and the air inlet 12, allowing cold air to be stably and efficiently guided to the air inlet 12 through the air guide channel 31. While satisfying the assembly and air guiding performance requirements with the ice-making component 1, the air guide component 3 can be miniaturized, resulting in a more compact structure for the air guide component 3 and the refrigeration component 2.

[0070] In some embodiments, at least one of the cold-end heat exchange component 22 and the hot-end heat exchange component 23 is connected to the air guide 3. It is understood that the cold-end heat exchange component 22, the hot-end heat exchange component 23, and the semiconductor cooling chip 21 are connected together by the connector 27, and the cooling assembly 2 is an integral structure. Therefore, when the cold-end heat exchange component 22 is connected to the air guide 3, it is equivalent to the cooling assembly 2 being connected to the air guide 3, or when the hot-end heat exchange component 23 is connected to the air guide 3, it is equivalent to the cooling assembly 2 being connected to the air guide 3.

[0071] This embodiment ensures effective alignment between the cold-end heat exchange component 22 and the air guide channel 31 of the air guide component 3, allowing the cooled air from the cold-end heat exchange component 22 to enter the air guide channel 31 more smoothly. Furthermore, based on the alignment relationship between the air guide component 3 and the cold-end heat exchange component 22 or the hot-end heat exchange component 23 in the refrigeration assembly 2, it is determined whether the cold-end heat exchange component 22 is connected to the air guide component 3, or the hot-end heat exchange component 23 is connected to the air guide component 3, or both the cold-end heat exchange component 22 and the hot-end heat exchange component 23 are connected to the air guide component 3. This rational determination of the connection position between the air guide component 3 and the refrigeration assembly 2 improves the overall performance after assembly.

[0072] Furthermore, the ice-making device 100 also includes a fixed bracket 4, which is connected to at least one of the cold-end heat exchange component 22 and the hot-end heat exchange component 23, and is also connected to the air guide component 3. The fixed bracket 4 is fixed to the air guide component 3 and can be a plate, rod, or other irregularly shaped structural component; for example, the fixed bracket 4 is an L-shaped bent plate. One end of the fixed bracket 4 is connected to the air guide component 3 by screws, bolts, or other connecting parts 27. The fixed bracket 4 can also be connected to the guide component by plugging or snapping, or it can be integrally formed with the air guide component 3. The other end of the fixed bracket 4 is connected to either the cold-end heat exchange component 22 or the hot-end heat exchange component 23. Preferably, there are multiple fixed brackets 4, with some fixed brackets 4 connected to the cold-end heat exchange component 22 and others connected to the hot-end heat exchange component 23. The fixed bracket 4 can also be connected to the corresponding heat exchange component by screws, bolts or other connectors 27, or the fixed bracket 4 can be connected to the corresponding heat exchange component by plug-in or snap-fit.

[0073] Preferably, the fixed bracket 4 is connected to the air guide 3, and the heat exchange fins 26 of the cold end heat exchange component 22 and the hot end heat exchange component 23 are all connected by screws. In this embodiment, the fixed bracket 4 makes it easier to align and assemble the air guide 3 and the refrigeration component 2, resulting in better overall structural stability.

[0074] See Figure 4In some embodiments, the ice-making assembly 1 includes a bracket 13 and an ice grid 14. The bracket 13 defines the top wall of the ice-making cavity 11, and the ice grid 14 is disposed inside the ice-making cavity 11. The air guide 3 is connected to the bracket 13. The bracket 13 can be part of the main body of the ice-making assembly 1. There is a gap between the top wall of the bracket 13 and the upper part of the ice grid 14. The air inlet 12 corresponds to the gap. Cold air flows into the ice-making cavity 11 from the air inlet 12 and is then blown towards the space between the ice grid 14 and the top wall, thereby causing the water in the ice grid 14 to freeze and form ice.

[0075] See Figure 4 and Figure 7 In some embodiments, the ice-making device 100 further includes a fan 5, which is located between the inlet and the cold-end heat exchange component 22. The fan 5 can draw cold air into the inlet of the air guide 3, increase the airflow speed at the cold end of the semiconductor cooling chip 21, and direct the cold air into the inlet of the air guide 3 after passing through the cold-end heat exchange component 22, thereby increasing the airflow into the ice-making chamber 11 and improving the ice-making effect and efficiency.

[0076] In some embodiments, multiple thermoelectric coolers 21 are arranged at intervals. By using multiple thermoelectric coolers 21, the cooling effect of the cold air can be further improved, and the temperature of the cold air flowing into the air inlet 12 can be made uniform. When the air inlet 12 is an elongated opening, the multiple thermoelectric coolers 21 can be arranged at intervals along the length of the air inlet 12, thereby allowing the cold air flowing into the air inlet 12 to exchange heat with the cold ends of the thermoelectric coolers 21, resulting in lower and more uniform cold air temperature.

[0077] The number of semiconductor cooling chips 21 can be two, three or more, and multiple semiconductor cooling chips 21 can work simultaneously to improve ice-making efficiency.

[0078] See Figure 1 and Figure 2In some embodiments, the ice-making device 100 further includes a housing 6 and a water tank 7, with both the ice-making component 1 and the refrigeration component 2 housed within the housing 6. The water tank 7, located within the housing 6, supplies water to the ice-making chamber 11. The water tank 7, ice-making component 1, and refrigeration component 2 are housed within the housing 6, thus achieving overall integration, resulting in better overall structural stability and easier assembly and disassembly. The ice-making device 100 can be detachably connected to the freezer compartment 81, for example, as an optional accessory for a refrigerator or freezer. When needed, the user can purchase the ice-making device 100 separately and install it in the freezer compartment 81. Alternatively, the ice-making device 100 can be fixed within the freezer compartment 81 and is normally not removable. The water tank 7 can be removed separately from the housing 6 for easy refilling. Water in water tank 7 can be pumped into ice trays. When ice is needed, water in water tank 7 is pumped into ice trays in ice making chamber 11 of ice making component 1. Then, fan 5 and refrigeration component 2 are started so that cold air from freezer 81 is cooled by semiconductor refrigeration chip 21 and then blown into ice making chamber 11.

[0079] See Figures 8 to 10 The refrigeration device 200 of this disclosure includes an ice-making device 100 according to any of the above embodiments. The refrigeration device 200 includes a body 8, which has a freezing chamber 81 and a cold air duct 82. The cold air duct 82 has an air outlet 821 communicating with the freezing cavity 811 of the freezing chamber 81. The ice-making device 100 is an ice-making device 100 as described in any of the above embodiments. The ice-making device 100 is disposed in the freezing chamber 81. There can be multiple air outlets 821 in the cold air duct, some of which are opposite to the hot end of the semiconductor cooling chip 21 to improve the heat dissipation efficiency of the hot end.

[0080] The beneficial effects achieved by the refrigeration device 200 in this application embodiment are the same as those achieved by the ice-making device 100 in the above embodiment, and will not be repeated here.

[0081] It should be noted that the refrigeration equipment 200 also includes a door 83, which is connected to the main body 8 and used to seal the freezer compartment 81. The refrigeration equipment 200 may be a refrigerator, which may also have at least one of a refrigerator compartment and a fresh food compartment.

[0082] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0083] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0084] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0085] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0086] In this disclosure, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0087] Although embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present disclosure.

Claims

1. An ice-making apparatus (100), characterized in that, include: An ice-making assembly (1) has an ice-making chamber (11) and an air inlet (12) communicating with the ice-making chamber (11). The refrigeration assembly (2) includes a semiconductor refrigeration chip (21) having a cold end and a hot end opposite each other in its thickness direction. The hot end of the semiconductor refrigeration chip (21) is located near the air outlet (821) of the cold air duct (82) of the refrigeration device (200), and the cold end of the semiconductor refrigeration chip (21) is located facing the ice-making cavity (11). The cold air in the cold air duct (82) is blown toward the hot end of the semiconductor refrigeration chip (21) so that the cold end of the semiconductor refrigeration chip (21) delivers cold energy to the ice-making cavity (11).

2. The ice-making apparatus (100) according to claim 1, characterized in that, The hot end of the semiconductor cooling chip (21) is positioned opposite to the air outlet (821); and / or The cold end of the semiconductor cooling chip (21) is positioned opposite to the air inlet (12).

3. The ice-making apparatus (100) according to claim 1, characterized in that, The cooling component (2) also includes: A cold-end heat exchange component (22) is disposed at the cold end of the semiconductor cooling chip (21); and / or, A hot-end heat exchange component (23) is disposed at the hot end of the semiconductor cooling chip (21).

4. The ice-making apparatus (100) according to claim 3, characterized in that, At least one of the cold end heat exchange component (22) facing the hot end heat exchange component (23) and the hot end heat exchange component (23) facing the cold end heat exchange component (22) has a protrusion (24), and the semiconductor cooling chip (21) is attached to the protrusion (24).

5. The ice-making apparatus (100) according to claim 4, characterized in that, The free end face of the protrusion (24) has a recess, and at least a portion of the semiconductor cooling chip (21) is embedded in the recess.

6. The ice-making apparatus (100) according to claim 3, characterized in that, It also includes a connector (27) that connects the cold end heat exchange component (22) and the hot end heat exchange component (23). The connector (27) and the semiconductor refrigeration chip (21) are arranged at a distance in a first direction, which is orthogonal to the thickness direction of the semiconductor refrigeration chip (21).

7. The ice-making apparatus (100) according to claim 3, characterized in that, At least one of the cold end heat exchange component (22) and the hot end heat exchange component (23) includes a base (25) extending along a first direction and a plurality of heat exchange fins (26) arranged at intervals in the first direction on the base (25).

8. The ice-making apparatus (100) according to claim 3, characterized in that, It also includes an air guide (3), which is connected to the ice-making assembly (1) and has an air guide channel (31). The air guide channel (31) has an inlet and an outlet. The inlet is opposite to the cold end heat exchange component (22), and the outlet is opposite to and connected to the air inlet (12).

9. The ice-making apparatus (100) according to claim 8, characterized in that, The air guide (3) includes an air guide body (32) and an extension (33). The air guide channel (31) is located on the air guide body (32). The extension (33) extends from one end of the air guide body (32) toward the air inlet (12) toward the air inlet (12). The top surface of the extension (33) is connected to the bottom wall surface of the air guide channel (31).

10. The ice-making apparatus (100) according to claim 9, characterized in that, The air guide (3) further includes a plurality of baffles (34) extending toward the air inlet (12), the baffles (34) being disposed on the top surface of the extension (33), and the plurality of baffles (34) being arranged at intervals; and / or, The bottom wall of the air guide channel (31) is arranged to slope downwards in the direction toward the air inlet (12).

11. The ice-making apparatus (100) according to claim 8, characterized in that, At least one of the cold end heat exchange component (22) and the hot end heat exchange component (23) is connected to the air guide (3).

12. The ice-making apparatus (100) according to claim 11, characterized in that, It also includes a fixed bracket (4), which is connected to at least one of the cold end heat exchange component (22) and the hot end heat exchange component (23), and the fixed bracket (4) is connected to the air guide (3).

13. The ice-making apparatus (100) according to claim 8, characterized in that, The ice-making assembly (1) includes a bracket (13) and an ice grid (14). The bracket (13) defines the top wall of the ice-making cavity (11). The ice grid (14) is located inside the ice-making cavity (11). The air guide (3) is connected to the bracket (13).

14. The ice-making apparatus (100) according to claim 8, characterized in that, It also includes a fan (5), which is located between the inlet and the cold end heat exchange component (22).

15. The ice-making apparatus (100) according to any one of claims 1-14, characterized in that, There are multiple semiconductor cooling chips (21), and the multiple semiconductor cooling chips (21) are arranged at intervals.

16. The ice-making apparatus (100) according to any one of claims 1-14, characterized in that, Also includes: The housing (6) contains both the ice-making component (1) and the refrigeration component (2). Water tank (7), which is located inside the shell (6) and is used to supply water to the ice-making cavity (11).

17. A refrigeration device (200), characterized in that, Includes an ice-making apparatus (100) according to any one of claims 1-16.

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