Multi-zone independent measurement wafer vacuum pressure distribution sensor sheet

Abstract

This utility model discloses a wafer vacuum pressure distribution sensor for multi-zone independent measurement, relating to the technical field of wafer vacuum pressure distribution sensor technology. It includes a first sensor body, with a second sensor body connected to the bottom of the first sensor body. The first sensor body includes region blocks, and pre-drilled slots are provided on the edges of both the first and second sensor bodies. In this utility model, by setting up the region blocks, sensor bodies, and sensor sheets, the wafer vacuum pressure distribution sensor is placed on a wafer placement platform. The sensor bodies positioned at the region blocks can sense the pressure on the wafer placement platform, achieving the purpose of zoned measurement. This allows for quick identification of pressure unevenness, thus accelerating the adjustment process and effectively speeding up the measurement work on the wafer placement platform using the wafer vacuum pressure distribution sensor.

Description

Technical Field

[0001] This utility model relates to the field of wafer vacuum pressure distribution sensing sheet technology, and in particular to a wafer vacuum pressure distribution sensing sheet with multi-zone independent measurement. Background Technology

[0002] With the development of wafer vacuum pressure distribution sensor technology and the progress of the times, wafer vacuum pressure distribution sensor, as one of the important components in semiconductor manufacturing, mainly detects vacuum pressure distribution through pressure-sensitive units. It also utilizes the characteristic of generating electricity under pressure to achieve high-precision measurement, making it suitable for monitoring vacuum cavity pressure in semiconductor manufacturing.

[0003] Existing wafer vacuum pressure distribution sensors lack zoning during use, meaning that users can only determine if the pressure is normal before adjusting the semiconductor, resulting in long adjustment times and impacting measurement progress. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing wafer vacuum pressure distribution sensors, which lack partitioning during use. This means that users can only determine if the pressure is normal before adjusting the semiconductor, resulting in long adjustment times and impacting the measurement progress. Therefore, this invention proposes a wafer vacuum pressure distribution sensor with multi-partition independent measurement.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A wafer vacuum pressure distribution sensor chip for multi-zone independent measurement includes: A first sensing sheet is connected to a second sensing sheet at its bottom, and the first sensing sheet includes multiple sets of area blocks. Both the first and second sensing sheets have reserved slots on their edges.

[0006] Preferably, the bottom end of the first sensing sheet is bonded to the sensor body.

[0007] Preferably, an inlay groove is provided on the inner side of the second sensing sheet.

[0008] Preferably, a mounting groove is provided in the middle of the inner side of the second sensor sheet.

[0009] Preferably, a through groove is formed on the inner side of the second sensing sheet.

[0010] Preferably, the inlay slot is sleeved with the tail of the sensor body.

[0011] Preferably, the inner side of the reserved slot has a V-shaped structure, and the reserved slot, through the slotting, forms an integrated structure with the first sensor sheet and the second sensor sheet.

[0012] Preferably, the center line of the through slot passes through the center of the inlay slot.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are: 1. In this utility model, by setting up the area block, sensor body, sensing sheet, etc., the wafer vacuum pressure distribution sensing sheet is placed on the wafer placement platform (the chuck of the vacuum chamber). The sensor body installed at the area block can sense the pressure of the wafer placement platform, realize the purpose of zone measurement, and enable people to quickly know the location of pressure unevenness, thereby speeding up the adjustment process. Therefore, it effectively speeds up the measurement work of the wafer vacuum pressure distribution sensing sheet on the wafer placement platform. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall top view of the present invention; Figure 2 This is a schematic diagram of the overall side structure of this utility model; Figure 3 This is a schematic diagram of the structure of the second sensor chip in this utility model.

[0015] Legend: 1. First sensor sheet; 2. Region block; 3. Sensor body; 4. Reserved slot; 5. Second sensor sheet; 6. Embedding slot; 7. Through slot; 8. Mounting slot. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0017] Reference Figure 1-3A wafer vacuum pressure distribution sensor for multi-zone independent measurement includes a first sensor body 1, a second sensor body 5 connected to the bottom of the first sensor body 1, and the first sensor body 1 includes area blocks 2. A sensor body 3 is attached to the bottom of the first sensor body 1. Preferably, multiple independent area blocks 2 are arranged on the first sensor body 1, and an independent sensor body 3 is arranged below each area block 2, forming a distributed multi-point pressure sensing array. This arrangement allows the wafer vacuum pressure distribution sensor to synchronously and independently measure the vacuum pressure experienced by different areas of the wafer, thereby providing a detailed "pressure distribution map". Operators can intuitively and quickly locate specific areas of abnormal or uneven pressure, providing precise data guidance for subsequent process adjustments (such as adjusting chamber airflow, correcting chuck position, etc.), greatly shortening the diagnosis and adjustment time caused by pressure problems, and accelerating the overall production progress.

[0018] Both the first sensor chip 1 and the second sensor chip 5 have pre-drilled slots 4 along their edges. The inner side of the pre-drilled slot 4 has a V-shaped structure, and the pre-drilled slot 4 forms an integrated structure with both the first sensor chip 1 and the second sensor chip 5 through the slotting. The V-shaped pre-drilled slot 4 facilitates quick and accurate alignment and splicing of the first sensor chip 1 and the second sensor chip 5 during assembly, allowing for faster completion of the splicing work between them.

[0019] The inner side of the second sensor chip 5 has an inlay groove 6, which is fitted onto the tail of the sensor body 3. By embedding the terminal device of the sensor body 3 into the inlay groove 6, a stable embedded installation is achieved, resulting in good connection performance between it and the second sensor chip 5. A mounting groove 8 is formed in the middle of the inner side of the second sensor chip 5, and a through groove 7 is formed on the inner side of the second sensor chip 5, with the center line of the through groove 7 passing through the center of the inlay groove 6. Simultaneously, the through groove 7 design provides a neat and protected internal wiring space for the cables connecting the main control board to each sensor. This integrated design avoids the interference and damage risks of exposed cables, improves the overall structural stability and signal transmission reliability of the wafer vacuum pressure distribution sensor chip, thereby ensuring long-term measurement accuracy. The mounting groove 8 is mainly used for installing the main control board, enabling it to conduct the circuit formed by the cables through the through groove 7 and the terminal of the sensor body 3 in the inlay groove 6. The principle of this circuit is conventional technology and will not be described in detail.

[0020] Working principle: In use, the operator first places the wafer vacuum pressure distribution sensor on the wafer placement platform (the chuck of the vacuum chamber). Then, the measuring device is activated, enabling the sensor body 3 located at area block 2 to sense the pressure of the wafer placement platform, achieving the purpose of zoned measurement. This allows people to quickly identify the location of pressure unevenness and speed up the adjustment process. Therefore, it effectively accelerates the measurement work of the wafer vacuum pressure distribution sensor on the wafer placement platform. (It should be noted that the specific models and specifications of the electrical components involved in this solution need to be selected and determined according to the actual specifications of the device. The specific selection and calculation method adopts the existing technology in this field, so it will not be described in detail.)

[0021] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A wafer vacuum pressure distribution sensor chip for multi-zone independent measurement, comprising: The first sensing sheet (1) is characterized in that: the bottom of the first sensing sheet (1) is connected to the second sensing sheet (5), and the first sensing sheet (1) includes multiple sets of area blocks (2), and the edges of the first sensing sheet (1) and the second sensing sheet (5) are provided with reserved grooves (4).

2. The wafer vacuum pressure distribution sensor chip for multi-zone independent measurement according to claim 1, characterized in that: The bottom end of the first sensor sheet (1) is attached to the sensor body (3).

3. The wafer vacuum pressure distribution sensor chip for multi-zone independent measurement according to claim 1, characterized in that: The second sensor sheet (5) has an inlay groove (6) on its inner side.

4. The wafer vacuum pressure distribution sensor chip for multi-zone independent measurement according to claim 1, characterized in that: The second sensor sheet (5) has an installation groove (8) in the middle of its inner side.

5. A wafer vacuum pressure distribution sensor with multi-zone independent measurement according to claim 1, characterized in that: A through groove (7) is provided on the inner side of the second sensor sheet (5).

6. A wafer vacuum pressure distribution sensor with multi-zone independent measurement according to claim 3, characterized in that: The inlay groove (6) is fitted with the tail of the sensor body (3).

7. A wafer vacuum pressure distribution sensor with multi-zone independent measurement according to claim 1, characterized in that: The inner side of the reserved slot (4) has a V-shaped structure, and the reserved slot (4) forms an integrated structure with the first sensing sheet (1) and the second sensing sheet (5) through the slotting.

8. A wafer vacuum pressure distribution sensor for multi-zone independent measurement according to claim 5, characterized in that: The centerline of the through groove (7) passes through the center of the inlay groove (6).

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