Test accessories and test equipment for semiconductor chips

Abstract

This application provides a testing accessory and testing equipment for semiconductor chips. The testing equipment includes a drive mechanism, a range sensor, and a testing accessory. The testing accessory includes a test blade with a rear end for detachable connection to the range sensor and the drive mechanism; a testing carrier with a receiving groove at the top for accommodating the semiconductor chip, the receiving groove extending through the testing carrier along the forward path of the test blade; the testing carrier within the receiving groove, with slots on both sides of the receiving groove for laterally fixing the semiconductor chip placed within the receiving groove; the drive mechanism for driving the test blade to apply a horizontal thrust to the semiconductor chip; and the range sensor for collecting test data during the process of the test blade applying the thrust to the semiconductor chip. This configuration allows the testing equipment to overcome the limitations of testing direction and achieve horizontal thrust testing of the semiconductor chip, thereby enabling a more comprehensive evaluation of chip performance.

Description

Technical Field

[0001] This application belongs to the field of semiconductor testing equipment technology, and specifically relates to a testing accessory and testing equipment for semiconductor chips. Background Technology

[0002] In the semiconductor industry, chip push testing is a crucial test for evaluating chip structural strength, interconnect reliability, and failure resistance. However, current industry-standard testing equipment has significant limitations. First, it offers only one testing dimension; the equipment is typically designed to support only horizontal chip placement for vertical force testing. This fixed mode cannot perform horizontal testing when the chip is vertically placed, making it impossible to simulate the actual forces acting on the chip's sides, thus limiting its application scope and the comprehensive evaluation of the chip's mechanical properties. Therefore, there is an urgent need for testing accessories and equipment for semiconductor chips that can overcome the limitations of testing direction. Utility Model Content

[0003] The purpose of this application is to provide a test accessory and test equipment for semiconductor chips, which aims to solve the problem of limited testing direction of existing test equipment.

[0004] Based on this aspect, this application provides a test accessory for semiconductor chips, including: a test blade, the rear end of which is detachably connected to a range sensor and a drive mechanism of a test device; and a test carrier, the top of which is provided with a receiving groove for accommodating the semiconductor chip, the receiving groove passing through the test carrier along the forward path of the test blade.

[0005] The test carrier is located within the receiving groove, and slots are provided on both sides of the receiving groove. The slots are used to fix the semiconductor chip placed in the receiving groove from the side.

[0006] In some embodiments, the test vehicle is provided with multiple sets of loading structures on its top, each set of loading structures consisting of the receiving slot and the card slot, and the multiple sets of loading structures are adapted to multiple semiconductor chips of different sizes.

[0007] In some embodiments, the test vehicle is composed of a first vehicle and a second vehicle joined together; the first vehicle and the second vehicle are connected by fasteners; an installation area is provided on one side of the first vehicle; the overall shape of the second vehicle matches the shape of the installation area; when the first vehicle and the second vehicle are together, they form the receiving groove and the slot.

[0008] In some embodiments, the number of the first vehicle is one, and the number of the second vehicles is multiple; multiple installation areas are provided at intervals on one side of the first vehicle; the multiple installation areas are provided in a one-to-one correspondence with the multiple second vehicles.

[0009] In some embodiments, a buffer zone is provided in front of the receiving groove for the test blade to enter the receiving groove from the buffer zone; and / or, the bottom of the receiving groove is flush with the bottom of the slot.

[0010] In some embodiments, the minimum width of the front end of the test blade used to contact the semiconductor chip is ≤0.25mm.

[0011] In some embodiments, the width and thickness of the test blade increase from the front end to the rear end.

[0012] In some embodiments, the test tool head is provided with a front end area, a transition area and a rear end area sequentially along its own axial direction;

[0013] In the width direction, both sides of the front end area and the transition area are sloped surfaces, and the inclination of the sloped surfaces on both sides of the transition area is greater than that of the sloped surfaces on both sides of the front end area. Both sides of the rear end area are flat surfaces with a constant width.

[0014] In the thickness direction, one side of the front end area and the transition area is a flat surface, and the other side is a sloped surface. The slope of the transition area is greater than the slope of the front end area. The two sides of the rear end area are flat surfaces and the thickness is constant.

[0015] In some embodiments, the included angle between the two inclined surfaces of the transition zone is 52.11°, and the minimum width of the front end of the test blade is 0.25 mm.

[0016] On the other hand, this application also provides a testing device, including: a drive mechanism; a range sensor; and the aforementioned testing accessories;

[0017] Wherein: the driving mechanism is used to drive the test head of the test accessory so that the test head can apply a horizontal thrust to the semiconductor chip; the range sensor is used to collect test data during the process of the test head applying the thrust to the semiconductor chip.

[0018] As described above, the test accessories and test equipment for semiconductor chips provided in this application can place and vertically fix the semiconductor chip through the test carrier, and apply a horizontal thrust to the semiconductor chip in coordination with the test blade, thereby realizing the horizontal thrust test of the semiconductor chip, solving the problem that traditional test equipment cannot test due to structural limitations.

[0019] In a further improvement, this application sets the minimum width of the front end of the test blade to ≤0.25mm, so that the test blade can be adapted to large-range sensors (such as 500N) while also being suitable for thrust testing of small-sized chips (such as 5×5mm and below), thereby solving the problem that traditional blades cannot test small-sized chips due to their excessive width.

[0020] In a further improvement, this application incorporates multiple loading structures on the top of the test carriage, enabling these structures to be compatible with semiconductor chips of different sizes. When testing chips of different sizes, it is not necessary to replace the entire test carriage; only the corresponding loading structure needs to be replaced. This significantly enhances the test equipment's adaptability to different product specifications and improves testing efficiency. Attached Figure Description

[0021] Those skilled in the art will understand that the accompanying drawings are provided to better understand this application and do not constitute any limitation on the scope of this application.

[0022] Figure 1 This is a schematic diagram of the overall structure of the test vehicle according to an embodiment of this application. The test vehicle in the figure is assembled from a first vehicle and a second vehicle.

[0023] Figure 2 for Figure 1 A magnified view of the test vehicle at position A;

[0024] Figure 3 This is a schematic diagram of the structure of the first vehicle according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the structure of the second vehicle according to an embodiment of this application;

[0026] Figure 5 This is a front view of the test blade in the width direction according to an embodiment of this application;

[0027] Figure 6 for Figure 5 Side view of the test cutter head in the thickness direction;

[0028] Figure 7 for Figure 6 Top view of the test cutter head.

[0029] Explanation of reference numerals in the attached drawings: 100-Test carrier, 101-Receiving groove, 102-Card slot, 110-First carrier, 111-Mounting area, 112-Protrusion, 113-First groove, 120-Second carrier, 121-Second groove, 200-Test cutter head, 201-Front end area, 202-Transition area, 203-Rear end area, 204-Mounting interface. Detailed Implementation

[0030] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Therefore, the drawings only show components related to this application and are not drawn according to the actual number, shape, and size of components in the implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0031] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this application must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, where implementation is possible, those skilled in the art can selectively implement some or all of the technical features in any embodiment, or selectively implement a combination of some or all of the technical features in multiple embodiments, based on the disclosure of this application and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this application.

[0032] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “multiple” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “installed,” “connected,” and “linked” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can be internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly specify the number of indicated technical features. It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In this document, unless otherwise stated, the terms "vertically fixed" or "vertically placed" refer to the state of the chip in the vertical direction.

[0033] As mentioned in the background section, current commonly used testing equipment typically only supports horizontal chip placement for vertical thrust testing. Therefore, due to equipment structural limitations, chips cannot be stably placed vertically for horizontal (e.g., X or Y) thrust testing, resulting in a limited range of test types that cannot accurately reflect the mechanical reliability of chips in complex application environments.

[0034] Based on this, this application provides a testing accessory for semiconductor chips to solve the problem of horizontal chip testing. Furthermore, through further improvements, the testing accessory of this application can be compatible with chips of different sizes, including small-sized chips. It should be noted that the semiconductor chip mentioned in this application mainly refers to a single die, and the type, shape, and size of the chip are not limited.

[0035] Specifically, the test accessories of this application include a test carrier and a test blade. The test carrier can vertically place and fix the semiconductor chip (e.g., a diced chip). The test blade, as the direct component of the thrusting action, can move under the control of the drive mechanism of the test equipment to apply a horizontal thrust to the chip until the chip is deflected, thereby realizing the horizontal thrust test of the chip. The following description refers to the accompanying drawings.

[0036] Figure 1 This is a schematic diagram of the overall structure of the test vehicle 100 according to an embodiment of this application. The test vehicle 100 is assembled from a first vehicle 110 and a second vehicle 120. Figure 2 for Figure 1 A magnified view of the test vehicle 100 at position A.

[0037] like Figures 1-2 As shown, the test accessories provided in this application include a test vehicle 100, which can be designed as an integral unit or as a separate unit. In this embodiment, the test vehicle 100 adopts a separate design to simplify the structure and reduce costs.

[0038] Whether the test carrier 100 is split or integrated, its top is provided with a receiving groove 101 for accommodating semiconductor chips. This receiving groove 101 can accommodate the test blade 200 (i.e., the pusher blade; see [reference needed] for details). Figures 5 to 7 The forward path of the test vehicle 100 is used to provide clearance for the test cutter head 200.

[0039] Meanwhile, the test carrier 100 is located within the receiving groove 101, and slots 102 are provided on both sides of the receiving groove 101. The slots 102 are used to fix the semiconductor chip placed in the receiving groove 101 from the side, so as to achieve vertical fixation of the semiconductor chip and facilitate horizontal crushing of the chip. The slots 102 are usually symmetrically arranged on both sides of the receiving groove 101.

[0040] Understandably, both the receiving groove 101 and the card slot 102 open upwards, which facilitates the insertion and removal of semiconductor chips in the vertical direction. Furthermore, since the receiving groove 101 passes through the test carrier 100 along the forward path of the test blade 200, it facilitates the insertion and retraction of the test blade 200 without causing interference.

[0041] With this configuration, the semiconductor chip can be placed and vertically fixed using the test carrier 100, and a horizontal thrust can be applied to the semiconductor chip using the test blade 200. This enables horizontal thrust testing of the semiconductor chip, solving the problem that traditional test equipment cannot perform such tests due to structural limitations. This allows the test equipment to overcome the limitations of the testing direction, expand the testing range, and facilitate comprehensive performance evaluation of the semiconductor chip.

[0042] Accordingly, this application also provides a testing device, which includes: a driving mechanism, a range sensor; and the testing accessories of this application. Since the driving mechanism and the range sensor are existing structures, they will not be described in detail. Specifically: the driving mechanism drives the test cutter head 200 so that the test cutter head 200 can apply a horizontal thrust to the semiconductor chip; the range sensor is used to collect test data (such as test data of thrust and displacement) during the process of the test cutter head 200 applying the thrust to the semiconductor chip.

[0043] Since the testing equipment and the testing accessories of this application belong to the same inventive concept, the testing equipment provided by this application has all the advantages of the testing accessories provided by this application. Therefore, the beneficial effects of the testing equipment provided by this application will not be described in detail here.

[0044] The testing of semiconductor chips can be performed according to the following steps:

[0045] (1) First, place the semiconductor chip vertically in the receiving slot 101 of the test carrier 100 and fix it through the slot 102;

[0046] (2) Then the test carrier 100 loaded with semiconductor chips is placed on the test platform of the test equipment and fixed.

[0047] (3) Select the corresponding test range (i.e. the range of applied thrust) and debug it first. Generally, place the semiconductor chip to be tested in the middle position of the test blade 200, with the test blade 200 located on one side of the chip and close to the chip.

[0048] (4) After positioning the test head 200, start the test. The test equipment can automatically infer the chip according to the program settings and collect the test data of the test head 200 in real time.

[0049] If a vertical crush test is required on the chip, the existing carrier can be replaced and the chip placed horizontally. This allows the same testing equipment to perform both vertical and horizontal thrust tests.

[0050] In actual use, the test vehicle 100 of this application can be directly installed using the existing installation position on the test platform, which is convenient for use.

[0051] For example, in this embodiment, the entire test vehicle 100 is set as a rectangle, which can be detachably connected to the test platform using its length or width sides, preferably a quick-release connection. If the test platform provides slots, the two sides of the test vehicle 100 can be directly inserted into the slots for fixation, which is convenient for disassembly and use.

[0052] Furthermore, this application does not impose any particular limitations on the shape and size of the receiving slot 101 and the card slot 102, because the shape and size of both need to be set according to the shape and size of the corresponding semiconductor chip. In short, as long as it can be ensured that the semiconductor chip will not tip over or move during the test.

[0053] As an example, the cross-sectional shape of the card slot 102 perpendicular to the chip insertion / removal direction can be V-shaped, U-shaped, rectangular, or other suitable shape, as long as it can vertically fix the chip and facilitate chip placement and removal. Similarly, the cross-sectional shape of the receiving slot 101 parallel to the chip insertion / removal direction can be V-shaped, U-shaped, rectangular, or other suitable shape.

[0054] The bottom of the card slot 102 may or may not be flush with the bottom of the receiving groove 101. In this embodiment, the bottom of the card slot 102 is flush with the bottom of the receiving groove 101, so that when the chip is placed, its bottom can be supported by the bottoms of both the card slot 102 and the receiving groove 101. If the bottom of the card slot 102 is not flush with the bottom of the receiving groove 101, the bottom of the card slot 102 may or may not extend beyond the bottom of the receiving groove 101.

[0055] In some embodiments, a buffer zone 103 may be provided in front of the receiving slot 101 so that the test blade 200 can directly enter the receiving slot 101 from the buffer zone 103 when it falls, which facilitates the slow movement of the test blade 200 close to the chip before testing, ensuring the safety and reliability of the test.

[0056] The test vehicle 100 of this application is typically made of metallic materials, such as stainless steel, anodized aluminum alloy, hard alloy, etc., to ensure rigidity and wear resistance.

[0057] For ease of description, the structure consisting of the receiving groove 101 and the card slots 102 on both sides inside it is defined as the loading structure.

[0058] In some embodiments, the top of the test vehicle 100 may be equipped with only one set of loading structures, which is only suitable for chips of a certain size.

[0059] In this embodiment, the test carrier 100 has multiple sets of loading structures on its top, which are adapted to various semiconductor chips of different sizes. Therefore, multiple loading structures allow for compatibility with semiconductor chips of different sizes. When testing chips of different sizes, it is not necessary to replace the entire test carrier; only the corresponding loading structure needs to be replaced. This greatly improves the adaptability of the testing equipment to products of different specifications and enhances testing efficiency. In this case, each loading structure is only suitable for chips of a specific size; incompatible chips cannot be loaded.

[0060] In a specific example, such as Figure 1As shown, the test carrier 100 has four sets of loading structures on its top, spaced apart along the length of the test carrier 100. However, the number of loading structures is not limited to four; it can also be two, three, or more than four, and the specific number can be adjusted according to the size specifications of the chip.

[0061] In this embodiment, the test vehicle 100 adopts a modular design, consisting of a first vehicle 110 and a second vehicle 120 joined together. The first vehicle 110 and the second vehicle 120 are detachably connected, preferably by fasteners.

[0062] Figure 3 This is a schematic diagram of the structure of the first carrier 110 according to an embodiment of this application. Figure 4 This is a schematic diagram of the structure of the second carrier 120 according to an embodiment of this application. Figure 3 and Figure 4 As shown, and in combination Figure 1 and Figure 2 In some embodiments, a mounting area 111 is provided on one side of the first carrier 110, and the shape of the mounting area 111 matches the overall shape of the second carrier 120; thus, when the first carrier 110 and the second carrier 120 are closed together, a receiving groove 101 and a slot 102 can be precisely formed.

[0063] The term "shape matching" as used herein means that the overall shape of the second carrier 120 can fit into the shape of the first carrier 110 in the corresponding mounting area 111. This configuration, by matching the shape of the second carrier 120 with the shape of the first carrier 110 in the corresponding mounting area 111, facilitates precise positioning of the second carrier 120 with the first carrier 120 when the second carrier 120 is placed in the mounting area 111, and allows the corresponding structure of the second carrier 120 to precisely align with the corresponding structure of the first carrier 110 to form the slot 102 and the receiving groove 101.

[0064] In a specific example, Figure 4 As shown, the top of the first carrier 110 is provided with a protrusion 112 extending its entire length, and multiple first grooves 113 are provided at intervals along the extending direction of the protrusion 112. A hollowed-out mounting area 111 is provided on one side of the first groove 113. The mounting area 111 is used to position and place the corresponding second carrier 120. When there are multiple mounting areas 111, the shape of each mounting area 111 matches the shape of the corresponding placed second carrier 120.

[0065] In a specific example, such as Figure 3 As shown, the top of the second vehicle 120 is provided with a second groove 121, which is provided through and forms a buffer zone 103.

[0066] When the second carrier 120 is placed into the corresponding installation area 111, its shape fits perfectly with the installation area 111. After being enclosed, it forms a complete receiving slot 101 and a card slot 102.

[0067] Therefore, when there are multiple second vehicles 120, the overall shape of each can be matched with the shape of the corresponding mounting area 111 of the first vehicle 110.

[0068] There is only one first carrier 110, while there may be one or more second carriers 120. In this embodiment, to adapt to chips of different sizes, multiple second carriers 120 are provided, and the shapes of the multiple second carriers 120 may be the same or different. Specifically, multiple hollowed-out mounting areas 111 are provided at intervals on one side of the first carrier 110, and the multiple mounting areas 111 are provided in a one-to-one correspondence with the multiple second carriers 120. The shape of each mounting area 111 matches the overall shape of the corresponding second carrier 120.

[0069] It should also be noted that when there are multiple loading structures, the depth of the receiving slots 101 of the multiple loading structures along the chip insertion / removal direction can be the same or different, and the width between the two sides of the receiving slots 101 of the multiple loading structures is different, so as to facilitate testing chips of different sizes, including but not limited to chips of different thicknesses. Similarly, the width of the chip clamping slots 102 of the multiple loading structures needs to be set according to the size of the chip, and the specific value is not limited.

[0070] Furthermore, the inventors discovered that existing large-range sensors (such as 500N) typically require large-sized test heads to ensure structural strength and rigidity. That is, a robust test head is needed to measure greater forces, but such a robust head cannot test small chips. When testing small-sized chips (such as 5mm × 5mm and below), the required test force is relatively small. Traditional testing equipment (such as equipment equipped with a 500N force sensor) typically uses a large force-applying test head to ensure performance under large ranges; the head width may even exceed the width of the chip being tested. This results in the test head failing to effectively align and adhere to the chip surface during testing, instead causing mechanical interference with the test platform or fixture, making testing impossible. Therefore, existing test heads are unsuitable for thrust testing of small-sized chips.

[0071] Therefore, in further improvements, this application sets the minimum width of the front end of the test head 200 to an extremely small width, and through extensive theoretical research and experimental analysis, limits the minimum width of the front end of the test head 200 to ≤0.25mm. This allows the test head 200 to be adapted to both large-range sensors (such as 500N) and small-sized chips (such as 5×5mm and below) for thrust testing, thus solving the problem that traditional test heads cannot test small-sized chips due to their excessive width.

[0072] Figure 5 This is a front view of the test blade 200 in the width direction according to an embodiment of this application. Figure 6 for Figure 5 Side view of the test head 200 in the thickness direction. Figure 7 for Figure 6 Top view of the test cutter head 200.

[0073] like Figures 5 to 7 As shown, the minimum width W1 of the front end of the test blade 200 used to contact the semiconductor chip is ≤0.25mm. The blade tip width of this test blade 200 is much smaller than that of traditional blades, making it suitable for thrust testing of small-sized chips (such as 5mm×5mm and below), and of course also compatible with thrust testing of larger-sized chips. There is no need to configure multiple specifications of test blades, which greatly saves costs.

[0074] In some embodiments, the test head 200 of this application is adapted to a 500N range sensor.

[0075] It is also easy to understand that during the test, the test head 200 contacts the chip and applies force through the thrust surface at its front end, and the thrust surface is limited by the width of the test head 200.

[0076] The test cutter head 200 of this application can be of various shapes, such as flat-head push cutter, wedge-shaped or conical push cutter, ball-head push cutter, etc., as long as its minimum front end width W1 ≤ 0.25mm, is not easy to break, can prevent interference with the carrier, and in some cases, facilitates visual positioning and observation of the position of the cutter head.

[0077] In some embodiments, the test head 200 is configured such that its width and thickness increase from the front end to the rear end, thereby setting the test head 200 into a wedge-shaped or tapered structure. This structure allows for a smoother transmission of force from the rear end to the front end, effectively avoiding stress concentration and ensuring the structural integrity and reliability of the test head under a large range of testing up to 500N. Moreover, it provides the necessary structural space and strength for the rear end of the test head 200 to achieve a detachable connection (such as threads or snaps) with a drive mechanism (such as the Z-axis). In addition, while ensuring an ultra-narrow width at the front end, it allows the test head 200 to effectively avoid the test carrier 100, preventing interference during movement and facilitating observation and alignment. Furthermore, this structure also facilitates the manufacturing and clamping of the test head 200 itself.

[0078] Furthermore, the test head 200 can be sequentially configured with a front end region 201, a transition region 202, and a rear end region 203 along its own axial direction. The front end region 201 is the force-applying part that directly acts on the chip, and its minimum width W1 ≤ 0.25 mm. The transition region 202 serves both as a clearance and to strengthen the front end region 201. The rear end region 203 is directly used for detachable connection with the drive mechanism and the range sensor. In the width direction, both sides of the front end region 201 and the transition region 202 are inclined surfaces, and the inclination of the inclined surfaces on both sides of the transition region 202 is greater than that of the inclined surfaces on both sides of the front end region 201. The two sides of the rear end region 203 are flat surfaces with a constant width. In the thickness direction, one side of the front end region 201 and the transition region 202 is a flat surface, and the other side is an inclined surface. The inclination of the inclined surface on the side of the transition region 202 is greater than that of the inclined surface on the side of the front end region 201. The two sides of the rear end region 203 are flat surfaces with a constant thickness.

[0079] The included angle θ1 between the two inclined surfaces of the transition zone 202 is typically an acute angle. The range of the acute angle can be adjusted according to the minimum width W1 of the front end, and the specific value is not limited. In a specific example, when the minimum width W1 of the front end of the test cutter head 200 is 0.25mm, the included angle θ1 between the two inclined surfaces of the transition zone 202 is 52.11°, and the length L1 of the front end region 201 can be 3.6mm to 3.8mm.

[0080] In practice, the minimum width W1 of the front end of the test blade 200 and the included angle θ1 of the two inclined surfaces of the transition area 202 are crucial. Given that the minimum width W1 of the front end is determined, the included angle θ1 of the two inclined surfaces only needs to be set according to the length L1 of the front end area 201. The length L1 of the front end area 201 is set according to the size of the blade contacting the chip. This is something that those skilled in the art can easily understand how to implement based on their knowledge. Therefore, this application does not impose any special restrictions on the specific value of the length L1 of the front end area 201.

[0081] In specific settings, the size of the test head 200 should ensure that it can move the chip horizontally without obstruction within the receiving groove 101 (equivalent to the guide groove) of the test carrier 100. The front end area 201 is the actual working area of ​​the head, which can meet the minimum chip size requirement. At the same time, the width of the head gradually increases towards the rear end, ensuring that the actual working area of ​​the head is sturdy and durable and not easily deformed. In this way, even with a very small width at the front end of the head, it can still measure a larger force, thus taking into account both small-sized chips and a large range.

[0082] As an example, such as Figure 5 As shown, the length L1 of the front end region 201 ranges from 3.6mm to 3.8mm.

[0083] As an example, the angle θ2 between the two inclined surfaces of the front end region 201 is 17.76°, while the angle θ1 between the two inclined surfaces of the transition region 202 is 52.11°.

[0084] As an example, the total length L2 of the test cutter head 200 is 17mm~19mm, such as 17mm, 17.05mm, 18mm, 18.05mm or 19mm.

[0085] As an example, such as Figure 6 As shown, the slope θ3 of the inclined surface on one side of the front end region 201 is 9.09°.

[0086] As an example, the slope θ4 of the slope on one side of the transition zone 202 is 32.59°.

[0087] As an example, the maximum thickness T of the test head 200 (that is, the thickness of the rear end area 203) is 2.95mm~3.05mm, such as 2.95mm, 2.99mm, 3.0mm, 3.01mm or 3.05mm.

[0088] In one specific embodiment, W1 is 0.25 mm, L1 is 3.6 mm (tolerance +0.2), L2 is 18 mm (tolerance +0.05), θ2 is 17.76°, θ1 is 52.11°, θ3 is 9.09°, T is 3 mm ± 0.01, and θ4 is 32.59°.

[0089] Furthermore, the rear end of the test head 200 is provided with a mounting interface 204 for connecting to the drive mechanism and a range sensor (such as a Z-axis with an integrated range sensor). This mounting interface 204 is preferably a quick-release interface, such as... Figure 7 As shown. Generally, the Z-axis end of the testing equipment has a slot. The mounting interface 204 at the rear end of the testing tool head 200 is directly inserted into the slot and then tightened with screws.

[0090] In summary, the test accessories provided in this application can solve the technical problems in push force testing of semiconductor chips, especially small chips. Existing technologies can only perform horizontally placed vertical crush tests, while this application achieves horizontal inference when placed vertically using the test carrier 100, and is equipped with a dedicated test blade 200, compatible with push force testing of small-sized chips. In particular, through the synergy of the test carrier 100 and the test blade 200, both the limitations of test direction and the difficulties of small-sized testing are solved, and it is also capable of testing 6C products.

[0091] Specifically, on the one hand, by improving the test carrier 100, the vertical fixation of the chip was achieved, and the horizontal thrust test that was previously impossible was completed. On the other hand, for small-sized chips, a test head 200 with an extremely small width (e.g., 0.25 mm) and a specific angle (e.g., 52.11°) was designed. This test head 200 can meet the thrust test of most chips, overcoming the previous problem of not being able to perform thrust tests on small-sized chips, while ensuring that the test head can be matched with large-range (e.g., 500N) sensors.

[0092] It should be understood that the above embodiments specifically disclose the features of the preferred embodiments of this application, enabling those skilled in the art to better understand this application. Those skilled in the art should understand that, based on the disclosure of this application, appropriate modifications can be easily made to this application to achieve the same purpose and / or the same advantages as the embodiments disclosed in this application. Those skilled in the art should also recognize that such similar structures do not depart from the scope of this application, and that they can be changed, substituted, and modified in various ways without departing from the scope of this application.

Claims

1. A testing accessory for semiconductor chips, characterized in that, include: The test head has a rear end that is detachably connected to the range sensor and drive mechanism of the test equipment; And a test carrier having a receiving groove on its top for accommodating the semiconductor chip, the receiving groove extending through the test carrier along the forward path of the test blade; The test carrier is located within the receiving groove, and slots are provided on both sides of the receiving groove. The slots are used to fix the semiconductor chip placed in the receiving groove from the side.

2. The test accessory for semiconductor chips according to claim 1, characterized in that, The test vehicle is equipped with multiple loading structures on its top. Each loading structure consists of the receiving slot and the card slot. The multiple loading structures are adapted to multiple semiconductor chips of different sizes.

3. The test accessory for semiconductor chips according to claim 1 or 2, characterized in that, The test vehicle is composed of a first vehicle and a second vehicle joined together; the first vehicle and the second vehicle are connected by fasteners; an installation area is provided on one side of the first vehicle; the overall shape of the second vehicle matches the shape of the installation area; when the first vehicle and the second vehicle are closed together, they form the receiving groove and the slot.

4. The test accessory for semiconductor chips according to claim 3, characterized in that, The number of the first vehicle is one, and the number of the second vehicles is multiple; multiple installation areas are provided at intervals on one side of the first vehicle; the multiple installation areas are provided in a one-to-one correspondence with the multiple second vehicles.

5. The test accessory for semiconductor chips according to claim 1 or 2, characterized in that, A buffer zone is provided in front of the receiving groove for the test blade to enter the receiving groove from the buffer zone; and / or, the bottom of the receiving groove is flush with the bottom of the slot.

6. The test accessory for semiconductor chips according to claim 1 or 2, characterized in that, The minimum width of the front end of the test blade used to contact the semiconductor chip is ≤0.25mm.

7. The test accessory for semiconductor chips according to claim 6, characterized in that, The width and thickness of the test blade increase from the front end to the rear end.

8. The test accessory for semiconductor chips according to claim 7, characterized in that, The test cutter head is sequentially configured with a front end area, a transition area, and a rear end area along its own axial direction; In the width direction, both sides of the front end area and the transition area are sloped surfaces, and the inclination of the sloped surfaces on both sides of the transition area is greater than that of the sloped surfaces on both sides of the front end area. Both sides of the rear end area are flat surfaces with a constant width. In the thickness direction, one side of the front end area and the transition area is a flat surface, and the other side is a sloped surface. The slope of the transition area is greater than the slope of the front end area. The two sides of the rear end area are flat surfaces and the thickness is constant.

9. The test accessory for semiconductor chips according to claim 8, characterized in that, The included angle between the two inclined planes of the transition zone is 52.11°, and the minimum width of the front end of the test blade is 0.25mm.

10. A testing device, characterized in that, include: Drive mechanism; Range sensor; And the test accessories as described in any one of claims 1-9; Wherein: the driving mechanism is used to drive the test head of the test accessory so that the test head can apply a horizontal thrust to the semiconductor chip; the range sensor is used to collect test data during the process of the test head applying the thrust to the semiconductor chip.

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